CN116613507A - Implementation method of satellite-borne extensible high-density multi-beam active array - Google Patents

Abstract

The invention discloses a realization method of a satellite-borne extensible high-density multi-beam active array, which is characterized in that the array is divided into a plurality of mutually independent subarrays according to the scale of the active array, the envelope size of each subarray does not exceed the caliber of a corresponding radiation surface, and the subarray is provided with an independent electrical interface; carrying out modularized design on subarrays, wherein each subarray comprises a radiation unit layer, a T/R assembly layer and a multi-beam forming network layer, the surface of the multi-beam forming network layer is electrically provided with the T/R assembly layer of the BGA package, and the surface of the T/R assembly layer is overlapped with the radiation unit layer; all subarrays are assembled on a power combining network module to form a complete active array. The invention solves the key problems of high design difficulty and long custom development period of the satellite-borne large-scale ultrahigh-density multi-beam phased array.

Description

A Realization Method of Spaceborne Scalable High Density Multi-beam Active Array

technical field

The invention relates to a method for realizing a space-borne scalable high-density multi-beam active array, and belongs to the technical field of microwave design.

Background technique

The Ka-band multi-beam active phased array antenna is one of the core loads of low-orbit satellites. Its main function is to form multiple independent high-gain beams through the antenna unit to achieve random access and multi-point communication. It has high flexibility and Wide-angle scanning and other advantages. Due to the high frequency band of the antenna, the small spacing between the array elements, and the large number of units, the traditional spaceborne multi-beam phased array antennas mostly use several single-beam antennas for splicing to achieve multi-beam functions, or based on the combination of bricks and tiles, the core T The /R component adopts a brick structure to realize the amplitude and phase control and signal amplification of multiple channels and multiple beams, and the synthesis network adopts an independent tile structure. The disadvantage of the above solution is that the volume, weight and power consumption of the product are large. In view of the urgent demand for miniaturization and light weight of low-orbit satellites, none of the above solutions can meet the needs of multi-beam functions. Conventional tile architecture requires metal connectors for electrical interconnection between different modules, which has the disadvantages of low integration and poor mass production, and cannot meet the needs of rapid mass production of hundreds of low-orbit satellites in the short term.

At present, airborne or missile-borne phased arrays adopt more tile structures, which integrate the antenna array, RF power synthesis/distribution network and low-frequency circuits based on the multi-layer microwave dielectric substrate technology. After the RF active circuit is packaged Mounting is carried out on the back of the multi-layer substrate, and the solution used on the ground is mostly a single-beam application. The disadvantage of this solution is that because the radio frequency signal has a long transmission path through layers in the multilayer substrate, the loss is large, which directly affects the G/T value or EIRP value of the antenna system. For different types of applications, changes in antenna form or array size will lead to changes in design schemes, redesign of circuits, poor scalability and reconfigurability, seriously affecting product delivery schedules, and high development costs.

Contents of the invention

The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, a method for implementing a space-borne scalable high-density multi-beam active array is proposed, and by rationally dividing sub-arrays and innovatively designing sub-arrays, the The design difficulty of space-borne large-scale ultra-high-density multi-beam phased array and the key problem of long custom development cycle.

Technical solution of the present invention is:

A method for realizing a space-borne scalable high-density multi-beam active array, comprising:

According to the size of the active array, the array is divided into several independent sub-arrays. The envelope size of each sub-array does not exceed the corresponding radiating surface aperture, and has an independent electrical interface;

Modular design of sub-arrays, each sub-array includes radiation unit layer, T/R component layer, multi-beam forming network layer, multi-beam forming network layer T/R component layer of surface electrical installation BGA package, T/R component Layers of radiating elements are stacked on the surface;

All sub-arrays are assembled on the power combining network module to form a complete active array.

Preferably, the radiating unit layer includes a multi-layer substrate, one side of the substrate is attached with a metal layer as a ground plane, and the other side is made into a metal patch with a predetermined shape, and the metal patch is fed to form an antenna.

Preferably, the T/R component layer adopts multi-layer high-temperature co-fired ceramic or silicon-based packaging, based on the integrated design of packaging and wiring, the ceramic shell or silicon-based is not only the package but also the carrier of the circuit layout cavity and wiring. The open cavity integrates multiple amplifier chips, and the back open cavity integrates multi-beam amplitude and phase control multifunctional chips, which realize electrical interconnection through gold wire bonding and three-dimensional vertical interconnection; at the same time, a number of radio frequency pads are integrated on the front of the package for communication with the radiation unit layer. For electrical connection, several RF and LF pads are integrated on the back for electrical interconnection with the beamforming network.

Preferably, the multi-beamforming network layer is designed based on a multi-layer substrate, and the front and back are designed as external interfaces. The radio frequency network, low-frequency power supply and distribution and control circuits distributed in each layer are all stripline designs, and the striplines on the same layer The lines are isolated through shielding ground holes on both sides, and the striplines of different layers are isolated through large-area metal grounds between layers.

Preferably, in the multi-beam forming network layer, a number of low-frequency and radio-frequency pads are integrated on the front of the multi-layer substrate for electrical connection with the T/R component layer; The output of the radio frequency interface of each beam is realized through the low frequency connector to realize external low frequency interconnection.

Preferably, the beamforming network layer is based on a multi-layer substrate, combined with polytetrafluoroethylene prepreg laminated multiple times to realize a high-low frequency hybrid circuit board integrating multi-beam forming network and low-frequency power supply control.

Preferably, in each sub-array, the radiation unit layer, the T/R component layer, and the multi-beam forming network layer are electrically connected by BGA ball planting, specifically including:

First, ball plant the back of the radiation unit layer, then plant balls on the bottom of the T/R component layer, and finally stack the beamforming network layer, T/R component layer and radiation unit layer in three dimensions, and then pass a reflow soldering Complete the electrical installation.

Preferably, the radiation unit layer, the T/R component layer, and the beamforming network layer are all metallized and wrapped.

Preferably, the method of assembling all sub-arrays on the power combining network module to form a complete active array is:

Simultaneously plug and interconnect the RF connectors, low frequency connectors and power combining network modules of each sub-array;

Each sub-array is fixed on the casing of the power combining network module through the mounting holes on the back of each sub-array.

Preferably, according to the application requirements of different orbits of the satellite, the design of the radiation unit layer of each sub-array is changed according to the application requirements, and the T/R component layer and the beamforming network layer remain unchanged, so as to realize rapid mass production.

The advantage of the present invention compared with prior art is:

(1) The present invention divides a large-scale ultra-high-density array into sub-arrays, and the sub-arrays are two-dimensionally expandable, which reduces the difficulty of array design and realizes the architecture design of complex and highly integrated arrays.

(2) The present invention is based on the modular design of the sub-array, which is divided into three independent parts: the radiation unit layer, the T/R component layer, and the multi-beam network layer, which can be realized by optimizing the corresponding functional layer according to the needs of different users Different functions shorten the development cycle and are suitable for platform-based products.

(3) The T/R component layer designed by the present invention realizes the shortest path connection with the radiation unit layer and the beam forming network layer in terms of electrical performance through double-sided cavity opening and double-sided ball planting, and has good transmission characteristics. At the same time, based on the system-in-package technology, the hermetic packaging of the bare chip is realized to meet the high reliability application in the spaceborne environment.

Description of drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiment. The drawings are only for the purpose of illustrating a preferred embodiment and are not to be considered as limiting the invention. Also throughout the drawings, the same reference numerals are used to designate the same parts. In the attached picture:

FIG. 1 is a schematic diagram of the scalable sub-array architecture of the present invention;

Fig. 2 is a schematic diagram of array distribution according to an embodiment of the present invention;

Fig. 3 is a schematic block diagram of receiving a phased array sub-array according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of beamforming network layers according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of the receiving phased array sub-array structure according to an embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a receiving phased array array according to an embodiment of the present invention.

Detailed ways

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

A method for implementing a space-borne scalable high-density multi-beam active array. First, the array is divided into sub-arrays according to the size of the array. The principle of division is to ensure that the array can be expanded arbitrarily in the two-dimensional direction. Not exceeding the corresponding radiating surface aperture, the sub-arrays have independent electrical interfaces, which is easy to realize array integration between sub-arrays. The sub-array is divided into three functional layers. The layered architecture is shown in Figure 1. According to the functional division, it is divided into radiation unit layer, T/R component layer, and multi-beam forming network layer.

The radiating unit layer is designed based on a multi-layer substrate. One side is attached with a metal layer as a grounding plate, and the other side is made into a metal patch of a certain shape. Microstrip lines or coaxial probes are used to feed the patch to form an antenna. By optimizing the antenna pattern , which can achieve good radiation characteristics and polarization isolation, and the conformal design of the antenna and structure makes it easy to achieve low profile characteristics. Wherein, the multi-layer substrate may be a composite dielectric substrate or a low-temperature co-fired ceramic or a high-temperature co-fired ceramic.

The T/R component layer adopts multi-layer high-temperature co-fired ceramic (HTCC) or silicon-based packaging. Based on the integrated design of packaging and wiring, the ceramic shell or silicon-based is not only the package but also the carrier of the circuit layout cavity and wiring. A low-noise amplifier chip, a power amplifier chip and a multi-beam amplitude-phase control multifunctional chip. The electrical interconnection inside the module is realized through gold wire bonding and three-dimensional vertical interconnection. Combined with the sealing and welding process, the airtightness of the module is guaranteed to meet the spaceborne application environment. high reliability requirements.

The multi-beam forming network layer is based on the multi-layer substrate design, and the front and back are designed as external interfaces. The complex radio frequency network and low-frequency power supply and distribution circuits are designed with strip lines. The power division network circuit adopts the Wilkinson form. The wires are isolated through shielding ground holes on both sides, and the striplines of different layers are isolated through a large area of metal ground between layers to improve the EMI (electromagnetic interference) characteristics between channels and beams.

The main body of the sub-array is a multi-beam forming network, and the electrical connection between the radiation unit layer, the T/R component layer, and the multi-beam forming network layer is realized by BGA (ball grid array) ball planting, in which the multi-beam forming The T/R component of the BGA package is installed on the surface of the network, and the radiation unit layer is stacked on the surface of the T/R component. The way of BGA ball planting is easy to realize the high-density integration of the interface, avoiding the traditional metal connector, which is convenient and fast. The radiation unit layer, T/R component layer, and beamforming network layer are all metallized and wrapped to prevent crosstalk between signals after large-scale array integration.

Taking a Ka-band 768 element 4-beam receiving phased array as an example, the present invention is described in detail: the Ka-band receiving phased array antenna adopts a system architecture based on AOP stack packaging, with a total of 768 units, and the unit spacing is extremely small. Traditional It is difficult to achieve large-scale high-density integration in a limited space due to its architectural layout. Based on the design of the present invention, the entire antenna array is divided into 8 sub-arrays according to every 96 elements as a sub-array, and each sub-array is independent of each other. The array distribution is shown in FIG. 2 . The sub-array is divided into three functional layers. Figure 3 is the functional block diagram of the sub-array. From the signal flow direction, it is the radiation unit, the receiving component, and the beamforming network.

The radiating unit layer is based on TSM-DS3 (polyester fiber + glass fiber + ceramic) multi-layer substrate, adopts the form of double resonant microstrip unit, designed as a printed board coupling antenna, a single substrate integrates 2*2 antenna units, and adopts second-order pressure Combined, sidewall metallization process, with independent processability and testability. In order to facilitate the integration of radiating units, receiving components, and beamforming networks, and in consideration of device layout and on-board reliability, the receiving component adopts a solution based on HTCC double-sided cavity opening and double-sided ball planting. The receiving component is packaged in a high-precision HTCC ceramic alumina tube shell to realize the integrated design of the tube and shell layout, and the cap is sealed by high-efficiency parallel seam welding to achieve airtight packaging while ensuring electromagnetic shielding, meeting the high reliability of spaceborne applications Require. A single receiving component corresponds to 4 antenna units, the front opening integrates 4 low-noise amplifiers, and the back opening integrates a 4-input and 4-out amplitude-phase multi-function. The front and back of the module are integrated with external interfaces. The front integrates multiple radio frequency pads for electrical connection with the radiation unit layer, and the back integrates several radio frequency and low frequency pads for electrical interconnection with the beamforming network. The beamforming network layer is based on the TSM-DS3 multilayer substrate, combined with FR-28-0040-50 (polytetrafluoroethylene) prepreg laminated multiple times, realizing a high-low frequency hybrid circuit integrating multi-beam forming network and low-frequency power supply control plate. The stacked structure adopts 22-layer board, and the stacked relationship is shown in Figure 4. The RF signal layout is on the 1st, 6th, 10th, 14th, 18th and 22nd layers, and the interlayer interconnection of the signal is realized through K1~K6 metallized vias. The low-frequency (power supply and control) signals are laid out on the 2nd, 3rd, and 4th layers. The signal interconnection is realized through K1 and K16 metallized holes, and the other hole types are all ground holes to achieve good signal shielding. The total thickness of the printed board is about 4.0mm. Several low-frequency and radio-frequency pads are integrated on the front side of the beamforming network substrate for electrical connection with the receiving components. The back of the substrate realizes the output of the sub-array’s external 4-beam RF interface through the surface-mounted SSMP connector, and the low-frequency interface adopts a surface-mounted micro-rectangular connector to realize external low-frequency interconnection.

The receiving phased array sub-array integration adopts two stacked BGA balls (450um high-lead solder balls), one soldering process, firstly plant balls on the back of the radiation unit layer, then plant balls on the bottom of the receiving component, and finally place The beamforming network layer, receiving component and radiation unit layer are three-dimensionally stacked, and only one reflow soldering is required to complete the electrical assembly. This integration method does not involve a micro-assembly process and is fast and mass-producible. The size of a single sub-array is 63.6mm*42mm*17mm (including sub-array mounting feet and connector height). The traditional brick structure is greatly reduced, only 1/30 of the traditional design.

The entire active array can be expanded through 8 sub-arrays, and the cable-free assembly design is adopted. The schematic diagram of array integration is shown in Figure 6. The entire array includes 8 sub-arrays and 1 power combining network module, each sub-array has 4 RF connectors, 1 low-frequency connector and the power combining network are plugged and interconnected at the same time to realize the electrical connection of radio-frequency signals and low-frequency signals. The sub-array is fixed on the power combining network housing through the four mounting holes on the back of the sub-array to realize structural integration, and the guiding design of the KK connector at the receptacle end of the power combining network ensures the mating accuracy of the RF connector ( The low-frequency connector body has guide posts).

After actual testing, the electrical performance of the product is excellent. At the same time, according to the application requirements of different orbits of low-orbit satellites, it is only necessary to optimize the design of different forms of radiation units. The rest of the circuit layers of the sub-array are of general design, which can be repeatedly put into production in batches. Based on the rapid production of the sub-array level, the entire active array Both the economy and the development cycle cost meet the overall demand for satellites to be fast, smart and cheap.

The above-described embodiments are only preferred specific implementations of the present invention, and ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present invention shall be included in the protection scope of the present invention.

Claims (10)

1. The implementation method of the satellite-borne scalable high-density multi-beam active array is characterized by comprising the following steps of:

dividing the array into a plurality of mutually independent subarrays according to the scale of the active array, wherein the envelope size of each subarray does not exceed the caliber of a corresponding radiation surface, and the subarray is provided with an independent electrical interface;

carrying out modularized design on subarrays, wherein each subarray comprises a radiation unit layer, a T/R assembly layer and a multi-beam forming network layer, the surface of the multi-beam forming network layer is electrically provided with the T/R assembly layer of the BGA package, and the surface of the T/R assembly layer is overlapped with the radiation unit layer;

all subarrays are assembled on a power combining network module to form a complete active array.

2. The method for realizing the satellite-borne extensible high-density multi-beam active array according to claim 1, wherein the radiation unit layer comprises a multi-layer substrate, one surface of the substrate is attached with a metal layer as a grounding plate, the other surface of the substrate is made into a metal patch with a set shape, and the metal patch is fed to form an antenna.

3. The method for realizing the satellite-borne extensible high-density multi-beam active array is characterized in that the T/R component layer adopts multi-layer high-temperature co-fired ceramic or silicon-based packaging, and based on packaging wiring integrated design, a ceramic tube shell or silicon-based is used as a carrier for packaging, a circuit layout cavity and wiring, a plurality of amplifier chips are integrated in a front cavity, a multi-beam amplitude-phase control multi-functional chip is integrated in a back cavity, and electric interconnection is realized through gold wire bonding and three-dimensional vertical interconnection; meanwhile, the front surface of the package body is integrated with a plurality of radio frequency bonding pads for being electrically connected with the radiation unit layer, and the back surface of the package body is integrated with a plurality of radio frequency and low frequency bonding pads for being electrically interconnected with the beam forming network.

4. The method for realizing the satellite-borne extensible high-density multi-beam active array according to claim 1, wherein the multi-beam forming network layer is based on a multi-layer substrate design, the front and the back of the multi-beam forming network layer are designed to be external interfaces, the radio frequency network, the low-frequency power supply and distribution and control circuits distributed on each layer are all designed as strip lines, the strip lines on the same layer are isolated through shielding ground holes on two sides, and the strip lines on different layers are isolated through interlayer large-area metal ground.

5. The method of claim 4, wherein a plurality of low frequency and radio frequency pads are integrated on the front side of the multi-layer substrate in the multi-beam forming network layer for electrical connection with the T/R module layer; the back of the multilayer substrate realizes the output of the subarray to a plurality of beam radio frequency interfaces through the radio frequency connector, and realizes the external low-frequency interconnection through the low-frequency connector.

6. The method for realizing the satellite-borne extensible high-density multi-beam active array according to claim 4, wherein the beam forming network layer is based on a multi-layer substrate and is combined with polytetrafluoroethylene prepregs to be pressed for a plurality of times, so that the high-frequency and low-frequency hybrid circuit board integrating the multi-beam synthesis network and the low-frequency power supply control is realized.

7. The method for realizing the satellite-borne extensible high-density multi-beam active array according to claim 1, wherein in each subarray, a radiation unit layer, a T/R assembly layer and a multi-beam forming network layer are electrically connected in a Ball Grid Array (BGA) ball-mounting manner, specifically comprising the following steps:

firstly, implanting balls on the back surface of the radiation unit layer, secondly, implanting balls on the bottom of the T/R component layer, finally, carrying out three-dimensional lamination on the beam forming network layer, the T/R component layer and the radiation unit layer, and finally, completing electric installation through one-time reflow soldering.

8. The method of claim 1, wherein the radiating element layer, the T/R element layer, and the beam forming network layer are metallized.

9. The method for implementing a satellite-borne scalable high-density multi-beam active array according to claim 1, wherein all sub-arrays are assembled on a power combining network module to form a complete active array by:

simultaneously inserting and interconnecting the radio frequency connector, the low frequency connector and the power synthesis network module of each subarray;

and fixing each subarray on the shell of the power synthesis network module through the mounting hole on the back of each subarray.

10. The method for realizing the satellite-borne extensible high-density multi-beam active array according to claim 1, wherein the design of the radiation unit layers of all subarrays is changed according to application requirements aiming at the application requirements of different orbits of satellites, and the T/R component layers and the beam forming network layers are kept unchanged, so that mass rapid production is realized.