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CN116618780A - A fully automatic chip tinning operation equipment and tinning method thereof - Google Patents

A fully automatic chip tinning operation equipment and tinning method thereof Download PDF

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Publication number
CN116618780A
CN116618780A CN202310345525.8A CN202310345525A CN116618780A CN 116618780 A CN116618780 A CN 116618780A CN 202310345525 A CN202310345525 A CN 202310345525A CN 116618780 A CN116618780 A CN 116618780A
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China
Prior art keywords
chip
tin
tinning
unit
feeding
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Chinese (zh)
Inventor
武爱军
肖全
刘雨
贾江深
武贵军
梁平
赵晓艳
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Tianjin Aofeng Technology Co ltd
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Tianjin Aofeng Technology Co ltd
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Priority to CN202310345525.8A priority Critical patent/CN116618780A/en
Publication of CN116618780A publication Critical patent/CN116618780A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/082Flux dispensers; Apparatus for applying flux
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种全自动芯片搪锡作业设备及其搪锡方法,包括:活动设置于X轴移动机构上的上料机构和下料机构,所述上料机构和下料机构均包括同轴布置的两个吸杆和两个吸盘;沿轴线依次布置的助焊剂槽、助焊剂活化单元、去金单元、搪锡单元、热风平整单元以及下料视觉相机。该发明提供的全自动芯片搪锡作业设备及其搪锡方法,基于视觉引导的自动识别不同尺寸规格芯片和不同类型芯片,完成自动识别,自动搪锡作业的全自动化过程。

The invention discloses a full-automatic chip tinning operation equipment and a tinning method thereof, comprising: a feeding mechanism and an unloading mechanism movably arranged on an X-axis moving mechanism, and the loading mechanism and the unloading mechanism both include the same Two suction rods and two suction cups arranged on the axis; flux tank, flux activation unit, degold unit, tinning unit, hot air leveling unit and blanking vision camera arranged in sequence along the axis. The fully automatic chip tinning operation equipment and tinning method provided by the invention can automatically identify chips of different sizes and different types based on vision guidance, and complete the fully automatic process of automatic identification and automatic tinning operation.

Description

一种全自动芯片搪锡作业设备及其搪锡方法A fully automatic chip tinning operation equipment and tinning method thereof

技术领域technical field

本发明涉及全自动芯片搪锡作业设备,具体涉及一种全自动芯片搪锡作业设备及其搪锡方法。The invention relates to a fully automatic chip tinning operation device, in particular to a fully automatic chip tinning operation device and a tinning method thereof.

背景技术Background technique

现有搪锡作业方式存在以下几个问题:There are the following problems in the existing tinning operation mode:

1、采用每种不同芯片重复编程和调试来实现不同尺寸规格不同类型的芯片的搪锡作业;但是,由于每种不同尺寸规格不同类型的芯片需要重复编程,针对每种芯片需要进行复杂验证,获取过程参数,然后进行设置,编程过程中工艺参数需要反复试样进行验证,编程过程复杂,换型时间长,对人员的专业知识要求较高,制约芯片应用行业的发展;1. Repeated programming and debugging of each different chip is used to realize the tinning operation of chips of different sizes and types; however, since each chip of different sizes and types needs to be reprogrammed, complex verification is required for each chip, Obtain the process parameters and then set them up. During the programming process, the process parameters need to be verified by repeated samples. The programming process is complicated, the changeover time is long, and the professional knowledge of personnel is required to be high, which restricts the development of the chip application industry;

2、传统搪锡设备只能实现固定的搪锡作业,对搪锡工艺中的蘸助焊剂、蘸锡等重要工艺环节调节性差,搪锡适用性差且搪锡合格率低;通常为合格率50-70%;2. Traditional tinning equipment can only achieve fixed tinning operations, and has poor adjustment to important process links such as dipping flux and tin in the tinning process, poor tinning applicability and low tinning pass rate; usually the pass rate is 50 -70%;

3、传统搪锡机采用多轴机器人每次提取一个芯片进行搪锡的单循环作业模式,效率低,一般只能达到60个芯片每小时的搪锡效率;3. The traditional tinning machine adopts a single-cycle operation mode in which a multi-axis robot extracts one chip at a time for tinning, and the efficiency is low. Generally, the tinning efficiency of 60 chips per hour can only be achieved;

4、传统搪锡机适用性非常差,一套设备智能适用单类芯片的搪锡,不同的DIP,QFP和SMD等芯片类型搪锡,需要投入不同的设备进行搪锡作业,投入成本高。4. The applicability of the traditional tinning machine is very poor. A set of equipment is intelligently suitable for tinning of a single type of chip. Different chip types such as DIP, QFP and SMD need to be invested in different equipment for tinning operation, and the input cost is high.

发明内容Contents of the invention

本发明的目的是提供一种全自动芯片搪锡作业设备及其搪锡方法,用于解决统搪锡设备搪锡新的规格新的类型芯片需要进行复杂的工艺验证和设备编程,换型时间长,效率低,可操作性差,不良率高;适用性差。The purpose of the present invention is to provide a fully automatic chip tinning operation equipment and its tinning method, which is used to solve the need for complex process verification and equipment programming for new specifications and new types of chips in traditional tinning equipment, and the time required for changing models. Long, low efficiency, poor operability, high defect rate; poor applicability.

为了实现上述目的,本发明提供如下技术方案:一种全自动芯片搪锡作业设备,包括:In order to achieve the above object, the present invention provides the following technical solutions: a fully automatic chip tinning operation equipment, comprising:

活动设置于X轴移动机构上的上料机构和下料机构,所述上料机构和下料机构均包括同轴布置的两个吸杆和两个吸盘;The feeding mechanism and the unloading mechanism that are movably arranged on the X-axis moving mechanism, the loading mechanism and the unloading mechanism both include two suction rods and two suction cups arranged coaxially;

沿轴线依次布置的助焊剂槽、助焊剂活化单元、去金单元、搪锡单元、热风平整单元以及下料视觉相机。The flux tank, flux activation unit, degold unit, tinning unit, hot air leveling unit and blanking vision camera are arranged in sequence along the axis.

作为优选的,所述上料机构和下料机构均包括机架,所述机架上设置有液压伸缩杆,所述液压伸缩杆的输出端固定安装有滑动设置于机架的机头,所述机头上对称安装有倾斜电机,所述倾斜电机分别用于驱使所述吸杆和所述吸盘偏转。As preferably, both the feeding mechanism and the unloading mechanism include a frame, and the frame is provided with a hydraulic telescopic rod, and the output end of the hydraulic telescopic rod is fixedly installed with a machine head that is slidably arranged on the frame, so A tilting motor is symmetrically installed on the machine head, and the tilting motor is respectively used to drive the deflection of the suction rod and the suction cup.

作为优选的,所述上料机构的机头上固定安装有附属支架,所述附属支架上安装有光源箱,所述机头的侧壁安装有第一视觉相机,所述第一视觉相机轴心与所述光源箱中心同轴。Preferably, an auxiliary bracket is fixedly installed on the machine head of the feeding mechanism, a light source box is installed on the auxiliary bracket, a first visual camera is installed on the side wall of the machine head, and the axis of the first visual camera The center is coaxial with the center of the light box.

作为优选的,所述光源箱具体为方向透明玻璃罩,且方向透明玻璃罩内设置有LED灯带。Preferably, the light source box is specifically a direction transparent glass cover, and an LED light strip is arranged inside the direction transparent glass cover.

作为优选的,所述上料机构和所述下料机构位于所述X轴移动机构上分别具有一起始工位;As a preference, the loading mechanism and the unloading mechanism respectively have a starting station on the X-axis moving mechanism;

还包括设置于两个起始工位上的Y轴送料机构,所述Y轴送料机构至少包括受驱保持Y轴移动的送料台。It also includes a Y-axis feeding mechanism arranged on the two starting stations, and the Y-axis feeding mechanism at least includes a feeding table driven to keep the Y-axis moving.

作为优选的,所述助焊剂活化单元包括活化仓,所述活化仓内设置有隔板,并通过隔板使所述活化仓内分隔多个相互连通的腔体;Preferably, the flux activation unit includes an activation chamber, and a partition is arranged in the activation chamber, and a plurality of interconnected cavities are separated in the activation chamber through the partition;

所述腔体内至少设置有两个芯片吸盘。At least two chip chucks are arranged in the cavity.

作为优选的,所述去金单元和搪锡单元均包括锡槽,所述锡槽内设置有多个加热棍。Preferably, both the degold unit and the tin enamel unit include a tin bath, and a plurality of heating rods are arranged in the tin bath.

作为优选的,所述热风平整单元包括热风整平风刀口以及设置于所述热风整平风刀口正下方的储液筒;Preferably, the hot air leveling unit includes a hot air leveling air knife edge and a liquid storage cylinder arranged directly below the hot air leveling air knife edge;

所述热风整平风刀口具体为漏斗状,其窄口朝向所述储液筒,且外接通有热风机。The edge of the hot air leveling air knife is specifically funnel-shaped, its narrow opening faces the liquid storage cylinder, and a hot air blower is connected to the outside.

一种芯片搪锡的搪锡方法,包括上述方案所述的全自动芯片搪锡作业设备进行制备芯片,其步骤如下:A tinning method for chip tinning, comprising the fully automatic chip tinning operation equipment described in the above scheme to prepare chips, the steps are as follows:

S001、人工整盘将芯片放到所述送料台上,所述送料台被Y轴送料机构驱动移动至上料机构正下方;S001. Manually place the chips on the feeding table, and the feeding table is driven by the Y-axis feeding mechanism to move directly below the feeding mechanism;

S002、所述第一视觉相机从送料台的第一行第一列穴位开始识别芯片,并判定芯片的中心位置坐标和角度,同时识别芯片所有规格特征,通过视觉软件分析来引导后续的真个搪锡作业过程;S002. The first visual camera starts to identify the chip from the acupoints in the first row and first column of the feeding table, and determines the coordinates and angles of the center position of the chip, and at the same time identifies all the specifications and features of the chip, and guides the subsequent real-time analysis through visual software analysis. tinning process;

S003、完成识别之后,上料机构将第一个吸盘正对芯片中心,第一个吸杆在倾斜电机带动下到达竖直向下角度,此时的第一个吸盘对应的Z轴伸出到芯片表面,第一个吸盘吸住芯片,完成一个芯片的拾取,所述第一视觉相机再次定位,同样步骤完成第二个吸盘对第二个芯片的拾取;S003. After the identification is completed, the feeding mechanism aligns the first suction cup to the center of the chip, and the first suction rod reaches a vertical downward angle driven by the tilt motor. At this time, the Z axis corresponding to the first suction cup extends to On the surface of the chip, the first sucker sucks the chip to complete the picking of a chip, the first vision camera is positioned again, and the second sucker picks up the second chip by the same steps;

S004、拾取后,两个芯片吸盘根据相机识别的芯片角度,通过倾斜电机带动两个吸杆转动来调整角度,对芯片的XY方向角度进行矫正;S004. After picking up, according to the chip angle recognized by the camera, the two chip suction cups drive the two suction rods to rotate through the tilt motor to adjust the angle, and correct the XY direction angle of the chip;

S005、角度矫正后,X轴移动机构驱动上料机构移动,并将两个芯片,移动到助焊剂槽上方,所述倾斜电机驱动使得芯片,所述液压伸缩杆伸出,将芯片引脚插入助焊剂液面,完成芯片第一侧引脚的蘸助焊剂,然后所述液压伸缩杆收缩,所述倾斜电机转动90度,完成芯片第二侧引脚的蘸助焊剂;S005. After the angle is corrected, the X-axis moving mechanism drives the feeding mechanism to move, and moves the two chips to the top of the flux tank. The tilt motor drives the chips, and the hydraulic telescopic rod extends out to insert the chip pins Flux liquid level, complete the dipping of the pins on the first side of the chip with flux, then the hydraulic telescopic rod shrinks, and the tilting motor rotates 90 degrees to complete the dipping of the pins on the second side of the chip;

S006、步骤五完成之后,X轴移动机构带动两个芯片,移动到所述助焊剂活化单元上方,倾斜电机调整竖直,将芯片放入活化仓进行助焊剂活化处理;S006, after step 5 is completed, the X-axis moving mechanism drives the two chips to move above the flux activation unit, the tilt motor is adjusted vertically, and the chips are put into the activation chamber for flux activation treatment;

S007、所述X轴移动机构带动两个芯片移动到所述去金单元的上方,所述倾斜电机调整倾斜,所述液压伸缩杆向下伸出锡槽,将芯片第一侧引脚探入锡液,进行去金处理,一侧完成后,所述液压伸缩杆升起,所述倾斜电机旋转90度,完成第二侧引脚去金,依次完成四侧引脚的去金;S007. The X-axis moving mechanism drives the two chips to move above the gold removal unit, the tilt motor adjusts the tilt, and the hydraulic telescopic rod extends downwards out of the tin bath to probe the pins on the first side of the chip into The tin liquid is degolded. After one side is completed, the hydraulic telescopic rod rises, and the tilt motor rotates 90 degrees to complete the degolding of the second side pins, and sequentially complete the degolding of the four side pins;

S008、所述X轴移动机构带动芯片至搪锡单元,所述倾斜电机调整倾斜,所述液压伸缩杆向下伸出,将芯片第一侧引脚探入锡液,进行搪锡处理,一侧完成后,所述液压伸缩杆升起,所述倾斜电机调整旋转90度,完成第二侧引脚搪锡,依次完成四侧引脚的搪锡;S008. The X-axis moving mechanism drives the chip to the tinning unit, the tilting motor adjusts the tilt, and the hydraulic telescopic rod extends downwards to probe the pins on the first side of the chip into the tin liquid for tinning treatment. After the side is completed, the hydraulic telescopic rod is raised, and the tilt motor is adjusted and rotated by 90 degrees to complete the tinning of the second side pins, and sequentially complete the tinning of the four side pins;

S009、所述X轴移动机构带动芯片至所述热风平整单元的上方,所述倾斜电机调整倾斜,所述液压伸缩杆伸出,将芯片底部前端移动至热风整平风刀口,然后再将芯片调整水平状态,然后随着所述X轴移动机构移动缓慢通过所述热风整平风刀口;S009. The X-axis moving mechanism drives the chip to the top of the hot air leveling unit, the tilt motor adjusts the tilt, and the hydraulic telescopic rod extends to move the bottom front end of the chip to the hot air leveling knife edge, and then the chip is Adjust the horizontal state, and then slowly pass the hot air to level the air knife edge as the X-axis moving mechanism moves;

S010、所述X轴移动机构带动芯片至所述下料视觉相机,所述倾斜电机调整倾斜使得芯片横平竖直角度,从低部对芯片进行成像,进行搪锡检验;S010. The X-axis moving mechanism drives the chip to the blanking vision camera, and the tilting motor adjusts the tilt to make the chip horizontally flat and vertically angled, and images the chip from the lower part to perform tinning inspection;

S011、检验合格后,所述X轴移动机构带动芯片移动的下料工位的送料台,所述倾斜电机调整竖直,并将将第一个吸盘对正所述送料台第一行第一列的第一个穴位,依次排放。S011. After passing the inspection, the X-axis moving mechanism drives the feeding platform of the unloading station where the chips move, and the tilting motor adjusts the vertical, and aligns the first sucker with the first row of the feeding platform. The first acupuncture point in the column is discharged in turn.

在上述技术方案中,本发明提供的一种全自动芯片搪锡作业设备及其搪锡方法,具备以下有益效果:基于视觉引导的自动识别不同尺寸规格芯片和不同类型芯片,完成自动识别,自动搪锡作业的全自动化过程。In the above technical solution, the present invention provides a fully automatic chip tinning operation equipment and tinning method thereof, which have the following beneficial effects: automatically identify chips of different sizes and different types based on visual guidance, complete automatic identification, and automatically Fully automated process for tinning operations.

完全改变了原有搪锡设备的弊端,实现了完全自动化的芯片搪锡作业,通过自动视觉识别芯片的类型为单边,双边或四边引脚,可根据边数自动进行搪锡,同时识别壳体长宽,引脚长度,引脚间距,芯片厚度等重要芯片规格参数;将芯片的所有规格参数通过软件计算,自动化指引搪锡设备进行搪锡作业,无需设备编程,即可进行搪锡作业,实现芯片搪锡过程的完全自动化搪锡处理,极大的提高了成品率以及工作效率。It has completely changed the disadvantages of the original tinning equipment and realized a fully automated chip tinning operation. Through automatic visual identification of the type of chip as single-sided, double-sided or four-sided pins, tinning can be performed automatically according to the number of sides, and the shell can be identified at the same time Body length and width, pin length, pin pitch, chip thickness and other important chip specification parameters; all specification parameters of the chip are calculated by software, and the tinning equipment can be automatically guided to carry out the tinning operation, and the tinning operation can be performed without equipment programming , to realize the fully automatic tinning process of the chip tinning process, which greatly improves the yield and work efficiency.

附图说明Description of drawings

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明中记载的一些实施例,对于本领域普通技术人员来讲,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings that are required in the embodiments. Obviously, the accompanying drawings in the following description are only described in the present invention For some embodiments of the present invention, those skilled in the art can also obtain other drawings according to these drawings.

图1为本发明实施例提供的整体的结构示意图;Fig. 1 is the overall structural schematic diagram provided by the embodiment of the present invention;

图2为本发明实施例提供的上料机构的结构示意图;Fig. 2 is a schematic structural view of a feeding mechanism provided by an embodiment of the present invention;

图3为本发明实施例提供的去金单元和搪锡单元的结构示意图;Fig. 3 is a schematic structural view of a degold unit and a tin enamel unit provided by an embodiment of the present invention;

图4为本发明实施例提供的热风平整单元的结构示意图;Figure 4 is a schematic structural view of a hot air leveling unit provided by an embodiment of the present invention;

图5为本发明实施例提供的助焊剂活化单元的结构示意图。FIG. 5 is a schematic structural diagram of a flux activation unit provided by an embodiment of the present invention.

附图标记说明:Explanation of reference signs:

1、X轴移动机构;11、上料机构;12、下料机构;2、助焊剂槽;3、助焊剂活化单元;31、活化仓;32、芯片吸盘;4、去金单元;5、搪锡单元;6、热风平整单元;61、热风整平风刀口;62、储液筒;7、下料视觉相机;8、Y轴送料机构;81、送料台;100、吸杆;101、吸盘;200、机架;201、液压伸缩杆;202、机头;203、倾斜电机;204、第一视觉相机;300、附属支架;301、光源箱;500、锡槽;501、加热棍。1. X-axis moving mechanism; 11. Feeding mechanism; 12. Unloading mechanism; 2. Flux tank; 3. Flux activation unit; 31. Activation chamber; 32. Chip sucker; 4. Degold unit; 5. 6. Hot air leveling unit; 61. Hot air leveling air knife edge; 62. Liquid storage cylinder; 7. Blanking visual camera; 8. Y-axis feeding mechanism; 81. Feeding table; 100. Suction rod; 101. Suction cup; 200, frame; 201, hydraulic telescopic rod; 202, head; 203, tilt motor; 204, first vision camera; 300, accessory bracket; 301, light source box; 500, tin bath; 501, heating rod.

具体实施方式Detailed ways

为了使本领域的技术人员更好地理解本发明的技术方案,下面将结合附图对本发明作进一步的详细介绍。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

如图1-5所示,一种全自动芯片搪锡作业设备,包括:活动设置于X轴移动机构1上的上料机构11和下料机构12,上料机构11和下料机构12均包括同轴布置的两个吸杆100和两个吸盘101;沿轴线依次布置的助焊剂槽2、助焊剂活化单元3、去金单元4、搪锡单元5、热风平整单元6以及下料视觉相机7。As shown in Figures 1-5, a fully automatic chip tinning operation equipment includes: a loading mechanism 11 and a blanking mechanism 12 that are movably arranged on the X-axis moving mechanism 1, and the loading mechanism 11 and the blanking mechanism 12 are both It includes two suction rods 100 and two suction cups 101 arranged coaxially; flux tank 2, flux activation unit 3, degold unit 4, tinning unit 5, hot air leveling unit 6 and blanking vision arranged in sequence along the axis camera7.

进一步的,上料机构11和下料机构12均包括机架200,机架200上设置有液压伸缩杆201,液压伸缩杆201的输出端固定安装有滑动设置于机架200的机头202,机头202上对称安装有倾斜电机203,倾斜电机203分别用于驱使吸杆100和吸盘101偏转。Further, both the feeding mechanism 11 and the unloading mechanism 12 include a frame 200, on which a hydraulic telescopic rod 201 is arranged, and the output end of the hydraulic telescopic rod 201 is fixedly installed with a machine head 202 slidingly arranged on the frame 200, Tilting motors 203 are symmetrically installed on the machine head 202, and the tilting motors 203 are respectively used to drive the suction rod 100 and the suction cup 101 to deflect.

再者,上料机构11的机头202上固定安装有附属支架300,附属支架300上安装有光源箱301,机头202的侧壁安装有第一视觉相机204,第一视觉相机204轴心与光源箱301中心同轴。Furthermore, the head 202 of the feeding mechanism 11 is fixedly equipped with an auxiliary bracket 300, the light source box 301 is installed on the auxiliary bracket 300, the side wall of the head 202 is equipped with a first visual camera 204, and the first visual camera 204 axis It is coaxial with the center of the light source box 301.

更为进一步的,光源箱301具体为方向透明玻璃罩,且方向透明玻璃罩内设置有LED灯带。Furthermore, the light source box 301 is specifically a direction transparent glass cover, and an LED light strip is arranged in the direction transparent glass cover.

其中,上述实施例中的X轴移动机构1包括导轨架、转动设置于导轨架上的丝杆以及驱使该丝杆旋转的驱动电机,实施例中的上料机构11和下料机构12均的机架200均滑动于导轨架上,并分别受到两个丝杆传动单独移动。Wherein, the X-axis moving mechanism 1 in the above-mentioned embodiment includes a guide rail frame, a screw mandrel that is rotatably arranged on the guide rail frame, and a drive motor that drives the screw mandrel to rotate. The feeding mechanism 11 and the unloading mechanism 12 in the embodiment are both The frame 200 all slides on the guide rail frame, and is driven by two screw rods to move independently.

上述技术中,基于视觉引导的自动识别不同尺寸规格芯片和不同类型芯片,完成自动识别,自动搪锡作业的全自动化过程。In the above-mentioned technology, based on the vision-guided automatic recognition of chips of different sizes and different types, the fully automatic process of automatic recognition and automatic tin enamel operation is completed.

完全改变了原有搪锡设备的弊端,实现了完全自动化的芯片搪锡作业,通过自动视觉识别芯片的类型为单边,双边或四边引脚,可根据边数自动进行搪锡,同时识别壳体长宽,引脚长度,引脚间距,芯片厚度等重要芯片规格参数;将芯片的所有规格参数通过软件计算,自动化指引搪锡设备进行搪锡作业,无需设备编程,即可进行搪锡作业,实现芯片搪锡过程的完全自动化搪锡处理,极大的提高了成品率以及工作效率。It has completely changed the disadvantages of the original tinning equipment and realized a fully automated chip tinning operation. Through automatic visual identification of the type of chip as single-sided, double-sided or four-sided pins, tinning can be performed automatically according to the number of sides, and the shell can be identified at the same time Body length and width, pin length, pin pitch, chip thickness and other important chip specification parameters; all specification parameters of the chip are calculated by software, and the tinning equipment can be automatically guided to carry out the tinning operation, and the tinning operation can be performed without equipment programming , to realize the fully automatic tinning process of the chip tinning process, which greatly improves the yield and work efficiency.

作为本发明进一步提供给的一个实施例,如图1所示,上料机构11和下料机构12位于X轴移动机构1上分别具有一起始工位;As an embodiment further provided by the present invention, as shown in FIG. 1 , the loading mechanism 11 and the unloading mechanism 12 are located on the X-axis moving mechanism 1 and have a starting station respectively;

还包括设置于两个起始工位上的Y轴送料机构8,Y轴送料机构8至少包括受驱保持Y轴移动的送料台81。It also includes a Y-axis feeding mechanism 8 arranged on the two starting stations. The Y-axis feeding mechanism 8 at least includes a feeding table 81 driven to keep the Y-axis moving.

具体的,实施例中的Y轴送料机构8还包括包括导轨架、转动设置于导轨架上的丝杆以及驱使该丝杆旋转的驱动电机,上述丝杆用于驱动送料台81移动。Specifically, the Y-axis feeding mechanism 8 in the embodiment also includes a guide rail frame, a screw rod rotatably arranged on the guide rail frame, and a drive motor to drive the screw rod to rotate. The above screw rod is used to drive the feeding table 81 to move.

作为本发明进一步提供给的另一个实施例,助焊剂活化单元3包括活化仓31,活化仓31内设置有隔板,并通过隔板使活化仓31内分隔多个相互连通的腔体;腔体内至少设置有两个芯片吸盘32。As another embodiment further provided by the present invention, the flux activation unit 3 includes an activation bin 31, a partition is arranged in the activation bin 31, and a plurality of interconnected cavities are separated in the activation bin 31 by the partition; At least two chip chucks 32 are arranged in the body.

作为本发明进一步提供给的再一个实施例,去金单元4和搪锡单元5均包括锡槽500,锡槽500内设置有多个加热棍501。As yet another embodiment further provided by the present invention, both the degold unit 4 and the tin enamel unit 5 include a tin bath 500 , and a plurality of heating rods 501 are arranged in the tin bath 500 .

作为本发明进一步提供给的又一个实施例,热风平整单元6包括热风整平风刀口61以及设置于热风整平风刀口61正下方的储液筒62;As yet another embodiment further provided by the present invention, the hot air leveling unit 6 includes a hot air leveling air knife edge 61 and a liquid storage cylinder 62 arranged directly below the hot air leveling air knife edge 61;

热风整平风刀口61具体为漏斗状,其窄口朝向储液筒62,且外接通有热风机。The hot air leveling air knife edge 61 is specifically funnel-shaped, and its narrow mouth faces the liquid storage cylinder 62, and a hot air blower is connected outside.

一种芯片搪锡的搪锡方法,全自动芯片搪锡作业设备进行制备芯片,其步骤如下:A tinning method for chip tinning, fully automatic chip tinning operation equipment to prepare chips, the steps are as follows:

S001、人工整盘将芯片放到送料台81上,送料台81被Y轴送料机构8驱动移动至上料机构11正下方;S001. Manually place the chips on the feeding table 81, and the feeding table 81 is driven by the Y-axis feeding mechanism 8 to move directly below the feeding mechanism 11;

S002、第一视觉相机204从送料台81的第一行第一列穴位开始识别芯片,并判定芯片的中心位置坐标和角度,同时识别芯片所有规格特征,通过视觉软件分析来引导后续的真个搪锡作业过程;S002. The first visual camera 204 starts to identify the chip from the acupuncture points in the first row and the first column of the feeding table 81, and determines the coordinates and angles of the center position of the chip, and at the same time identifies all the specifications and features of the chip, and guides subsequent real-time testing through visual software analysis. tinning process;

S003、完成识别之后,上料机构11将第一个吸盘101正对芯片中心,第一个吸杆100在倾斜电机203带动下到达竖直向下角度,此时的第一个吸盘101对应的Z轴伸出到芯片表面,第一个吸盘101吸住芯片,完成一个芯片的拾取,第一视觉相机204再次定位,同样步骤完成第二个吸盘101对第二个芯片的拾取;S003. After the identification is completed, the feeding mechanism 11 will align the first suction cup 101 to the center of the chip, and the first suction rod 100 will reach a vertical downward angle driven by the tilt motor 203. At this time, the first suction cup 101 corresponds to The Z axis extends to the surface of the chip, the first sucker 101 sucks the chip, completes the picking of a chip, the first visual camera 204 is positioned again, and the second sucker 101 picks up the second chip by the same steps;

S004、拾取后,两个芯片吸盘根据相机识别的芯片角度,通过倾斜电机203带动两个吸杆100转动来调整角度,对芯片的XY方向角度进行矫正;S004. After picking up, the two chip suction cups drive the two suction rods 100 to rotate through the tilt motor 203 to adjust the angle according to the chip angle recognized by the camera, and correct the XY direction angle of the chip;

S005、角度矫正后,X轴移动机构1驱动上料机构11移动,并将两个芯片,移动到助焊剂槽2上方,倾斜电机203驱动使得芯片,液压伸缩杆201伸出,将芯片引脚插入助焊剂液面,完成芯片第一侧引脚的蘸助焊剂,然后液压伸缩杆201收缩,倾斜电机203转动90度,完成芯片第二侧引脚的蘸助焊剂;S005. After the angle is corrected, the X-axis moving mechanism 1 drives the feeding mechanism 11 to move, and moves the two chips to the top of the flux tank 2, and the tilt motor 203 drives the chips, and the hydraulic telescopic rod 201 stretches out, and the chip pins Insert the flux liquid level to complete the dipping of the pins on the first side of the chip with flux, then the hydraulic telescopic rod 201 shrinks, and the tilt motor 203 rotates 90 degrees to complete the dipping of the pins on the second side of the chip;

S006、步骤五完成之后,X轴移动机构1带动两个芯片,移动到助焊剂活化单元3上方,倾斜电机203调整竖直,将芯片放入活化仓31进行助焊剂活化处理;S006, after step five is completed, the X-axis moving mechanism 1 drives the two chips to move above the flux activation unit 3, the tilt motor 203 is adjusted vertically, and the chips are put into the activation chamber 31 for flux activation treatment;

S007、X轴移动机构1带动两个芯片移动到去金单元4的上方,倾斜电机203调整倾斜,液压伸缩杆201向下伸出锡槽500,将芯片第一侧引脚探入锡液,进行去金处理,一侧完成后,液压伸缩杆201升起,倾斜电机203旋转90度,完成第二侧引脚去金,依次完成四侧引脚的去金;S007. The X-axis moving mechanism 1 drives the two chips to move to the top of the de-gold unit 4, the tilt motor 203 adjusts the tilt, the hydraulic telescopic rod 201 extends downward from the tin bath 500, and probes the pins on the first side of the chip into the tin liquid. Carry out degolding treatment, after one side is completed, the hydraulic telescopic rod 201 rises, the tilt motor 203 rotates 90 degrees, completes the degolding of the pins on the second side, and completes the degolding of the pins on the four sides in turn;

S008、X轴移动机构1带动芯片至搪锡单元5,倾斜电机203调整倾斜,液压伸缩杆201向下伸出,将芯片第一侧引脚探入锡液,进行搪锡处理,一侧完成后,液压伸缩杆201升起,倾斜电机203调整旋转90度,完成第二侧引脚搪锡,依次完成四侧引脚的搪锡;S008. The X-axis moving mechanism 1 drives the chip to the tinning unit 5, the tilting motor 203 adjusts the tilt, the hydraulic telescopic rod 201 extends downward, and the pins on the first side of the chip are dipped into the tin liquid for tinning treatment, and one side is completed Finally, the hydraulic telescopic rod 201 is raised, and the tilt motor 203 is adjusted and rotated by 90 degrees to complete the tinning of the second side pins, and sequentially complete the tinning of the four side pins;

S009、X轴移动机构1带动芯片至热风平整单元6的上方,倾斜电机203调整倾斜,液压伸缩杆201伸出,将芯片底部前端移动至热风整平风刀口61,然后再将芯片调整水平状态,然后随着X轴移动机构1移动缓慢通过热风整平风刀口61;S009, the X-axis moving mechanism 1 drives the chip to the top of the hot air leveling unit 6, the tilt motor 203 adjusts the tilt, and the hydraulic telescopic rod 201 stretches out to move the front end of the bottom of the chip to the hot air leveling knife edge 61, and then adjust the chip to a horizontal state , and then move slowly through the hot air along with the X-axis moving mechanism 1 to level the air knife edge 61;

S010、X轴移动机构1带动芯片至下料视觉相机7,倾斜电机203调整倾斜使得芯片横平竖直角度,从低部对芯片进行成像,进行搪锡检验;S010, the X-axis moving mechanism 1 drives the chip to the blanking vision camera 7, and the tilt motor 203 adjusts the tilt to make the chip horizontally flat and vertically angled, and the chip is imaged from the bottom, and the tin-coating inspection is performed;

S011、检验合格后,X轴移动机构1带动芯片移动的下料工位的送料台81,倾斜电机203调整竖直,并将将第一个吸盘101对正送料台81第一行第一列的第一个穴位,依次排放。S011. After passing the inspection, the X-axis moving mechanism 1 drives the feeding table 81 of the unloading station where the chip moves, and the tilting motor 203 adjusts the vertical, and aligns the first suction cup 101 with the first row and the first column of the feeding table 81 The first acupoints are discharged in sequence.

以上只通过说明的方式描述了本发明的某些示范性实施例,毋庸置疑,对于本领域的普通技术人员,在不偏离本发明的精神和范围的情况下,可以用各种不同的方式对所描述的实施例进行修正。因此,上述附图和描述在本质上是说明性的,不应理解为对本发明权利要求保护范围的限制。Certain exemplary embodiments of the present invention have been described above only by way of illustration, and it goes without saying that those skilled in the art can use various methods without departing from the spirit and scope of the present invention. The described embodiments are modified. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims (9)

1. A full-automatic chip tin coating operation device is characterized by comprising:
the feeding mechanism (11) and the discharging mechanism (12) are movably arranged on the X-axis moving mechanism (1), and the feeding mechanism (11) and the discharging mechanism (12) comprise two sucking rods (100) and two sucking discs (101) which are coaxially arranged;
the automatic feeding device comprises a soldering flux tank (2), a soldering flux activating unit (3), a gold removing unit (4), a tin lining unit (5), a hot air leveling unit (6) and a blanking vision camera (7) which are sequentially arranged along an axis.
2. The full-automatic chip tin coating operation equipment according to claim 1, wherein the feeding mechanism (11) and the discharging mechanism (12) comprise a frame (200), a hydraulic telescopic rod (201) is arranged on the frame (200), a machine head (202) which is arranged on the frame (200) in a sliding manner is fixedly arranged at the output end of the hydraulic telescopic rod (201), oblique motors (203) are symmetrically arranged on the machine head (202), and the oblique motors (203) are respectively used for driving the suction rod (100) and the suction disc (101) to deflect.
3. The full-automatic chip tin coating operation device according to claim 2, wherein an auxiliary support (300) is fixedly installed on a machine head (202) of the feeding mechanism (11), a light source box (301) is installed on the auxiliary support (300), a first vision camera (204) is installed on the side wall of the machine head (202), and the axis of the first vision camera (204) is coaxial with the center of the light source box (301).
4. A fully automatic chip tin coating operation device according to claim 3, wherein the light source box (301) is specifically a directional transparent glass cover, and an LED lamp strip is arranged in the directional transparent glass cover.
5. The full-automatic chip tin coating operation equipment according to claim 1, wherein the feeding mechanism (11) and the discharging mechanism (12) are positioned on the X-axis moving mechanism (1) and respectively provided with a starting station;
the automatic feeding device is characterized by further comprising Y-axis feeding mechanisms (8) arranged on the two initial stations, wherein the Y-axis feeding mechanisms (8) at least comprise feeding tables (81) driven to keep Y-axis movement.
6. The full-automatic chip tin coating operation equipment according to claim 1, wherein the scaling powder activating unit (3) comprises an activating bin (31), a partition plate is arranged in the activating bin (31), and a plurality of cavities which are mutually communicated are separated in the activating bin (31) through the partition plate;
at least two chip suckers (32) are arranged in the cavity.
7. The full-automatic chip tin coating operation device according to claim 1, wherein the gold removing unit (4) and the tin coating unit (5) comprise a tin bath (500), and a plurality of heating rods (501) are arranged in the tin bath (500).
8. The full-automatic chip tin coating operation equipment according to claim 1, wherein the hot air leveling unit (6) comprises a hot air leveling wind knife edge (61) and a liquid storage cylinder (62) arranged right below the hot air leveling wind knife edge (61);
the hot air leveling air knife edge (61) is in a funnel shape, the narrow opening of the hot air leveling air knife edge faces the liquid storage barrel (62), and an air heater is externally connected.
9. A method for enameling tin on a chip, which is characterized by comprising the steps of preparing the chip by using the full-automatic chip enameling tin operation equipment as claimed in any one of claims 1 to 8, wherein the method comprises the following steps:
s001, a chip is placed on the feeding table (81) by a manual whole disc, and the feeding table (81) is driven by the Y-axis feeding mechanism (8) to move to the position right below the feeding mechanism (11);
s002, the first vision camera (204) starts to identify the chip from the first row and first column of acupoints of the feeding table (81), judges the central position coordinates and angles of the chip, simultaneously identifies all specification characteristics of the chip, and guides the subsequent real tin coating operation process through vision software analysis;
s003, after identification is completed, a first sucker (101) is opposite to the center of a chip by a feeding mechanism (11), a first sucker rod (100) is driven by an inclined motor (203) to reach a vertical downward angle, a Z axis corresponding to the first sucker (101) at the moment extends out of the surface of the chip, the first sucker (101) sucks the chip to complete the pickup of the chip, a first vision camera (204) is positioned again, and the second sucker (101) picks up the second chip in the same step;
s004, after picking up, the two chip suckers drive the two suction rods (100) to rotate through the inclined motor (203) according to the chip angle identified by the camera to adjust the angle, so as to correct the XY direction angle of the chip;
s005, after angle correction, an X-axis moving mechanism (1) drives a feeding mechanism (11) to move and move two chips to the position above a soldering flux groove (2), an inclined motor (203) drives the chips, a hydraulic telescopic rod (201) stretches out, chip pins are inserted into the liquid level of the soldering flux to finish dipping soldering flux of pins on the first side of the chips, then the hydraulic telescopic rod (201) contracts, and the inclined motor (203) rotates for 90 degrees to finish dipping soldering flux of pins on the second side of the chips;
s006, after the step five is completed, the X-axis moving mechanism (1) drives two chips to move to the position above the soldering flux activating unit (3), the tilting motor (203) adjusts the verticality, and the chips are placed into the activating bin (31) for soldering flux activating treatment;
s007, the X-axis moving mechanism (1) drives two chips to move to the upper part of the gold removing unit (4), the tilting motor (203) adjusts the tilting, the hydraulic telescopic rod (201) stretches out of the tin bath (500) downwards, pins on the first side of the chips are immersed in tin liquid for gold removing treatment, after one side is finished, the hydraulic telescopic rod (201) is lifted, the tilting motor (203) rotates for 90 degrees, gold removing of pins on the second side is finished, and gold removing of pins on the four sides is sequentially finished;
s008, the X-axis moving mechanism (1) drives a chip to a tin enameling unit (5), the tilting motor (203) adjusts tilting, the hydraulic telescopic rod (201) stretches out downwards, a first side pin of the chip is immersed in tin liquid to perform tin enameling treatment, after one side is finished, the hydraulic telescopic rod (201) is lifted, the tilting motor (203) adjusts and rotates for 90 degrees to finish tin enameling of a second side pin, and tin enameling of four side pins is sequentially finished;
s009, the X-axis moving mechanism (1) drives the chip to the upper part of the hot air leveling unit (6), the tilting motor (203) adjusts the tilting, the hydraulic telescopic rod (201) stretches out, the front end of the bottom of the chip is moved to the hot air leveling air knife edge (61), then the chip is adjusted to be in a horizontal state, and then the chip slowly passes through the hot air leveling air knife edge (61) along with the movement of the X-axis moving mechanism (1);
s010, the X-axis moving mechanism (1) drives the chip to the blanking vision camera (7), the tilting motor (203) adjusts the tilting to enable the chip to be in a horizontal, horizontal and vertical angle, the chip is imaged from the lower part, and tin lining inspection is carried out;
and after the test is qualified, the X-axis moving mechanism (1) drives the feeding table (81) of the blanking station for chip movement, the inclined motor (203) is adjusted to be vertical, and a first sucking disc (101) is aligned with a first acupoint of a first row and a first column of the feeding table (81) and is sequentially discharged.
CN202310345525.8A 2023-04-03 2023-04-03 A fully automatic chip tinning operation equipment and tinning method thereof Pending CN116618780A (en)

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CN118455684A (en) * 2024-07-15 2024-08-09 宁波中电集创科技有限公司 Full-automatic intelligent tin lining machine for high-precision detection and gold removal of pins of semiconductor chip

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CN213764379U (en) * 2020-10-27 2021-07-23 德州市航星智能设备有限公司 Full-automatic tin-coating and gold-removing equipment
CN214558100U (en) * 2021-04-13 2021-11-02 天津奥峰科技有限公司 Tin coating equipment
CN217193139U (en) * 2021-12-17 2022-08-16 上海威克鲍尔通信科技有限公司 Automatic tin device that wards off of electronic components pin

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US20050230457A1 (en) * 2004-04-16 2005-10-20 Kay Lawrence C Soldering process
CN108754380A (en) * 2018-06-15 2018-11-06 德阳帛汉电子有限公司 A kind of tin plating method and automatic tinning stack
CN211595765U (en) * 2019-12-31 2020-09-29 深圳市艾贝特电子科技有限公司 Automatic gold-washing tin-coating device
CN213764379U (en) * 2020-10-27 2021-07-23 德州市航星智能设备有限公司 Full-automatic tin-coating and gold-removing equipment
CN214558100U (en) * 2021-04-13 2021-11-02 天津奥峰科技有限公司 Tin coating equipment
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CN118455684A (en) * 2024-07-15 2024-08-09 宁波中电集创科技有限公司 Full-automatic intelligent tin lining machine for high-precision detection and gold removal of pins of semiconductor chip
CN118455684B (en) * 2024-07-15 2024-09-20 宁波中电集创科技有限公司 Full-automatic intelligent tin lining machine for high-precision detection and gold removal of pins of semiconductor chip

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