CN116554685A - Bi-component heat-conducting gel and preparation method and application thereof - Google Patents
Bi-component heat-conducting gel and preparation method and application thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims description 9
- 238000001879 gelation Methods 0.000 title 1
- 229920002545 silicone oil Polymers 0.000 claims description 79
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 79
- 229920002554 vinyl polymer Polymers 0.000 claims description 79
- 239000003292 glue Substances 0.000 claims description 43
- 239000000835 fiber Substances 0.000 claims description 35
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 26
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 23
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- 239000001257 hydrogen Substances 0.000 claims description 15
- -1 polydimethylsiloxane Polymers 0.000 claims description 11
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 claims description 9
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 8
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 7
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 238000004898 kneading Methods 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 239000000945 filler Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000013329 compounding Methods 0.000 abstract description 2
- 239000000499 gel Substances 0.000 description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 241000530146 Clerodendrum buchananii Species 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 150000002431 hydrogen Chemical class 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C08K7/00—Use of ingredients characterised by shape
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
Description
技术领域technical field
本发明涉及导电材料技术领域，尤其是涉及一种一种双组分导热凝胶及其制备方法和应用。The invention relates to the technical field of conductive materials, in particular to a two-component thermally conductive gel and its preparation method and application.
背景技术Background technique
在电子器件快速发展的过程中，电子元器件的总功率密度也在不断提高，但其尺寸越来越小，热流密度会不断增加。在这种高温环境下，势必会影响电子元器件的性能指标，为此，需要加强电子元器件的热控制。如何解决电子元器件的散热问题是现阶段的重点。In the process of rapid development of electronic devices, the total power density of electronic components is also increasing, but their size is getting smaller and smaller, and the heat flux density will continue to increase. In such a high-temperature environment, it is bound to affect the performance indicators of electronic components. Therefore, it is necessary to strengthen the thermal control of electronic components. How to solve the heat dissipation problem of electronic components is the focus at this stage.
电子元件的高效散热问题受到传热和流体力学原理的影响。电气设备的散热是控制电子设备的工作温度，以保证其工作的温度和安全，主要涉及散热、材料等不同方面。The problem of efficient cooling of electronic components is influenced by the principles of heat transfer and fluid mechanics. The heat dissipation of electrical equipment is to control the working temperature of electronic equipment to ensure its working temperature and safety, which mainly involves different aspects such as heat dissipation and materials.
通常的导热材料以硅油硅胶为基体，掺入导热陶瓷粉体形成导热胶体。常用的导热陶瓷粉体如氧化铝、氧化镁、氧化锌等。其中这些粉体通常都是球形或类球形的形状。但是这种球形和类球形的填料将导致导热率无法提高。因为热量在球体中出来，要经过基体-导热粉之间的界面热阻，再传导到下一个粉体，经过这个过程，导热能力大大下降。而纤维型连续导热通道成为一种更好的选择。近年来，以碳纤维为主的导热填料被广泛应用于导热垫片，和导热凝胶等产品，并取得了不错的导热效果。然而，碳纤维是导电材料，对于应用在芯片电路板等上面的导热界面材料而言，是一个比较大的缺点。因此，如何选取其他绝缘纤维型材料构造导热凝胶或其他导热材料成为一个非常有意义的课题。The usual heat-conducting material is based on silicone oil and silica gel, mixed with heat-conducting ceramic powder to form heat-conducting colloid. Commonly used heat-conducting ceramic powders such as alumina, magnesium oxide, zinc oxide, etc. These powders are usually spherical or spherical in shape. However, such spherical and quasi-spherical fillers cannot improve the thermal conductivity. Because the heat comes out of the sphere, it has to go through the interface thermal resistance between the substrate and the heat-conducting powder, and then conducts to the next powder. After this process, the thermal conductivity is greatly reduced. The fiber-type continuous heat conduction channel becomes a better choice. In recent years, carbon fiber-based thermally conductive fillers have been widely used in products such as thermally conductive gaskets and thermally conductive gels, and have achieved good thermally conductive effects. However, carbon fiber is a conductive material, which is a relatively large disadvantage for thermal interface materials applied to chip circuit boards and the like. Therefore, how to select other insulating fiber-type materials to construct thermally conductive gels or other thermally conductive materials has become a very meaningful topic.
实际上，近年诞生了一批具有潜在导热性的陶瓷纤维材料，有氧化铝纤维、氮化铝纤维、以及氮化硅纤维这三种。其中氧化铝纤维量产较为常见，氮化铝和氮化硅纤维属于比较罕见的新型材料。经测试表明，形成纤维后，这些材料的导热系数均较粉体时有大幅下降，氧化铝纤维仅为5W/mK，氮化铝为15W/mK，氮化硅为18W/mK的数量级。本专利选用氮化硅这种新型纤维材料构造导热材料。In fact, a batch of ceramic fiber materials with potential thermal conductivity have been born in recent years, including alumina fibers, aluminum nitride fibers, and silicon nitride fibers. Among them, mass production of alumina fiber is more common, and aluminum nitride and silicon nitride fibers are relatively rare new materials. Tests have shown that after forming fibers, the thermal conductivity of these materials is significantly lower than that of powders. The alumina fiber is only 5W/mK, the aluminum nitride is 15W/mK, and the silicon nitride is 18W/mK. This patent selects silicon nitride, a new type of fiber material, to construct the heat-conducting material.
专利CN114106564A公开了一种取向型导热凝胶及其制备方法及应用，通过球形填料和各向异性导热填料在液体树脂中的合理配比分散，制得的取向型导热凝胶具有优良的导热性能的同时保持有较好的挤出性能。Patent CN114106564A discloses an oriented heat-conducting gel and its preparation method and application. The prepared oriented heat-conducting gel has excellent heat-conducting properties through the reasonable proportion dispersion of spherical fillers and anisotropic heat-conducting fillers in liquid resins. While maintaining good extrusion performance.
专利CN114539781A公开了一种导热凝胶及其制备方法，具有低的粘度和适中的触变性，更适合连续化的点胶方式进行操作，同时由于减少使用的填料，从而导热凝胶具有更好的柔韧性。Patent CN114539781A discloses a thermally conductive gel and its preparation method, which has low viscosity and moderate thixotropy, and is more suitable for continuous dispensing. At the same time, due to the reduction of fillers used, the thermally conductive gel has better flexibility.
通常的导热材料以硅油硅胶为基体，掺入导热陶瓷粉体形成导热胶体。常用的导热陶瓷粉体如氧化铝、氧化镁、氧化锌等。其中这些粉体通常都是球形或类球形的形状。但是这种球形和类球形的填料将导致导热率无法提高。因为热量在球体中出来，要经过基体-导热粉之间的界面热阻，再传导到下一个粉体，经过这个过程，导热能力大大下降。而纤维型连续导热通道成为一种更好的选择。近年来，以碳纤维为主的导热填料被广泛应用于导热垫片，和导热凝胶等产品，并取得了不错的导热效果。然而，碳纤维是导电材料，对于应用在芯片电路板等上面的导热界面材料而言，是一个比较大的缺点。因此，如何选取其他绝缘纤维型材料构造导热凝胶或其他导热材料成为一个非常有意义的课题。The usual heat-conducting material is based on silicone oil and silica gel, mixed with heat-conducting ceramic powder to form heat-conducting colloid. Commonly used heat-conducting ceramic powders such as alumina, magnesium oxide, zinc oxide, etc. These powders are usually spherical or spherical in shape. However, such spherical and quasi-spherical fillers cannot improve the thermal conductivity. Because the heat comes out of the sphere, it has to go through the interface thermal resistance between the substrate and the heat-conducting powder, and then conducts to the next powder. After this process, the thermal conductivity is greatly reduced. The fiber-type continuous heat conduction channel becomes a better choice. In recent years, carbon fiber-based thermally conductive fillers have been widely used in products such as thermally conductive gaskets and thermally conductive gels, and have achieved good thermally conductive effects. However, carbon fiber is a conductive material, which is a relatively large disadvantage for thermal interface materials applied to chip circuit boards and the like. Therefore, how to select other insulating fiber-type materials to construct thermally conductive gels or other thermally conductive materials has become a very meaningful topic.
实际上，近年诞生了一批具有潜在导热性的陶瓷纤维材料，有氧化铝纤维、氮化铝纤维、以及氮化硅纤维、氮化硼纤维这四种。经测试发现，氧化铝纤维、氮化铝纤维、以及氮化硅纤维的导热系数均比其体材料陶瓷粉体低不少，成纤维后均低于20W/mK，用于导热凝胶中略低。而氮化硼材料的体材料导热系数达到600W/mK，形成纳米纤维后，据报道，导热率仍然大于100W/mK。In fact, a batch of ceramic fiber materials with potential thermal conductivity have been born in recent years, including alumina fibers, aluminum nitride fibers, silicon nitride fibers, and boron nitride fibers. After testing, it is found that the thermal conductivity of alumina fiber, aluminum nitride fiber, and silicon nitride fiber is much lower than that of ceramic powder, which is the bulk material, and is lower than 20W/mK after fiber formation. Low. While the thermal conductivity of boron nitride materials reaches 600W/mK, after forming nanofibers, it is reported that the thermal conductivity is still greater than 100W/mK.
本发明提供了一种导热凝胶，能够同时协调柔韧性、高导热性、粘结力等问题，提供了一种高效双组分导热凝胶。The invention provides a heat-conducting gel, which can simultaneously coordinate problems such as flexibility, high thermal conductivity, and cohesive force, and provides a high-efficiency two-component heat-conducting gel.
发明内容Contents of the invention
本发明提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：所述A胶包括以下重量百分比的组分：The present invention provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue: the A glue includes the following components by weight percentage:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为400cp的乙烯基硅油 2％Vinyl silicone oil with a viscosity of 400cp 2%
黏度为20cp的乙烯基硅油 8％Vinyl silicone oil with a viscosity of 20cp 8%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
γ-(2,3环氧丙氧)丙基三甲氧基硅烷和硅烷偶联剂KH560的混合物 0.1％Mixture of γ-(2,3 glycidoxy)propyltrimethoxysilane and silane coupling agent KH560 0.1%
平均直径为10～20um的氮化硅纤维 余量。The balance of silicon nitride fibers with an average diameter of 10-20um.
优先的，所述A胶和B胶的质量比为1:(0.75-1.25)。Preferably, the mass ratio of the glue A and glue B is 1:(0.75-1.25).
优先的，所述乙烯基含量为0.21％-0.24％的乙烯基硅油的分子量为4500-8000。Preferably, the vinyl silicone oil with a vinyl content of 0.21%-0.24% has a molecular weight of 4500-8000.
优先的，黏度为1000-2000，所述密度为0.97-0.98g/cm的乙烯基硅油的黏度为1000-2000cp。Preferably, the viscosity is 1000-2000, and the vinyl silicone oil with a density of 0.97-0.98g/cm has a viscosity of 1000-2000cp.
优先的，所述黏度为400cp的乙烯基硅油的分子量为15000，Preferably, the vinyl silicone oil with a viscosity of 400cp has a molecular weight of 15000,
优先的，所述黏度为20cp的乙烯基硅油的分子量为2000。Preferably, the vinyl silicone oil with a viscosity of 20 cp has a molecular weight of 2000.
优先的，氮化硅纤维为导热填料。Preferably, silicon nitride fibers are thermally conductive fillers.
另外一方面所述的双组分导热凝胶的制备方法包括以下步骤：The preparation method of the two-component thermally conductive gel described in another aspect comprises the following steps:
所述A胶的制备方法包括以下步骤：The preparation method of described A glue comprises the following steps:
按比例加入分子量为5000的双氢键甲氧基聚二甲基硅氧烷、分子量为20000的甲基MQ硅树脂、乙烯基含量为0.21％-0.24％的乙烯基硅油、密度为0.97-0.98g/cm的乙烯基硅油、正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物、氮化硅纤维进行混料捏合，得到A胶第一混合料；Add in proportion dihydrogen bond methoxy polydimethylsiloxane with a molecular weight of 5000, methyl MQ silicone resin with a molecular weight of 20000, vinyl silicone oil with a vinyl content of 0.21%-0.24%, and a density of 0.97-0.98 The mixture of g/cm vinyl silicone oil, n-dodecyltrimethoxysilane SCA-K12M, n-hexyltriethoxysilane SCA-K06E, and silicon nitride fiber is mixed and kneaded to obtain the first mixture of glue A ;
将剩余原料投入A胶第一混合料中，进行真空搅拌15分钟，搅拌速度1000rpm，真空度0.2MP，得A胶；Put the remaining raw materials into the first mixture of glue A, and carry out vacuum stirring for 15 minutes at a stirring speed of 1000rpm and a vacuum degree of 0.2MP to obtain glue A;
所述B胶的制备方法包括以下步骤：按比例加入分子量10000的单乙烯基甲氧基聚二甲基硅氧烷、苯基三乙氧基硅烷、黏度为400cp的乙烯基硅油、黏度为20cp的乙烯基硅油、RH-H33含氢硅油、氮化硅纤维进行混料捏合，得到B胶第一混合料；将剩余原料投入混合料中进行真空搅拌15分钟，搅拌速度1000rpm，真空度0.2MP，得B胶。The preparation method of the B glue comprises the following steps: adding monovinylmethoxy polydimethylsiloxane with a molecular weight of 10,000, phenyltriethoxysilane, vinyl silicone oil with a viscosity of 400 cp, and a viscosity of 20 cp in proportion. The vinyl silicone oil, RH-H33 hydrogen-containing silicone oil, and silicon nitride fiber were mixed and kneaded to obtain the first mixture of B glue; the remaining raw materials were put into the mixture and stirred in vacuum for 15 minutes, the stirring speed was 1000rpm, and the vacuum degree was 0.2MP , get B glue.
另外一方面所述的双组分导热凝胶应用于电子元器件和电子设备领域。In another aspect, the two-component thermally conductive gel is applied in the field of electronic components and electronic equipment.
采用上述技术方案，本发明具有如下有益效果：Adopt above-mentioned technical scheme, the present invention has following beneficial effect:
1.本申请中选用不同形貌的填料合理复配，也具有更快的散热功能；1. In this application, fillers with different shapes are selected for reasonable compounding, which also has a faster heat dissipation function;
2.本发明通过在体系中调配不同分子量的有机成分，使得体系各组分之间具有导热桥梁，从而降低了界面热阻。2. The present invention adjusts organic components with different molecular weights in the system, so that there is a thermal conduction bridge between the components of the system, thereby reducing the interface thermal resistance.
具体实施方式Detailed ways
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
实施例1Example 1
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物(比例为1：1) 0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E (ratio 1:1) 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为400cp的乙烯基硅油 2％Vinyl silicone oil with a viscosity of 400cp 2%
黏度为20cp的乙烯基硅油 8％Vinyl silicone oil with a viscosity of 20cp 8%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
γ-(2,3环氧丙氧)丙基三甲氧基硅烷和硅烷偶联剂KH560的混合物(比例为1：1)0.1％Mixture of γ-(2,3 glycidoxy)propyltrimethoxysilane and silane coupling agent KH560 (ratio 1:1) 0.1%
平均直径为10～20um的氮化硅纤维 余量Silicon nitride fibers with an average diameter of 10-20um
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000，黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。The vinyl silicone oil with a molecular weight of 15000 and a viscosity of 400cp and the vinyl silicone oil with a molecular weight of 2000 and a viscosity of 20cp were purchased from Jinan Xingfeilong Chemical Co., Ltd.
实施例2Example 2
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000，黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。The vinyl silicone oil with a molecular weight of 15000 and a viscosity of 400cp and the vinyl silicone oil with a molecular weight of 2000 and a viscosity of 20cp were purchased from Jinan Xingfeilong Chemical Co., Ltd.
实施例3Example 3
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
所述氮化硅纤维的直径大于20微米。The silicon nitride fiber has a diameter greater than 20 microns.
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000，黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。The vinyl silicone oil with a molecular weight of 15000 and a viscosity of 400cp and the vinyl silicone oil with a molecular weight of 2000 and a viscosity of 20cp were purchased from Jinan Xingfeilong Chemical Co., Ltd.
实施例4Example 4
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物(比例为1：1) 0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E (ratio 1:1) 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为400cp的乙烯基硅油 2％Vinyl silicone oil with a viscosity of 400cp 2%
黏度为20cp的乙烯基硅油 8％Vinyl silicone oil with a viscosity of 20cp 8%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
γ-(2,3环氧丙氧)丙基三甲氧基硅烷和硅烷偶联剂KH560的混合物(比例为1：1)0.1％Mixture of γ-(2,3 glycidoxy)propyltrimethoxysilane and silane coupling agent KH560 (ratio 1:1) 0.1%
平均直径为10～20um的氮化硅纤维 余量Silicon nitride fibers with an average diameter of 10-20um
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000，黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。The vinyl silicone oil with a molecular weight of 15000 and a viscosity of 400cp and the vinyl silicone oil with a molecular weight of 2000 and a viscosity of 20cp were purchased from Jinan Xingfeilong Chemical Co., Ltd.
实施例5Example 5
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物(比例为1：1) 0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E (ratio 1:1) 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为400cp的乙烯基硅油 10％Vinyl silicone oil with a viscosity of 400cp 10%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
γ-(2,3环氧丙氧)丙基三甲氧基硅烷和硅烷偶联剂KH560的混合物(比例为1：1)0.1％Mixture of γ-(2,3 glycidoxy)propyltrimethoxysilane and silane coupling agent KH560 (ratio 1:1) 0.1%
平均直径为10～20um的氮化硅纤维 余量Silicon nitride fibers with an average diameter of 10-20um
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000。The molecular weight is 15000, vinyl silicone oil with a viscosity of 400cp and a molecular weight of 2000.
实施例6Example 6
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物(比例为1：1) 0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E (ratio 1:1) 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为400cp的乙烯基硅油 2％Vinyl silicone oil with a viscosity of 400cp 2%
黏度为20cp的乙烯基硅油 8％Vinyl silicone oil with a viscosity of 20cp 8%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
硅烷偶联剂KH560 0.1％Silane coupling agent KH560 0.1%
平均直径为10～20um的氮化硅纤维 余量Silicon nitride fibers with an average diameter of 10-20um
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
所述分子量为15000，黏度为400cp的乙烯基硅油和分子量为2000，黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。The vinyl silicone oil with a molecular weight of 15000 and a viscosity of 400cp and the vinyl silicone oil with a molecular weight of 2000 and a viscosity of 20cp were purchased from Jinan Xingfeilong Chemical Co., Ltd.
实施例7Example 7
本实施例提供一种双组分导热凝胶，所述双组分导热凝胶包括A胶和B胶：This embodiment provides a two-component thermally conductive gel, the two-component thermally conductive gel includes A glue and B glue:
所述A胶包括以下重量百分比的组分：Described A glue comprises the component of following percentage by weight:
分子量为5000的双氢键甲氧基聚二甲基硅氧烷 3％Dihydrogen-bonded methoxypolydimethylsiloxane with a molecular weight of 5000 3%
分子量为20000的甲基MQ硅树脂 9％Methyl MQ silicone resin with a molecular weight of 20000 9%
乙烯基含量为0.21％-0.24％的乙烯基硅油 3％Vinyl silicone oil with a vinyl content of 0.21%-0.24% 3%
密度为0.97-0.98g/cm的乙烯基硅油 7％Vinyl silicone oil with a density of 0.97-0.98g/cm 7%
RH-H503 含氢硅油 0.8％RH-H503 Hydrogen silicone oil 0.8%
正十二烷基三甲氧基硅烷SCA-K12M、正己基三乙氧基硅烷SCA-K06E的混合物(比例为1：1) 0.08％Mixture of n-dodecyltrimethoxysilane SCA-K12M and n-hexyltriethoxysilane SCA-K06E (ratio 1:1) 0.08%
乙炔基环乙醇 0.7％Ethynyl cycloethanol 0.7%
平均直径为10～20um的氮化硅纤维 余量；The remainder of silicon nitride fibers with an average diameter of 10-20um;
所述B胶包括以下重量百分比的组分：Described B glue comprises the component of following percentage by weight:
分子量10000的单乙烯基甲氧基聚二甲基硅氧烷 9％Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000 9%
苯基三乙氧基硅烷 3％Phenyltriethoxysilane 3%
黏度为20cp的乙烯基硅油 10％Vinyl silicone oil with a viscosity of 20cp 10%
RH-H33 含氢硅油 0.7％RH-H33 Hydrogen silicone oil 0.7%
铂金催化剂 1.0％Platinum Catalyst 1.0%
γ-(2,3环氧丙氧)丙基三甲氧基硅烷和硅烷偶联剂KH560的混合物(比例为1：1)0.1％Mixture of γ-(2,3 glycidoxy)propyltrimethoxysilane and silane coupling agent KH560 (ratio 1:1) 0.1%
平均直径为10～20um的氮化硅纤维 余量Silicon nitride fibers with an average diameter of 10-20um
分子量为4500-8000，乙烯基含量为0.21％-0.24％的乙烯基硅油购买自山东博港生物科技有限公司，黏度为1000-2000，密度为0.97-0.98g/cm的乙烯基硅油购买自东莞市蓝硅硅橡胶科技有限公司。Vinyl silicone oil with a molecular weight of 4500-8000 and a vinyl content of 0.21%-0.24% was purchased from Shandong Bogang Biotechnology Co., Ltd. Vinyl silicone oil with a viscosity of 1000-2000 and a density of 0.97-0.98g/cm was purchased from Dongguan City Blue Silicon Silicone Rubber Technology Co., Ltd.
黏度为20cp的乙烯基硅油均购买自济南兴飞隆化工有限公司。Vinyl silicone oil with a viscosity of 20cp was purchased from Jinan Xingfeilong Chemical Co., Ltd.
通过稳态法使用瑞玲的导热系数仪(如下表)测试了样品的导热系数和热阻。The thermal conductivity and thermal resistance of the samples were tested by the steady-state method using Ruiling's thermal conductivity meter (as shown in the table below).
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.
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