CN116498628A - Synthesis method of imaging electronic box - Google Patents

Abstract

A method for synthesizing an imaging electrical box, which relates to the technical field of imaging electrical box synthesis based on space applications, and solves the problem that after the assembly of the existing imaging electrical box, the overlap resistance does not meet the index requirements, and unpacking will easily lead to deformation of the imaging electrical box To further reduce the heat conduction efficiency and electrical connection characteristics of the circuit board, the present invention proposes a method for decomposing and step-by-step link control of the thermal conduction resistance and lap resistance index, establishes a link model of heat conduction and electric lap, and integrates the electric box body board Carry out thermal conduction and electrical bonding application classification, and set reasonable working steps. In the present invention, the electrical box body panels with the electrical lapping function are pre-assembled to determine whether the final electrical lapping index meets the requirements, and then the final assembly is performed after the electrical lapping index meets the requirements. On the one hand, there is no need to wipe Unpacking after gluing, on the other hand, can avoid repeated operations such as cleaning up excess material and dust in the electrical box with a large workload.

Description

A kind of synthesis method of imaging electric box

technical field

The invention relates to the technical field of imaging electric box synthesis based on space application, in particular to a synthesis method of imaging electric box.

Background technique

For the assembly method of stacking and installing circuit boards to form an electric box, the heat generated by each circuit board needs to be transferred through the heat transfer between the circuit board frame and the box body of the electric box, and finally transferred to the external cold-applying plate through the heat pipe; To improve heat conduction efficiency, an insulating heat-conducting glue is usually applied between the circuit board frame and the electric box body plate to fill the gap and increase the conduction area; the lap resistance between the connector on each circuit board and the grounding stake on the electric box , there is a need for a good electrical connection between the circuit board frame and the electrical box body board, which is in contradiction with the heat conduction requirement, and a compromise between the two requirements is required. In addition, after the glued box boards are assembled, it is found that the lap resistance does not meet the index requirements. On the one hand, it is difficult to unpack the glued box, and on the other hand, it is easy to cause deformation of the electric box, which further reduces the thermal conductivity and thermal efficiency of the circuit board. The characteristics of electrical connection; operations such as cleaning up redundant objects and removing dust in the electrical box that require a large workload have to be repeated.

Contents of the invention

In order to solve the problem that the lap resistance does not meet the index requirements after the assembly of the existing imaging electrical box, and the unpacking will easily lead to the deformation of the electrical box and further reduce the heat conduction efficiency and electrical connection characteristics of the circuit board, the present invention provides an imaging imaging electrical box. The synthesis method of electric box.

A method for synthesizing an imaging electric box, the method is realized by the following steps:

Step 1. Thread the single circuit board frame of the imaging electrical box to the connector, and require the lap resistance R between the connector and the single circuit board frame _{→the connector} to be less than or equal to the lap resistance Half of the index; after reaching the requirements of the lap resistance index, apply glue to the screw head at the threaded connection to realize the fixation of the single circuit board frame and the connector;

Step 2. Measure the height of the high-power components on the circuit board, and then conduct research on the height of the boss on the heat-conducting cover to ensure that the distance between the high-power components and the boss on the heat-conducting cover is 0.3-0.35mm; use 0.25 mm insulation heat conduction pad, 0.05 ~ 0.1mm gap is filled with glue;

Step 3, all circuit board frames are installed and fixed on the focal plane substrate to form a whole; the focal plane substrate and each circuit board frame do not perform electrical overlap and heat conduction;

Step 4. Combine the boxes; the specific process is:

Step 41. Pre-close the box, that is: test the _three box panels that are in contact with the connector and the left and right side panels after installation, and require the lap resistance R between the grounding pile and the connector _{. Grounding pile → upper cover} + R _{Cover plate → side plate} is less than or equal to the lap resistance index;

Step 42. Apply glue to the side walls of the frame that are in contact with the large heat pipes on the left and right side panels, install the remaining cabinet panels and corresponding detector heat pipes, and finally install the light entrance cabinet panels;

Step 43: Thermal control wiring, clean dust inside the electrical box, install the light inlet side box board, re-test the lap resistance, screw glue to prevent loosening, and thermal control box wiring to complete the box assembly.

Beneficial effects of the present invention:

1. In the present invention, multiple electric box body panels are divided into two types, each of which is used for heat conduction and electrical lapping, and simultaneously meets the heat dissipation requirements of high-power components in the electric box and the electromagnetic compatibility performance of the electric box;

2. In the method of the present invention, by establishing the lap resistance model of the electric box, the control is carried out step by step and link to ensure that the final lap index meets the application requirements; the work efficiency is improved and the workload of rework is reduced at the same time.

3. In the present invention, the electric box body panels with the electric lap function are pre-assembled to determine whether the final electric lap index meets the requirements, and the final assembly is performed after the electric lap index meets the requirements. On the one hand, it does not It is necessary to unpack the box after applying the glue. On the other hand, it can avoid repeated operations such as cleaning up excess material and dust in the electrical box with a large workload.

Description of drawings

Fig. 1 is the structural representation of imaging electric box in the synthetic method of a kind of imaging electric box of the present invention;

Fig. 2 is a schematic diagram of the connection relationship between the electric box side plate, the circuit board frame and the connector in the imaging electric box of the present invention;

Fig. 3 is a heat transfer path diagram of a high-power chip in a synthesis method of an imaging electric box according to the present invention.

Detailed ways

1 to 3 illustrate this embodiment, a synthesis method of an imaging electrical box, and FIG. 1 is a diagram of an imaging electrical box of the present invention, which consists of an upper cover plate 1, a lower cover plate 2 and a plurality of side plates 3 to form an approximation Closed body; the upper cover plate 1 is equipped with grounding stakes 4 . Multiple side plates include a heat conduction cover dedicated to heat conduction, a heat conduction cover dedicated to electrical bonding, and a light entrance plate. The light entrance plate is facing the detector in the electrical box, and the external light is irradiated on the detector through the light entrance plate;

In this embodiment, the lap resistance and thermal conduction resistance models are established

The lap resistance model requires less than or equal to the lap resistance index:

R _{electrical box} = R _{ground pile → upper cover} + R _{upper cover → side plate} + R _{side plate → veneer frame} + R _{veneer frame → connector}

Thermal conduction resistance model:

θ _chip = θ _{chip → heat conduction cover} + θ _{heat conduction cover → plate frame} + θ _{plate frame → large heat pipe side wall} + θ _{large heat pipe side wall → large heat pipe}

In the formula, R _{electric box} is the lap resistance between the ground stake on the electric box and the connector; it is the lap resistance between the R _{ground stake → the ground stake on the upper cover} electric box and the _upper cover plate; _{Cover plate → side plate} is the lap resistance between the upper cover plate and the side plate of the electric box; R _{side plate → veneer frame} is the lap resistance between the side plate of the electric box and the veneer frame; R _{veneer Frame → connector} is the lap resistance between the connector and the board frame; θ _chip is the thermal conduction resistance of the high-power chip; θ _{chip → heat conduction cover} is the heat conduction resistance between the high-power chip and the heat conduction cover; θ _{Heat conduction cover → plate frame} is the heat conduction resistance between plate frame and heat conduction cover; θ _{plate frame → large heat pipe side wall} is the heat conduction resistance between plate frame and electric box side wall; θ _{large heat pipe side wall → large heat pipe} is Thermal conduction resistance between the large heat pipe and the side wall of the electrical box.

In this embodiment, the steps of closing the electric box are as follows:

Step 1: For a single circuit board frame, during the installation of the connector, it is required that the fixed screw thread is not glued, and only glue is applied to the nail head after fastening; after the installation is completed, the test requires the connection between the connector and the frame. Lap resistance R _{veneer board frame → connector} is less than or equal to half of the lap resistance index; if not satisfied, it needs to be dealt with (increasing torque or grinding the contact surface, etc.) to ensure that the index requirements are finally met;

Step 2: Measure the height of the high-power components on the circuit board, and then repair the height of the boss on the heat-conducting cover to ensure that the spacing is 0.3-0.35mm; use a 0.25mm insulating heat-conducting pad, and use a 0.05-0.1mm gap glue filling;

Step 3: All circuit boards are installed and fixed on the focal plane substrate to form a whole; the focal plane substrate and the circuit board do not conduct electrical laps and heat conduction;

As shown in Figure 2, in this embodiment, the connector and the circuit board frame are tightly connected together; on the side plate of the electric box, a hole will be made at the position where the connector is located to expose the part of the connector; the circuit board The plate frame and the side plate of the electric box are fixedly connected by screws, that is, the connection between the connector and the side plate of the electric box is mainly connected by means of the circuit board plate frame to realize the connection between the two. To reduce the lap resistance between the connector and the side plate of the electric box, it is necessary to reduce the lap resistance between the connector and the circuit board frame, and at the same time reduce the lap resistance between the circuit board frame and the side plate of the electric box. lap resistance.

Step 4: Close the box.

(1) Pre-closed box, after installing the three box panels and the left and right titanium alloy side panels that are in contact with the connector, test it. It is required that the lap resistance R between the grounding pile and the connector _{is grounding pile → upper cover} + R _{upper cover Plate → side plate} is less than or equal to the lap resistance index; if it is not satisfied, it needs to be dealt with to ensure that the index requirements are finally met;

(2) Only apply glue on the side wall of the plate frame that is in contact with the two heat pipe box plates, and control the thickness of the glue to ensure that the glue will not overflow to other positions;

(3) Install the remaining cabinet boards and corresponding detector heat pipes, and install the light entrance cabinet board last;

(4) Thermal control wiring;

(5) For the operation of cleaning dust in the electric box, install the box plate on the side of the light entrance;

(6) Overlap resistance retest;

(7) Screw dispensing and anti-loosening;

(8) The wiring of the thermal control box.

In this embodiment, the imaging controller adopts the virtex6 device and its internal resources; the TDICMOS image sensor adopts the customized product of Changguang Chenxin Company; The PC of the CameraLink acquisition card is used for image acquisition and processing; the temperature controller uses a high and low temperature box.

Claims (3)

1. A synthetic method of an imaging electronic box is characterized in that: the synthesis method is realized by the following steps:

step one, a single circuit board frame of an imaging electric box is connected with a connector in a threaded manner, and the lap joint resistance R between the connector and the single circuit board frame is required _{Single board frame-connector} Less than or equal to half of the overlap resistance index; after meeting the lapping resistance index requirement, dispensing glue on screw heads at the threaded connection part to fix the single circuit board frame and the connector;

step two, measuring the height of the high-power components on the circuit board, and then repairing and grinding the height of the boss on the heat conduction cover plate to ensure that the distance between the high-power components and the boss on the heat conduction cover plate is 0.3-0.35 mm; an insulating heat conducting pad with the thickness of 0.25mm is used, and a gap with the thickness of 0.05-0.1 mm is filled with glue;

step three, all the circuit board frames are installed and fixed on the focal plane substrate to form a whole; the focal plane substrate and each circuit board frame are not electrically overlapped and thermally conducted;

step four, assembling the box; the specific process is as follows:

step four, pre-assembling a box, namely: after the three box body plates contacted with the connector and the left side plate and the right side plate are mounted, testing is carried out, and the lap joint resistance R of the grounding pile and the connector is required _{Grounding pile-upper cover plate} +R _{Upper cover plate → side plate} The overlap resistance index is smaller than or equal to the overlap resistance index;

step four, gluing the side walls of the plate frame contacted with the large heat pipes on the left side plate and the right side plate, installing other box body plates and corresponding detector heat pipes, and finally installing the box body plate with the light inlet;

and step four, carrying out thermal control wiring, cleaning dust in the electric box, installing a box body plate at the side of the light inlet, retesting the lap resistance, dispensing and loosening screws, and carrying out thermal control box wiring to complete box closing.

2. The method for synthesizing the imaging electronic box according to claim 1, wherein the method comprises the following steps: establishing a lap joint resistance model of the imaging electric box, wherein the lap joint resistance is required to be smaller than or equal to the lap joint resistance index;

R _{electric box} ＝R _{Grounding pile-upper cover plate} +R _{Upper cover plate → side plate} +R _{Side plate-single plate frame} +R _{Single board frame-connector}

Wherein R is _{Electric box} R is the overlap resistance between the grounding pile and the connector on the electric box _{Grounding pile-upper cover plate} R is the overlap resistance between the grounding pile and the upper cover plate on the electric box _{Upper cover plate → side plate} R is the lap resistance between the upper cover plate and the side plate of the electric box _{Side plate-single plate frame} R is the lap resistance between the side plate of the electric box and the single circuit board frame _{Single board frame-connector} Is the overlap resistance between the connector and the single board frame.

3. The method for synthesizing the imaging electronic box according to claim 1, wherein the method comprises the following steps: establishing a thermal conduction resistance model of the imaging electric box:

θ _chip ＝θ _{Chip-heat conducting cover plate} +θ _{Heat conducting cover plate-plate frame} +θ _{Plate frame-side wall of large heat pipe} +θ _{Side wall of big heat pipe → big heat pipe}

In θ _Chip Is the heat conduction resistance of the high-power chip; θ _{Chip-heat conducting cover plate} The heat conduction resistor is between the high-power chip and the heat conduction cover plate; θ _{Heat conducting cover plate-plate frame} The heat conduction resistor is arranged between the circuit board frame and the heat conduction cover plate; θ _{Plate frame-side wall of large heat pipe} Is a heat conduction resistance between the side wall of the electric box and the side wall of the electric box; θ _{Side wall of big heat pipe → big heat pipe} Is the heat conduction resistance between the large heat pipe and the side wall of the electric box.