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CN116321676A - Circuit board assembly, radiation spurious emission anomaly detection method and electronic device - Google Patents

Circuit board assembly, radiation spurious emission anomaly detection method and electronic device Download PDF

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Publication number
CN116321676A
CN116321676A CN202310032167.5A CN202310032167A CN116321676A CN 116321676 A CN116321676 A CN 116321676A CN 202310032167 A CN202310032167 A CN 202310032167A CN 116321676 A CN116321676 A CN 116321676A
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signals
signal
circuit board
microstrip antenna
harmonic
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贺晨阳
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202310032167.5A priority Critical patent/CN116321676A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08Measuring electromagnetic field characteristics
    • G01R29/0807Measuring electromagnetic field characteristics characterised by the application
    • G01R29/0814Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08Measuring electromagnetic field characteristics
    • G01R29/0864Measuring electromagnetic field characteristics characterised by constructional or functional features
    • G01R29/0892Details related to signal analysis or treatment; presenting results, e.g. displays; measuring specific signal features other than field strength, e.g. polarisation, field modes, phase, envelope, maximum value
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04KSECRET COMMUNICATION; JAMMING OF COMMUNICATION
    • H04K3/00Jamming of communication; Counter-measures
    • H04K3/60Jamming involving special techniques
    • H04K3/68Jamming involving special techniques using passive jamming, e.g. by shielding or reflection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The application discloses a circuit board assembly, a radiation stray emission anomaly detection method and electronic equipment. The circuit board assembly includes: a main board, on which a signal detection circuit is arranged; the shielding cover is arranged above the main board and connected with the main board, and a cavity is formed by enclosing the shielding cover and the main board; the bracket is arranged above the shielding cover and connected with the main board, a signal processing circuit is arranged on the bracket and is used for receiving stray signals leaked from the shielding cover, filtering the stray signals to obtain harmonic signals, and sending the harmonic signals to the signal detection circuit; the signal detection circuit is used for receiving the harmonic signals, detecting the energy of the harmonic signals, and determining that the electronic equipment has radiation spurious emission abnormality when the energy of the harmonic signals exceeds a threshold value. According to the electronic device, the signal processing circuit is arranged on the support, and the signal detection circuit is arranged on the main board, so that whether the electronic device is abnormal in radiation spurious emission or not can be detected in real time.

Description

电路板组件、辐射杂散发射异常检测方法及电子设备Circuit board assembly, radiation spurious emission anomaly detection method and electronic device

技术领域technical field

本申请属于电子技术领域,具体涉及一种电路板组件、辐射杂散发射异常检测方法及电子设备。The application belongs to the field of electronic technology, and in particular relates to a circuit board assembly, a method for detecting abnormal radiation stray emission, and electronic equipment.

背景技术Background technique

射频干扰是目前移动通信行业的痛点和难点问题,一台电子设备产生的射频干扰有可能会严重影响其他电子设备的正常通信。射频干扰类的认证测试项(EMC测试)也是所有厂商最为关注的认证测试项之一。而其中属辐射杂散发射(Radiated SpuriousEmission,RSE)最为严格并且易出问题。Radio frequency interference is a sore point and difficult problem in the mobile communication industry at present. The radio frequency interference generated by one electronic device may seriously affect the normal communication of other electronic devices. The radio frequency interference certification test item (EMC test) is also one of the certification test items most concerned by all manufacturers. Among them, Radiated Spurious Emission (RSE) is the most stringent and prone to problems.

在电子设备的生产过程中,厂商会测试电子设备的RSE水平。但是在电子设备生产完毕后,由于运输、环境湿度等原因可能会导致电子设备出现RSE异常。厂商在电子设备生产完毕后无法检测电子设备的RSE水平。During the production process of electronic equipment, manufacturers will test the RSE level of electronic equipment. However, after the electronic equipment is produced, RSE abnormality may occur in the electronic equipment due to reasons such as transportation and environmental humidity. The manufacturer cannot detect the RSE level of the electronic equipment after the production of the electronic equipment is completed.

发明内容Contents of the invention

本申请旨在提供一种电路板组件、辐射杂散发射异常检测方法及电子设备,以解决在电子设备生产完毕后无法检测电子设备的RSE水平的问题。The present application aims to provide a circuit board assembly, a method for detecting abnormal radiation stray emission and electronic equipment, so as to solve the problem that the RSE level of the electronic equipment cannot be detected after the electronic equipment is produced.

为了解决上述技术问题,本申请是这样实现的:In order to solve the above-mentioned technical problems, the application is implemented as follows:

第一方面,本申请实施例提出了一种电路板组件,包括:In the first aspect, the embodiment of the present application proposes a circuit board assembly, including:

主板,所述主板上设有信号检测电路;A main board, the main board is provided with a signal detection circuit;

屏蔽罩,设置在所述主板上方并与所述主板连接,所述屏蔽罩与所述主板之间围合形成腔体;A shielding cover is arranged above the main board and connected to the main board, and a cavity is formed between the shielding cover and the main board;

支架,设置在所述屏蔽罩上方并与所述主板连接,所述支架上设有信号处理电路,所述信号处理电路用于接收从所述屏蔽罩处泄露的杂散信号,对所述杂散信号进行滤波处理得到谐波信号,将所述谐波信号发送至所述信号检测电路;a bracket, arranged above the shielding cover and connected to the main board, a signal processing circuit is provided on the bracket, the signal processing circuit is used to receive stray signals leaked from the shielding cover, and filter the scattered signal to obtain a harmonic signal, and send the harmonic signal to the signal detection circuit;

所述信号检测电路用于接收所述谐波信号,检测所述谐波信号的能量,在所述谐波信号的能量超过阈值时确定电子设备出现辐射杂散发射异常。The signal detection circuit is used to receive the harmonic signal, detect the energy of the harmonic signal, and determine that the electronic device has abnormal radiation spurious emission when the energy of the harmonic signal exceeds a threshold.

第二方面,本申请实施例提出了一种辐射杂散发射异常检测方法,所述辐射杂散发射异常检测方法应用于本发明第一方面所述的电路板组件,所述方法包括:接收从屏蔽罩处泄露的杂散信号;对所述杂散信号进行滤波处理得到谐波信号;检测所述谐波信号的能量;在所述谐波信号的能量超过阈值的情况下,确定电子设备出现辐射杂散发射异常。In the second aspect, an embodiment of the present application proposes a method for detecting abnormal spurious emission of radiation, which is applied to the circuit board assembly described in the first aspect of the present invention, and the method includes: receiving from A stray signal leaked from the shield; filter the stray signal to obtain a harmonic signal; detect the energy of the harmonic signal; and determine that the electronic device is present when the energy of the harmonic signal exceeds a threshold Radiation spurious emission anomalies.

第三方面,本申请实施例提出了一种电子设备,包括本发明第一方面所述的电路板组件。In a third aspect, the embodiment of the present application provides an electronic device, including the circuit board assembly described in the first aspect of the present invention.

在本申请的实施例中,通过在主板上设置支架,支架上设有可用于接收从屏蔽罩处泄露的杂散信号的信号处理电路,信号处理电路可以对杂散信号进行滤波处理得到谐波信号,并将谐波信号发送至主板上的信号检测电路,信号检测电路检测接收到的谐波信号的能量,在谐波信号的能量超过阈值时确定电子设备出现辐射杂散发射异常,在电子设备生产完毕后也可以实时检测电子设备是否出现辐射杂散发射异常。In the embodiment of the present application, by setting the bracket on the main board, the bracket is provided with a signal processing circuit that can receive the stray signal leaked from the shield, and the signal processing circuit can filter the stray signal to obtain the harmonic signal, and send the harmonic signal to the signal detection circuit on the motherboard, the signal detection circuit detects the energy of the received harmonic signal, and when the energy of the harmonic signal exceeds the threshold, it is determined that the electronic device has an abnormal radiation spurious emission. After the equipment is produced, it is also possible to detect in real time whether the electronic equipment has abnormal radiation spurious emissions.

本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

附图说明Description of drawings

本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and understandable from the description of the embodiments in conjunction with the following drawings, wherein:

图1是本发明实施例中一种电路板组件的示意图;Fig. 1 is a schematic diagram of a circuit board assembly in an embodiment of the present invention;

图2是本发明实施例中另一种电路板组件的示意图;Fig. 2 is the schematic diagram of another kind of circuit board assembly in the embodiment of the present invention;

图3是本发明实施例中信号处理电路的示意图;3 is a schematic diagram of a signal processing circuit in an embodiment of the present invention;

图4是本发明实施例中微带带通滤波器的示意图;Fig. 4 is the schematic diagram of microstrip bandpass filter in the embodiment of the present invention;

图5是本发明实施例中又一种电路板组件的示意图。FIG. 5 is a schematic diagram of another circuit board assembly in an embodiment of the present invention.

附图标记:Reference signs:

100-主板;101-第三微带天线;102-收发器;200-屏蔽罩;201-开口;300-支架;301-第一微带天线;302-微带带通滤波器;303-第二微带天线。100-mainboard; 101-third microstrip antenna; 102-transceiver; 200-shielding cover; 201-opening; 300-bracket; 301-first microstrip antenna; 302-microstrip bandpass filter; Two microstrip antennas.

具体实施方式Detailed ways

下面将详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。Embodiments of the present invention will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and therefore should not be construed as limiting the invention.

在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

下面结合图1-图5描述根据本申请实施例提供的电路板组件、辐射杂散发射异常检测方法和电子设备。The following describes a circuit board assembly, a radiation spurious emission abnormality detection method and an electronic device according to an embodiment of the present application with reference to FIGS. 1 to 5 .

根据本发明的一个实施例,提供了一种电路板组件。如图1所示,所述电路板组件包括:主板100,所述主板上设有信号检测电路。屏蔽罩200,设置在所述主板100上方并与所述主板100连接,所述屏蔽罩200与所述主板100之间围合形成腔体。支架300,设置在所述屏蔽罩200上方并与所述主板100连接,所述支架300上设有信号处理电路,所述信号处理电路用于接收从所述屏蔽罩200处泄露的杂散信号,对所述杂散信号进行滤波处理得到谐波信号,将所述谐波信号发送至所述信号检测电路。所述信号检测电路用于接收所述谐波信号,检测所述谐波信号的能量,在所述谐波信号的能量超过阈值时确定电子设备出现辐射杂散发射异常。According to one embodiment of the present invention, a circuit board assembly is provided. As shown in FIG. 1 , the circuit board assembly includes: a main board 100 on which a signal detection circuit is arranged. The shielding case 200 is disposed above the main board 100 and connected to the main board 100 , and a cavity is formed between the shielding case 200 and the main board 100 . The bracket 300 is arranged above the shielding cover 200 and connected to the main board 100 , the bracket 300 is provided with a signal processing circuit, and the signal processing circuit is used to receive stray signals leaked from the shielding cover 200 and performing filtering processing on the stray signal to obtain a harmonic signal, and sending the harmonic signal to the signal detection circuit. The signal detection circuit is used to receive the harmonic signal, detect the energy of the harmonic signal, and determine that the electronic device has abnormal radiation spurious emission when the energy of the harmonic signal exceeds a threshold.

支架300可以通过卡扣结构卡接在主板100上,支架300也可以通过螺钉固定在主板100上,支架300与主板100之间也可以使用其它连接方式,本实施例对支架与主板的连接方式不做限定。支架300与屏蔽罩200之间可以有间隙,支架300与主板100之间也可以有间隙,间隙的大小可以根据实际需求进行设置。The bracket 300 can be clamped on the main board 100 through a buckle structure, and the bracket 300 can also be fixed on the main board 100 by screws. Other connection methods can also be used between the bracket 300 and the main board 100. In this embodiment, the connection mode between the bracket and the main board No limit. There may be a gap between the bracket 300 and the shielding cover 200, and there may be a gap between the bracket 300 and the main board 100, and the size of the gap may be set according to actual requirements.

屏蔽罩200可以焊接在主板100上。在屏蔽罩200与主板100之间的焊接不牢固的情况下,从屏蔽罩200处会泄露出杂散信号。支架300上的信号处理电路会接收到杂散信号。信号处理电路对杂散信号进行滤波处理,得到谐波信号。信号处理电路将谐波信号发送至主板100上的信号检测电路,通过主板100上的信号检测电路检测谐波信号的能量,如果谐波信号的能量超过阈值,那么说明电子设备出现辐射杂散发射异常。在检测到电子设备出现辐射杂散发射异常后,可以将检测结果上报给电子设备的生产厂家,方便厂家回收,减少市面上出现的不良产品。The shielding case 200 can be welded on the main board 100 . If the soldering between the shielding case 200 and the main board 100 is weak, stray signals may leak from the shielding case 200 . The signal processing circuit on the bracket 300 will receive stray signals. The signal processing circuit filters the stray signals to obtain harmonic signals. The signal processing circuit sends the harmonic signal to the signal detection circuit on the main board 100, and detects the energy of the harmonic signal through the signal detection circuit on the main board 100. If the energy of the harmonic signal exceeds a threshold value, it means that the electronic device has radiated spurious emissions. abnormal. After detecting abnormal radiation spurious emission of electronic equipment, the detection result can be reported to the manufacturer of the electronic equipment, which is convenient for the manufacturer to recycle and reduce the defective products on the market.

根据本发明实施例的电路板组件,通过在主板上设置支架,支架上设有可用于接收从屏蔽罩处泄露的杂散信号的信号处理电路,信号处理电路可以对杂散信号进行滤波处理得到谐波信号,并将谐波信号发送至主板上的信号检测电路,信号检测电路检测接收到的谐波信号的能量,在谐波信号的能量超过阈值时确定电子设备出现辐射杂散发射异常,在电子设备生产完毕后也可以实时检测电子设备是否出现辐射杂散发射异常。According to the circuit board assembly of the embodiment of the present invention, by setting the bracket on the main board, the bracket is provided with a signal processing circuit that can be used to receive the stray signal leaked from the shield, and the signal processing circuit can filter the stray signal to obtain Harmonic signal, and send the harmonic signal to the signal detection circuit on the main board, the signal detection circuit detects the energy of the received harmonic signal, and when the energy of the harmonic signal exceeds the threshold, it is determined that the electronic device has an abnormal radiation spurious emission, After the electronic equipment is produced, it is also possible to detect in real time whether the electronic equipment has abnormal radiation spurious emission.

可选地,如图2所示,所述屏蔽罩200具有开口201,所述信号处理电路包括:第一微带天线301,设置在所述屏蔽罩200的开口201的上方或者屏蔽罩200边缘处,用于接收所述杂散信号;微带带通滤波器302,所述微带带通滤波器302的第一端与所述第一微带天线301连接,用于过滤所述泄露信号中基波频率的信号,输出谐波信号;第二微带天线303,与所述微带带通滤波器302的第二端连接,用于将所述谐波信号传递至所述信号检测电路。Optionally, as shown in FIG. 2 , the shielding case 200 has an opening 201, and the signal processing circuit includes: a first microstrip antenna 301 disposed above the opening 201 of the shielding case 200 or at the edge of the shielding case 200 place, for receiving the spurious signal; microstrip bandpass filter 302, the first end of the microstrip bandpass filter 302 is connected to the first microstrip antenna 301, for filtering the leakage signal The signal at the fundamental frequency is output as a harmonic signal; the second microstrip antenna 303 is connected to the second end of the microstrip bandpass filter 302, and is used to transmit the harmonic signal to the signal detection circuit .

屏蔽罩200具有开口201,在支架300上与开口201相对的位置设置第一微带天线301。杂散信号会从屏蔽罩200上的开口201处泄露出,将第一微带天线301设置在开口201上方,可以便于第一微带天线301接收杂散信号。The shielding case 200 has an opening 201 , and a first microstrip antenna 301 is disposed on the support 300 at a position opposite to the opening 201 . The stray signal will leak out from the opening 201 on the shielding cover 200, and the first microstrip antenna 301 is arranged above the opening 201, which can facilitate the first microstrip antenna 301 to receive the stray signal.

杂散信号还可能从屏蔽罩200的边缘处泄露,也可以将第一微带天线301设置在屏蔽罩200边缘处,让第一微带天线301可以接收从屏蔽罩200边缘处泄露的杂散信号。为了保证能够接收从屏蔽罩200任意位置泄露的杂散信号,可以在屏蔽罩200的开口201上方以及屏蔽罩200边缘处都设置第一微带天线301。Stray signals may also leak from the edge of the shield 200, and the first microstrip antenna 301 can also be arranged at the edge of the shield 200, so that the first microstrip antenna 301 can receive the stray signal leaked from the edge of the shield 200. Signal. In order to ensure that stray signals leaked from any position of the shielding case 200 can be received, a first microstrip antenna 301 can be provided above the opening 201 of the shielding case 200 and at the edge of the shielding case 200 .

如图3所示,微带带通滤波器302的第一端通过微带线与第一微带天线301连接。微带带通滤波器302的第二端通过微带线与第二微带天线302连接。在第一微带天线301接收到杂散信号后,通过微带线将杂散信号传输至微带带通滤波器302。微带带通滤波器302对杂散信号进行滤波处理,得到谐波信号,通过微带线将谐波信号传输至第二微带天线303。第二微带天线303将谐波信号发送至主板100上的信号检测电路。As shown in FIG. 3 , the first end of the microstrip bandpass filter 302 is connected to the first microstrip antenna 301 through a microstrip line. The second end of the microstrip bandpass filter 302 is connected to the second microstrip antenna 302 through a microstrip line. After the first microstrip antenna 301 receives the spurious signal, the spurious signal is transmitted to the microstrip bandpass filter 302 through the microstrip line. The microstrip bandpass filter 302 filters the spurious signals to obtain harmonic signals, and transmits the harmonic signals to the second microstrip antenna 303 through the microstrip line. The second microstrip antenna 303 sends the harmonic signal to the signal detection circuit on the main board 100 .

在一个例子中,如图3所示,微带带通滤波器302为5阶切比雪夫发夹型带通滤波器。微带带通滤波器302包括5个发夹谐振器,通过将半波长阶梯阻抗谐振器耦合结构折合成U字形来得到发夹谐振器。微带带通滤波器302的性能由各个发夹谐振器的结构参数确定。如图4所示,发夹谐振器的臂长为L,发夹谐振器的间距为S,发夹谐振器的线宽为W,抽头位置为t。通过调整发夹型带通滤波器的结构尺寸,可以调整发夹型带通滤波器的频率响应。发夹谐振器的臂长L计算公式如下:In one example, as shown in FIG. 3 , the microstrip bandpass filter 302 is a fifth-order Chebyshev hairpin bandpass filter. The microstrip bandpass filter 302 includes five hairpin resonators, and the hairpin resonators are obtained by converting the half-wavelength stepped impedance resonator coupling structure into a U-shape. The performance of the microstrip bandpass filter 302 is determined by the structural parameters of each hairpin resonator. As shown in Fig. 4, the arm length of the hairpin resonator is L, the spacing of the hairpin resonators is S, the line width of the hairpin resonator is W, and the tap position is t. By adjusting the structural size of the hairpin bandpass filter, the frequency response of the hairpin bandpass filter can be adjusted. The formula for calculating the arm length L of a hairpin resonator is as follows:

Figure BDA0004041805030000061
Figure BDA0004041805030000061

Figure BDA0004041805030000062
Figure BDA0004041805030000062

其中,h是微带结构的介质板板厚,εr是介质的相对介电常数,λ0为滤波器中心频率点的自由空间传播波长。抽头位置t的计算公式如下:Among them, h is the thickness of the dielectric plate of the microstrip structure, ε r is the relative permittivity of the medium, and λ 0 is the free-space propagation wavelength at the center frequency point of the filter. The calculation formula of the tap position t is as follows:

Figure BDA0004041805030000063
Figure BDA0004041805030000063

其中,R是抽头线的特性阻抗,Z0是发夹谐振器的特性阻抗,Q是发夹谐振器的外部耦合系数。Among them, R is the characteristic impedance of the tap line, Z0 is the characteristic impedance of the hairpin resonator, and Q is the external coupling coefficient of the hairpin resonator.

本实施例通过将第一微带天线设置在屏蔽罩开口上方,让第一微带天线能够更容易接收到从屏蔽罩开口处泄露的杂散信号,提高对电子设备辐射杂散发射异常的检测精度。In this embodiment, by arranging the first microstrip antenna above the opening of the shielding cover, the first microstrip antenna can more easily receive the stray signal leaked from the opening of the shielding cover, and improve the detection of abnormal radiation spurious emission of electronic equipment precision.

可选地,如图5所示,所述信号检测电路包括:第三微带天线101,设置在所述主板100上与所述第二微带天线303相对的位置,所述第三微带天线101在所述屏蔽罩200的外侧,用于接收所述第二微带天线303发送的所述谐波信号。收发器102,与所述第三微带天线101连接,用于检测所述谐波信号的能量,在所述谐波信号的能量超过阈值时确定电子设备出现辐射杂散发射异常。Optionally, as shown in FIG. 5 , the signal detection circuit includes: a third microstrip antenna 101, arranged on the motherboard 100 at a position opposite to the second microstrip antenna 303, and the third microstrip antenna The antenna 101 is outside the shielding case 200 and used to receive the harmonic signal sent by the second microstrip antenna 303 . The transceiver 102 is connected to the third microstrip antenna 101 and is configured to detect the energy of the harmonic signal, and determine that the electronic device has abnormal radiation spurious emission when the energy of the harmonic signal exceeds a threshold.

在主板100上设有第三微带天线101和收发器102。第三微带天线101设置在主板100上与第二微带天线303相对的位置。具体地,第三微带天线101可以设置在第二微带天线303的下方。收发器102可以设置在主板100上的任意位置。A third microstrip antenna 101 and a transceiver 102 are provided on the main board 100 . The third microstrip antenna 101 is disposed on the main board 100 opposite to the second microstrip antenna 303 . Specifically, the third microstrip antenna 101 may be disposed below the second microstrip antenna 303 . The transceiver 102 can be arranged at any position on the motherboard 100 .

第三微带天线101可以接收第二微带天线303发送的谐波信号。第三微带天线101通过微带线与收发器102连接,第三微带天线101可以将接收到的谐波信号通过微带线发送至收发器102,通过收发器102检测谐波信号的能量。如果检测到谐波信号的能量超过阈值,判断电子设备出现辐射杂散发射异常。The third microstrip antenna 101 can receive the harmonic signal sent by the second microstrip antenna 303 . The third microstrip antenna 101 is connected with the transceiver 102 through the microstrip line, the third microstrip antenna 101 can send the received harmonic signal to the transceiver 102 through the microstrip line, and detect the energy of the harmonic signal by the transceiver 102 . If it is detected that the energy of the harmonic signal exceeds the threshold, it is determined that the electronic device has abnormal radiation spurious emission.

本实施例通过将第三微带天线设置在主板上与第二微带天线相对的位置,便于第三微带天线接收第二微带天线发送的谐波信号。In this embodiment, by arranging the third microstrip antenna on the main board at a position opposite to the second microstrip antenna, it is convenient for the third microstrip antenna to receive the harmonic signal sent by the second microstrip antenna.

可选地,如图5所示,所述收发器102设置在所述腔体内,所述收发器102通过微带线与所述第三微带天线101连接。Optionally, as shown in FIG. 5 , the transceiver 102 is disposed in the cavity, and the transceiver 102 is connected to the third microstrip antenna 101 through a microstrip line.

收发器102设置在屏蔽罩200与主板100围合形成的腔体内,收发器102在屏蔽罩200下方。在收发器102内设有接收机电路,可以对谐波信号进行放大、混频、滤波和检波,从而获得谐波信号的频率和能量信息,进而判断电子设备是否出现辐射杂散发射异常。The transceiver 102 is disposed in the cavity formed by the shielding case 200 and the motherboard 100 , and the transceiver 102 is under the shielding case 200 . There is a receiver circuit in the transceiver 102, which can amplify, mix, filter and detect the harmonic signal, so as to obtain the frequency and energy information of the harmonic signal, and then judge whether the electronic device has abnormal radiation spurious emission.

收发器在工作时会产生射频信号,本实施例通过将收发器设置在屏蔽罩与主板围合形成的腔体内,屏蔽收发器的射频干扰,让收发器正常工作。The transceiver generates radio frequency signals when it is working. In this embodiment, the transceiver is placed in the cavity formed by the shielding cover and the main board to shield the radio frequency interference of the transceiver and allow the transceiver to work normally.

可选地,所述微带带通滤波器为发夹型带通滤波器、交指型带通滤波器、SIR(Stepped Impedance Resonators,阶梯阻抗谐振器)平行耦合带通滤波器中任意一种。Optionally, the microstrip bandpass filter is any one of a hairpin bandpass filter, an interdigitated bandpass filter, and a SIR (Stepped Impedance Resonators, stepped impedance resonator) parallel coupled bandpass filter .

可选地,所述屏蔽罩200具有多个开口201,在所述支架300上与每个开口201对应的位置都设有所述第一微带天线301。Optionally, the shielding case 200 has a plurality of openings 201 , and the first microstrip antenna 301 is provided at a position corresponding to each opening 201 on the bracket 300 .

在屏蔽罩200上可以有多个开口201,当出现杂散泄露时,杂散信号可以从屏蔽罩200的多个开口201向外泄露。在支架300上与每个开口201对应的位置都设有第一微带天线301,第一微带天线301可以接收对应开口201处泄露的杂散信号。比如在屏蔽罩200上设有四个开口201,那么在支架300上设有四个第一微带天线301。每个第一微带天线301都与微带带通滤波器的第一端连接。There may be a plurality of openings 201 on the shielding case 200 , and when stray leakage occurs, stray signals may leak out from the plurality of openings 201 of the shielding case 200 . A first microstrip antenna 301 is provided at a position corresponding to each opening 201 on the bracket 300 , and the first microstrip antenna 301 can receive the stray signal leaked from the corresponding opening 201 . For example, if four openings 201 are provided on the shielding case 200 , then four first microstrip antennas 301 are provided on the bracket 300 . Each first microstrip antenna 301 is connected to the first end of the microstrip bandpass filter.

本实施例通过在屏蔽罩有多个开口的情况下,设置与每个开口对应的第一微带天线,可以接收从任意一个开口处泄露的杂散信号,避免出现遗漏,保证能够接收到所有的杂散信号,提高检测精度。In this embodiment, when the shielding cover has multiple openings, a first microstrip antenna corresponding to each opening can be provided to receive stray signals leaking from any opening, avoiding omissions, and ensuring that all signals can be received. spurious signals, improve detection accuracy.

可选地,所述第一微带天线301设置在所述支架300上与所述屏蔽罩200的边缘对应的位置。Optionally, the first microstrip antenna 301 is disposed on the support 300 at a position corresponding to the edge of the shielding case 200 .

杂散信号还可能从屏蔽罩200的边缘处泄露。屏蔽罩200的边缘是指屏蔽罩200与主板100的连接处。在屏蔽罩200的边缘位置设置第一微带天线301,第一微带天线301可以接收从屏蔽罩200边缘泄露的杂散信号,进一步提高检测精度。Spurious signals may also leak from the edges of the shield 200 . The edge of the shielding case 200 refers to the connection between the shielding case 200 and the main board 100 . A first microstrip antenna 301 is provided at the edge of the shielding case 200, and the first microstrip antenna 301 can receive stray signals leaked from the edge of the shielding case 200, further improving detection accuracy.

可选地,所述信号处理电路可以通过以下任意一种方式实现:微带结构、激光直接成型技术(Laser-Direct-structuring,LDS)、液晶聚合物(Liquid Crystal Polymer,LCP)、柔性电路板(Flexible Printed Circuit,FPC)。通过采用柔性电路板来实现信号处理电路,柔性电路板材质较软,让电路板组件可以被随意弯折,能够适应电子设备的内部空间,提高电子设备内部空间的利用率。可以通过激光直接成型技术在电路板组件上化镀形成天线。信号处理电路还可以使用液晶聚合物来实现。Optionally, the signal processing circuit can be implemented in any of the following ways: microstrip structure, laser direct structuring (Laser-Direct-structuring, LDS), liquid crystal polymer (Liquid Crystal Polymer, LCP), flexible circuit board (Flexible Printed Circuit, FPC). The signal processing circuit is implemented by using a flexible circuit board. The material of the flexible circuit board is relatively soft, so that the circuit board components can be bent at will, which can adapt to the internal space of the electronic device and improve the utilization rate of the internal space of the electronic device. The antenna can be formed by chemical plating on the circuit board assembly by laser direct forming technology. Signal processing circuits can also be implemented using liquid crystal polymers.

本实施例介绍了一种辐射杂散发射异常检测方法,所述辐射杂散发射异常检测方法应用于本发明任意实施例所述的电路板组件,所述方法包括步骤101-104。This embodiment introduces a method for detecting abnormality of stray radiation emission, which is applied to the circuit board assembly described in any embodiment of the present invention, and the method includes steps 101-104.

步骤101:接收从屏蔽罩处泄露的杂散信号。Step 101: Receive the stray signal leaked from the shield.

通过支架上的第一微带天线接收从屏蔽罩处泄露的杂散信号。可以是从屏蔽罩的任意开口处泄露的杂散信号,也可以是从屏蔽罩的边缘处泄露的杂散信号。The stray signal leaked from the shield is received by the first microstrip antenna on the bracket. This can be a stray signal leaking from any opening in the shield, or a spurious signal leaking from the edge of the shield.

步骤102:对所述杂散信号进行滤波处理得到谐波信号。Step 102: Filtering the stray signal to obtain a harmonic signal.

第一微带天线接收到杂散信号后,第一微带天线将杂散信号发送至微带带通滤波器。微带带通滤波器对杂散信号进行滤波处理,滤除杂散信号中基波频率的信号,得到谐波信号。After the first microstrip antenna receives the spurious signal, the first microstrip antenna sends the spurious signal to the microstrip bandpass filter. The microstrip bandpass filter performs filtering processing on the spurious signal, and filters out the signal of the fundamental frequency in the spurious signal to obtain the harmonic signal.

步骤103:检测所述谐波信号的能量。Step 103: Detect the energy of the harmonic signal.

对杂散信号进行滤波后,微带带通滤波器将谐波信号发送至第二微带天线。在第二微带天线和第三微带天线的共同作用下,第三微带天线接收到谐波信号。第三微带天线将谐波信号发送至收发器,通过收发器检测谐波信号的能量。After filtering the spurious signals, the microstrip bandpass filter sends the harmonic signals to the second microstrip antenna. Under the joint action of the second microstrip antenna and the third microstrip antenna, the third microstrip antenna receives the harmonic signal. The third microstrip antenna sends the harmonic signal to the transceiver, and the energy of the harmonic signal is detected by the transceiver.

步骤104:在所述谐波信号的能量超过阈值的情况下,确定电子设备出现辐射杂散发射异常。Step 104: When the energy of the harmonic signal exceeds a threshold, determine that the electronic device has an abnormal radiation spurious emission.

根据对谐波信号的检测结果来判断电子设备是否出现辐射杂散发射异常。如果谐波信号的能量超过阈值,那么认为电子设备出现辐射杂散发射异常。According to the detection result of the harmonic signal, it is judged whether the electronic equipment has abnormal radiation spurious emission. If the energy of the harmonic signal exceeds the threshold, the electronic device is considered to have abnormal radiation spurious emissions.

本实施例通过接收屏蔽罩处泄露的杂散信号,对杂散信号进行滤波处理得到谐波信号,检测谐波信号的能量,根据检测结果判断电子设备是否出现辐射杂散发射异常,能够实时检测电子设备是否出现辐射杂散发射异常。In this embodiment, by receiving the stray signal leaked from the shielding cover, filtering the stray signal to obtain the harmonic signal, detecting the energy of the harmonic signal, and judging whether the electronic device has abnormal radiation spurious emission according to the detection result, it can detect in real time Whether the electronic equipment has abnormal radiation spurious emission.

本实施例介绍了一种电子设备,具有如上任一实施例所述的电路板组件,能够实时检测电子设备是否出现辐射杂散发射异常。This embodiment introduces an electronic device, which has the circuit board assembly as described in any one of the above embodiments, and can detect in real time whether the electronic device has abnormal radiation spurious emission.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

尽管已经示出和描述了本发明的实施例,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (10)

1. A circuit board assembly, comprising:
the main board is provided with a signal detection circuit;
the shielding cover is arranged above the main board and connected with the main board, and a cavity is formed by enclosing the shielding cover and the main board;
the bracket is arranged above the shielding cover and connected with the main board, a signal processing circuit is arranged on the bracket and is used for receiving stray signals leaked from the shielding cover, filtering the stray signals to obtain harmonic signals, and sending the harmonic signals to the signal detection circuit;
the signal detection circuit is used for receiving the harmonic signals, detecting the energy of the harmonic signals, and determining that the electronic equipment has radiation spurious emission abnormality when the energy of the harmonic signals exceeds a threshold value.
2. The circuit board assembly of claim 1, wherein the shield has an opening, the signal processing circuit comprising:
the first microstrip antenna is arranged above the opening of the shielding case or at the edge of the shielding case and is used for receiving the stray signals;
the first end of the microstrip band-pass filter is connected with the first microstrip antenna and is used for filtering signals with fundamental wave frequency in the leakage signals and outputting harmonic signals;
and the second microstrip antenna is connected with the second end of the microstrip band-pass filter and is used for transmitting the harmonic signals to the signal detection circuit.
3. The circuit board assembly of claim 2, wherein the signal detection circuit comprises:
the third microstrip antenna is arranged on the main board at a position opposite to the second microstrip antenna, and is arranged on the outer side of the shielding cover and used for receiving the harmonic signals sent by the second microstrip antenna;
and the transceiver is connected with the third microstrip antenna and is used for detecting the energy of the harmonic signal, and determining that the electronic equipment has abnormal radiation spurious emission when the energy of the harmonic signal exceeds a threshold value.
4. A circuit board assembly according to claim 3, wherein the transceiver is disposed within the cavity, the transceiver being connected to the third microstrip antenna by a microstrip line.
5. The circuit board assembly of claim 2, wherein the microstrip bandpass filter is any one of a hairpin bandpass filter, an interdigital bandpass filter, and an SIR parallel coupled bandpass filter.
6. The circuit board assembly of claim 2, wherein the shield has a plurality of openings, and the first microstrip antenna is provided on the support at a location corresponding to each of the openings.
7. The circuit board assembly of claim 2, wherein the first microstrip antenna is disposed on the support at a location corresponding to an edge of the shield.
8. The circuit board assembly of claim 1, wherein the signal processing circuit is implemented by any one of: microstrip structure, laser direct structuring technology, liquid crystal polymer, flexible circuit board.
9. A method for detecting radiation spurious emissions anomalies, wherein the method is applied to the circuit board assembly of any one of claims 1 to 8, the method comprising:
receiving stray signals leaking from the shield;
filtering the spurious signals to obtain harmonic signals;
detecting energy of the harmonic signal;
and under the condition that the energy of the harmonic signal exceeds a threshold value, determining that the electronic equipment has radiation spurious emission abnormality.
10. An electronic device having the circuit board assembly of any one of claims 1-8.
CN202310032167.5A 2023-01-06 2023-01-06 Circuit board assembly, radiation spurious emission anomaly detection method and electronic device Pending CN116321676A (en)

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