CN116283835A - A kind of biomass epoxy monomer, self-curing epoxy resin and preparation method thereof - Google Patents
A kind of biomass epoxy monomer, self-curing epoxy resin and preparation method thereof Download PDFInfo
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 66
- 239000000178 monomer Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title claims abstract description 45
- 150000002989 phenols Chemical class 0.000 claims abstract description 47
- DZGWFCGJZKJUFP-UHFFFAOYSA-N Tyramine Natural products NCCC1=CC=C(O)C=C1 DZGWFCGJZKJUFP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229960003732 tyramine Drugs 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 20
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- 239000012299 nitrogen atmosphere Substances 0.000 description 1
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- YVOFTMXWTWHRBH-UHFFFAOYSA-N pentanedioyl dichloride Chemical compound ClC(=O)CCCC(Cl)=O YVOFTMXWTWHRBH-UHFFFAOYSA-N 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3227—Compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
- C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
- C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
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- C07—ORGANIC CHEMISTRY
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- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
- C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract
Description
技术领域technical field
本发明涉及一种生物质环氧单体、生物质自固化环氧树脂及其制备方法,属于功能高分子材料技术领域。The invention relates to a biomass epoxy monomer, a biomass self-curing epoxy resin and a preparation method thereof, belonging to the technical field of functional polymer materials.
背景技术Background technique
环氧热固性树脂具有良好的耐化学性、热稳定性、机械强度、粘结性、尺寸稳定性和电气绝缘性,作为涂料、粘合剂、高性能复合材料树脂基体而广泛应用于电气工程、电子封装、航空航天、新能源、轨道交通等众多领域。然而,目前多数环氧树脂是由不可再生资源石油制得的,环氧树脂与固化剂经交联,形成高强度的热固性固化物。固化剂的种类主要有胺类、酸酐类和潜伏性固化剂等。在环氧树脂和固化剂在混合过程中,由于混合的不均匀或者是气泡等原因,会使固化物中存在一些缺陷,而这些缺陷正是材料的脆弱点,直接导致了材料在应力作用下的过早破坏。另外,有些环氧树脂或者固化剂的粘度比较大,共混的时候需要加入一些有机溶剂来进行稀释,这些有机溶剂的挥发会污染大气环境和危害人体健康。Epoxy thermosetting resins have good chemical resistance, thermal stability, mechanical strength, cohesiveness, dimensional stability and electrical insulation, and are widely used in electrical engineering, Electronic packaging, aerospace, new energy, rail transportation and many other fields. However, at present, most epoxy resins are made from non-renewable resource petroleum, and epoxy resins are cross-linked with curing agents to form high-strength thermosetting cured products. The types of curing agents mainly include amines, acid anhydrides and latent curing agents. During the mixing process of epoxy resin and curing agent, due to uneven mixing or air bubbles, there will be some defects in the cured product, and these defects are the weak points of the material, which directly lead to the failure of the material under stress. premature destruction. In addition, some epoxy resins or curing agents have relatively high viscosity. When blending, some organic solvents need to be added for dilution. The volatilization of these organic solvents will pollute the atmospheric environment and endanger human health.
因此,合成一种新型自固化型环氧树脂,其能够在常温下稳定,而在特定条件下发生自身的交联反应,就能最大限度地减少混合过程中的不均匀性导致的固化物缺陷。迄今为止,现有的自固化环氧树脂大多不是生物质树脂,同时,现在的自固化环氧树脂在固化过程中往往会添加咪唑、吡啶或胺类催化剂,与环氧发生反应,因此,不是真正意义的自固化环氧树脂。并且,它们的弯曲强度和冲击强度偏低。简单来说,现有技术没有具有高的弯曲强度和冲击强度的生物质自固化环氧树脂。Therefore, synthesizing a new type of self-curing epoxy resin, which can be stable at room temperature and undergoes its own cross-linking reaction under specific conditions, can minimize the cured product defects caused by inhomogeneity in the mixing process . So far, most of the existing self-curing epoxy resins are not biomass resins. At the same time, the current self-curing epoxy resins often add imidazole, pyridine or amine catalysts during the curing process to react with epoxy. Therefore, it is not A true self-curing epoxy resin. Also, their bending strength and impact strength are low. In short, the prior art does not have a biomass self-curing epoxy resin with high flexural and impact strength.
综上所述,研发一种具有高耐热性、高弯曲模量和强度以及高冲击强度的生物质自固化环氧树脂仍具有一定的挑战。In summary, it is still challenging to develop a biomass self-curing epoxy resin with high heat resistance, high flexural modulus and strength, and high impact strength.
发明内容Contents of the invention
本发明针对现有技术的不足,提供一种生物质环氧单体,具有高耐热性、高弯曲模量和强度以及高冲击强度的生物质自固化环氧树脂及其制备方法。Aiming at the deficiencies of the prior art, the present invention provides a biomass epoxy monomer, a biomass self-curing epoxy resin with high heat resistance, high flexural modulus and strength, and high impact strength and a preparation method thereof.
为达到上述目的,本发明所采用的技术方案是:In order to achieve the above object, the technical scheme adopted in the present invention is:
一种生物质环氧单体,所述生物质环氧单体的制备方法包括如下步骤:A kind of biomass epoxy monomer, the preparation method of described biomass epoxy monomer comprises the steps:
(1)将酪胺和双酚酸加热反应后,得到酚化合物;(1) After heating and reacting tyramine and bisphenolic acid, a phenolic compound is obtained;
(2)将所述酚化合物和环氧氯丙烷加热反应,得到生物质环氧单体。(2) heating and reacting the phenolic compound and epichlorohydrin to obtain a biomass epoxy monomer.
一种生物质自固化环氧树脂,所述生物质自固化环氧树脂的制备方法包括如下步骤:A kind of biomass self-curing epoxy resin, the preparation method of described biomass self-curing epoxy resin comprises the steps:
(1)将酪胺和双酚酸加热反应后,得到酚化合物;(1) After heating and reacting tyramine and bisphenolic acid, a phenolic compound is obtained;
(2)将所述酚化合物和环氧氯丙烷加热反应,得到生物质环氧单体;(2) heating and reacting the phenolic compound and epichlorohydrin to obtain a biomass epoxy monomer;
(3)将所述生物质环氧单体固化,得到生物质自固化环氧树脂。(3) curing the biomass epoxy monomer to obtain a biomass self-curing epoxy resin.
本发明步骤(1)中,酪胺和双酚酸的摩尔比为1∶(0.5~1.5),优选1∶1;加热反应的温度为170~185℃,时间为3~8h,优选的,加热反应的温度为175~180℃,时间为4~6h。In the step (1) of the present invention, the molar ratio of tyramine and bisphenolic acid is 1: (0.5-1.5), preferably 1:1; the temperature of the heating reaction is 170-185°C, and the time is 3-8h, preferably, The temperature of the heating reaction is 175-180° C., and the time is 4-6 hours.
本发明步骤(2)中,酚化合物和环氧氯丙烷的摩尔比为1∶(5~15),优选1∶10。In step (2) of the present invention, the molar ratio of phenolic compound and epichlorohydrin is 1: (5-15), preferably 1:10.
本发明步骤(2)中,加热反应在醇溶剂中进行,优选的,醇溶剂为乙醇;加热反应的温度为80~100℃,时间为1~2h,优选的,加热反应的温度为80~90℃,时间为1.5~2h。In the step (2) of the present invention, the heating reaction is carried out in an alcohol solvent. Preferably, the alcohol solvent is ethanol; the temperature of the heating reaction is 80-100°C, and the time is 1-2h. Preferably, the temperature of the heating reaction is 80-100°C. 90°C for 1.5-2 hours.
本发明步骤(2)中,加热反应在无机碱存在下进行,优选的,无机碱为氢氧化钠;无机碱的用量为酚化合物中酚羟基摩尔量的1~1.5倍,优选1.1~1.2倍,比如1.1倍。In step (2) of the present invention, the heating reaction is carried out in the presence of an inorganic base, preferably, the inorganic base is sodium hydroxide; the amount of the inorganic base is 1 to 1.5 times, preferably 1.1 to 1.2 times, the molar weight of the phenolic hydroxyl group in the phenolic compound , such as 1.1 times.
本发明步骤(3)中,将所述生物质环氧单体脱泡后再固化;固化的温度为160~220℃,时间为5~16h。优选的,所述固化为阶梯升温方式,每个阶梯温度下保温时间不少于1h,相邻阶梯的温度差不超过30℃。In the step (3) of the present invention, the biomass epoxy monomer is degassed and then solidified; the curing temperature is 160-220° C., and the curing time is 5-16 hours. Preferably, the curing is carried out in a stepwise heating manner, the holding time at each step temperature is not less than 1 h, and the temperature difference between adjacent steps does not exceed 30°C.
具体的,本发明生物质自固化环氧树脂的制备如下:Specifically, the preparation of biomass self-curing epoxy resin of the present invention is as follows:
(1)按摩尔份计,将100份酪胺和100份双酚酸混合,然后在175~180℃下搅拌反应4~6h,自然冷却至室温,得到酚化合物;(1) In molar parts, mix 100 parts of tyramine and 100 parts of bisphenolic acid, then stir and react at 175-180°C for 4-6 hours, and naturally cool to room temperature to obtain a phenolic compound;
(2)按摩尔份计,将100份酚化合物和1000份环氧氯丙烷在乙醇中混合,然后向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1~1.5倍当量),在80~100℃下反应1~2h,自然冷却至室温,然后将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80℃,0.1MPa)以除去溶剂,通过真空蒸馏(120℃)得到生物质环氧单体;(2) In terms of molar parts, mix 100 parts of phenolic compound and 1000 parts of epichlorohydrin in ethanol, and then add dropwise sodium hydroxide aqueous solution (1mol/L, 1 to 1.5 times equivalent per mole of phenolic hydroxyl group) to the mixture , reacted at 80-100°C for 1-2h, cooled naturally to room temperature, then mixed the mixture with dichloromethane, washed with deionized water, and rotary evaporated (80°C, 0.1MPa) to remove the solvent, and vacuum distillation (120 ℃) obtain biomass epoxy monomer;
(3)将步骤(2)得到的生物质环氧单体脱泡,再经固化,得到生物质自固化环氧树脂。(3) The biomass epoxy monomer obtained in step (2) is defoamed, and then cured to obtain a biomass self-curing epoxy resin.
本发明公开了酪胺、双酚酸、环氧氯丙烷为原料在制备环氧树脂单体或者固化物中的应用;上述生物质环氧单体或者自固化环氧树脂在制备环氧树脂材料,尤其是自固化环氧树脂材料中的应用。The invention discloses the application of tyramine, bisphenolic acid and epichlorohydrin as raw materials in the preparation of epoxy resin monomers or cured products; the above-mentioned biomass epoxy monomer or self-curing epoxy resin is used in the preparation of epoxy resin materials , especially the application of self-curing epoxy resin materials.
与现有技术相比,本发明取得的有益效果是:Compared with prior art, the beneficial effect that the present invention obtains is:
1. 本发明以酪胺和双酚酸为原料,合成了一个含有酰胺键的环氧树脂,所采用的酪胺和双酚酸均为生物质原料,由其固化得到生物质自固化环氧树脂;1. The present invention uses tyramine and bisphenolic acid as raw materials to synthesize an epoxy resin containing an amide bond. The tyramine and bisphenolic acid used are biomass raw materials, which are solidified to obtain biomass self-curing epoxy resin. resin;
2. 本发明制备的生物质自固化环氧树脂具有突出的耐热性,玻璃化转变温度(Tg)为126℃,其还具有高弯曲模量(4.67GPa)和强度(188.3MPa),同时其还具有高冲击强度(21.80KJ/m2,无缺口)以及拉伸强度(89.99MPa),从而为其在尖端领域的应用提供了可靠的基础。2. The biomass self-curing epoxy resin prepared by the present invention has outstanding heat resistance, the glass transition temperature (T g ) is 126°C, and it also has high flexural modulus (4.67GPa) and strength (188.3MPa), At the same time, it also has high impact strength (21.80KJ/m 2 , no notch) and tensile strength (89.99MPa), which provides a reliable basis for its application in cutting-edge fields.
附图说明Description of drawings
图1是本发明实施例1中制备酚化合物、生物质环氧单体的合成反应式及化学结构式。Fig. 1 is the synthetic reaction formula and chemical structural formula of preparing phenolic compound and biomass epoxy monomer in Example 1 of the present invention.
图2是本发明实施例1中酚化合物的核磁共振氢谱(1H-NMR)。Fig. 2 is the hydrogen nuclear magnetic resonance spectrum ( 1 H-NMR) of the phenolic compound in Example 1 of the present invention.
图3是本发明实施例1中酚化合物的核磁共振碳谱(13C-NMR)。Fig. 3 is the carbon nuclear magnetic resonance spectrum ( 13 C-NMR) of the phenolic compound in Example 1 of the present invention.
图4是本发明实施例1中生物质环氧单体的核磁共振氢谱(1H NMR)。Fig. 4 is the hydrogen nuclear magnetic resonance spectrum ( 1 H NMR) of the biomass epoxy monomer in Example 1 of the present invention.
图5是本发明实施例1中生物质环氧单体的核磁共振氢谱(13C-NMR)。Fig. 5 is the hydrogen nuclear magnetic resonance spectrum ( 13 C-NMR) of the biomass epoxy monomer in Example 1 of the present invention.
图6是本发明实施例1制备的生物质环氧单体的高分辨质谱图。Fig. 6 is a high-resolution mass spectrum of the biomass epoxy monomer prepared in Example 1 of the present invention.
图7是本发明实施例1制备的生物质自固化环氧树脂的热失重(TGA)曲线,10℃/min,氮气。Fig. 7 is the thermogravimetric loss (TGA) curve of the biomass self-curing epoxy resin prepared in Example 1 of the present invention, 10°C/min, nitrogen.
图8是本发明实施例1制备的生物质自固化环氧树脂的动态热机械分析(DMA)曲线,10℃/min。Fig. 8 is the dynamic thermomechanical analysis (DMA) curve of the biomass self-curing epoxy resin prepared in Example 1 of the present invention, 10°C/min.
图9是本发明实施例1制备的生物质自固化环氧树脂的弯曲应力-应变曲线。Fig. 9 is the bending stress-strain curve of the biomass self-curing epoxy resin prepared in Example 1 of the present invention.
图10是本发明实施例1制备的生物质自固化环氧树脂的拉伸应力-应变曲线。Fig. 10 is the tensile stress-strain curve of the biomass self-curing epoxy resin prepared in Example 1 of the present invention.
具体实施方式Detailed ways
本发明公开的生物质自固化环氧树脂制备过程参见图1,具体如下:Refer to Fig. 1 for the preparation process of biomass self-curing epoxy resin disclosed by the present invention, specifically as follows:
(1)将酪胺和双酚酸加热反应后,得到酚化合物;(1) After heating and reacting tyramine and bisphenolic acid, a phenolic compound is obtained;
(2)将所述酚化合物和环氧氯丙烷加热反应,得到含酰胺键生物质环氧单体;(2) heating and reacting the phenolic compound and epichlorohydrin to obtain an amide bond-containing biomass epoxy monomer;
(3)将所述含酰胺键生物质环氧单体固化,得到生物质自固化环氧树脂。(3) curing the amide bond-containing biomass epoxy monomer to obtain a biomass self-curing epoxy resin.
下面结合附图和实施例,对本发明技术方案作进一步的描述;所有原料都为市购,且涉及的具体制备操作以及测试方法都为本领域常规方法,采用万能试验机(MTS CMT-4104)测试力学性能,拉伸试验参照ASTM-D882,弯曲试验参照GBT2570-1995,冲击试验参照GBT2571-1995。采用高分辨质谱(HRMS,MICRO TOF-Q III,ESI+)测试环氧单体的分子量。采用核磁共振仪(Bruker 400-600mhz)测试1H-NMR和13C-NMR谱,溶剂为CDCl3或DMSO-d6。使用热重分析仪(TGA,Discovery)研究树脂在N2气氛下的热稳定性,以10℃/min 的加热速率从室温加热至800℃。The technical solution of the present invention will be further described below in conjunction with the accompanying drawings and examples; all raw materials are commercially available, and the specific preparation operations and testing methods involved are all conventional methods in the field, using a universal testing machine (MTS CMT-4104) To test the mechanical properties, refer to ASTM-D882 for tensile test, refer to GBT2570-1995 for bending test, and refer to GBT2571-1995 for impact test. The molecular weight of the epoxy monomer was tested by high-resolution mass spectrometry (HRMS, MICRO TOF-Q III, ESI+). The 1 H-NMR and 13 C-NMR spectra were measured using a nuclear magnetic resonance instrument (Bruker 400-600mhz), and the solvent was CDCl 3 or DMSO-d6. The thermogravimetric analyzer (TGA, Discovery) was used to study the thermal stability of the resin under N2 atmosphere, heating from room temperature to 800 °C at a heating rate of 10 °C/min.
实施例1Example 1
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺(CAS#: 51-67-2)和12.52g双酚酸(CAS#: 126-00-1)混合,然后在175℃下搅拌反应4h,再自然冷却至室温,得到酚化合物,产率94%;其核磁共振氢谱(1H-NMR)和核磁共振碳谱(13C-NMR)分别参见附图2和图3。Mix 6g of tyramine (CAS#: 51-67-2) and 12.52g of bisphenolic acid (CAS#: 126-00-1), then stir and react at 175°C for 4h, then cool naturally to room temperature to obtain phenolic compound , and the yield was 94%; its proton nuclear magnetic resonance spectrum ( 1 H-NMR) and carbon nuclear magnetic resonance spectrum ( 13 C-NMR) are shown in Figure 2 and Figure 3, respectively.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
室温下,将10g酚化合物和16.10g环氧氯丙烷在35mL乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),滴加完成后在80℃下反应2h,然后自然冷却至室温,将得到的混合物与30mL二氯甲烷混合,再用100mL去离子水洗涤,然后旋转蒸发(80℃,0.1MPa)以除去二氯甲烷和大部分乙醇,再通过真空蒸馏(120℃)得到含酰胺键生物质环氧单体,产率90%;图4是其核磁共振氢谱(1H NMR);图5是其核磁共振氢谱(13C-NMR);图6是其高分辨质谱图。At room temperature, mix 10g of phenolic compound and 16.10g of epichlorohydrin in 35mL of ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times the equivalent per mole of phenolic hydroxyl group) to the mixture, and after the addition is completed, heat at 80°C The mixture was reacted at lower temperature for 2 h, then naturally cooled to room temperature, the resulting mixture was mixed with 30 mL of dichloromethane, washed with 100 mL of deionized water, and then rotary evaporated (80° C., 0.1 MPa) to remove dichloromethane and most of the ethanol, and then Biomass epoxy monomer containing amide bonds was obtained by vacuum distillation (120°C), with a yield of 90%; Figure 4 is its hydrogen nuclear magnetic resonance spectrum ( 1 H NMR); Figure 5 is its hydrogen nuclear magnetic resonance spectrum ( 13 C-NMR ); Figure 6 is its high-resolution mass spectrum.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃,10min,0.1MPa),而后将模具放入鼓风干燥箱,依次按照160℃/2 h + 180 ℃/2 h+ 200 ℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂,其热失重曲线、动态热机械分析(DMA)曲线以及弯曲应力-应变曲线、拉伸应力-应变曲线分别参见图7、图8、图9、图10。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for degassing (110°C, 10min, 0.1MPa), then put the mold into a blast drying oven, and follow the 160 ℃/2 h + 180 ℃/2
从中可以看出,上述生物质自固化环氧树脂的玻璃化转变温度(Tg)为126℃,Td5%为317℃。进一步的,上述生物质自固化环氧树脂的常温下的弯曲模量、弯曲强度、拉伸强度分别为4.67GPa、188.3MPa、89.99MPa,同时其还具有高冲击强度(21.80kJ/m2),具有突出的力学性能。It can be seen that the above-mentioned biomass self-curing epoxy resin has a glass transition temperature (T g ) of 126 °C and a T d5% of 317 °C. Furthermore, the flexural modulus, flexural strength, and tensile strength of the above-mentioned biomass self-curing epoxy resin at room temperature are 4.67GPa, 188.3MPa, and 89.99MPa, respectively, and it also has high impact strength (21.80kJ/m 2 ) , with outstanding mechanical properties.
现有技术以可再生的生物基化合物和厚朴酚为原料,通过一步反应制得生物基环氧树脂DGEH,固化后DGEH/DDS的弯曲模量为3360 MPa,认为比E51/DDS体系的相应值提高了30%。The prior art uses the renewable bio-based compound honokiol as raw material to prepare bio-based epoxy resin DGEH through a one-step reaction. The flexural modulus of DGEH/DDS after curing is 3360 MPa, which is considered to be higher than that of the E51/DDS system. Value increased by 30%.
现有双酚酸环氧树脂自固化后的玻璃化转变温度为70.84℃,采用普通环氧树脂128与市售固化剂D230按照质量比3:1进行固化实验,玻璃化转变温度为88.83℃。The glass transition temperature of the existing bisphenolic acid epoxy resin after self-curing is 70.84°C. The curing experiment was carried out with ordinary epoxy resin 128 and commercially available curing agent D230 at a mass ratio of 3:1, and the glass transition temperature was 88.83°C.
现有技术以丁香酚和戊二酰氯为原料,设计并制备了具有自固化特性的生物质环氧树脂(EPEUGL),C-EPEUGL的玻璃化转变温度(TgDMA)为94.6℃。In the prior art, a self-curing biomass epoxy resin (EPEUGL) was designed and prepared using eugenol and glutaryl chloride as raw materials. The glass transition temperature (TgDMA) of C-EPEUGL is 94.6°C.
现有技术公开了一种含活性酯侧基新型生物基环氧单体,在固化促进剂的存在下,固化产物的弯曲强度为105MPa。The prior art discloses a novel bio-based epoxy monomer containing active ester side groups. In the presence of a curing accelerator, the cured product has a bending strength of 105 MPa.
现有技术公开了一种含有酸酐的自固化环氧树脂,指出其具有高的模量和强度,在少量乙基-4-甲基咪唑促进下,固化物的拉伸强度为42.5±3.6MPa。The prior art discloses a self-curing epoxy resin containing acid anhydride, pointing out that it has high modulus and strength, and under the promotion of a small amount of ethyl-4-methylimidazole, the tensile strength of the cured product is 42.5±3.6MPa .
现有技术以间苯二甲酰胺为初始原料制备了环氧树脂BTE,采用N 2,N 5-双(4-羟基苯基)呋喃-2,5-二甲酰胺制备环氧树脂BFE;两种单体的DSC曲线固化峰偏小,与商品化双酚A环氧近似,自固化物性能差,Td5%都小于200℃(10℃/min,氮气),限制其作为高性能材料的使用。In the prior art, epoxy resin BTE was prepared with isophthalamide as the initial raw material, and epoxy resin BFE was prepared with N 2 , N 5 -bis(4-hydroxyphenyl)furan-2,5-dicarboxamide; two The curing peak of the DSC curve of this monomer is relatively small, which is similar to that of commercial bisphenol A epoxy. The performance of self-curing products is poor, and T d5% is less than 200°C (10°C/min, nitrogen), which limits its use as a high-performance material. use.
以上说明本发明所制备的生物质自固化环氧树脂具有优异的耐热性以及非常好的力学性能。The above shows that the biomass self-curing epoxy resin prepared by the present invention has excellent heat resistance and very good mechanical properties.
实施例2Example 2
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在175℃下搅拌反应5h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 175°C for 5h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在80 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 80°C for 2h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例3Example 3
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在175℃下搅拌反应5h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 175°C for 5h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在90 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10 g of phenolic compound and 16.10 g of epichlorohydrin in ethanol, add aqueous sodium hydroxide solution (1 mol/L, 1.1 equivalents per mole of phenolic hydroxyl group) dropwise to the mixture, react at 90 °C for 2 h, and cool naturally to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例4Example 4
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在175℃下搅拌反应5h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 175°C for 5h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在100 ℃下反应1h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 100°C for 1h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例5Example 5
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在175℃下搅拌反应6h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 175°C for 6h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在80 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 80°C for 2h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例6Example 6
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在175℃下搅拌反应4h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 175°C for 4h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在100 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add aqueous sodium hydroxide solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 100°C for 2h, and cool naturally to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例7Example 7
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在180℃下搅拌反应4h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 180°C for 4h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在80 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 80°C for 2h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例8Example 8
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在180℃下搅拌反应5h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 180°C for 5h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在80 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 80°C for 2h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例9Example 9
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在180℃下搅拌反应5h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 180°C for 5h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在100 ℃下反应1h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 100°C for 1h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
实施例10Example 10
(1)酚化合物的制备(1) Preparation of phenolic compounds
将6g酪胺和12.52g双酚酸混合,在180℃下搅拌反应6h,自然冷却至室温,得到酚化合物。6g of tyramine and 12.52g of bisphenolic acid were mixed, stirred and reacted at 180°C for 6h, and naturally cooled to room temperature to obtain a phenolic compound.
(2)含酰胺键生物质环氧单体的制备(2) Preparation of amide bond-containing biomass epoxy monomer
将10g酚化合物和16.10g环氧氯丙烷在乙醇中混合,向混合物中滴加氢氧化钠水溶液(1mol/L,每摩尔酚羟基1.1倍当量),在80 ℃下反应2h,自然冷却至室温,将混合物与二氯甲烷混合,用去离子水洗涤,旋转蒸发(80 ℃,0.1MPa)以除去二氯甲烷和大部分乙醇,通过真空蒸馏(120 ℃)得到含酰胺键生物质环氧单体。Mix 10g of phenolic compound and 16.10g of epichlorohydrin in ethanol, add dropwise sodium hydroxide aqueous solution (1mol/L, 1.1 times equivalent per mole of phenolic hydroxyl group) to the mixture, react at 80°C for 2h, and naturally cool to room temperature , the mixture was mixed with dichloromethane, washed with deionized water, rotary evaporated (80 °C, 0.1 MPa) to remove dichloromethane and most of the ethanol, and vacuum distillation (120 °C) to obtain amide bond-containing biomass epoxy monomers body.
(3)生物质自固化环氧树脂的制备(3) Preparation of biomass self-curing epoxy resin
将10.0g含酰胺键生物质环氧单体放入模具中,将模具放入真空烘箱中进行脱泡(110℃下10min),而后将模具放入鼓风干燥箱,依次按照160 ℃/2 h + 180 ℃/2 h + 200℃/2 h + 220 ℃/2 h工艺进行固化;固化结束后,随烘箱自然冷却,即得到生物质自固化环氧树脂。Put 10.0g of amide bond-containing biomass epoxy monomer into the mold, put the mold into a vacuum oven for defoaming (10min at 110°C), then put the mold into a blast drying oven, and follow the steps of 160°C/2 h + 180 °C/2 h + 200 °C/2 h + 220 °C/2 h for curing; after curing, cool naturally with the oven to obtain biomass self-curing epoxy resin.
本发明以酪胺和双酚酸为原料,合成了一个含有酰胺键的环氧树脂,所采用的酪胺和双酚酸均为生物质原料,制备的生物质自固化环氧树脂具有突出的耐热性,玻璃化转变温度(Tg)为126℃,其还具有高弯曲模量(4.67GPa)和强度(188.3MPa),同时其还具有高冲击强度(21.80kJ/m2)以及拉伸强度(89.99MPa),与现有技术相比,本发明首次实现了全生物质原料制备生物质环氧树脂,且该树脂具有真正自固化的能力,尤其是,自固化产物具有非常优异的综合性能,从而为其在尖端领域的应用提供了可靠的基础。The present invention uses tyramine and bisphenolic acid as raw materials to synthesize an epoxy resin containing amide bonds. The tyramine and bisphenolic acid used are both biomass raw materials, and the prepared biomass self-curing epoxy resin has outstanding Heat resistance, the glass transition temperature (T g ) is 126°C, it also has high flexural modulus (4.67GPa) and strength (188.3MPa), and it also has high impact strength (21.80kJ/m 2 ) and tensile strength Tensile strength (89.99MPa), compared with the prior art, the present invention realizes the preparation of biomass epoxy resin from all biomass raw materials for the first time, and the resin has real self-curing ability, especially, the self-curing product has very excellent Comprehensive performance, thus providing a reliable basis for its application in cutting-edge fields.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116836350A (en) * | 2023-06-26 | 2023-10-03 | 苏州大学 | A heat-resistant bio-based benzoxazine resin and its preparation method and application |
| CN117003713A (en) * | 2023-07-14 | 2023-11-07 | 苏州大学 | A kind of biomass epoxy monomer and biomass high heat-resistant self-healing epoxy resin |
| CN117164532A (en) * | 2023-08-02 | 2023-12-05 | 苏州大学 | Biomass recyclable shape memory epoxy resin, monomer thereof and preparation method thereof |
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| CN119101017A (en) * | 2024-09-02 | 2024-12-10 | 南京工业大学 | A tyramine/phenolic bi-biobased epoxy resin monomer and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391651A (en) * | 1990-08-03 | 1995-02-21 | The Dow Chemical Company | Curable mixtures of mesogenic epoxy resins and mesogenic polyamines and cured compositions |
| US20160032043A1 (en) * | 2013-03-14 | 2016-02-04 | Case Western Reserve University | Bisphenol polymer precursor replacements |
| CN113004494A (en) * | 2021-03-30 | 2021-06-22 | 金向红 | Modified epoxy resin, preparation method and emulsion preparation method thereof, and application of waterproof coating |
| CN113999417A (en) * | 2021-10-26 | 2022-02-01 | 华南理工大学 | Continuous fiber reinforced thermosetting resin-based high-thermal-conductivity composite material and preparation method thereof |
| CN113999191A (en) * | 2021-11-25 | 2022-02-01 | 大连理工大学 | Novel bio-based epoxy resin containing active ester side group and preparation method thereof |
| CN115160540A (en) * | 2022-08-09 | 2022-10-11 | 四川大学 | A kind of high modulus and high activity epoxy resin and its synthesis method and use |
| CN115197173A (en) * | 2022-07-19 | 2022-10-18 | 南京工业大学 | A kind of bio-based epoxy resin and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106589317B (en) * | 2016-12-03 | 2019-02-05 | 苏州大学 | A kind of biomass-based epoxy resin and preparation method thereof |
| CA3087267A1 (en) * | 2018-01-10 | 2019-07-18 | Brightseed, Inc. | Composition for modulating metabolism |
-
2023
- 2023-02-24 CN CN202310162654.3A patent/CN116283835B/en active Active
- 2023-03-07 WO PCT/CN2023/079969 patent/WO2024174291A1/en not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391651A (en) * | 1990-08-03 | 1995-02-21 | The Dow Chemical Company | Curable mixtures of mesogenic epoxy resins and mesogenic polyamines and cured compositions |
| US20160032043A1 (en) * | 2013-03-14 | 2016-02-04 | Case Western Reserve University | Bisphenol polymer precursor replacements |
| CN113004494A (en) * | 2021-03-30 | 2021-06-22 | 金向红 | Modified epoxy resin, preparation method and emulsion preparation method thereof, and application of waterproof coating |
| CN113999417A (en) * | 2021-10-26 | 2022-02-01 | 华南理工大学 | Continuous fiber reinforced thermosetting resin-based high-thermal-conductivity composite material and preparation method thereof |
| CN113999191A (en) * | 2021-11-25 | 2022-02-01 | 大连理工大学 | Novel bio-based epoxy resin containing active ester side group and preparation method thereof |
| CN115197173A (en) * | 2022-07-19 | 2022-10-18 | 南京工业大学 | A kind of bio-based epoxy resin and preparation method thereof |
| CN115160540A (en) * | 2022-08-09 | 2022-10-11 | 四川大学 | A kind of high modulus and high activity epoxy resin and its synthesis method and use |
Non-Patent Citations (2)
| Title |
|---|
| ZIZHAO QIAN 等: "Bio-based epoxy resins derived from diphenolic acid via amidation showing enhanced performance and unexpected autocatalytic effect on curing", CHEMICAL ENGINEERING JOURNAL, vol. 435, no. 2, pages 289 - 292 * |
| 济南油漆厂: "水溶性双酚酸环氧酯粉末涂料", 涂料工业, pages 70 - 74 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116836350A (en) * | 2023-06-26 | 2023-10-03 | 苏州大学 | A heat-resistant bio-based benzoxazine resin and its preparation method and application |
| CN116836350B (en) * | 2023-06-26 | 2024-04-05 | 苏州大学 | A heat-resistant bio-based benzoxazine resin and its preparation method and application |
| CN117003713A (en) * | 2023-07-14 | 2023-11-07 | 苏州大学 | A kind of biomass epoxy monomer and biomass high heat-resistant self-healing epoxy resin |
| CN117003713B (en) * | 2023-07-14 | 2024-05-28 | 苏州大学 | A biomass epoxy monomer and a biomass high heat-resistant self-repairing epoxy resin |
| CN117164532A (en) * | 2023-08-02 | 2023-12-05 | 苏州大学 | Biomass recyclable shape memory epoxy resin, monomer thereof and preparation method thereof |
| CN117164532B (en) * | 2023-08-02 | 2025-07-18 | 苏州大学 | A biomass recyclable shape memory epoxy resin and its monomer and preparation method |
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