CN116276630B - Suction and wiping integrated head wiping device - Google Patents
Suction and wiping integrated head wiping deviceInfo
- Publication number
- CN116276630B CN116276630B CN202310080721.7A CN202310080721A CN116276630B CN 116276630 B CN116276630 B CN 116276630B CN 202310080721 A CN202310080721 A CN 202310080721A CN 116276630 B CN116276630 B CN 116276630B
- Authority
- CN
- China
- Prior art keywords
- sucker
- hole
- main body
- suction cup
- wiping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an integrated suction and wiping head device which comprises a sucker main body and a sucker core, wherein a first annular groove for containing grinding fluid is formed in the upper surface of the sucker main body, a first grinding fluid discharge hole is formed in the bottom of the first annular groove, a first vent hole is formed in the center of an installation round table, the sucker core is arranged on the lower surface of the sucker main body, the sucker core is provided with a second vent hole coaxially communicated with the first vent hole, an air distribution disc is arranged at the lower end of the sucker core, a plurality of first radial vent holes are uniformly formed in the circumferential direction of the air distribution disc, and are communicated with the second vent holes, and the integrated suction and wiping head device further comprises a vent pipeline, a grinding fluid pipeline, a sweeping air pipeline and a flushing fluid pipeline. The invention can realize non-contact loading and unloading of the ceramic wafer, can finish grinding, flushing and blowing of the ceramic wafer, greatly avoids the problems of scratching, damaging, scrapping and secondary pollution of the ceramic wafer, improves the working efficiency and ensures the grinding effect and cleanliness of the ceramic wafer.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to an absorbing and wiping integrated head wiping device.
Background
In some processes in the semiconductor field, ceramic wafers with holes are required, and in the preparation and processing of ceramic wafers, grinding and cleaning of ceramic wafers are indispensable procedures. And (3) processing a plurality of holes with smaller sizes on the surface of the ceramic wafer by using a laser drilling machine according to processing requirements, wherein the holes are round or irregular in shape, and the number and the positions of the holes are not determined. Because the high temperature generated in the processing process can cause the molten material to be generated at the edge of the hole, the subsequent processing and use are not facilitated, the molten material at the edge of the hole needs to be ground, and the surface cleanliness of the molten material is high.
The surface of the ceramic wafer is provided with irregular small holes, and the ceramic wafer is thin, high in precision and fragile, so that a proper loading and unloading mode and an appropriate loading and unloading device are selected, in addition, along with the development of ceramic wafer manufacturing technology, the size of the ceramic wafer is continuously increased, and higher requirements are put on the stability and the loading and unloading capability of the loading and unloading mode and the device.
At present, in the post-treatment process of ceramic wafers, polishing cloth is generally used manually, alumina grinding fluid is utilized to polish the ceramic wafers, deionized water is used to wash the ceramic wafers, and finally drying treatment is carried out. The mode is low in efficiency, workers can scratch and damage the ceramic wafer easily to cause scrapping, and meanwhile secondary pollution of the ceramic wafer can be caused, so that the production quality and the qualification rate of the ceramic wafer are affected. In addition, the strength of operators, the grinding times and the thickness of the ceramic wafer have great influence on the grinding effect in the grinding process, and the ceramic wafer can reach the grinding requirement only by repeating the process for a plurality of times, so that the production efficiency is greatly reduced.
Disclosure of Invention
The embodiment of the invention provides an absorbing and wiping integrated head wiping device, which aims to solve the problems that the existing mode for treating ceramic wafers is easy to cause scratching, damage, scrapping and secondary pollution of the ceramic wafers, and influences the production quality, qualification rate and production efficiency of the ceramic wafers.
In order to achieve the above purpose, the invention adopts the technical scheme that the invention provides an integrated suction and wiping head device, which comprises:
The polishing device comprises a sucker main body, a first polishing liquid discharge hole, a first vent hole, a second vent hole, a first negative pressure cavity, a second vent hole, a first polishing liquid discharge hole, a second vent hole and a second negative pressure cavity, wherein the middle of the upper surface of the sucker main body is provided with the mounting round table;
The suction cup comprises a mounting hole, a suction cup core, a plurality of first radial exhaust holes, a plurality of second radial exhaust holes, a plurality of suction cup cores and a plurality of suction cup cores, wherein the suction cup cores are arranged at the mounting hole and are hidden in the negative pressure cavity;
The polishing device comprises a sucker main body, a support, a driving motor, a ventilation pipeline, a grinding fluid pipeline, a sweeping gas pipeline and a flushing fluid pipeline, wherein the driving motor is arranged at the lower end of the support, the ventilation pipeline is communicated with a hollow shaft of the driving motor, the grinding fluid pipeline, the sweeping gas pipeline and the flushing fluid pipeline are fixed by the support, a first ventilation hole on the installation round table is communicated with the hollow shaft, the grinding fluid pipeline is positioned right above the first annular groove, and the lower ends of the sweeping gas pipeline and the flushing fluid pipeline are positioned at the outer side of the sucker main body.
In one possible implementation, the surface of the negative pressure cavity is a circular arc-shaped curved surface.
In one possible implementation manner, the mounting hole is a threaded hole, an external thread is arranged on the outer surface of the upper end of the sucker core, and the sucker core is in threaded connection with the sucker body.
In one possible implementation manner, the center of the lower end of the sucker core is further provided with an air distribution circular table, an annular ventilation groove is formed between the air distribution circular table and the air distribution disc, the air distribution circular table is provided with second radial exhaust holes communicated with the second ventilation holes, and the second radial exhaust holes and the first radial exhaust holes are in radial one-to-one correspondence.
In one possible implementation manner, the upper end surface of the sucker core is further provided with a second annular groove, the second annular groove is surrounded on the periphery of the second ventilation hole, and a sealing ring is arranged in the second annular groove.
In one possible implementation, the method further includes:
The suction cup comprises a suction cup bottom plate fixedly arranged on the lower surface of the suction cup main body, a second grinding fluid discharge hole communicated with the first grinding fluid discharge hole, a third vent hole concentric with the opening of the negative pressure cavity and a third vent hole arranged in the center of the suction cup bottom plate
The polishing felt is fixedly arranged on the lower surface of the sucker bottom plate, a third grinding fluid discharge hole communicated with the second grinding fluid discharge hole is formed in the polishing felt, and a fourth air hole concentric with the third air hole is formed in the center of the polishing felt.
In one possible implementation mode, the fixing structure of the sucker bottom plate and the sucker main body comprises a plurality of fixing columns uniformly arranged on the sucker bottom plate, a plurality of fixing holes matched with the fixing columns are formed in the lower surface of the sucker main body, locking holes which are radially communicated with the fixing holes are further formed in the periphery of the sucker main body, the fixing columns are inserted into the fixing holes, and the sucker bottom plate and the sucker main body are fixed together through first locking screws which are radially screwed into the locking holes.
In one possible implementation manner, the novel suction cup further comprises a suction cup cover, wherein the suction cup cover is provided with a central hole, the central hole is coaxial with the first vent hole, the suction cup cover is fixedly arranged on the installation round table, and an elastic buffer piece is arranged between the suction cup cover and the installation round table.
In one possible implementation, the suction cup cover is connected with the installation round table through a bolt, wherein the elastic buffer piece is sleeved on the bolt.
In one possible implementation, the device further comprises a sensor mounted on the support.
Compared with the prior art, the suction and wiping integrated head wiping device has the advantages that the sucker main body, the grinding liquid pipeline, the flushing liquid pipeline and the sweeping air pipeline are integrated on the support, grinding liquid is discharged through the grinding liquid pipeline and the first grinding liquid discharge hole in the sucker main body, gas for adsorbing the ceramic wafer is discharged to the negative pressure cavity through the ventilation pipeline, the hollow shaft of the driving motor, the first ventilation hole and the second ventilation hole, after the ceramic wafer is polished by rotation of the sucker main body, the flushing liquid pipeline is opened to flush the ceramic wafer, then the sweeping air pipeline is switched to be opened to sweep the surface of the ceramic wafer, the whole process can realize non-contact loading and unloading of the ceramic wafer, manual operation is not needed, grinding, flushing and sweeping of the ceramic wafer can be completed, the problems of scratching, damaging, scrapping and secondary pollution of the ceramic wafer are greatly avoided, the working efficiency is improved, the grinding effect and the cleanliness of the ceramic wafer are ensured, and the quality and the qualification rate of the ceramic wafer in the grinding process are not influenced.
Drawings
Fig. 1 is a schematic structural diagram of an integrated suction and wiping head device according to an embodiment of the present invention;
Fig. 2 is a schematic structural diagram of a suction and wiping integrated wiping head device according to a second embodiment of the present invention;
Fig. 3 is a schematic front view of a suction and wiping integrated wiping head device according to an embodiment of the present invention;
FIG. 4 is a schematic view of an exploded view of a chuck part according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a front view of a sucker part according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;
fig. 7 is a schematic diagram of a front view of a sucker part according to a second embodiment of the present invention;
FIG. 8 is a cross-sectional view taken along line B-B of FIG. 7;
Fig. 9 is a schematic perspective view of a sucker core according to an embodiment of the present invention;
Fig. 10 is a schematic front view of a sucker core according to an embodiment of the present invention;
FIG. 11 is a cross-sectional view taken along line C-C of FIG. 10;
fig. 12 is a schematic perspective view of a sucker body according to an embodiment of the present invention;
fig. 13 is a schematic diagram of a perspective structure of a sucker main body according to an embodiment of the present invention;
Fig. 14 is a schematic diagram of a front view of a chuck body according to an embodiment of the present invention;
FIG. 15 is a cross-sectional view taken along line D-D of FIG. 14;
Fig. 16 is a schematic diagram of a perspective structure of a sucker main body according to an embodiment of the present invention;
FIG. 17 is a cross-sectional view taken along line E-E of FIG. 16;
FIG. 18 is a schematic perspective view of a suction cup cover according to an embodiment of the present invention;
Fig. 19 is a schematic front view of a suction cup cover according to an embodiment of the present invention;
FIG. 20 is a cross-sectional view taken along line F-F of FIG. 19;
Reference numerals illustrate:
1. The polishing machine comprises a bracket, a top support plate, 102, a vertical plate, 103, a bottom support plate, 2, a ventilation pipeline, 3, a driving motor, 4, a sucker cover, 401, a central hole, 5, a sucker main body, 501, a first ventilation hole, 502, a mounting round table, 503, a first annular groove, 504, a negative pressure cavity, 505, a first grinding fluid discharge hole, 506, a mounting hole, 507, a fixing hole, 508, a locking hole, 6, a grinding fluid pipeline, 7, a gas-liquid common pipe, 8, Y-shaped three-way quick connector, 9, a first check valve, 10, a second check valve, 11, a flushing fluid pipeline, 12, a purge gas pipeline, 13, a first locking screw, 14, a right sensor, 15, a left sensor, 16, a sucker core, 161, a gas distribution disc, 162, a gas distribution round table, 163, a first radial vent hole, 164, a second radial vent hole, 165, a second ventilation hole, 166, a second annular groove, 17, a sucker plate, 171, a fixing column, 172, a third vent hole, 173, a second grinding fluid discharge hole, 18, a polishing felt discharge hole, 18, a fourth vent hole, 181, a fourth vent hole, a damping member, 20 and a locking screw.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 20, an integrated suction and wiping head device according to the present invention will now be described. The suction and wiping integrated head wiping device comprises a sucker main body 5 and a sucker core 16, wherein a mounting round table 502 is arranged in the middle of the upper surface of the sucker main body 5, a first annular groove 503 for containing grinding fluid is formed around the mounting round table 502, a first grinding fluid discharge hole 505 is formed in the bottom of the first annular groove 503, a first vent hole 501 is formed in the center of the mounting round table 502, and a mounting hole 506 and a negative pressure cavity 504 are formed in the middle of the lower surface of the sucker main body 5. In this embodiment, four first polishing liquid discharge holes 505 are uniformly distributed, or three, five or six equal numbers may be uniformly distributed.
The sucker core 16 is arranged at the mounting hole 506 and hidden in the negative pressure cavity 504, the sucker core 16 is provided with a second vent hole 165 coaxially communicated with the first vent hole 501, the second vent hole 165 is a blind hole and does not penetrate through the sucker core 16, the lower end of the sucker core 16 exposed out of the mounting hole 506 is provided with an air distribution plate 161, a plurality of first radial vent holes 163 are uniformly arranged along the circumferential direction of the air distribution plate 161, and the first radial vent holes 163 are communicated with the second vent hole 165. The nitrogen entering through the ventilation pipeline 2 is discharged through the plurality of first radial exhaust holes 163 of the sucker core 16 and is sprayed to the inner wall of the negative pressure cavity 504, so that the pressure of the airflow is buffered, the pressure of the upper surface of the ceramic wafer is reduced, and the damage to the impact of the ceramic wafer caused by the overlarge impact force of the airflow is avoided.
The suction and wiping integrated head wiping device further comprises a support 1, a driving motor 3 arranged at the lower end of the support 1, a ventilation pipeline 2 communicated with a hollow shaft of the driving motor 3, a grinding fluid pipeline 6 fixed by the support 1, a sweeping air pipeline 12 and a flushing fluid pipeline 11, wherein a first vent hole 501 on a mounting round table 502 is communicated with the hollow shaft, the grinding fluid pipeline 6 is positioned right above the first annular groove 503, and the lower ends of the sweeping air pipeline 12 and the flushing fluid pipeline 11 are positioned at the outer side of the sucker main body 5.
The driving motor 3 drives the sucker body 5 to rotate, the sucker body 5 is connected to the lower end of the hollow shaft, the grinding fluid flows out from the grinding fluid pipeline 6 and is directly stored on the first annular groove 503, and the grinding fluid is uniformly distributed on the ceramic wafer along with the rotation of the sucker body 5.
The suction and wiping integrated head wiping device provided by the invention is characterized in that a sucker main body 5, a grinding liquid pipeline 6, a flushing liquid pipeline 11 and a purging gas pipeline 12 are integrated on a bracket 1, grinding liquid is discharged through the grinding liquid pipeline 6 and a first grinding liquid discharge hole 505 on the sucker main body 5, gas for adsorbing a ceramic wafer is discharged to a negative pressure cavity 504 through a ventilation pipeline 2, a hollow shaft of a driving motor 3, a first ventilation hole 501 and a second ventilation hole 165, after the ceramic wafer is polished by rotation of the sucker main body 5, the flushing liquid pipeline 11 is opened to flush the ceramic wafer, then the purging gas pipeline 12 is switched to be opened to purge the surface of the ceramic wafer, the whole process can realize non-contact loading and unloading of the ceramic wafer without manual operation, the grinding, flushing and purging of the ceramic wafer can be completed, the problems of scratching, damaging, scrapping and secondary pollution of the ceramic wafer are greatly avoided, the working efficiency is improved, and the grinding effect and the purity of the ceramic wafer are ensured in the grinding process are not influenced.
The bracket 1 is arranged on the three-dimensional module, so that the movement of the whole head wiping device in the XYZ three-dimensional direction can be realized.
Optionally, the purge air pipeline 12 and the flushing fluid pipeline 11 are combined into one at the lower end, specifically, the purge air pipeline 12 and the flushing fluid pipeline 11 are respectively provided with the first check valve 9 and the second check valve 10, the lower ends of the two pipelines are provided with the Y-shaped three-way quick connector 8, and the double-interface side of the Y-shaped three-way quick connector 8 is connected with the first check valve 9 and the second check valve 10 through PE pipes, so that the medium backflow is prevented. After the two are combined into a whole, a gas-liquid common pipe 7 is arranged below the suction cup main body 5, the gas-liquid common pipe 7 is connected to the lower end interface of the Y-shaped three-way quick connector 8 through a PE pipe of the through quick connector box, and the gas-liquid common pipe 7 is arranged outside the suction cup main body 5 and directly above the ceramic wafer. Wherein, the upper end of the gas-liquid common pipe 7 is provided with a joint, and can be directly fixed on the lower supporting plate 103. Wherein the purge gas is also nitrogen.
In some embodiments, as shown in fig. 6 and 8, the surface of the negative pressure chamber 504 is a circular arc-shaped curved surface, which is beneficial to buffer the pressure of the gas and weaken the pressure of the gas acting on the ceramic wafer.
In some embodiments, as shown in fig. 6 and 8, the mounting hole 506 is a threaded hole, and the outer surface of the upper end of the sucker core 16 is provided with external threads, and the sucker core 16 is in threaded connection with the sucker body 5. The sucker main body 5 is in threaded connection with the sucker core 16, and the assembly and the disassembly are simple and convenient.
In some embodiments, as shown in fig. 9 to 11, the center of the lower end of the sucker core 16 is further provided with an air distribution circular table 162, an annular ventilation slot is formed between the air distribution circular table 162 and the air distribution disc 161, the air distribution circular table 162 is provided with second radial exhaust holes 164 communicated with the second ventilation holes 165, and the second radial exhaust holes 164 are in radial one-to-one correspondence with the first radial exhaust holes 163. Through the radial exhaust holes of two-stage evenly distributed, the pressure of the nitrogen entering from the ventilation pipeline 2 is increased after being dispersed through the radial exhaust holes, and then the nitrogen is impacted on the wall surface of the negative pressure cavity 504, so that the pressure of the nitrogen is reduced, and the damage to the ceramic wafer is avoided.
In some embodiments, as shown in fig. 11, the upper end surface of the sucker core 16 is further provided with a second annular groove 166, the second annular groove 166 is surrounded by the second ventilation hole 165, and a sealing ring is disposed in the second annular groove 166. The sealing ring is arranged at the connecting part of the sucker core 16 and the sucker main body 5, so that the influence of nitrogen leakage from the connecting part on the adsorption force can be avoided.
The suction and wiping integrated head device further comprises a sucker base plate 17 and a polishing felt 18, wherein the sucker base plate 17 is fixedly arranged on the lower surface of the sucker main body 5, a second grinding fluid discharge hole 173 communicated with the first grinding fluid discharge hole 505 is formed in the sucker base plate 17, a third air vent 172 concentric with an opening of the negative pressure cavity 504 is formed in the center of the sucker base plate 17, the polishing felt 18 is fixedly arranged on the lower surface of the sucker base plate 17, a third grinding fluid discharge hole 182 communicated with the second grinding fluid discharge hole 173 is formed in the polishing felt 18, and a fourth air vent 181 concentric with the third air vent 172 is formed in the center of the polishing felt 18.
The third vent hole 172 on the chuck base 17 is used for flowing out nitrogen gas, and the polishing liquid flows out through the first polishing liquid discharge hole 505, the second polishing liquid discharge hole 173 and the third polishing liquid discharge hole 182. The third vent hole 172 and the fourth vent hole 181 have a size corresponding to the size of the opening of the negative pressure chamber 504.
The polishing felt 18 can also play a role in buffering and skid resistance, is not easy to damage the ceramic wafer, is convenient to install and is convenient to replace after abrasion failure.
In some embodiments, as shown in fig. 1 to 8, the fixing structure of the sucker base 17 and the sucker body 5 comprises a plurality of fixing columns 171 uniformly arranged on the sucker base 17, a plurality of fixing holes 507 adapted to the fixing columns 171 arranged on the lower surface of the sucker body 5, locking holes 508 radially communicated with the fixing holes 507 arranged on the periphery of the sucker body 5, and the fixing columns 171 inserted into the fixing holes 507 and fixing the sucker base 17 and the sucker body 5 together by the first locking screws 13 radially screwed into the locking holes 508. Specifically, the fixing column 171 and the sucker body 5 can be fixed together by using a locking screw of Φ2, so that the sucker bottom plate 17 is fixed on the lower surface of the sucker body 5.
The suction and wiping integrated head wiping device further comprises a suction cup cover 4, as shown in fig. 18 to 20, a central hole 401 is formed in the suction cup cover 4, the central hole 401 is coaxial with the first vent hole 501, the suction cup cover 4 is fixedly arranged on the installation round table 502, and an elastic buffer piece 19 is arranged between the suction cup cover 4 and the installation round table 502. The elastic buffer 19 can play a role in buffering and axial displacement compensation, and in addition, the assembly precision and the manufacturing difficulty can be reduced due to the existence of the elastic buffer 19. The elastic buffer 19 is preferably a spring, and may be a rubber pad or the like.
In some embodiments, as shown in fig. 1 to 8, the suction cup cover 4 and the mounting round table 502 are connected through bolts, wherein the elastic buffer 19 is sleeved on the bolts. The present embodiment is provided with four bolts. The sucker cover 4 is fixed at the lower end of the hollow shaft of the driving motor 3, and is radially provided with a second locking screw 20 for locking.
In some embodiments, as shown in fig. 1-3, a sensor mounted on the bracket 1 is also included. Specifically including a left sensor 15 and a right sensor 14. The left sensor 15 and the right sensor 14 are connected with the lower support plate 103 through threads and adjusted to a proper height, and the left sensor and the right sensor work so that the device position moves to the center position of the ceramic wafer as much as possible.
The bracket 1 used in the present invention, as shown in fig. 1 to 3, comprises an upper support plate 101, a vertical plate 102, a shield and a lower support plate 103, the vertical plate 102 and the shield being fastened between the upper support plate 101 and the lower support plate 103 by screws. The protective cover can play a role in protecting the device due to splashing of liquid in the process.
The principle of the suction ceramic wafer of the wiping head part is that nitrogen flows from the center to the edge of the upper surface of the ceramic wafer, the upper surface of the ceramic wafer is in a negative pressure state due to the large gas flow speed, and the gas flow speed of the lower surface of the ceramic wafer is low, so that pressure difference can be generated on the upper side and the lower side of the ceramic wafer, and the purpose of adsorbing the ceramic wafer with holes in a non-contact mode is achieved under the action of the pressure difference. The mode is softer to adsorb the ceramic wafer, and the stability is improved. The polishing felt 18 is adopted to grind the ceramic wafer, one side of the polishing felt 18 is provided with viscosity, the polishing felt can be directly adhered to the lower surface of the sucker base plate 17, in addition, the polishing felt 18 is large in area, the effects of buffering and skid resistance can be achieved when the ceramic wafer is absorbed, the ceramic wafer is not easy to damage, the polishing felt 18 is convenient to install and replace after abrasion failure, the sucker main body 5, the sucker base plate 17 and the polishing felt 18 of the wiping head part can be replaced according to the size of the ceramic wafer actually processed, the diameter is about 2/3 of the diameter of the ceramic wafer, round holes are formed in the bottoms of the sucker base plate 17 and the polishing felt 18, larger suction force can be provided, the pressure can be adjusted by utilizing the spring between the sucker main body 5 and the sucker cover 4, and the effect of buffering and axial displacement compensation can be achieved by adjusting the position of the three-dimensional module Z shaft can be achieved when the ceramic wafer is absorbed, and the assembly precision and the manufacturing difficulty can be reduced due to the spring.
The device comprises the following specific working processes of conveying a ceramic wafer to a fixed position by adopting an external wafer conveying mechanism, moving the device to the position of the ceramic wafer by adopting a three-dimensional module, enabling the left sensor 15 and the right sensor 14 to work so that the device is moved to the central position of the ceramic wafer as much as possible, connecting a ventilation pipeline 2 of a sucker main body 5, sucking the ceramic wafer under the action of pressure difference, moving the device to a carrier position by adopting the three-dimensional module, lowering a Z-axis to the fixed position, stopping the ventilation pipeline 2, placing the ceramic wafer on the carrier, connecting a grinding liquid pipeline 6, simultaneously driving a motor 3 to work, rotating the sucker main body 5, enabling the grinding liquid to uniformly fall on the upper surface of the ceramic wafer through a first grinding liquid discharge hole 505 in a first annular groove 503 of the sucker main body 5, pressing the ceramic wafer at the moment, continuing to be introduced with the grinding liquid, continuing to rotate the sucker main body 5 and move according to a set track, achieving the grinding effect, adding deionized water into the pipeline 11 after the grinding, flushing the surface of the ceramic wafer, removing residual grinding liquid, cleaning the surface of the ceramic wafer, stopping the ventilation pipeline 12, wiping the ceramic wafer at the position of the suction main body, blowing the nitrogen gas pipeline, and blowing the ceramic wafer, and finally, partially blowing the ceramic wafer to the surface by the nitrogen gas, and blowing and the cleaning head, and the ceramic wafer according to the set position, and the nitrogen gas.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. An integrated suction and wiping head device, comprising:
The polishing device comprises a sucker main body (5), wherein a mounting circular table (502) is arranged in the middle of the upper surface of the sucker main body (5), a first annular groove (503) for containing polishing liquid is formed around the mounting circular table (502), a first polishing liquid discharge hole (505) is formed in the bottom of the first annular groove (503), a first vent hole (501) is formed in the center of the mounting circular table (502), and a mounting hole (506) and a negative pressure cavity (504) are formed in the middle of the lower surface of the sucker main body (5);
The sucker core (16) is arranged at the mounting hole (506) and hidden in the negative pressure cavity (504), the sucker core (16) is provided with a second vent hole (165) which is coaxially communicated with the first vent hole (501), the second vent hole (165) is a blind hole and does not penetrate through the sucker core (16), the lower end of the sucker core (16) exposed out of the mounting hole (506) is provided with an air distribution plate (161), a plurality of first radial vent holes (163) are uniformly arranged along the circumferential direction of the air distribution plate (161), and the first radial vent holes (163) are communicated with the second vent hole (165);
The novel polishing device comprises a sucker main body (5), and is characterized by further comprising a bracket (1), a driving motor (3) arranged at the lower end of the bracket (1), a ventilation pipeline (2) communicated with a hollow shaft of the driving motor (3), a grinding fluid pipeline (6) fixed by the bracket (1), a purging pipeline (12) and a flushing fluid pipeline (11), wherein a first vent hole (501) on a mounting round table (502) is communicated with the hollow shaft, the grinding fluid pipeline (6) is positioned right above the first annular groove (503), and the lower ends of the purging pipeline (12) and the flushing fluid pipeline (11) are positioned at the outer side of the sucker main body (5);
the polishing device further comprises a sucker base plate (17) fixedly arranged on the lower surface of the sucker main body (5), a second grinding fluid discharge hole (173) communicated with the first grinding fluid discharge hole (505) is arranged on the sucker base plate (17), a third vent hole (172) concentric with the opening of the negative pressure cavity (504) is arranged in the center of the sucker base plate (17), and
The polishing felt (18) is fixedly arranged on the lower surface of the sucker bottom plate (17), a third grinding fluid discharge hole (182) communicated with the second grinding fluid discharge hole (173) is formed in the polishing felt (18), and a fourth air hole (181) concentric with the third air hole (172) is formed in the center of the polishing felt (18).
2. The suction and wiping integrated wiping head device as defined in claim 1, characterized in that the surface of the negative pressure cavity (504) is a circular arc-shaped curved surface.
3. The suction and wiping integrated wiping head device as recited in claim 1, characterized in that the mounting hole (506) is a threaded hole, an external thread is arranged on the outer surface of the upper end of the suction cup core (16), and the suction cup core (16) is in threaded connection with the suction cup main body (5).
4. The suction and wiping integrated head wiping device as recited in claim 1, characterized in that an air distribution circular table (162) is further arranged at the center of the lower end of the suction cup core (16), an annular ventilation groove is formed between the air distribution circular table (162) and the air distribution circular table (161), a second radial exhaust hole (164) communicated with the second ventilation hole (165) is arranged on the air distribution circular table (162), and the second radial exhaust holes (164) are in radial one-to-one correspondence with the first radial exhaust holes (163).
5. The suction and wiping integrated head device according to claim 1, wherein a second annular groove (166) is further formed in the upper end surface of the suction cup core (16), the second annular groove (166) is surrounded by the second ventilation hole (165), and a sealing ring is arranged in the second annular groove (166).
6. The suction and wiping integrated head device as claimed in claim 1, wherein the fixing structure of the suction cup bottom plate (17) and the suction cup main body (5) comprises a plurality of fixing columns (171) uniformly arranged on the suction cup bottom plate (17), a plurality of fixing holes (507) matched with the fixing columns (171) are formed in the lower surface of the suction cup main body (5), locking holes (508) radially communicated with the fixing holes (507) are further formed in the periphery of the suction cup main body (5), and the fixing columns (171) are inserted into the fixing holes (507) and are fixed with the suction cup main body (5) through first locking screws (13) radially screwed into the locking holes (508).
7. The suction and wiping integrated head wiping device as claimed in claim 1, further comprising a suction cup cover (4), wherein a central hole (401) is formed in the suction cup cover (4), the central hole (401) is coaxial with the first ventilation hole (501), the suction cup cover (4) is fixedly arranged on the installation round table (502), and an elastic buffer piece (19) is arranged between the suction cup cover (4) and the installation round table (502).
8. The suction and wiping integrated head device according to claim 7, wherein the suction cup cover (4) is connected with the mounting round table (502) through a bolt, the elastic buffer piece (19) is sleeved on the bolt, and the elastic buffer piece (19) is a spring.
9. A suction and wiping integrated wiping head device as defined in claim 1, characterized by further comprising a sensor mounted on the bracket (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310080721.7A CN116276630B (en) | 2023-02-06 | 2023-02-06 | Suction and wiping integrated head wiping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310080721.7A CN116276630B (en) | 2023-02-06 | 2023-02-06 | Suction and wiping integrated head wiping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116276630A CN116276630A (en) | 2023-06-23 |
| CN116276630B true CN116276630B (en) | 2025-08-08 |
Family
ID=86791466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310080721.7A Active CN116276630B (en) | 2023-02-06 | 2023-02-06 | Suction and wiping integrated head wiping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116276630B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111911518A (en) * | 2020-08-27 | 2020-11-10 | 常州科瑞尔科技有限公司 | A Bernoulli sucker |
| CN213660369U (en) * | 2020-12-16 | 2021-07-09 | 苏州沃驰智能科技有限公司 | Circular Bernoulli sucking disc |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1353966A (en) * | 1919-10-29 | 1920-09-28 | William A Lorenz | Suction-head for disk grinding-machines |
| FR2728188B1 (en) * | 1994-12-14 | 1997-03-21 | Seva | METHOD AND DEVICE FOR FIXING AN ABRASIVE TOOL FOR POLISHING |
| US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| JP2000127025A (en) * | 1998-10-23 | 2000-05-09 | Toshiba Corp | Polishing apparatus and polishing method |
| WO2013143081A1 (en) * | 2012-03-28 | 2013-10-03 | Acm Research (Shanghai) Inc. | Vacuum chuck |
| CN202878100U (en) * | 2012-10-25 | 2013-04-17 | 上海集成电路研发中心有限公司 | Chemical machinery grinding head |
| CN105150060B (en) * | 2015-08-27 | 2017-10-10 | 哈尔滨商业大学 | A kind of robot automatically grinding device for large-scale workpiece |
| CN206286994U (en) * | 2016-12-06 | 2017-06-30 | 合肥宏光研磨科技有限公司 | A kind of novel glass polishing disk |
| CN208663469U (en) * | 2018-07-20 | 2019-03-29 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
| CN210236835U (en) * | 2018-08-09 | 2020-04-03 | 昆山迈瑞凯精密工业有限公司 | Bernoulli sucker for fixing air path |
| CN209491637U (en) * | 2018-12-11 | 2019-10-15 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
| CN112497046A (en) * | 2020-11-26 | 2021-03-16 | 上海新昇半导体科技有限公司 | Wafer edge polishing apparatus and method |
| CN114683163A (en) * | 2020-12-31 | 2022-07-01 | 上海新昇半导体科技有限公司 | Dehumidifying device and polishing equipment |
| CN113649949A (en) * | 2021-08-24 | 2021-11-16 | 上海致领半导体科技发展有限公司 | Multi-path vacuum chuck component for polishing semiconductor wafer |
-
2023
- 2023-02-06 CN CN202310080721.7A patent/CN116276630B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111911518A (en) * | 2020-08-27 | 2020-11-10 | 常州科瑞尔科技有限公司 | A Bernoulli sucker |
| CN213660369U (en) * | 2020-12-16 | 2021-07-09 | 苏州沃驰智能科技有限公司 | Circular Bernoulli sucking disc |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116276630A (en) | 2023-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101164148A (en) | Device for and method of polishing peripheral edge of semiconductor wafer | |
| CN114454024B (en) | Wafer Processing Equipment | |
| CN114378031A (en) | Single wafer type wafer cleaning device | |
| CN111326473A (en) | Silicon wafer bearing device and edge polishing equipment | |
| CN112872960B (en) | Wafer edge polishing device and polishing method | |
| US12304025B2 (en) | Jig for mounting and dismounting processing tool | |
| CN116276630B (en) | Suction and wiping integrated head wiping device | |
| CN108723972B (en) | Edge grinding base based on Bernoulli principle, edge grinding system and method | |
| CN119388462B (en) | Manipulator structure for wafer processing | |
| KR20230039545A (en) | Robot hand | |
| CN114454092B (en) | Rotary Lifting Suction Stage for Wafer Grinding | |
| CN219043806U (en) | Substrate thinning workbench and substrate thinning device | |
| CN113523933B (en) | An integrated device for wafer grinding and polishing | |
| JP2018117014A (en) | Carrying-out mechanism | |
| US6905399B2 (en) | Conditioning mechanism for chemical mechanical polishing | |
| JP4824883B2 (en) | Substrate polishing apparatus and substrate polishing / cleaning / drying method | |
| CN214979847U (en) | Wafer edge polishing device | |
| CN116175367A (en) | Substrate thinning workbench, substrate thinning device and substrate thinning method | |
| JP2005026274A (en) | Method of polishing edge of semiconductor wafer | |
| JP2022180712A (en) | Grinder, grinder control method, and recording medium | |
| KR20230010581A (en) | Spindle unit | |
| JPS61182738A (en) | Free size chucking mechanism for wafer | |
| CN207104599U (en) | One kind polishing servicing unit | |
| CN111633520A (en) | A highly integrated thinning device | |
| TW202126393A (en) | Improved grinding and cleaning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |