CN116148634A - Empty board testing system and method for Mini Led substrate - Google Patents

Abstract

The invention relates to a blank testing system and method for a Mini LED substrate, which are used for conducting a conductivity test on a Mini LED substrate circuit before packaging chips, wherein the blank testing system comprises the Mini LED substrate, a blank testing module and a result display unit. The invention adopts the conduction testing method that the control unit for controlling the testing route and the Mini Led substrate circuit to be tested can be connected to any one angle welding disc in the matrix welding disc in a contact way through the substrate connector to test the substrate circuit, and one-key testing can be completed by one-key operation, the testing time is short, and the efficiency is high; meanwhile, the connection control mode can be suitable for all products which are connected by adopting matrix type bonding pads, and personnel training cost and jig development cost are saved. In addition, the invention adopts the storage analysis unit to record the conductivity test results of a plurality of Mini Led base lines for integral analysis and visual display, thereby being beneficial to timely finding and improving the manufacturing process defects and saving unnecessary cost.

Description

A kind of empty board test system and method of Mini Led substrate

technical field

The invention relates to the technical field of electrical testing of Mini Led substrates, in particular to an empty board testing system and method for Mini Led substrates.

Background technique

Carrying out the electrical test of the empty board of the Mini Led substrate can detect the functional defects of the circuit early, which is conducive to improving the production process, increasing the product yield and reducing the cost. At present, the industry conducts the electrical test of the empty board of the Mini Led substrate. The commonly used methods are the moving flying probe test and the on-off fixture test. The moving flying probe test uses four to eight independently controlled probes to move into the test. Pads for testing, mobile flying probe testing is more flexible, a set of equipment can be used in products with different structures, but based on the characteristics of small pad spacing and many line connections on the Mini Led substrate circuit, the time and efficiency of using mobile flying probe testing is long Low, cumbersome and error-prone operations by the staff, and easy to cause mismeasurement due to the small pad spacing; the on-off jig test is a jig developed for each structure of the product, the test speed is faster than the flying probe test, and the staff is easy to operate , but one fixture cannot be used for products with multiple structures, and the development cost of the fixture is high; on the other hand, neither the moving flying probe test nor the on-off fixture test has the ability to store the test data of multiple Mini Led substrates Functions for overall intuitive analysis. It is necessary to study an empty board test method for Mini Led substrates, which can solve the current problems of long test time and low efficiency, high cost of test tool development, cumbersome and error-prone staff operations, and no intuitive data as a basis for process improvement.

Contents of the invention

In order to solve the problems of long time, low efficiency, high cost of test tool development, cumbersome and error-prone operations of the staff in the empty board electrical test of the current Mini Led substrate, and the use of intuitive data as the basis for process improvement, the present invention proposes the use of Connect the contact connector to any corner pad in the matrix pad of the Mini Led substrate, control the test circuit through the control unit, record multiple Mini Led substrates for overall analysis, and visually display the circuit test results of each Mini Led substrate A solution for screening good products and displaying the overall analysis results as a reference for diagnosing process defects.

The technical scheme that the present invention solves its technical problem adopts is as follows:

In the first aspect, the present invention provides an empty board test system for a Mini Led substrate, which is used for conducting a continuity test on the Mini Led substrate circuit before packaging the chip. The empty board test system includes: a Mini Led substrate, an empty board test module and The result display unit; the Mini Led substrate includes: a substrate circuit with matrix pads, each pad can be independently connected to the positive and negative electrodes of the substrate circuit, and the matrix pads are used to fully connect the lines, which is conducive to the flexible setting of the driver chip. Circuit function connection is carried out in partitions; the empty board test module includes: a substrate connector for electrically connecting to the substrate circuit, and a control unit for controlling the continuity test when the substrate connector is electrically connected to the substrate circuit, and the control unit can Through one-click setting of full-line test, the test efficiency is high; the result display unit is used to display the continuity test results, and the displayed results can be directly used for sorting and screening of good and bad products.

Preferably, the method of electrically connecting the substrate connection head to the substrate circuit includes: contacting the substrate connection head to any corner pad of the matrix pad to energize the substrate circuit and transmitting connection signals between the control unit and the substrate circuit , It is convenient to connect and disconnect by using the contact connection method, which can reduce the test time and improve the efficiency; due to the characteristics of the small pad spacing of the Mini Led, connecting the connector to the corner pad relatively improves the connection degree and reduces mistesting. The connection method is applicable to all substrates with fully connected matrix pad lines.

Preferably, the continuity test includes pad continuity test and line continuity test. The pad continuity test method is as follows: the control unit controls and tests the continuity of each pad, based on the fact that each pad is directly connected to the positive and negative poles of the substrate circuit, and the pad continuity test can be performed quickly with one key. Measure the connection of each pad. The line continuity test method is as follows: the control unit controls the test to start from any corner pad of the matrix pad, traverse the circuit in a clockwise serpentine manner to connect to the diagonal pad of the starting point in sequence; The pad starts to traverse the line in a counterclockwise serpentine manner and connects to the diagonal pad at the starting point in turn. By performing clockwise serpentine traversal and counterclockwise serpentine traversal from the same corner pad, it can be tested with a shorter route. Continuity of each line.

Preferably, the result display unit is to display the continuity test result on the display screen included in the empty board test module. The lines and pads that are connected, and the lines and pads that should be turned on but not connected are marked, the test results are displayed intuitively, and good products and defective products can be screened out in real time.

Preferably, the empty board test module also includes a storage analysis unit, which is used to record the continuity test results of each Mini Led substrate and conduct an overall analysis. By displaying the overall analysis results in real time, defects in the manufacturing process can be found in time for process improvement. .

Preferably, a die-bonding glue containing phosphor is coated on each pad, and the result display unit includes displaying the continuity test result on the pad, and the specific display method is: the control unit controls the set circuit and pad During the test, the phosphor on the conducting pad emits light, so that the conduction of the pad of the line is visually displayed by using the structural characteristics of the pad.

In the second aspect, the present invention also provides an empty board test method for the Mini Led substrate, which uses the empty board test system of the first aspect to test the continuity of the Mini Led substrate circuit, including steps: S1, connecting the substrate connector to the On any corner pad of the MiniLed substrate matrix pad; S2, the control unit starts the pad continuity test, and the result display unit displays the pad continuity test result, which is recorded by the storage analysis unit included in the empty board test module The pad continuity test results of each Mini Led substrate line fed back by the control unit; S3, the control unit starts the line continuity test, the result display unit displays the line continuity test results, and the storage analysis unit records the control unit Feedback the line continuity test results of each Mini Led substrate circuit; S4, extract the line continuity test results recorded by the storage analysis unit, select several pieces of Mini Led substrate line continuity test records for overall analysis and conduct Visualized result display, convenient connection and one-key operation test, short test time and intuitive test results.

The beneficial effects of the present invention are:

In the first aspect, the present invention adopts the method of contactably connecting the control unit controlling the test route and the Mini Led substrate circuit to be tested to any corner pad in the matrix pads through the substrate connector to conduct a continuity test. Convenient connection and one-key operation control can complete the continuity test of all lines, and the test result can be displayed intuitively by the result display unit, with short test time and high efficiency.

In the second aspect, the present invention uses a storage analysis unit to record the continuity test results of multiple Mini Led base lines and visually displays them through the result display unit, which is conducive to timely discovery and improvement of defects in the manufacturing process and reduces unnecessary costs.

In the third aspect, the contactable connection mode of the control unit and the basic circuit adopted by the present invention is easy to operate and can be adapted to all products that use matrix pad full connection, saving personnel training costs and fixture development costs.

Description of drawings

Fig. 1 is a schematic structural diagram of an empty board testing system for a Mini Led substrate provided by an embodiment of the present invention;

Fig. 2 is a schematic diagram of the wiring connection of the Mini Led substrate provided by the embodiment of the present invention;

Fig. 3 is a schematic diagram of line traversal for line continuity test provided by an embodiment of the present invention;

Fig. 4 is a flow chart of a blank board testing method for a Mini Led substrate provided by an embodiment of the present invention.

Drawing logo:

1-Mini Led substrate; 11-substrate line; 12-pad; 121-corner pad; 122-diagonal pad;

2-empty board test module; 21-substrate connector; 22-control unit;

3- Result display unit;

41-Clockwise serpentine traversal line; 42-Counterclockwise serpentine traversal line.

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described:

The empty board mentioned in this program refers to a circuit board without soldering devices. The circuit board production process is long, and defects such as short circuit, open circuit, and leakage are prone to occur during the production process. The Mini Led substrate 1 has the characteristics of high density and fine pitch, and the production is more difficult. During the production process, if the circuit board cannot be timely Electronically defective products are screened out and allowed to flow into the production process, which will cause more waste of cost. It is necessary to improve the testing technology and improve the process in time to reduce the product scrap rate and improve the yield rate. After the empty board is produced, if the open circuit of the substrate can be detected, the defect can be improved by supplementing the line, or a Mini Led substrate 1 can be discarded directly; but if the open circuit cannot be detected, it will be shipped to the downstream manufacturer for installation on the equipment If it is detected and found in time, it will waste more man-hours and material costs of downstream manufacturers. If no problems are found when downstream manufacturers install equipment, the overall product will be discovered only when it enters the market for use, and the cost loss will be greater. Therefore, high-quality and high-quality Efficient empty board testing is necessary to find circuit defects in time. This solution aims to improve the problems of long time and low efficiency of the current empty board testing technology, high cost of fixture development, process improvement without intuitive and accurate data.

Please refer to Figure 1 and Figure 2. This solution provides an empty board test system for Mini Led substrate 1, which is used to test the continuity of the Mini Led substrate circuit 11 before packaging the chip. The empty board test system includes: Mini Led substrate 1. Empty board test module 2 and result display unit 3; Mini Led substrate 1 includes: substrate circuit 11 containing matrix pads 12, each pad 12 can be independently connected to the positive and negative electrodes of the substrate circuit 11; empty board test The module 2 includes: a substrate connection head 21 for electrically connecting to the substrate circuit 11, and a control unit 22 for controlling the continuity test when the substrate connection head 21 is electrically connected to the substrate circuit 11; the result display unit 3 is used for Displays the continuity test results.

Specifically, the Mini Led substrate 1 has pads with a small spacing and is arranged in a matrix. Each pad can be independently connected to the positive and negative electrodes of the substrate circuit 11. All the substrate circuits 11 are connected to each other. The characteristics of the control application circuit, so the traditional flying probe test or special fixture test is used, and its operation efficiency is very low. Using the control unit 22 to connect to the circuit 11 of the substrate is the same as the principle that the circuit is controlled by the driver chip after the substrate is installed in the device. By using the substrate connector 21 to connect and power on, the control unit 22 controls all the connected circuits with one key. Test, the test is automatically completed in a short time without moving the flying probe, and the test accuracy is high.

Further, the method of electrically connecting the substrate connection head 21 to the substrate circuit 11 includes: contacting the substrate connection head 21 to any corner pad 121 of the matrix pad to energize the substrate circuit and connecting the control unit 22 and the substrate circuit. 11 to transmit connection signals.

Specifically, in order to improve the test efficiency, the conventional probe insertion test method is only suitable for the test of a small number of substrates, and requires a simple operation mode of connecting and disconnecting for a large number of tests, so the substrate connector 21 is connected to the substrate circuit 11 The pad 12 of the pad adopts a contactable connection method, such as an adsorption type, a plug-in type, a buckle type, and a shrapnel type. Based on the characteristics that each pad 12 is independently connected to the positive and negative poles of the substrate circuit 11, connecting the substrate connector 21 to any pad 12 in the matrix pad 12 can realize the control of all pads 12 through the control unit 22 It is connected to all lines, but due to the small spacing between the pads 12, if the substrate connector 21 is inserted into the middle pad 12, it is easier to touch other pads during insertion than the corner pad 121 12 cause unnecessary damage, therefore, this solution adopts to insert the substrate connector 21 into the corner pad 121 for connection, and the connection with less damage is more convenient. Connecting through the substrate connection head 21, on the one hand, it is to energize the substrate circuit 11, and on the other hand, it is to transmit the signal, that is, the control unit 22 transmits the connected circuit signal to the substrate circuit 11, and the substrate circuit 11 will set the circuit and welding. The switching on of the disk 12 is fed back to the control unit 22 .

Further, please continue to refer to FIG. 2 , the continuity test includes a pad continuity test and a line continuity test. The pad continuity test method is: the control unit 22 controls the conductivity of each pad 12 to be tested once.

Specifically, the test process is set to conduct the pad continuity test first, and then the line continuity test, because if it is found that the pad 12 is disconnected during the pad continuity test stage, it can be directly The Mini Led substrate 1 is returned to the manufacturing process for repair or discarded, which can save the time spent in the subsequent circuit continuity test. Of course, when an open circuit is found in the pad 12 , whether to continue the subsequent line continuity test can be set by the control unit 22 .

Further, please refer to FIG. 3 , the circuit continuity test method also includes: the control unit 22 controls the test to start from any corner pad 121 of the matrix pad 12, and traverses the circuit in a clockwise serpentine manner to sequentially connect to The diagonal pad 122 of the starting point; and then from the starting point pad 121 traversing the circuit in a counterclockwise serpentine manner and sequentially connected to the diagonal pad 122 of the starting point pad.

Specifically, if no open circuit is found in the soldering continuity test, based on the characteristics of the full connection of the lines between the pads 12 of the Mini Led substrate 1, it does not mean that all lines are conducting, and further line continuity testing is required. , the purpose of the line continuity test includes firstly that all lines need to be traversed, and secondly that the test line should be as short as possible to ensure the test efficiency. Based on the characteristics of matrix pads and fully connected lines, any pad can be used As the starting point, through two-dimensional array traversal methods, such as loop traversal, diagonal traversal, etc., this program uses any corner pad 121 as the starting point, firstly traverse clockwise to the diagonal pad 122, and then from The counterclockwise serpentine traversal method starting from the starting point pad 121 has the characteristics of traversing all the circuits and the traversing route is relatively short, which is the preferred method of traversing the test circuit.

Further, the result display unit 3 displays the continuity test result on the display screen included in the blank board test module 2 . The method of using the display screen to display the continuity test result is: when the control unit 22 controls the set circuit and pad to be tested, the conductive line and pad are marked on the display screen, and it is indicated that it should be connected but not conducted. through the lines and pads.

Specifically, after the substrate connector 21 is connected to the substrate circuit 11, the control unit 22 can automatically detect the structure of the substrate circuit 11 and simulate the overall circuit diagram of the substrate on the display screen. After the test is completed, the test can be The feedback line connection status is marked on the overall line diagram, that is, the connected line status can be marked, and the unconnected line status can also be marked. The display through the display screen has the characteristics of real-time, intuitive and comprehensive.

Further, the empty board test module 2 also includes a storage and analysis unit for recording the continuity test results of each Mini Led substrate and performing overall analysis.

Specifically, the storage analysis unit is connected with the control unit 22 and the display screen, and records the continuity test situation fed back to the control unit 22. When the recorded Mini Led substrate 1 exceeds two, the overall analysis can be performed in real time and the results will be updated. to the display. The storage and analysis unit can also be externally connected, such as installing the storage and analysis unit on the upper PC, and then connecting the control unit to the upper PC, so that the storage capacity can be expanded, and the number of records on the corresponding stored Mini Led substrate 1 can be changed. Restricted, the content of data analysis can be richer. It is also possible to have a built-in storage and analysis unit in the empty board test module and an external storage and analysis unit on the upper PC. The built-in can display the brief situation of the overall analysis in real time, but the amount of data is limited; the amount of data that can be stored in the external connection is not limited. The content of the analysis can be more comprehensive, but the real-time performance may be affected.

Further, each bonding pad 12 is coated with a die-bonding glue containing phosphor, and the result display unit 3 includes displaying the continuity test result on the bonding pad 12. The specific display method is: the control unit 22 controls the set When the circuit and pad are tested, the phosphor powder on the conductive pad 12 emits light.

Specifically, coating the die-bonding glue containing fluorescent powder on the pad is used as a guideline for dividing different functional areas when soldering the Mini Led chip. As a simple system application of the empty board test system, the empty board test module 2 may only include the substrate connector 21 and the control unit 22, and the result display is based on the characteristics of the pad 12 of the Mini Led substrate 1 that can emit light when it is energized It can be directly displayed, and the test results can also be displayed on the display screen and pad light-emitting display at the same time. The staff can directly screen and sort out defective products according to the pad display results.

Please refer to Fig. 4, this scheme also provides a kind of empty board test method of Mini Led substrate 1, this method adopts the empty board test system as mentioned above to carry out continuity test to Mini Led substrate circuit 11, and described method comprises the steps : S1, connect the substrate connector 21 to any corner pad 122 of the matrix pad 12 of the Mini Led substrate 1; S2, the control unit 22 starts the pad continuity test, and the result display unit 3 displays the pad guide Continuity test result, the pad continuity test result of each Mini Led substrate line 11 fed back by the storage analysis unit included in the empty board test module 22 recorded by the control unit 22; S3, the control unit 22 starts the line continuity test , the line continuity test result is displayed by the result display unit 3, and the line continuity test result of each Mini Led substrate line 11 fed back by the storage analysis unit recording control unit 222; S4, extracting the line continuity test result recorded by the storage analysis unit For the results of the continuity test, select several continuity test records of the Mini Led substrate circuit 11 for overall analysis and visual display of the results.

Specifically, one end of the substrate connector 11 is fixedly connected to the control unit 22, and the other end is contactably connected to any one of the four corner pads 121 of the matrix pad 12 of the substrate circuit 11, which can realize Any pads and connections to the substrate circuit 11. Contactable connections include but are not limited to suction connections, plug-in connections, shrapnel connections, buckle connections, etc., which have the characteristics of convenient connection and disconnection operations and improve test efficiency. After the substrate connector 21 is connected to the control unit 22 and the substrate circuit 11, the control unit 22 first starts the pad continuity test, that is, tests whether each pad 12 can be connected separately; and then the control unit 22 starts the circuit conduction test. Continuity test, the goal of line continuity test is to use the shortest line to traverse to all the connections of lines and pads. The substrate line 11 is similar to a two-dimensional array connection method, and the available line traversal methods include loop traversal , diagonal traversal, etc., this program uses any corner pad 121 as the starting point, firstly traverse clockwise to the diagonal pad 122 of the starting corner pad 121, and then start from the starting point to perform counterclockwise snake-like traversal The solution to the diagonal pad 122 can traverse all the pads of the circuit, and the traversed circuit is short, that is, the number of repeated circuits is small, which has the advantage of achieving the test target with high efficiency. It should be noted that the pad continuity test and the line continuity test mentioned in this solution are both controlled by the control unit 22 to control the direction of the connected lines. Existing technology conducts empty board testing, and directly reworks or discards defective Min Led substrates 1, and often uses an intuitive way to summarize process defects for improvement. This solution stores the test records of each Mini Led substrate 1, Carry out overall analysis to provide accurate data reference for process improvement.

Those skilled in the art can make various other corresponding changes and deformations according to the above-described technical solutions and concepts, and all these changes and deformations should fall within the protection scope of the claims of the present invention.

It should be noted that: the above-mentioned embodiments are only some embodiments of the present invention, but not all embodiments. As used in the examples and appended claims, the singular forms "a", "the", "this time", "when", "last time" and "the" are also intended to include the plural forms unless The context clearly indicates other meanings.

Claims (10)

1. An empty board test system of Mini Led substrate for conducting test to Mini Led substrate circuit before packaging chip, which is characterized in that the empty board test system comprises: mini Led base plate, empty plate test module and result display unit;

the Mini Led substrate comprises: a substrate circuit including matrix-type pads, each pad being independently connectable to a positive electrode and a negative electrode of the substrate circuit;

the empty board test module includes: a substrate connector for electrically connecting to the substrate circuit, and a control unit for controlling conducting of the conductivity test when the substrate connector is electrically connected to the substrate circuit;

the result display unit is used for displaying the conductivity test result.

2. The blank testing system of claim 1, wherein the manner in which the substrate connector is electrically connected to the substrate trace comprises: the contact connection of the substrate connector to any one of the corner pads of the matrix pad energizes the substrate circuit and transmits a connection signal between the control unit and the substrate circuit.

3. The blank testing system of claim 1, wherein the continuity test comprises a pad continuity test and a line continuity test.

4. The blank testing system of claim 3, wherein the pad conductivity test mode is: the conductivity of each pad is controlled by a control unit.

5. A blank testing system according to claim 3, wherein the line conductivity testing is performed by: the control unit controls and tests any corner pad of the matrix-shaped pad to serve as a starting point, and the clockwise snakelike traversing line is sequentially connected to the diagonal pad of the starting point; and starting from the starting corner pad, connecting the diagonal pad of the starting corner pad in reverse time Zhong Shexing traversing lines.

6. The blank testing system according to claim 1, wherein the result display unit displays the continuity test result on a display screen included in the blank testing module.

7. The blank testing system of claim 6, wherein the means for displaying the conductivity test results is: when the control unit controls the set lines and bonding pads to be tested, the display screen marks the conductive lines and bonding pads and marks the lines and bonding pads which are required to be conductive but not conductive.

8. The empty board test system according to claim 1, wherein the empty board test module further comprises a storage analysis unit for recording a conductivity test result of each Mini Led substrate and performing overall analysis.

9. The blank testing system according to claim 1, wherein each bonding pad is coated with a die bond adhesive containing fluorescent powder, and the result display unit displays the conductivity test result on the bonding pad in the following specific display modes: and the control unit controls the fluorescent powder on the conducting bonding pad to emit light when the set circuit and the bonding pad are tested.

10. A blank testing method for a Mini Led substrate, the method adopting the blank testing system according to any one of claims 1-9 to conduct conductivity test on a Mini Led substrate circuit, the method comprising the steps of:

s1, connecting a substrate connector to any corner pad of a Mini Led substrate matrix pad;

s2, the control unit starts a pad conductivity test, a result display unit displays a pad conductivity test result, and a storage analysis unit contained by the empty board test module records the pad conductivity test result of each Mini Led substrate circuit fed back by the control unit;

s3, the control unit starts a circuit conductivity test, a result display unit displays a circuit conductivity test result, and a storage analysis unit records the circuit conductivity test result of each Mini Led substrate circuit fed back by the control unit;

s4, extracting the line conductivity test results recorded by the storage analysis unit, selecting the conductivity test records of a plurality of Mini Led substrate lines to carry out overall analysis and carrying out visual result display.

Images