CN115802699B - electronic devices - Google Patents
electronic devicesInfo
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- CN115802699B CN115802699B CN202211319864.0A CN202211319864A CN115802699B CN 115802699 B CN115802699 B CN 115802699B CN 202211319864 A CN202211319864 A CN 202211319864A CN 115802699 B CN115802699 B CN 115802699B
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- air
- air duct
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- heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本申请公开了一种电子设备，包括壳体、导风罩、多个待散热器件和散热风机。导风罩容置于内腔内。导风罩将壳体的内腔分隔为通风腔和隔离腔。通风腔包括主风道和与主风道相连通的多个分支风道。每一分支风道开设有与隔离腔相连通的排风孔。壳体的一端开设有与主风道相连通的进风口，壳体的另一端开设有与隔离腔相连通的出风口。多个待散热器件设置在隔离腔内。散热风机用于将气流导入进风口，经进风口导入的气流通过主风道流入多个分支风道中，并通过多个分支风道流向多个待散热器件，以对多个待散热器件进行散热，从而实现电子设备对精准送风进行控制,满足散热风向的多样化使用需求，以及通过分支风道能够针对性地对各个待散热器件进行散热。
The present application discloses an electronic device, comprising a housing, an air duct, a plurality of devices to be cooled, and a heat dissipation fan. The air duct is housed in an inner cavity. The air duct divides the inner cavity of the housing into a ventilation cavity and an isolation cavity. The ventilation cavity comprises a main air duct and a plurality of branch air ducts connected to the main air duct. Each branch air duct is provided with an exhaust hole connected to the isolation cavity. An air inlet connected to the main air duct is provided at one end of the housing, and an air outlet connected to the isolation cavity is provided at the other end of the housing. A plurality of devices to be cooled are arranged in the isolation cavity. The heat dissipation fan is used to guide the airflow into the air inlet, and the airflow introduced through the air inlet flows into the plurality of branch air ducts through the main air duct, and flows to the plurality of devices to be cooled through the plurality of branch air ducts to dissipate heat for the plurality of devices to be cooled, thereby realizing the electronic device to control the precise air supply, meeting the diversified use requirements of the cooling wind direction, and being able to dissipate heat for each device to be cooled in a targeted manner through the branch air ducts.
Description
Technical Field
The application relates to the technical field of heat dissipation of electronic devices, in particular to electronic equipment.
Background
With the continuous development of cloud computing and big data technology, the power consumption of the heating element of the electronic device is gradually increased, and the heat dissipation requirement is increased. At present, the heat dissipation mode of the electronic equipment mainly dissipates heat of the functional device through a heat dissipation fan. The existing heat dissipation air duct of the electronic equipment adopts an advancing air duct and a back air duct, and a wind shield is arranged at the bypass place of the air duct so as to optimize air duct management. However, in the scene of the air outlet duct after advancing, the electronic equipment cannot realize accurate air supply, the heat dissipation direction of the air duct is single, and the upstream heat dissipation devices which are sequentially arranged on the air outlet path have the effects of heating and wind shielding on the downstream heat dissipation devices, so that the heat dissipation requirements cannot be met.
Disclosure of Invention
In view of this, the application provides an electronic device, which solves the problems that in the scene of the air outlet duct after advancing, the electronic device cannot realize accurate air supply, the heat dissipation direction of the air duct is single, and the upstream devices to be cooled, which are sequentially arranged on the air outlet path, have the effects of heating and wind shielding on the downstream devices to be cooled, so that the heat dissipation requirement cannot be met.
In a first aspect, the present application provides an electronic device, comprising:
a housing having an interior cavity;
The air guide cover is connected with the shell, the air guide cover divides the inner cavity of the shell into a ventilation cavity and an isolation cavity which is isolated from the ventilation cavity, the ventilation cavity comprises a main air duct and a plurality of branch air ducts which are communicated with the main air duct and are isolated from each other, each branch air duct is provided with an exhaust hole which is communicated with the isolation cavity, the front side of the shell is provided with an air inlet which is communicated with the main air duct, and the rear side of the shell is provided with an air outlet which is communicated with the isolation cavity;
the devices to be cooled are arranged in the isolation cavity;
The heat dissipation fan is used for guiding air flow into the air inlet, the air flow guided through the air inlet flows into the plurality of branch air channels through the main air channel, and flows to the plurality of devices to be dissipated through the plurality of branch air channels so as to dissipate heat of the plurality of devices to be dissipated.
With reference to the first aspect, in certain implementation manners of the first aspect, the electronic device further includes a liquid cooling radiator, where the liquid cooling radiator is located in the isolation cavity and is isolated from the ventilation cavity, so that the liquid cooling radiator is prevented from being exposed to a cold air flow led in by the heat dissipation fan, and heat leakage problem of the liquid cooling radiator is reduced.
With reference to the first aspect, in some implementations of the first aspect, the device to be cooled includes a heating element and a radiator attached to the heating element, and the exhaust hole faces a windward side of the radiator, so that air flow entering the radiator is improved, contact area between the air flow and the radiator is increased, heat exchange efficiency between the radiator and the air flow is improved, the device to be cooled can cool rapidly, and cooling performance is improved.
The device to be cooled comprises a heating element, and the exhaust hole faces the heating surface of the heating element, so that the contact area of the air flow and the heating element is increased, the heat exchange efficiency of the heating element and the air flow is improved, the device to be cooled can be cooled rapidly, and the heat dissipation performance is improved.
With reference to the first aspect, in some implementations of the first aspect, a distance between the exhaust hole and the windward side or the heating side is less than or equal to 5mm, so that air flow led out by the branch air duct can be ensured to enter the air-cooled radiator quickly, and air-cooled radiating efficiency is improved.
With reference to the first aspect, in some implementations of the first aspect, the electronic device further includes a circuit board for disposing a plurality of devices to be cooled, the wind scooper is suspended in a containing space above or below the circuit board, and a gap for airflow passing through is formed between the circuit board and the wind scooper, so as to ensure that airflow passing through the devices to be cooled is discharged outside the housing through the air outlet.
With reference to the first aspect, in certain implementations of the first aspect, the air guide cover is configured as a hollow cover body, and an inner cavity of the air guide cover is used as the ventilation cavity, or
The air guide cover is in sealing connection with the shell, and the air guide cover and the shell surround to form the ventilation cavity.
With reference to the first aspect, in some implementations of the first aspect, the plurality of branch air channels include a first air channel and a second air channel, the plurality of devices to be cooled includes a first device to be cooled corresponding to the first air channel and a second device to be cooled corresponding to the second air channel, the first device to be cooled and the second device to be cooled are sequentially arranged along a length direction of the electronic device, an air flow flowing through the first air channel flows to the first device to be cooled so as to cool the first device to be cooled, and an air flow flowing through the second air channel flows to the second device to be cooled so as to cool the second device to be cooled. Therefore, on one hand, the first air duct and the second air duct are arranged in different directions, so that the airflow guided out by the first air duct and passing through the first device to be cooled is reduced to flow to the second device to be cooled, and further the heat passing through the first device to be cooled is better prevented from heating the second device to be cooled, and on the other hand, cold airflows are respectively and independently provided for the first device to be cooled and the second device to be cooled through the first air duct and the second air duct, and therefore the cooling effect of the first device to be cooled and the second device to be cooled is improved.
With reference to the first aspect, in certain implementation manners of the first aspect, the first air duct extends along a length direction of the electronic device, and the second air duct extends along a width direction of the electronic device, so as to ensure that the first air duct and the second air duct have enough space to provide a proper air outlet, and ensure that the first device to be cooled and the second device to be cooled are matched in a certain range to cool the first device to be cooled and the second device to be cooled, thereby improving cooling efficiency of the electronic device.
With reference to the first aspect, in some implementations of the first aspect, an included angle is formed between an air outlet direction of the first air duct and an air outlet direction of the second air duct, so that an influence of the first device to be cooled, which is arranged upstream of an air outlet path, on heating and wind shielding of the second device to be cooled, which is arranged downstream of the first device to be cooled, is reduced, and therefore a cooling effect is improved, and cooling requirements of the respective devices to be cooled are met.
With reference to the first aspect, in some implementation manners of the first aspect, an air outlet direction of the first air duct is perpendicular to an air outlet direction of the second air duct, so that a structure of the air guide cover is simplified, and assembly efficiency between the air guide cover and the housing is improved.
With reference to the first aspect, in certain implementation manners of the first aspect, a height of the first air duct is smaller than a height of the second air duct, so that a height of the air-cooled radiator can be increased in a limited space of the housing, a heat dissipation effect of the second device to be dissipated is improved, and the second air duct plays a role of a baffle to block airflow guided out by the first air duct and passing through the first device to be dissipated from flowing to the second device to be dissipated, directional guiding of wind power is achieved, and the heat dissipation effect is enhanced.
With reference to the first aspect, in certain implementation manners of the first aspect, the plurality of devices to be cooled further includes a third device to be cooled corresponding to the first air duct, and the third device to be cooled and the first device to be cooled are arranged at intervals so as to realize that the first device to be cooled and the third device to be cooled share the same first air duct, so as to concentrate on the first device to be cooled and the third device to be cooled, and simplify the air duct design of the air guide cover.
With reference to the first aspect, in some implementations of the first aspect, the number of the first air channels includes two, two first air channels are respectively disposed on two side portions of the main air channel in a width direction of the electronic device, and the second air channel is disposed on one side portion of the main air channel in a length direction of the electronic device, so that more spaces can be formed in a region surrounded by the two first air channels and the second air channel for mounting other functional devices of the electronic device, and an overall structure of the electronic device is more compact.
With reference to the first aspect, in some implementations of the first aspect, a projection of the first air duct on a projection plane of the electronic device in a width direction and a projection of the second air duct on the projection plane are arranged at intervals or are arranged adjacently, so that air guided out of the first air duct flows through the first device to be cooled and can avoid the second air duct to be cooled and then be guided to the outside of the housing rapidly, and a cooling effect of the first device to be cooled and the second device to be cooled is enhanced.
In combination with the first aspect, in some implementations of the first aspect, the number of the first air channels includes at least three, at least three first air channels are arranged at intervals in sequence in a width direction of the electronic device, two of the first air channels are arranged at two side portions of the main air channel in the width direction of the electronic device, the rest of the first air channels are arranged at the middle of the main air channel, and the second air channels are arranged at one side portion of the main air channel, so that a heat dissipation effect of the heat dissipation device to be dissipated corresponding to the first air channel located at the middle of the main air channel is enhanced.
With reference to the first aspect, in some implementations of the first aspect, the plurality of branch air ducts further include a third air duct, where the third air duct and the first air duct are located on different sides of the main air duct in a height direction of the electronic device, so that the devices to be cooled can be more dispersedly disposed in different areas of the isolation cavity, and therefore, an air supply and cooling range can be adjusted by optimizing a layout of the branch air ducts, and a cooling effect of the electronic device is improved.
With reference to the first aspect, in some implementations of the first aspect, an air outlet direction of the third air duct is different from air outlet directions of the first air duct and the second air duct, so that a spatial layout of each device to be cooled in the electronic device is more optimized, the structure is more compact, the functions are more diverse, and the heat dissipation is more efficient.
With reference to the first aspect, in certain implementation manners of the first aspect, at least one of the first air duct, the second air duct and the third air duct includes a plurality of sub-air ducts that are arranged at intervals, so that air supply control on each device to be cooled is more accurately achieved, and heat crosstalk between a plurality of devices to be cooled is prevented.
The electronic equipment provided by the application distributes air flow to the branch air channels based on the main air channel, on one hand, realizes accurate air supply control of the electronic equipment, is beneficial to reducing energy consumption, and on the other hand, realizes that a plurality of heat sinks respectively conduct separated heat dissipation through different branch air channels, can change the circulation direction of the air flow through the branch air channels so as to meet the diversified use requirements of heat dissipation air directions, solves the problem that upstream heat sinks sequentially arranged on an air outlet path heat and keep out wind to downstream heat sinks under the scene of advancing and exiting the air channels, further improves the heat dissipation effect, and meets the heat dissipation requirements of each heat sink.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic diagram of the electronic device of fig. 1 with a housing omitted.
Fig. 3 is a front view of the electronic device of fig. 1 with the housing omitted.
Fig. 4 is a left side view of the electronic device of fig. 1 with the housing omitted.
Fig. 5 is a schematic structural view of a first view angle of the first embodiment of the wind scooper of the electronic device in fig. 2.
Fig. 6 is a schematic structural diagram of a second view angle of the wind scooper of the electronic device in fig. 5.
Fig. 7 is a schematic structural diagram of a third view angle of the wind scooper of the electronic device in fig. 5.
Fig. 8 is a schematic diagram illustrating airflow directions of the electronic device in fig. 1 in a fresh air mode.
Fig. 9 is a schematic structural view of a second embodiment of a wind scooper of the electronic device in fig. 1.
Fig. 10 is a schematic structural view of a third embodiment of a wind scooper of the electronic device in fig. 1.
Fig. 11 is a schematic structural view of a fourth embodiment of a wind scooper of the electronic device in fig. 1.
Description of the main reference signs
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the manner in which the application may be better understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
The terms first, second and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1 together, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the application. The electronic device 100 includes a housing 10, a wind scooper 20, a plurality of devices 30 to be heat-dissipated, and a heat dissipation fan 40. The housing 10 has an interior cavity 110. The wind scooper 20 is accommodated in the inner cavity 110. In some embodiments, a wind scooper 20 is coupled to the housing 10. In other embodiments, the wind scooper 20 may also be placed within the interior cavity 110 of the housing 10. The hood 20 divides the interior cavity 110 of the housing 10 into a ventilation cavity 120 and an isolation cavity 130. The ventilation chamber 120 includes a main air duct 21 and a plurality of branch air ducts 23 communicating with the main air duct 21. Each of the branched air channels 23 is provided with an exhaust hole 230 communicated with the isolation chamber 130. An air inlet 101 communicated with the main air duct 21 is formed in one end of the shell 10, and an air outlet 102 communicated with the isolation cavity 130 is formed in the other end of the shell 10. A plurality of devices 30 to be heat-dissipated are disposed in the isolation chamber 130. The heat dissipation fan 40 is used for guiding air flow into the air inlet 101, and the air flow guided through the air inlet 101 flows into the plurality of branch air channels 23 through the main air channel 21, and flows to the plurality of devices to be dissipated 30 through the plurality of branch air channels 23, so as to dissipate heat of the plurality of devices to be dissipated 30.
The electronic equipment 100 provided by the application distributes air flow to the branch air channels 23 based on the main air channel 21, on one hand, realizes accurate air supply control of the electronic equipment 100, is beneficial to reducing energy consumption, and on the other hand, realizes that a plurality of radiators to be separated and radiating through different branch air channels 23, and can change the circulation direction of the air flow through the design of the branch air channels 23 to meet the diversified use requirements of the radiating air direction, and solves the problems that the upstream radiator 30 to be radiated sequentially arranged on an air outlet path heats and shields the downstream radiator 30 in the scene of the front and rear air outlet channels, thereby improving the radiating effect and meeting the radiating requirements of each radiator 30.
It should be noted that, fig. 1 is only for schematically describing the arrangement manner of the housing 10, the air guiding cover 20, the plurality of devices 30 to be cooled and the cooling fan 40, and is not limited to the connection positions, connection relationships, specific structures, and the like of the respective elements. Fig. 1 is merely a structure of an electronic device 100 according to an embodiment of the present application, and does not constitute a specific limitation of the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown in FIG. 1, or may combine certain components, or different components, e.g., electronic device 100 may also include, but is not limited to, power buttons, input-output interfaces, etc. Electronic device 100 includes, but is not limited to, a server, a computer system, a communications room, a data switching center, a network control system, and the like.
In some embodiments, electronic device 100 further comprises a liquid-cooled heat sink 60. The liquid-cooled radiator 60 is in contact with the plurality of devices 30 to be cooled to radiate heat from the plurality of devices 30 to be cooled. The liquid cooling radiator 60 is used in combination with the cooling fan 40 to improve the cooling capability of the electronic device 100 and reduce the requirement of the electric energy utilization efficiency (Power Usage Effectiveness, PUE). The PUE is an index for evaluating the energy efficiency of a data center, and is the ratio of all energy consumed by the data center to the energy consumed by IT loads.
As can be appreciated, when the liquid cooling radiator 60 is disposed on the air outlet path of the heat dissipating fan 40, the air flow will take away part of the heat of the liquid cooling radiator 60 after flowing through the liquid cooling area, i.e. the liquid cooling radiator 60 has a heat leakage phenomenon, thereby reducing the heat dissipating capacity of the liquid cooling radiator 60 to the heat dissipating device 30. In this embodiment, the liquid cooling radiator 60 is disposed outside the isolation cavity 130, that is, the liquid cooling radiator 60 is disposed separately from the ventilation cavity 120 of the air guide cover 20, so that the liquid cooling radiator 60 is prevented from being exposed to the cold air flow led in by the heat dissipation fan 40, and the heat leakage problem of the liquid cooling radiator 60 is reduced. In the present embodiment, the liquid-cooled radiator 60 is a contact-type liquid-cooled radiator.
Optionally, in some embodiments, the main air duct 21 and the plurality of branch air ducts 23 together define a limiting space 140 for accommodating at least part of the liquid-cooled radiator 60, on one hand, related functional devices are arranged as much as possible in the limited internal space of the electronic device 100, so that the overall volume is reduced, and on the other hand, the liquid-cooled radiator 60 is prevented from being exposed to the air outlet path of the branch air ducts 23, so that the problem of heat leakage of the liquid-cooled radiator 60 is further reduced. In other embodiments, the liquid-cooled heat sink 60 may also be disposed outside of the spacing space 140.
In the present embodiment, the portion of the device 30 to be heat-dissipated which has a relatively large amount of heat generation may include the heat generating element 31 and the air-cooled heat sink 32 attached to the heat generating element 31. The exhaust hole 230 of each branch air duct 23 faces the corresponding device 30 to be cooled. Optionally, the exhaust hole 230 faces the windward side 321 of the air-cooled radiator 32, so as to increase the air flow rate of the air flow entering the air-cooled radiator 32, increase the contact area between the air flow and the air-cooled radiator 32, improve the heat exchange efficiency between the air-cooled radiator 32 and the air flow, enable the device 30 to be cooled to dissipate heat quickly, and improve the heat dissipation performance. The windward side 321 of the air-cooled radiator 32 refers to a side into which air flows from the heat dissipation fins of the air-cooled radiator 32. Specifically, the windward side 321 of the air-cooled radiator 32 is provided with a plurality of grooves to form a plurality of heat dissipation fins. The remaining part of the device to be heat-dissipated 30, which generates a relatively small amount of heat, may also include only the heat generating element 31. The exhaust hole 230 can also face the heating surface 311 of the heating element 31, so as to increase the contact area between the air flow and the heating element 31, improve the heat exchange efficiency between the heating element 31 and the air flow, enable the device 30 to be cooled to dissipate heat quickly, and improve the heat dissipation performance. In other embodiments, all of the devices 30 to be heat-dissipated may include the heat-generating element 31 and the air-cooled heat sink 32, or may include only the heat-generating element 31.
Optionally, the distance L between the air outlet 230 and the windward side 321 and the distance L between the air outlet 230 and the heat generating side 311 are all less than or equal to 5mm, so as to ensure that the air flow guided out of the branch air duct 23 can quickly enter the air-cooled radiator 32, and improve the air-cooled heat dissipation efficiency. The size of the air outlet 230 is equal to the area of the windward side 321, on one hand, the air flow entering the air-cooled radiator 32 is improved, and the air cooling radiating efficiency is improved, on the other hand, the size of the opening of the air outlet 230 is increased in a limited space, so that the flow of cold air flow guided out by the branch air duct 23 received by the windward side 321 of the air-cooled radiator 32 is ensured to be far greater than the flow of hot air flow of the surrounding environment, and the heat crosstalk among a plurality of devices 30 to be radiated is reduced, and the radiating effect is enhanced.
The heating element 31 may be a functional device in the electronic device 100 that requires a cooling process, for example, the heating element 31 includes, but is not limited to, a chip, a fuse, a power supply, a memory, or other heating components. The chips include, but are not limited to, a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), and the like. The air-cooled radiator 32 covers the heating element 31, thereby increasing the contact area between the air-cooled radiator 32 and the heating element 31 and enhancing the heat dissipation effect. The side of the air-cooled radiator 32, which is away from the heating element 31, is provided with a plurality of radiating fins which are arranged at intervals, and the radiating area of the air-cooled radiator 32 is increased through the radiating fins, so that heat generated by the heating element 31 can be timely and effectively radiated to the external environment. The air-cooled radiator 32 is made of a metal material such as, but not limited to, aluminum, magnesium, copper, stainless steel, ceramic, graphite, or the like, or an alloy material such as, but not limited to, aluminum alloy, magnesium alloy, or the like. It should be noted that the material of the air-cooled radiator 32 may be selected according to actual needs, which is not particularly limited in the embodiment of the present application.
The plurality of devices to be heat-dissipated 30 includes a first device to be heat-dissipated 310 and a second device to be heat-dissipated 320. The first device to be heat-dissipated 310 and the second device to be heat-dissipated 320 may each include one or more heat generating elements 31. Optionally, the plurality of heating elements 31 may correspond to the same air-cooled radiator 32, so as to realize that the plurality of heating elements 31 share one air-cooled radiator 32, thereby simplifying the assembly process of the electronic device 100 and the design of the branch air duct 23, improving the space utilization rate of the air-cooled radiator 32, and enhancing the heat dissipation effect. In some embodiments, each heating element 31 may also correspond to one air-cooled radiator 32, so as to reduce crosstalk of heat between multiple chips and enhance heat dissipation effect. In the present embodiment, the first device to be cooled 310 and the second device to be cooled 320 respectively include a plurality of chips and one air-cooled radiator 32 attached to the plurality of chips. The first device to be heat-dissipated 310 and the second device to be heat-dissipated 320 may include, but are not limited to, a CPU heat sink, a memory heat sink, a motherboard chipset heat sink, a memory hard disk heat sink, a graphics card heat sink, or a power supply heat sink, etc. In this embodiment, the types of heat sinks of the first device to be cooled 310 and the second device to be cooled 320 are different, specifically, the first device to be cooled 310 is a CPU heat sink, and the second device to be cooled 320 is a memory heat sink. In some embodiments, the heat sinks of the first device to be heat-dissipated 310 and the second device to be heat-dissipated 320 are the same, for example, each may be a CPU heat sink. The plurality of devices 30 to be heat-dissipated further includes a third heat sink 330, such as a fuse, a power supply, etc.
For the sake of clarity, the opposite ends of an article are defined as the front side and the rear side, respectively. For example, as shown in fig. 1, when describing the front side or the rear side of the housing 10, the air intake side of the housing 10 is the front side, and the air outlet side of the housing 10 is the rear side. In the present embodiment, the housing 10 is a rectangular parallelepiped. Of course, in other embodiments, the housing 10 may be other shapes. The housing 10 includes a front side plate 11, a rear side plate 12, a left side plate 13, a right side plate 14, a bottom plate 15, and a top plate 16. The front side plate 11, the rear side plate 12, the left side plate 13, the right side plate 14, the bottom plate 15, and the top plate 16 collectively enclose an inner cavity 110 of the housing 10. The air guide cover 20, the device to be cooled 30 and the liquid cooling radiator 60 are all accommodated in the inner cavity 110 of the shell 10. The front side plate 11 is provided with an air inlet 101, and the rear side plate 12 is provided with an air outlet 102. The interior cavity 110 of the housing 10 forms a forward and rear air outlet duct between the air inlet 101 and the air outlet 102. The air inlet 101 of the main air duct 21 of the air guide cover 20 is in butt joint with the air inlet 101 of the shell, so that external air flow can directly enter the main air duct 21, the branch air ducts 23 can output ambient fresh air, and the heat dissipation efficiency of each device 30 to be dissipated is improved. The heat dissipation blower 40 may include one or more. The heat dissipation fan 40 may be disposed at a position of the housing 10 corresponding to the air inlet 101, or disposed at a position of the air outlet 102 corresponding to the air outlet. In other embodiments, the heat dissipation fan 40 may be disposed at a position of the housing 10 corresponding to the air inlet 101 and a position of the air outlet 102 at the same time, so as to accelerate air flow convection, increase heat dissipation speed, and improve heat dissipation efficiency. The heat radiation fan 40 may be disposed inside the housing 10 of the electronic device 100, or may be disposed outside the housing 10 of the electronic device 100, or may be disposed inside the housing 10 and outside the housing 10 of the electronic device 100. The heat dissipation fan 40 includes, but is not limited to, a fan or an air flow compressor.
The electronic apparatus 100 further includes a circuit board 50 for disposing a plurality of devices 30 to be heat-dissipated. The circuit board 50 is accommodated in the inner cavity 110 of the housing 10 and is located in the isolation cavity 130. The heating element 31 is disposed between the air-cooled radiator 32 and the circuit board 50. The liquid cooling radiator 60 is attached to the circuit board 50 in the area corresponding to the heating element 31. The liquid cooling radiator 60 can be in contact connection with the heating device, so as to realize heat dissipation of the circuit board 50, the heating element 31 and other functional elements arranged on the circuit board 50 by the liquid cooling radiator 60, and enhance the heat dissipation effect of the electronic device 100. The wind scooper 20 is suspended in the accommodating space above or below the circuit board 50, and a gap 150 for air flow to pass through is formed between the circuit board 50 and the wind scooper 20, so that air flow passing through the device 30 to be cooled is ensured to be discharged outside the housing 10 through the air outlet 102.
In the present embodiment, the air guiding cover 20 is configured as a hollow cover body, and the inner cavity of the air guiding cover 20 is used as the ventilation cavity 120, so that the assembly process between the air guiding cover 20 and the housing 10 is simplified, and good isolation effect between the ventilation cavity 120 and the isolation cavity 130 is ensured. In some embodiments, the air guiding cover 20 is connected with the housing 10 in a sealing manner, and the air guiding cover 20 and the housing 10 form the ventilation cavity 120 in a surrounding manner, that is, the housing 10 is used as a part of the cavity wall of the ventilation cavity 120, so that materials are saved, and production cost is reduced. The wind scooper 20 may be fixed to the housing 10 by, but not limited to, clamping, welding, screwing, etc.
Referring to fig. 1 to 4, fig. 2 is a schematic diagram illustrating a structure of the electronic device 100 shown in fig. 1 with the housing 10 omitted, fig. 3 is a front view of the electronic device 100 with the housing 10 omitted, and fig. 4 is a left side view of the electronic device 100 with the housing 10 omitted. For the sake of more clear description, the X-axis direction is defined as a direction parallel to the longitudinal direction of the electronic apparatus 100, the Y-axis direction is defined as a direction parallel to the width direction of the electronic apparatus 100, and the Z-axis direction is defined as a direction parallel to the thickness direction of the electronic apparatus 100. The X-axis direction, Y-axis direction, and Z-axis direction together constitute three orthogonal directions of the electronic device 100. Illustratively, the direction opposite to the arrow direction of the X-axis direction in fig. 1 is the front, i.e., the X-axis direction is the front-back direction of the electronic device 100, the arrow direction of the Y-axis direction is the left, i.e., the Y-axis direction is the left-right direction of the electronic device 100, the arrow direction of the Z-axis direction is the up, i.e., the opposite direction to the arrow direction of the Z-axis direction is the up-down direction of the electronic device 100.
In the present embodiment, the plurality of branched air channels 23 includes a first air channel 231 and a second air channel 232. The first air duct 231 and the second air duct 232 may be disposed vertically, that is, the extending direction of the first air duct 231 is perpendicular to the extending direction of the second air duct 232. In some embodiments, the first air duct 231 and the second air duct 232 may also be disposed at other angles, such as an obtuse angle or an acute angle between the extending direction of the first air duct 231 and the extending direction of the second air duct 232.
In some embodiments, the first air duct 231 and the second air duct 232 are disposed on the same side of the main air duct 21 in the height direction of the main air duct 21, respectively, i.e., the first air duct 231 and the second air duct 232 are both on the lower side of the main air duct 21. The second duct 232 is provided independently of the main duct 21. In other embodiments, the first air duct 231 is disposed at the lower side of the main air duct 21, the second air duct 232 is disposed at the rear side of the main air duct 21, and a part of the structure of the second air duct 232 forms a part of the main air duct 21. The second air duct 232 is constructed in a T-shaped structure. The longitudinal direction of the main air duct 21 is a direction parallel to the longitudinal direction of the electronic apparatus 100, the width direction of the main air duct 21 is a direction parallel to the width direction of the electronic apparatus 100, and the height direction of the main air duct 21 is a direction parallel to the height direction of the electronic apparatus 100.
The plurality of devices to be heat-dissipated 30 includes a first device to be heat-dissipated 310 corresponding to the first air duct 231 and a second device to be heat-dissipated 320 corresponding to the second air duct 232. The first device to be heat-dissipated 310 and the second device to be heat-dissipated 320 are sequentially arranged along the length direction (i.e., the X-axis direction) of the electronic apparatus 100. The air flow flowing through the first air duct 231 flows to the first device to be cooled 310 to cool the first device to be cooled 310, and the air flow flowing through the second air duct 232 flows to the second device to be cooled 320 to cool the second device to be cooled 320. Thus, on one hand, the first air duct 231 and the second air duct 232 are arranged along different directions, so that the airflow guided out by the first air duct 231 and passing through the first device to be cooled 310 is reduced to flow to the second device to be cooled 320, and the heat passing through the first device to be cooled 310 is better prevented from heating the second device to be cooled 320, and on the other hand, the first device to be cooled 310 and the second device to be cooled 320 are respectively provided with cold airflows through the first air duct 231 and the second air duct 232, so that the cooling effect of the first device to be cooled 310 and the second device to be cooled 320 is improved.
In some embodiments, as shown in fig. 2-4, the number of first air channels 231 includes two. The two first air channels 231 are respectively provided at both side portions of the main air channel 21 in the width direction (i.e., Y-axis direction) of the main air channel 21, and the second air channel 232 is provided at one side portion of the main air channel 21 in the length direction of the main air channel 21. In the present embodiment, the two first air channels 231 are located at the left side and the right side of the main air channel 21, and the second air channel 232 is located at the rear side of the main air channel 21, so that more space is available in the area surrounded by the two first air channels 231 and the second air channel 232 for installing other functional devices of the electronic device 100, such as the liquid cooling radiator 60, and the overall structure of the electronic device 100 is more compact. In this embodiment, one of the first air channels 231, the second air channel 232, and the other first air channel 231 are sequentially arranged along the width direction of the main air channel 21, and the second air channel 232 and the second device 320 to be heat-dissipated are sequentially arranged along the length direction of the main air channel 21. Therefore, the first device to be cooled 310 and the second device to be cooled 320 can be disposed in different areas of the isolation cavity 130 in a dispersed manner, so that the air supply and cooling range can be adjusted by optimizing the layout of the first air duct 231 and the second air duct 232, and the wind power is dispersed to make the cooling effect of the electronic device 100 better. It should be noted that the number, arrangement, etc. of the first air channels 231 and the second air channels 232 may be set according to the arrangement of the devices to be cooled, and the present application is not limited in particular.
Illustratively, according to the distribution of the devices to be cooled, the first air duct 231 is located between the main air duct 21 and the first device to be cooled 310, and the second air duct 232 is located at the front side of the second device to be cooled 320 and is disposed close to the second device to be cooled 320, so that the arrangement of the first device to be cooled 310 and the second device to be cooled 320 is optimized in the limited internal space of the electronic device 100, the overall volume is reduced, and the cooling wind direction of the cooling air duct is optimized to enhance the cooling effect. The first air duct 231 extends along the length direction of the main air duct 21, and the second air duct 232 extends along the width direction of the main air duct 21, so that the first air duct 231 and the second air duct 232 are ensured to have enough space to be provided with the exhaust holes 230 to provide proper air output, and the first device 310 and the second device 320 to be cooled are ensured to be matched with the installation positions of the first device 310 and the second device 320 to be cooled in a certain range to cool the first device 310 and the second device 320 to be cooled, and the cooling efficiency of the electronic equipment 100 is improved.
In some embodiments, the projection of the first air duct 231 on the projection plane perpendicular to the length direction of the main air duct 21 and the projection of the second air duct 232 on the projection plane are arranged at intervals or are adjacent to each other, that is, the first air duct 231 and the second air duct 232 are staggered along the width direction of the main air duct 21, so that the air flow led out of the first air duct 231 can avoid the second air duct 232 and be quickly led to the outside of the housing 10 after passing through the first device to be cooled 310, and the heat dissipation effect of the first device to be cooled 310 and the second device to be cooled 320 is enhanced. In other embodiments, the projection of the first air duct 231 on the projection plane perpendicular to the length direction of the main air duct 21 is overlapped with the projection of the second air duct 232 on the projection plane.
In some embodiments, the air outlet directions of the at least two branch air channels 23 are different, and the air outlet direction of the first air channel 231 and the air outlet direction of the second air channel 232 may form an included angle, so that the influence of the first device to be cooled 310 disposed upstream of the air outlet path on the heating and wind shielding of the second device to be cooled 320 downstream is reduced, the heat dissipation effect is further improved, and the heat dissipation requirement of each device to be cooled is satisfied. Referring to fig. 5 to 7, fig. 5 is a schematic structural diagram of a first view of a first embodiment of the air guide cover 20 of the electronic device 100 in fig. 2, fig. 6 is a schematic structural diagram of a second view of the air guide cover 20 of the electronic device 100 in fig. 5, and fig. 7 is a schematic structural diagram of a third view of the air guide cover 20 of the electronic device 100 in fig. 5. In the present embodiment, the air outlet direction of the first air duct 231 is perpendicular to the air outlet direction of the second air duct 232, so that the structure of the air guiding cover 20 is simplified, and the assembly efficiency between the air guiding cover 20 and the housing 10 is improved.
The first air duct 231 is provided with a first exhaust hole 2301 facing the first device to be cooled 310, the second air duct 232 is provided with a second exhaust hole 2302 facing the second device to be cooled 320, on one hand, air flows can gather and then flow to the first device to be cooled 310 and the second device to be cooled 320 to increase turbulence of indoor air flow, and further improve cooling effect, and on the other hand, air flow distribution is realized more accurately through the sizes of the first exhaust hole 2301 and the second exhaust hole 2302, so that cooling effect of a server is improved. The first exhaust hole 2301 is disposed at the bottom of the first air duct 231, and the second exhaust hole 2302 is disposed at the rear side of the second air duct 232. In this embodiment, the second exhaust holes 2302 may penetrate the rear sidewalls of the main air duct 21 and the second air duct 232, thereby reducing air resistance, increasing air flow, and further enhancing heat dissipation. In some embodiments, the second exhaust holes 2302 may also extend through only the rear sidewall of the second air duct 232. It is to be understood that the number, size and arrangement position of the exhaust holes 230 may be designed according to practical situations, and the present application is not limited thereto.
In other embodiments, the air outlet direction of the first air duct 231 is at a remaining angle, such as an acute angle or an obtuse angle, with the air outlet direction of the second air duct 232. The air outlet direction of the first air duct 231 and the air outlet direction of the second air duct 232 may be designed according to the layout of the device 30 to be cooled in the isolation cavity 130, which is not limited in detail.
In some embodiments, the third device to be cooled 330 corresponds to the first air duct 231, and the third device to be cooled 330 and the first device to be cooled 310 are arranged at intervals, so that the first device to be cooled 310 and the third device to be cooled 330 share the same first air duct 231, so as to concentrate on the first device to be cooled 310 and the third device to be cooled 330, and simplify the air duct design of the air guide cover 20. In this embodiment, the structure of the third device to be heat-dissipated 330 may be different from the structure of the first device to be heat-dissipated 310, and in other embodiments, the structure of the third device to be heat-dissipated 330 may be the same as the structure of the first device to be heat-dissipated 310. As shown in fig. 2 to 7, the third device to be heat-dissipated 330 and the first device to be heat-dissipated 310 are sequentially arranged along the X-axis direction. The first air duct 231 is provided with a third exhaust hole 2303 facing the third device 330 to be cooled. The third exhaust hole 2303 is spaced from the first exhaust hole 2301, that is, the first exhaust hole 2301 and the third exhaust hole 2303 are different holes, thereby realizing precise air supply. In some embodiments, the first exhaust hole 2301 and the third exhaust hole 2303 may be the same hole, so as to simplify the manufacturing process of the first air duct 231 and the assembling process of the first device to be cooled 310 and the third device to be cooled 330. In this embodiment, the third device to be heat-dissipated 330 is a fuse. In other embodiments, the third heat dissipation device 330 is, but not limited to, a transistor, a capacitor, an inductor, or other functional devices.
In some embodiments, the electronic device 100 further includes a regulating valve for regulating the air flow, so as to realize personalized accurate air supply, and ensure that the air flow reaches a required place, and ensure that each device to be heated in the electronic device 100 can be effectively cooled. The regulating valve may be provided in the main duct 21, or in the branch duct 23, or at a position corresponding to the exhaust hole 230.
Optionally, the height of the first air duct 231 is smaller than the height of the second air duct 232, so that the height of the air-cooled radiator 32 of the second device 320 to be cooled can be increased in the limited space of the housing 10, so as to improve the cooling effect of the second device 320 to be cooled, and the second air duct 232 acts as a baffle to block the air flow guided out by the first air duct 231 and passing through the first device 310 to be cooled from flowing to the second device 320 to be cooled, thereby realizing directional guiding of wind power and enhancing the cooling effect. The length of the first air duct 231 is smaller than or equal to the length of the main air duct 21, the width of the first air duct 231 is smaller than the width of the main air duct 21, the length of the second air duct 232 is smaller than the length of the main air duct 21, and the width of the second air duct 232 is smaller than or equal to the width of the main air duct 21, so that the space layout of the first air duct 231 and the second air duct 232 on the main air duct 21 is optimized, the space utilization rate of the shell 10 is improved, and through the first air duct 231 and the second air duct 232, air flow disturbance is avoided, the heat dissipation effect is good, the structure is simple, and the processing and the production are easy.
It should be noted that the term "length" as used herein refers to the distance between the two sides of the main air duct 21 in the longitudinal direction of the main air duct 21, the term "width" refers to the distance between the two sides of the main air duct 21 in the width direction of the main air duct 21, and the term "height" refers to the distance between the two sides of the main air duct 21 in the height direction of the main air duct 21.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating airflow directions of the electronic device 100 in fig. 1 in an operation mode. When the electronic device 100 is in the fresh air mode, the heat dissipation fan directs the air flow from the air inlet 101 into the main air duct 21, and leads the air flow out to the first device to be dissipated 310 and the third device to be dissipated 330 through the first air duct 231, and leads the air flow out to the second device to be dissipated 320 through the second air duct 232. Specifically, the first air duct 231 discharges the air flow to the first device 310 to be cooled in the Z-axis direction through the first air outlet 2301 and discharges the air flow to the third device 330 to be cooled in the Z-axis direction through the third air outlet 2303, the air flow passing through the first device 310 to be cooled and the air flow passing through the third device 330 to be cooled are converged and then discharged out of the housing 10 through the air outlet 102, and the second air duct 232 discharges the air flow to the second device 320 to be cooled through the second air outlet 2302 in the X-axis direction, and the air flow passing through the second device 320 to be cooled is discharged out of the housing 10 through the air outlet 102. The main duct 21 and the first and second ducts 231 and 232. Therefore, on one hand, the electronic device 100 of the application can realize the accurate management of the air duct by controlling the sizes of the air inlet 101 and/or the first air outlet 2301, the second air outlet 2302 and the third air outlet 2303, thereby being beneficial to reducing the energy consumption, on the other hand, a plurality of heat radiators to be separated and radiating through different branch air ducts 23, and the design of the branch air ducts 23 can change the circulation direction of air flow to meet the diversified use requirements of the radiating air direction, and solve the problems that the upstream heat radiator 30 to be radiated on the air outlet path heats and shields the downstream heat radiator 30 in the scene of the front and rear air outlet, thereby improving the radiating effect of the electronic device 100, and on the other hand, the main air duct 21 and the branch air ducts are in airtight design except the first air outlet 2301, the second air outlet 2302 and the third air outlet 2303, thereby realizing the heat leakage prevention design of the electronic device 100 and improving the radiating effect of the liquid cooling radiator 60.
Referring to fig. 1 and fig. 9 together, fig. 9 is a schematic structural diagram of a second embodiment of a wind scooper 20A of the electronic device 100 in fig. 1. In the second embodiment of the present application, the same contents as those of the first embodiment will not be repeated, and the structure of the wind scooper 20A is different from that of the wind scooper 20 of the first embodiment.
Specifically, the number of first air channels 231 of the branch air channels 23 includes at least three. At least three first air channels 231 are disposed on the same side of the main air channel 21 in the Z-axis direction, i.e., at least three first air channels 231 are all disposed under the main air channel 21 in an extending manner. At least three first air channels 231 are sequentially arranged at intervals in the width direction of the main air channel 21. Specifically, two of the first air channels 231 are disposed at two side portions of the main air channel 21, the remaining first air channels 231 are disposed at a middle portion of the main air channel 21, and the second air channel 232 is disposed at one side portion, such as a rear side portion, of the main air channel 21 in a length direction of the main air channel 21, so as to enhance a heat dissipation effect of the device 30 to be dissipated corresponding to the first air channel 231 located at the middle portion of the main air channel 21.
In the present embodiment, the number of the first air channels 231 of the air guide housing 20A includes three. The plurality of devices to be heat-dissipated 30 includes three first devices to be heat-dissipated 310 corresponding to the three first air channels 231, respectively. The first air duct 231 located at the middle of the main air duct 21 has a height equal to or less than that of the second air duct 232, thereby avoiding turbulence of air flow and enhancing heat dissipation. A first exhaust hole 2301 is formed in a side of each first air duct 231 facing away from the main air duct 21. In this embodiment, a second exhaust hole 2302 is formed at the rear side of the second air duct 232. The first exhaust holes 2301 may partially or entirely penetrate the bottom wall of the first air duct 231, and the second exhaust holes 2302 may penetrate only the rear sidewall of the second air duct 232, or penetrate both the rear sidewall of the second air duct 232 and the rear sidewall of the main air duct 21. The air outlet directions of the three first air channels 231 are perpendicular to the air outlet direction of the second air channel 232. In other embodiments, at least a portion of the air outlet direction of the first air duct 231 is at another angle, such as an acute angle or an obtuse angle, with respect to the air outlet direction of the second air duct 232.
Referring to fig. 1 and 10 together, fig. 10 is a schematic structural diagram of a third embodiment of a wind scooper 20B of the electronic device 100 in fig. 1. In the third embodiment of the present application, in the case where the structural configuration of the wind scooper 20B of the third embodiment does not conflict, the structural configuration of the wind scoopers 20, 20A of the first embodiment or the second embodiment as described above can be applied. In this embodiment, the same content as that of the first embodiment will not be described in detail, unlike the first embodiment, the multiple branch air ducts 23B of the air guiding cover 20B further include a third air duct 233, where the third air duct 233 and the first air duct 231 are disposed at intervals in the height direction of the main air duct 21, so that each device 30 to be heat-dissipated can be disposed in different areas of the isolation cavity 130 more dispersedly, and therefore, the air supply and heat dissipation range can be adjusted by optimizing the layout of the branch air duct 23B, and the heat dissipation effect of the electronic device 100 is improved.
The air outlet direction of the third air duct 233 is different from the air outlet directions of the first air duct 231 and the second air duct 232, so that the spatial layout of each device 30 to be cooled in the electronic device 100 is more optimized, the structure is more compact, the functions are more diverse, and the cooling is more efficient. In this embodiment, the air outlet direction of the first air duct 231 is perpendicular to the air outlet directions of the first air duct 231 and the third air duct 233, and the air outlet direction of the third air duct 233 is opposite to the air outlet direction of the first air duct 231, i.e. the air outlet direction of the first air duct 231 is downward, the air outlet direction of the second air duct 232 is rearward, and the air outlet direction of the third air duct 233 is upward. In other embodiments, the air outlet direction of the third air duct 233 and the air outlet directions of the first air duct 231 and the second air duct 232 may be disposed at the rest angles. In this embodiment, a fourth exhaust hole 2304 is formed on a side of the third air duct 233 facing away from the main air duct 21, so as to implement that devices to be cooled are disposed above and below the air guiding cover 20B.
Alternatively, the extending direction of the third air duct 233 may be the same as the extending direction of the first air duct 231 and/or the second air duct 232, i.e. the extending direction of the third air duct 233 is parallel to the first air duct 231, or the extending direction of the second air duct 232 may also be the same, so as to facilitate the processing technology of the air guiding cover 20. In some embodiments, the direction of extension of the third air duct 233 may be different from the direction of extension of the first air duct 231 and/or the second air duct 232. The extending direction of the third air duct 233 may be designed according to the setting position of the device to be heat-dissipated corresponding to the third air duct 233, and the present application is not particularly limited.
Referring to fig. 1 and 11 together, fig. 11 is a schematic structural diagram of a fourth embodiment of a wind scooper 20C of the electronic device 100 in fig. 1. In the fourth embodiment of the present application, the structural configuration of the wind scooper 20C of the fourth embodiment may be applied to the structural configurations of the wind scoopers 20, 20A, 20C of the first, second, or third embodiments as described above, without collision. In this embodiment, the same content as the first embodiment will not be described in detail, and unlike the first embodiment, at least one of the first air duct 231C, the second air duct 232 and the third air duct 233 of the air guiding cover 20C includes a plurality of sub air ducts 235 that are arranged at intervals, so as to more accurately realize air supply control for each device to be cooled, and prevent heat crosstalk between a plurality of devices to be cooled.
In this embodiment, the first air duct 231C includes a plurality of sub air ducts 235 arranged at intervals. The plurality of sub-air ducts 235 are located at the front side of the second air duct 232, so that crosstalk of heat between the multi-to-be-cooled devices 30 is reduced, a cooling effect is enhanced, and each sub-air duct 235 can correspond to a corresponding first to-be-cooled device, so that air supply control is performed more accurately. In this embodiment, the first exhaust hole 2301C of each sub-duct 235 faces downward (i.e. the air outlet direction of the sub-duct 235). In some embodiments, the orientation of the exit holes of at least some of the sub-stacks 235 may also be different. The air outlet direction of each sub air duct 235 may be designed according to the arrangement position of the device to be cooled corresponding to the sub air duct 235, and the present application is not limited in particular.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein. In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
It should be noted that, for simplicity of description, the foregoing method embodiments are all described as a series of acts, but it should be understood by those skilled in the art that the present invention is not limited by the order of acts described, as some steps may be performed in other orders or concurrently in accordance with the present invention. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.
In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the device embodiments described above are merely illustrative.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modifications or substitutions do not depart from the spirit and scope of the embodiments of the present invention.
Claims (14)
1. An electronic device, comprising:
a housing having an interior cavity;
The air guide cover is accommodated in the inner cavity, the inner cavity of the shell is divided into a ventilation cavity and an isolation cavity by the air guide cover, the ventilation cavity comprises a main air duct and a plurality of branch air ducts communicated with the main air duct, each branch air duct is provided with an exhaust hole communicated with the isolation cavity, one end of the shell is provided with an air inlet communicated with the main air duct, the other end of the shell is provided with an air outlet communicated with the isolation cavity, the air guide cover and the shell are mutually independent, and the inner cavity of the air guide cover is used as the ventilation cavity, or the air guide cover is in sealing connection with the shell, and the air guide cover and the shell are encircled to form the ventilation cavity;
the devices to be cooled are arranged in the isolation cavity;
The heat dissipation fan is used for guiding air flow into the air inlet, the air flow guided through the air inlet flows into the plurality of branch air channels through the main air channel, and flows to the plurality of devices to be dissipated through the plurality of branch air channels so as to dissipate heat of the plurality of devices to be dissipated.
2. The electronic device of claim 1, further comprising a liquid-cooled heat sink positioned in the isolation chamber, the liquid-cooled heat sink configured to contact the plurality of devices to be heat-dissipated to dissipate heat from the plurality of devices to be heat-dissipated.
3. The electronic device according to any one of claims 1-2, wherein the device to be heat-dissipated comprises a heat generating element and a heat sink attached to the heat generating element, the exhaust hole being directed toward a windward side of the heat sink, or
The device to be cooled comprises a heating element, and the exhaust holes face to a heating surface of the heating element.
4. The electronic device of claim 3, wherein a distance between the exhaust hole and the windward side or the heat-generating side is less than or equal to 5mm.
5. The electronic device according to any one of claims 1 to 4, wherein the plurality of branch air channels include a first air channel and a second air channel, the plurality of devices to be cooled include a first device to be cooled corresponding to the first air channel and a second device to be cooled corresponding to the second air channel, and the first device to be cooled and the second device to be cooled are sequentially arranged along a length direction of the electronic device;
The air flow flowing through the first air duct flows to the first device to be radiated so as to radiate the first device to be radiated, and the air flow flowing through the second air duct flows to the second device to be radiated so as to radiate the second device to be radiated.
6. The electronic device of claim 5, wherein the first air channel extends along a length direction of the electronic device and the second air channel extends along a width direction of the electronic device.
7. The electronic device of any of claims 5-6, wherein an air outlet direction of the first air duct forms an included angle with an air outlet direction of the second air duct.
8. The electronic device of claim 7, wherein an air outlet direction of the first air duct is perpendicular to an air outlet direction of the second air duct.
9. The electronic device of any of claims 5-8, wherein a height of the first air duct is less than a height of the second air duct.
10. The electronic device according to any one of claims 5 to 9, wherein the number of the first air channels includes two, the two first air channels are respectively provided at two side portions of the main air channel in a width direction of the electronic device, and the second air channel is provided at one side portion of the main air channel in a length direction of the electronic device.
11. The electronic device of any one of claims 5-10, wherein a projection of the first air duct onto a projection surface of the electronic device in a width direction is spaced apart or disposed adjacent to a projection of the second air duct onto the projection surface.
12. The electronic device according to any one of claims 5 to 9, wherein the number of the first air channels includes at least three, at least three of the first air channels are sequentially arranged at intervals in a width direction of the electronic device, two of the first air channels are arranged at two side portions of the main air channel, the remaining first air channels are arranged at a middle portion of the main air channel, and the second air channel is arranged at one side portion of the main air channel in a length direction of the electronic device.
13. The electronic device of any one of claims 5-12, wherein the plurality of branch air ducts further includes a third air duct, the third air duct being located on a different side of the main air duct in a height direction of the electronic device than the first air duct, respectively.
14. The electronic device of claim 13, wherein at least one of the first air duct, the second air duct, and the third air duct comprises a plurality of sub-air ducts disposed in a spaced apart relationship.
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| CN114077292A (en) * | 2020-08-13 | 2022-02-22 | 鸿富锦精密工业(武汉)有限公司 | Wind scooper and heat dissipation device |
| CN113056179B (en) * | 2021-03-31 | 2023-05-02 | 联想(北京)有限公司 | Electronic equipment |
| CN215421412U (en) * | 2021-07-28 | 2022-01-04 | 联想长风科技(北京)有限公司 | Electronic equipment |
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2022
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662921A (en) * | 2008-08-29 | 2010-03-03 | 富准精密工业(深圳)有限公司 | Heat radiation device and computer equipment with same |
| CN102053668A (en) * | 2009-11-06 | 2011-05-11 | 关建新 | Dustproof computer case |
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| CN115802699A (en) | 2023-03-14 |
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