CN115338181A - Surface cleaning device behind chip scribing - Google Patents
Surface cleaning device behind chip scribing Download PDFInfo
- Publication number
- CN115338181A CN115338181A CN202210884721.8A CN202210884721A CN115338181A CN 115338181 A CN115338181 A CN 115338181A CN 202210884721 A CN202210884721 A CN 202210884721A CN 115338181 A CN115338181 A CN 115338181A
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- China
- Prior art keywords
- cleaning agent
- water
- carbonated water
- chip
- supply system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004140 cleaning Methods 0.000 title claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 103
- 239000012459 cleaning agent Substances 0.000 claims abstract description 54
- 230000008859 change Effects 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 239000002893 slag Substances 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 6
- 239000006260 foam Substances 0.000 claims abstract description 6
- 238000013019 agitation Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 description 11
- 230000003068 static effect Effects 0.000 description 11
- 239000007789 gas Substances 0.000 description 7
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- -1 fingerprints Substances 0.000 description 3
- 241001089723 Metaphycus omega Species 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000002341 toxic gas Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a surface cleaning device after chip scribing, which is characterized in that; the device comprises: the device comprises a cleaning agent barrel, a carbonated water supply system, a carbonated water and cleaning agent mixing system and a high-frequency magnetic pump; the cleaning agent barrel and the carbonated water supply system are mixed by the carbonated water and cleaning agent mixing system and then output to the chip. When the surface cleaning device for the scribed chip is implemented; the water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed into the carbonated water pipeline to be mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact. The damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1. According to the theory of cleaning effect, the surface of the chip has no silicon slag and other particles or pollution, color change and the like.
Description
Technical Field
The invention relates to the field of chip scribing and cleaning, in particular to a device for cleaning the rear surface of a chip scribing.
Background
At present, static electricity is easy to generate under high-speed impact in the chip scribing process; the damage of static electricity to chip processing is mainly shown; the static electricity directly discharges to damage the chip, the static electricity accumulation discharges to cause discharge oxidation or breakdown, or the silicon chips and other particles generate static electricity to be adsorbed on the surface of the chip to cause damage to the chip or unclean cleaning, and the like.
Disclosure of Invention
Therefore, in order to solve the above-mentioned disadvantages, the present invention provides a device for cleaning the surface of a chip after dicing.
The invention is realized in such a way that a surface cleaning device after chip scribing is constructed, which is characterized in that; the device comprises: the device comprises a cleaning agent barrel, a carbonated water supply system, a carbonated water and cleaning agent mixing system and a high-frequency magnetic pump; the cleaning agent barrel and the carbonated water supply system are mixed by the carbonated water and cleaning agent mixing system and then output to the chip.
The surface cleaning device after chip scribing is characterized in that the surface cleaning device comprises a base; the carbonated water consists of DI water and CO2 gas, and the carbonated water supply system is provided with a CO2 supply system, a DI water and CO2 mixing system; the input ends of the DI water and CO2 mixing system are respectively communicated with the CO2 supply system and the DI water supply system.
The surface cleaning device after chip scribing is characterized in that the surface cleaning device comprises a base; the DI water and CO2 mixing system has an agitation mechanism.
The surface cleaning device after chip scribing is characterized in that the surface cleaning device comprises a base; and a mixed detection system is arranged on an output pipeline of the carbonated water supply system and is used for detecting the resistivity.
The surface cleaning device after chip scribing is characterized in that the surface cleaning device comprises a base; the service life of the wearing parts is shortened due to the excessive addition of CO2, the resistivity of the DI water is controlled to be 0.5-1.0M omega in general, and the gas consumption of 0.5 is 5 times of 1.0.
The surface cleaning device after the chip scribing is characterized in that the surface cleaning device comprises a base; the resistivity of the DI water is generally required to be 16 M.OMEGA.or more, and the demand for higher resistivity is required to be 18 M.OMEGA.or more.
The surface cleaning device after the chip scribing is characterized in that the surface cleaning device comprises a base; the water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed into the carbonated water pipeline to be mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact. The damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1. According to the theory of cleaning effect, the surface of the chip has no particles such as silicon slag and the like or pollution, color change and the like.
The invention has the following advantages:
1. the device comprises: cleaning agent, carbonated water supply system, carbonated water and cleaning agent mixing system, high-frequency magnetic pump.
2. The water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed to the carbonated water pipeline and mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact. The damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1. According to the theory of cleaning effect, the surface of the chip has no silicon slag and other particles or pollution, color change and the like.
3. The cleaning agent has low viscosity, good fluidity and very good permeability, can permeate into tiny gaps of components, cleans and brings out impurities, and keeps the surface of the chip clean.
4. No odor, no volatile toxic gas, and no harm to operator health. No flash point, no ignition, no danger of combustion and explosion, and safer use.
5. Cleaning other non-polar pollutants, ionic pollutants, dust, fingerprints, oil stains and other media.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the cleaning apparatus of the present invention.
Wherein: a cleaning agent barrel 100, a CO2 supply system 201, a DI water supply system 202, a DI water and CO2 mixing system 203, and a high frequency magnetic pump 300.
Detailed Description
The present invention will be described in detail with reference to fig. 1, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The invention provides a device for cleaning the surface of a chip after scribing through improvement, which utilizes carbonated water (DI water plus CO) 2 Gas) is added to prevent static electricity when the chip is scribed, and CO is added 2 Mainly prevents the damage of ESD to the chip; preventing silicon slag sediment on the surface of the chip after scribing; the cleaning agent is added to mainly prevent the silicon slag from depositing and polluting the surface of the chip.
As shown in fig. 1, it can be implemented as follows; the device comprises: the cleaning agent barrel 100, a carbonated water supply system, a carbonated water and cleaning agent mixing system and a high-frequency magnetic pump; the cleaning agent barrel 100 and the carbonated water supply system are mixed by the carbonated water and cleaning agent mixing system and then output to the chip.
When the surface cleaning device for the scribed chip is implemented; the carbonated water consists of DI water and CO2 gas, and the carbonated water supply system comprises a CO2 supply system 201, a DI water supply system 202 and a DI water and CO2 mixing system 203; the input ends of the DI water and CO2 mixing system 203 are respectively communicated with the CO2 supply system 201 and the DI water supply system 202.
When the surface cleaning device for the scribed chip is implemented; the DI water and CO2 mixing system 203 has an agitation mechanism.
When the surface cleaning device for the scribed chip is implemented; and a mixed detection system is arranged on an output pipeline of the carbonated water supply system and is used for detecting the resistivity.
When the surface cleaning device for scribing the chip is implemented; the service life of the wearing parts is shortened due to excessive addition of CO2, the resistivity of the DI water is controlled to be 0.5-1.0 MOmega under the general condition, and the gas consumption of 0.5 is 5 times of 1.0.
When the surface cleaning device for scribing the chip is implemented; the resistivity of the produced DI water is generally required to be 16M Ω or more, and the demand for the produced DI water is required to be 18M Ω or more.
When the surface cleaning device for the scribed chip is implemented; the water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed into the carbonated water pipeline to be mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact. The damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1. According to the theory of cleaning effect, the surface of the chip has no particles such as silicon slag and the like or pollution, color change and the like.
This device includes after the design: CO2 2 Supply system, DI water and CO 2 The hybrid system, the detecting system after mixing, detecting system detects normally and can normal operating after mixing, unusual shutdown is reported to the police. The resistivity of the produced DI water is generally required to be 16M Ω or more, and the demand for the produced DI water is required to be 18M Ω or more. Water is mainly conducted by salt ions dissolved in water, and the higher the resistivity of water, the lower the conductivity, and the more likely static electricity is generated by high-speed impact. The damage of static electricity to chip processing is mainly shown; the static electricity directly discharges to damage the chip, the static electricity accumulation discharges to cause discharge oxidation or breakdown, or the silicon chips and other particles generate static electricity to be adsorbed on the surface of the chip to cause damage to the chip or unclean cleaning, and the like.
CO 2 The resistivity of the DI water can be reduced after the DI water is added, and ESD is prevented. CO2 2 The changed gas is volatilized, and the surface of the chip is kept clean. CO2 2 The service life of the wearing parts is shortened due to the excessive addition, the resistivity of the DI water is controlled to be 0.5-1.0 MOmega under the general condition, and the gas consumption of 0.5 is 5 times of 1.0.
The device has the advantages that;
1. the device comprises: cleaning agent, carbonated water supply system, carbonated water and cleaning agent mixing system, high-frequency magnetic pump.
2. The water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed to the carbonated water pipeline and mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact. The damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1. According to the theory of cleaning effect, the surface of the chip has no particles such as silicon slag and the like or pollution, color change and the like.
3. The cleaning agent has low viscosity, good fluidity and very good permeability, can permeate into tiny gaps of components, cleans and brings out impurities, and keeps the surface of the chip clean.
4. No odor, no volatile toxic gas, and no harm to operator's health. No flash point, no ignition, no risk of combustion and explosion, and safer use.
5. Cleaning other non-polar pollutants, ionic pollutants, dust, fingerprints, oil stains and other media.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A surface cleaning device after scribing a chip is characterized in that; the device comprises: a cleaning agent barrel (100), a carbonated water supply system, a carbonated water and cleaning agent mixing system and a high-frequency magnetic pump; the cleaning agent barrel (100) and the carbonated water supply system are mixed by the carbonated water and cleaning agent mixing system and then output to the chip.
2. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; the carbonated water consists of DI water and CO2 gas, and the carbonated water supply system is provided with a CO2 supply system (201), a DI water supply system (202) and a DI water and CO2 mixing system (203); the input ends of the DI water and CO2 mixing system (203) are respectively communicated with the CO2 supply system (201) and the DI water supply system (202).
3. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; the DI water and CO2 mixing system (203) has an agitation mechanism.
4. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; and a mixed detection system is arranged on an output pipeline of the carbonated water supply system and is used for detecting the resistivity.
5. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; the service life of the wearing parts is shortened due to the excessive addition of CO2, the resistivity of the DI water is controlled to be 0.5-1.0M omega in general, and the gas consumption of 0.5 is 5 times of 1.0.
6. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; the resistivity of the produced DI water is generally required to be 16M Ω or more, and the demand for the produced DI water is required to be 18M Ω or more.
7. The post-dicing surface cleaning apparatus for chips according to claim 1, characterized in that; the water pressure of the carbonated water is more than 2kg/cm, the instantaneous pressure of the high-frequency magnetic pump is more than 3kg/cm, the cleaning agent is pressed into the carbonated water pipeline to be mixed with the carbonated water, and a large amount of foam water is generated under the high-speed impact; the damage to chip processing is mainly shown; the cleaning agent has slight corrosivity, and is mainly characterized in that the adding proportion is controlled, the cleaning performance of the cleaning agent is influenced by the concentration change of the cleaning agent, and the proportion of the cleaning agent to carbonated water is 1; according to the theory of cleaning effect, the surface of the chip has no silicon slag and other particles or pollution and color change.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210884721.8A CN115338181A (en) | 2022-07-26 | 2022-07-26 | Surface cleaning device behind chip scribing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210884721.8A CN115338181A (en) | 2022-07-26 | 2022-07-26 | Surface cleaning device behind chip scribing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115338181A true CN115338181A (en) | 2022-11-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210884721.8A Pending CN115338181A (en) | 2022-07-26 | 2022-07-26 | Surface cleaning device behind chip scribing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115338181A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993010280A1 (en) * | 1991-11-13 | 1993-05-27 | Hughes Aircraft Company | Method and system for removing contaminants |
| JP2009054635A (en) * | 2007-08-23 | 2009-03-12 | Dainippon Screen Mfg Co Ltd | Substrate treating equipment and substrate treating method |
| CN106033711A (en) * | 2015-03-18 | 2016-10-19 | 联华电子股份有限公司 | Method for cleaning substrate |
| KR20170024213A (en) * | 2015-08-24 | 2017-03-07 | 세메스 주식회사 | Method and Apparatus for treating substrate |
| CN110337419A (en) * | 2017-01-19 | 2019-10-15 | 可口可乐公司 | Automated cleaning system for beverage dispenser |
| CN111013425A (en) * | 2018-10-10 | 2020-04-17 | 株式会社迪思科 | mixing device |
| WO2022059414A1 (en) * | 2020-09-16 | 2022-03-24 | 株式会社Ｓｃｒｅｅｎホールディングス | Processing liquid supply device, substrate processing device, and processing liquid supply method |
-
2022
- 2022-07-26 CN CN202210884721.8A patent/CN115338181A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993010280A1 (en) * | 1991-11-13 | 1993-05-27 | Hughes Aircraft Company | Method and system for removing contaminants |
| JP2009054635A (en) * | 2007-08-23 | 2009-03-12 | Dainippon Screen Mfg Co Ltd | Substrate treating equipment and substrate treating method |
| CN106033711A (en) * | 2015-03-18 | 2016-10-19 | 联华电子股份有限公司 | Method for cleaning substrate |
| KR20170024213A (en) * | 2015-08-24 | 2017-03-07 | 세메스 주식회사 | Method and Apparatus for treating substrate |
| CN110337419A (en) * | 2017-01-19 | 2019-10-15 | 可口可乐公司 | Automated cleaning system for beverage dispenser |
| CN111013425A (en) * | 2018-10-10 | 2020-04-17 | 株式会社迪思科 | mixing device |
| WO2022059414A1 (en) * | 2020-09-16 | 2022-03-24 | 株式会社Ｓｃｒｅｅｎホールディングス | Processing liquid supply device, substrate processing device, and processing liquid supply method |
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Application publication date: 20221115 |
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| RJ01 | Rejection of invention patent application after publication |