CN115066111A - Do benefit to multilayer circuit board intelligence compression fittings that prevents layering - Google Patents

Abstract

The invention discloses an intelligent pressing device for multi-layer circuit boards which is beneficial for preventing delamination, and relates to the technical field of circuit boards. Including a connecting bracket, the inner bottom of the connecting bracket is provided with a mounting seat, the top of the mounting seat is provided with a connecting seat, the top of the connecting seat is movably provided with a limit seat, and the top of the limit seat is embedded with an operation tower. By setting the electric telescopic rod, it can effectively push the limit seat to drive the operating table to slide back and forth along the extension direction of the connecting guide rail, so as to control the use and movement of the operating table, and provide an operable space for the loading and taking out of the laminated circuit board, and The use position of the operating table is effectively monitored by the position sensor, thereby effectively ensuring the stamping accuracy of the stamping parts on the stamping mechanism on the operating table, improving the accuracy of the pressing mechanism of the pressing mechanism, avoiding the error of the pressing and reducing its impact. Material waste, enhancing the environmental friendliness of device usage.

Description

An intelligent pressing device for multi-layer circuit boards that is conducive to preventing delamination

technical field

The invention relates to the technical field of circuit boards, in particular to an intelligent pressing device for multi-layer circuit boards that is conducive to preventing delamination.

Background technique

Multilayer circuit boards are the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the wide application of large-scale and ultra-large-scale integrated circuits, multilayer circuit boards are becoming Rapidly developing towards high-density, high-precision, and high-level numbers, technologies such as fine lines, small aperture penetrations, blind vias and buried vias, and high board thickness-to-aperture ratio have emerged to meet the needs of the market; in the production and processing process of multi-layer circuit boards , it is necessary to stack a plurality of circuit boards and a plurality of insulating layers at intervals and fix them on a pressing device, and then perform a pressing operation to obtain a multi-layer circuit board.

In the prior art, the existing pressing devices mostly use the hydraulic mechanism to press the multi-layer circuit boards, but the existing devices do not have the pressure for pressing the multi-layer circuit boards in the process of pressing the multi-layer circuit boards. Monitoring and control is poor, resulting in too small pressing force, poor pressing effect of circuit boards or excessive pressing pressure, warping of the edges between circuit boards, resulting in delamination, and even damage, which affects its performance. The quality of production, and the setting of the plane of the processing table of the existing device, under the strong pressing and operation, it is easy to make the insulation layer outside the multi-layer circuit board adhere to the processing table after lamination, which is inconvenient for the collection of the multi-layer circuit board after processing. At the same time, the existing pressing device does not have high accuracy when pressing the multi-layer circuit board to it, which often results in waste of raw materials of the circuit board, and the pressing efficiency is relatively low, and the existing pressing device can effectively position the multi-layer circuit board. The effect is poor, which increases the probability of laminating defective products. Therefore, an intelligent laminating device for multi-layer circuit boards that is conducive to preventing delamination is proposed to solve the above problems.

SUMMARY OF THE INVENTION

The present invention provides an intelligent pressing device for multi-layer circuit boards that is beneficial to preventing delamination, so as to solve the problems in the background art.

In order to achieve the above purpose, the present invention provides the following technical solutions: an intelligent pressing device for multi-layer circuit boards that is conducive to preventing delamination, comprising a connecting bracket, the inner bottom of the connecting bracket is provided with a mounting seat, and the top of the mounting seat is provided with a mounting seat. A connecting seat is provided, the top of the connecting seat is movably provided with a limiting seat, the top of the limiting seat is embedded with an operating table, the top of the connecting seat is movably provided with a punching mechanism, and the top of the punching mechanism is provided with a control mechanism;

The bottom of the operating table is provided with a connection base, the inner bottom of the connection base is provided with a telescopic spring support, the top of the telescopic spring support is provided with a support, and the top of the support is provided with a punching groove, the The front and back of the punching groove are correspondingly provided with connecting grooves, the inner wall of the connecting groove is provided with a position sensor, the interior of the connecting groove is movably provided with a limiting shaft, and the bottom of the punching groove is provided with an ejection groove, the The inner bottom of the ejecting slot is provided with an electric ejector rod, and the inner bottom wall of the punching slot is movably embedded with a buffer pad.

Further, the inner bottom of the connection bracket is provided with a connection base plate, and the top of the connection base plate is provided with a limit clip.

Further, connecting rail grooves are provided on both inner sides of the top of the connecting seat, connecting guide rails are disposed on the inner bottom of the connecting seat, and an electric telescopic rod is disposed inside the front of the connecting seat.

Further, the interior of the front surface and the interior of the back of the limiting seat are provided with limiting horizontal plates, and the interiors of both sides of the limiting seat are provided with limiting side plates.

Further, the top of the punching mechanism is provided with a support plate, the top of the support plate is provided with a support rod, and the bottom of the support plate is provided with slider legs.

Further, the top of the support plate is provided with a hydraulic cylinder, the bottom of the hydraulic cylinder is provided with a hydraulic telescopic rod, and the outer wall of the hydraulic telescopic rod is provided with a pressure monitor.

Further, the bottom end of the hydraulic telescopic rod is provided with a connecting plate, and the bottom of the connecting plate is provided with a stamping part.

Further, a telescopic support is provided at the bottom of the buffer pad, a buffer spring is provided at the inner bottom of the telescopic support, and a rubber pad is provided at the top of the telescopic support.

Further, the telescopic support is embedded and arranged inside the buffer pad, and consists of a telescopic support, a buffer spring and a rubber backing plate, and each group consists of a telescopic support, a buffer spring and a rubber backing plate. Assembled into a pad, the buffer pad is composed of several groups of pads spliced together.

Further, an induction module, a main control module, a driving module and a monitoring module are respectively arranged inside the control mechanism, and the induction module, the main control module, the driving module and the monitoring module are all electrically connected.

Compared with the prior art, the present invention provides an intelligent lamination device for multi-layer circuit boards that is conducive to preventing delamination, and has the following beneficial effects:

1. The multi-layer circuit board intelligent pressing device, which is conducive to preventing delamination, can effectively monitor the use position of the operating table by setting a position sensor, and transmit the monitoring results to the induction module to determine the stamping on the stamping mechanism. The accuracy of the stamping of the parts on the operating table, and then the driving module is controlled by the main control module to drive the stamping mechanism to perform the pressing operation on the multi-layer circuit board placed on the operating table, and use the pressure monitor for the pressing operation. The pressure is monitored, and at the same time, the pressing pressure used by the device is controlled by the main control module, so that the device can effectively monitor and control the pressing pressure used by the device, so as to avoid the problem of poor pressing effect caused by too small pressing pressure and excessive pressing pressure. The problem of lifting and delamination of the multi-layer circuit board is caused, which improves the intelligence and usability of the device and enhances the stability of its use.

2. The multi-layer circuit board intelligent pressing device, which is beneficial to prevent delamination, is effectively assembled into a cushion by a set of cushioning parts, a telescopic support, a cushioning spring and a rubber cushion plate, and is passed through several groups of cushions. It is a cushion piece composed of splicing pieces, which is used to connect the multi-layer circuit boards placed in the stamping groove, and then through the individual independence of the cushion piece assembled by each group of telescopic supports, buffer springs and rubber backing plates to make the buffer cushion The multi-layer circuit board is loaded from point to surface by the multi-layer circuit board, and under the buffering action of the buffer spring and the rubber backing plate, the pressing pressure used by the device is reduced. The parts can expand and contract by themselves, effectively reducing the large-area overall contact between the cushion parts and the multi-layer circuit, so as to avoid the pressure of the device being too strong. Integrity and usability of press fit.

3. The multi-layer circuit board intelligent pressing device, which is beneficial to prevent delamination, is provided with an electric telescopic rod to effectively push the limit seat to drive the console to slide back and forth along the extension direction of the connecting guide rail to control the movement of the console. Provide an operable space for the loading and taking out of the multi-layer circuit board pressing, and effectively monitor the use position of the operating table through the position sensor, thereby effectively ensuring the stamping accuracy of the stamping parts on the stamping mechanism on the operating table and improving the stamping. The accuracy of the press-fit of the mechanism can avoid errors in its press-fit, reduce its material waste, and enhance the environmental protection of the device.

4. The multi-layer circuit board intelligent pressing device that is conducive to preventing delamination can effectively carry the multi-layer circuit board by setting the buffer pad, and position the multi-layer circuit board through the function of the limit shaft It is arranged inside the punching groove, and prevents the multi-layer circuit board from moving and causing deviation during the pressing process, thereby effectively improving the stability of the press-fitting use of the device, reducing the probability of pressing defective products, and enhancing the stability of the use of the device. Sex and Usability

5. The multi-layer circuit board intelligent pressing device, which is beneficial to prevent delamination, can effectively connect the multi-layer circuit board by setting the punching groove, and limit the shaft to the multi-layer circuit board placed in the punching groove. The limit is fixed, and then the limit seat is pushed by the electric telescopic rod to drive the operating table to slide along the extension direction of the connecting rail to just below the stamping part, and the stamping part is driven by the stamping mechanism to stamp it. The rod pushes out the laminated multi-layer circuit board, thereby effectively facilitating the operation and use of the device and improving the convenience of using the device.

Description of drawings

1 is a schematic structural diagram of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

2 is a schematic diagram of the connection between the connecting bracket and the mounting seat of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

3 is a schematic diagram of the connection between the connecting seat and the punching mechanism of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

4 is a schematic structural diagram of a connection seat of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

5 is a schematic structural diagram of a stamping mechanism of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

FIG. 6 is a schematic structural diagram of an operating table of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

7 is a front cross-sectional view of a support member of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention;

FIG. 8 is an enlarged schematic view of the structure at A in FIG. 7 of the present invention, which is an intelligent lamination device for multi-layer circuit boards that is conducive to preventing delamination;

FIG. 9 is an operating system diagram of a multi-layer circuit board intelligent pressing device that is beneficial to preventing delamination according to the present invention.

In the figure: 1, connecting bracket; 101, connecting base plate; 102, limit clip; 2, mounting seat; 3, connecting seat; 301, connecting rail groove; 302, electric telescopic rod; 303, connecting guide rail; 4, limit seat; 401, limit cross plate; 402, limit side plate; 5, punching mechanism; 501, support plate; 502, support rod; 503, hydraulic cylinder; 504, hydraulic telescopic rod; 505, connecting plate; 506, Stamping parts; 507, slider legs; 508, pressure monitor; 6, console; 601, connecting base; 602, supporting parts; 603, stamping groove; 604, connecting groove; 605, limit shaft; 606, 6061, telescopic support; 6062, buffer spring; 6063, rubber backing plate; 607, telescopic spring support; 608, position sensor; 609, ejector groove; 610, electric ejector rod; 7, control mechanism.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Referring to Figures 1-9, the present invention discloses an intelligent pressing device for multi-layer circuit boards that is conducive to preventing delamination, including a connecting bracket 1, and a mounting seat 2 is provided at the inner bottom of the connecting bracket 1, and the mounting seat The top of the connecting seat 3 is provided with a connecting seat 3, the top of the connecting seat 3 is movably provided with a limiting seat 4, the top of the limiting seat 4 is embedded with an operating table 6, and the top of the connecting seat 3 is movably provided with a punching mechanism 5. The top of the punching mechanism 5 is provided with a control mechanism 7;

The bottom of the operating table 6 is provided with a connection base 601, the inner bottom of the connection base 601 is provided with a telescopic spring support 607, the top of the telescopic spring support 607 is provided with a support 602, and the top of the support 602 is provided A punching groove 603 is provided, the front and back of the punching groove 603 are correspondingly provided with a connecting groove 604, the inner wall of the connecting groove 604 is provided with a position sensor 608, and a limit shaft 605 is movably arranged inside the connecting groove 604, The bottom of the punching slot 603 is provided with an ejector slot 609 , the inner bottom of the ejection slot 609 is provided with an electric ejector rod 610 , and the inner bottom wall of the punching slot 603 is movably embedded with a buffer pad 606 .

Specifically, the inner bottom of the connection bracket 1 is provided with a connection base plate 101 , and the top of the connection base plate 101 is provided with a limit clip 102 .

In this embodiment, when the connecting bracket 1 is in use, the connection base plate 101 is used to carry the installation of the mounting seat 2, and the limit clip 102 is used to limit and fix the installation of the mounting seat 2, thereby ensuring the use of the mounting seat 2. improve the stability of the base of the mounting seat 2.

Specifically, connecting rail grooves 301 are provided on both inner sides of the top of the connecting seat 3 , connecting guide rails 303 are arranged on the inner bottom of the connecting seat 3 , and an electric telescopic rod 302 is arranged inside the front of the connecting seat 3 .

In this embodiment, when the connecting seat 3 is in use, through the setting of the connecting rail groove 301, the use of the punching mechanism 5 can be effectively installed and adjusted, and under the action of the electric telescopic rod 302, the limit seat 4 can be effectively pushed to drive the operation. The table 6 slides back and forth along the extension direction of the connecting guide rail 303 to control the operation and movement of the operating table 6, providing an operable space for the loading and taking out of the multi-layer circuit board pressing, and enhancing the convenience and flexibility of its use.

Specifically, a limit cross plate 401 is provided on the inside of the front and the back of the limit seat 4 , and limit side plates 402 are provided on both sides of the limit seat 4 .

In this embodiment, when the limit seat 4 is in use, it can effectively pass the enclosure of the limit horizontal plate 401 and the limit side plate 402, and the operating table 6 is installed and installed inside the limit seat, and the installation of the operating table 6 is limited. The position is limited and fixed to ensure the stability of its use.

Specifically, the top of the punching mechanism 5 is provided with a support plate 501 , the top of the support plate 501 is provided with a support rod 502 , and the bottom of the support plate 501 is provided with slider legs 507 .

In this embodiment, when the punching mechanism 5 is in use, the installation of its components is supported by the setting of the support plate 501, and the installation and position adjustment of the punching mechanism 5 are facilitated by the action of the slider legs 507. At the same time, through the arrangement of the support rod 502, the control mechanism 7 is effectively supported, thereby ensuring the balance and stability of the device in use.

Specifically, the top of the support plate 501 is provided with a hydraulic cylinder 503 , the bottom of the hydraulic cylinder 503 is provided with a hydraulic telescopic rod 504 , and the outer wall of the hydraulic telescopic rod 504 is provided with a pressure monitor 508 .

In this embodiment, when the punching mechanism 5 is in use, the hydraulic telescopic rod 504 is driven by the hydraulic cylinder 503 as the driving source to operate, and the pressure used for the operation of the hydraulic telescopic rod 504 is monitored by the pressure monitor 508, thereby facilitating the installation of The stamping use and pressure monitoring are improved, the effectiveness and monitoring of the stamping mechanism 5 are improved, and the usability of its pressure use is guaranteed.

Specifically, the bottom end of the hydraulic telescopic rod 504 is provided with a connecting plate 505 , and the bottom of the connecting plate 505 is provided with a stamping part 506 .

In this embodiment, the punching mechanism 5 is used to connect and assemble the punching part 506 and the hydraulic telescopic rod 504 through the action of the connecting plate 505, and under the action of the hydraulic telescopic rod 504, the punching part 506 compresses the multi-layered The circuit board is pressed and closed, thereby effectively improving the convenience of the device.

Specifically, a telescopic support 6061 is disposed at the bottom of the cushioning member 606 , a buffer spring 6062 is disposed at the inner bottom of the telescopic support 6061 , and a rubber pad 6063 is disposed at the top of the telescopic support 6061 .

In this embodiment, when the buffer pad 606 is in use, its use is limited and supported by the telescopic support 6061, and the circuit board is supported by the rubber pad 6063, while the buffer spring 6062 and the rubber pad 6063 Under the buffering effect of the device, the pressing pressure used by the device is reduced, the buffering protection used by the device is improved, and the usability of the transposition is enhanced.

Specifically, the telescopic support 6061 is embedded in the buffer pad 606, and consists of a telescopic support 6061, a buffer spring 6062 and a rubber backing plate 6063, and each group consists of the telescopic support 6061, a buffer spring 6062 and a rubber pad 6063. The buffer spring 6062 and the rubber backing plate 6063 are assembled to form a pad, and the buffer pad 606 is composed of several groups of pads spliced together.

In this embodiment, when the buffer pads 606 are in use, the buffer pads 606 formed by splicing several sets of pads are used to hold the multi-layer circuit boards placed in the punching grooves 603, and then the multi-layer circuit boards placed in the punching grooves 603 are connected, and then each set of telescopic supports is used. 6061, buffer springs 6062 and rubber pads 6063 are assembled to form the individual independence of the pads, so that the buffer pads 606 can carry the load of the multi-layer circuit board from point to surface, and each group of pads can be stretched and retracted by itself, effectively Reduce the overall contact between the buffer pad 606 and the multi-layer circuit to avoid excessive pressing pressure of the device, and the insulating layer outside the multi-layer circuit board will be adhered to the operating table 6 after lamination, thereby enhancing the integrity of the device's pressing and use. sex and usability.

Specifically, the control mechanism 7 is provided with an induction module, a main control module, a driving module and a monitoring module, and the induction module, the main control module, the driving module and the monitoring module are all electrically connected.

In this embodiment, when the device is in use, the sensing module is used to sense the data monitored and transmitted by the position sensor 608 , and the driving module is controlled by the main control module to drive the punching mechanism 5 to perform pressing, and the monitoring module passes the pressure monitor 508 . The pressing pressure of the punching mechanism 5 driven by the driving module is monitored to ensure the effectiveness and accuracy of the monitoring and control of the pressing pressure.

In use, the punching groove 603 is used to effectively hold the multilayer circuit board, and the limit shaft 605 is used to limit and fix the multilayer circuit board placed in the punching groove 603, and then the electric telescopic rod 302 Pushing the limit seat 4 drives the operating table 6 to slide to the right under the stamping part 506 along the extending direction of the connecting guide rail 303, and drives the stamping part 506 to stamp it through the stamping mechanism 5. The combined multilayer circuit board is ejected to complete the operation of the device.

To sum up, the multi-layer circuit board intelligent lamination device, which is beneficial to prevent delamination, can effectively monitor the use position of the operating table 6 by setting the position sensor 608, and transmit the monitoring results to the sensing module, so that the Determine the accuracy of the stamping part 506 on the stamping mechanism 5 using the stamping on the console 6, and then control the drive module through the main control module to drive the stamping mechanism 5 to perform a pressing operation on the multi-layer circuit board placed on the console 6, and pass The pressure monitor 508 monitors the pressure used for its pressing operation, and at the same time controls the pressing pressure used by the device through the main control module, thereby effectively enabling the device to monitor and control the pressing pressure used by the device to avoid the pressure caused by too small pressing pressure. The problem of poor lamination effect and excessive lamination pressure cause the problem of lifting and delamination of the multilayer circuit board, which improves the intelligence and usability of the device and enhances the stability of its use.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (10)

1. A multi-layer circuit board intelligent pressing device for preventing delamination, comprising a connection bracket (1), characterized in that: the inner bottom of the connection bracket (1) is provided with a mounting seat (2), the installation A connecting seat (3) is arranged on the top of the seat (2), a limiting seat (4) is movably provided on the top of the connecting seat (3), and an operating table (6) is embedded in the top of the limiting seat (4). , the top of the connecting seat (3) is movably provided with a punching mechanism (5), and the top of the punching mechanism (5) is provided with a control mechanism (7); The bottom of the operating table (6) is provided with a connection base (601), the inner bottom of the connection base (601) is provided with a telescopic spring support (607), and the top of the telescopic spring support (607) is provided with a telescopic spring support (607). A supporting member (602), a punching groove (603) is formed on the top of the supporting member (602), and a connecting groove (604) is correspondingly opened on the front and back of the punching groove (603), and the connecting groove (604) is A position sensor (608) is arranged on the inner wall, a limit shaft (605) is movably arranged inside the connecting groove (604), and an ejector groove (609) is opened at the bottom of the punching slot (603), and the ejector The inner bottom of the groove (609) is provided with an electric ejector rod (610), and the inner bottom wall of the punching groove (603) is movably embedded with a buffer pad (606). 2. An intelligent pressing device for multi-layer circuit boards that is beneficial to preventing delamination according to claim 1, characterized in that: the inner bottom of the connecting bracket (1) is provided with a connecting bottom plate (101), and the connecting The top of the bottom plate (101) is provided with a limiting clip (102). 3. The intelligent lamination device for multi-layer circuit boards that is beneficial for preventing delamination according to claim 1, characterized in that: connecting rail grooves (301) are provided on both inner sides of the top of the connecting seat (3), The inner bottom of the connection seat (3) is provided with a connection guide rail (303), and the front of the connection seat (3) is provided with an electric telescopic rod (302). 4. The intelligent pressing device for multi-layer circuit boards that is beneficial to preventing delamination according to claim 1, characterized in that a limit cross plate is provided on the inside of the front and the inside of the back of the limit seat (4). (401), limiting side plates (402) are provided on both sides of the limiting seat (4). 5. An intelligent lamination device for multi-layer circuit boards that is beneficial for preventing delamination according to claim 1, characterized in that: a support plate (501) is provided on the top of the punching mechanism (5), and the support plate The top of (501) is provided with a support rod (502), and the bottom of the support plate (501) is provided with slider legs (507). 6. The intelligent pressing device for multi-layer circuit boards according to claim 5, characterized in that: a hydraulic cylinder (503) is provided on the top of the support plate (501), and the hydraulic cylinder The bottom of (503) is provided with a hydraulic telescopic rod (504), and the outer wall of the hydraulic telescopic rod (504) is provided with a pressure monitor (508). 7. An intelligent press-fitting device for multi-layer circuit boards that is conducive to preventing delamination according to claim 6, characterized in that: a connecting plate (505) is provided at the bottom end of the hydraulic telescopic rod (504), and the The bottom of the connecting plate (505) is provided with a stamping part (506). 8 . The intelligent lamination device for multi-layer circuit boards according to claim 1 , wherein a telescopic support ( 6061 ) is provided at the bottom of the buffer pad ( 606 ), and the telescopic A buffer spring (6062) is provided at the inner bottom of the support (6061), and a rubber backing plate (6063) is provided at the top of the telescopic support (6061). 9 . The intelligent lamination device for multi-layer circuit boards according to claim 8 , wherein the telescopic support ( 6061 ) is embedded in the buffer pad ( 606 ), and A telescopic support (6061), a buffer spring (6062) and a rubber backing plate (6063) are set as a set, and each set consists of a telescopic support (6061), a buffer spring (6062) and a rubber backing plate (6063) Assembled into a pad, the buffer pad (606) is composed of several groups of pads spliced together. 10 . The intelligent pressing device for multi-layer circuit boards according to claim 1 , wherein an induction module, a main control module, and a drive module are respectively arranged inside the control mechanism (7). 11 . and the monitoring module, and the sensing module, the main control module, the driving module and the monitoring module are all electrically connected.

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