CN115055814A - Workpiece five-axis adjustment frame, five-axis motion device, laser processing system and method - Google Patents

Abstract

The invention discloses a five-axis adjusting frame for a workpiece, a five-axis movement device, a laser processing system and a method, and belongs to the field of laser processing. According to the invention, different adjusting units are used for applying forces in different directions to the positioning disc, so that the pitching angle and the spatial position of the workpiece are changed, and the high-precision pose adjustment of the workpiece is realized, so that the rotating shafts of the double rotating tables, the curvature center of the workpiece and the laser optical axis are in high-precision fit. According to the invention, the axis A rotating table and the axis B rotating table are cooperatively controlled, the rotation characteristic of a workpiece to be processed is utilized, a processing mode that the laser focus position is fixed and the workpiece rotates at high speed and high precision is adopted, the lifting of a Z axis does not need to be controlled in the processing process, and the focusing precision error caused by the scanning change of an optical path is eliminated. The invention drives the workpiece to rotate in space through the A-axis rotating table and the B-axis rotating table, and the rotating angle and the speed of the rotating table are determined by the pattern to be processed, so that the set pattern can be processed on the surface of the workpiece at high precision and high speed.

Description

Workpiece five-axis adjustment frame, five-axis motion device, laser processing system and method

technical field

The invention belongs to the field of laser processing, and more particularly, relates to a five-axis adjustment frame of a workpiece, a five-axis motion device, and a laser processing system and method.

Background technique

With the continuous development of global industrial processing and manufacturing technology, the demand for material processing in various fields has developed from two-dimensional planes to three-dimensional curved surfaces. The processing of revolving surfaces such as spherical surfaces, cylindrical surfaces, and conical surfaces often adopts two methods:

One is the traditional method of machining a special mask and ion etching, and etching the pattern required for the application on the surface of the workpiece to be processed. The disadvantage of this processing method is that the processing accuracy of the graphics depends on the processing accuracy of the mask, and the mask material is often thin and easily deformed, and has the disadvantages of difficult to control graphics parameters, long processing time, and high requirements for tools.

The second is to use the laser method to etch the surface of the workpiece to be processed. Usually, a galvanometer can be used to perform precise scanning in a two-dimensional plane, and through the displacement control of the workpiece or the laser beam, the focus position of the laser beam on the workpiece forms a three-dimensional shape. Scanning can realize the processing of curved surfaces, but this method also has disadvantages such as uneven distribution of light spots due to changes in the focal plane, and that the beam is not strictly vertical to the surface due to the deflection of the galvanometer.

Patent CN103266323A discloses a method for etching the surface of metal products with a curved surface structure. First, the flat part and the curved part of the metal product are masked, the mask gap of the flat part is uniform, and the mask gap of the curved part is from the plane to the surface. The junction of the curved surface gradually increases to the edge of the curved surface, and then a corrosion-resistant shield is used to block the curved surface part of the metal product along the direction parallel to the plane of the metal product, and then the etching process is performed. This etching processing method has a cumbersome process. After the initial etching, follow-up processes such as stripping, re-etching, soaking, and cleaning are required, and the etching solution, anti-corrosion glue, cleaning solution, etc. used are all chemical products, which may have adverse effects on the environment. certain pollution. Since the processing pattern is formed by the chemical reaction between the etching solution and the metal surface, there is uncontrollability. The area that needs to be processed may not be etched due to the insufficiency of the chemical reaction, or the area that does not need to be processed may be affected by chemical reactions. The effect of the reaction is affected by etching, and its etching processing effect will be affected to a certain extent.

Patent CN109940270A discloses a seven-axis five-linkage ultrafast laser processing system. The method places the workpiece to be processed on a rotary table, and then modifies the deflection of the optical path by projecting structured light and taking pictures of the workpiece, and then using the galvanometer. Scan the workpiece. The principle of this method to realize the surface processing is to adjust the position of the workpiece through the rotary table, and then use the galvanometer to scan the plane within the small scanning field. In fact, the curved surface is divided into small planes, and the surface is continuous. not tall. And through structured light photography feedback to the computer, modifying the optical path, in fact, will still cause a certain degree of uneven focus.

Patent CN112475591A discloses a double swing head type five-axis linkage laser processing machine tool and a working method, using two rotary tables to realize the surface processing of the workpiece, one of which is used to fix and rotate the workpiece, so that the workpiece can be scanned in the circumferential direction , another rotary table is linked with the Z-axis displacement mechanism, and the laser surface scanning is realized by the swing of the laser head. This method can theoretically ensure that the laser focus is on the surface to be processed in real time, but due to the limitation of the Z-axis displacement mechanism, the scanning speed cannot be increased, and calibration needs to be performed before the linkage scanning, and the coaxiality between the dual rotary table and the workpiece is also Hard to guarantee.

Patent CN206561203U discloses a five-axis laser cutting device suitable for helmet processing. First, the workpiece is placed on the material table for positioning, and then the workpiece is pre-scanned in three-dimensional space, and the processing path is formed through an algorithm. The rotation of the workpiece is realized by the translation and rotation of the material table, and the curved surface scanning of the workpiece surface is realized by the swing angle head of the laser beam and the Z-axis displacement mechanism. This method can theoretically realize that the laser focus can be placed on the surface to be processed in real time, but the actual operation is more complicated. Pre-scanning affects the efficiency and accuracy of processing. The translation and rotation of the material table limit the processing speed. The coaxiality of the beam is difficult to guarantee.

Patent CN210817953U discloses a five-axis laser micro-machining device based on a scanning galvanometer. The workpiece is fixed on a rotary table, and at the same time, the rotation on an orthogonal plane is realized by another rotary table. When the double rotary tables work together, more complex curved surface processing can be achieved through the galvanometer. The method utilizes the double rotary table to make the workpiece have two orthogonal rotational degrees of freedom, which can theoretically realize high-efficiency and high-precision curved surface machining. However, the disadvantage is that there is a lack of specific devices, so that the rotation axis of the double rotary table, the center of curvature of the workpiece, and the laser optical axis can achieve a high-precision fit. accuracy.

The problems of the above-disclosed curved surface forming device and its surface etching are:

1. The surface structure that can be made by the traditional machining special mask and ion etching method is limited. Every time a surface structure is made, a corresponding mold needs to be made. The process is cumbersome and the cost is high. For some complex surface structures, the mold's The processing difficulty coefficient is high, and it is not easy to make. When using chemicals to etch metal surfaces, due to the uncertainty and non-directionality of chemical reactions, the etched area and etched depth cannot be controlled, which will seriously degrade the processing quality, and this etching method is suitable for small curved surfaces For metal materials, the difficulty of mask processing is greatly increased, and chemicals are easy to flow out from the area to be etched in the sample, resulting in damage to the sample.

2. The quality of the surface processed by the laser etching method scanned by the galvanometer is not ideal. In order to improve the processing efficiency, most of the current methods use galvanometer scanning, but the shape of the curved surface structure is non-planar, so there is a certain difference in the focus of each area affected by the laser, resulting in different absorption of laser energy by the surface material in the active area. The etching effect will be different, and the etching quality will be degraded. For a device that is etched and processed by a laser galvanometer scanning method, in order to obtain a better etching effect, the shape of the processed metal surface needs to be a planar structure, which leads to the limitation of the etching processing capability.

3. The laser etching method using the linkage of the rotary table and the displacement mechanism is less efficient. For the curved surface machining of the workpiece in the vertical plane, there is currently a way of using a rotary table and a laser beam to construct a swivel head, and then linking it with the Z-axis displacement mechanism. When the Z-axis displacement mechanism moves down, the swivel head swings upward, and the curved surface can be scanned and processed. However, the processing efficiency of this method is limited by the moving speed of the Z-axis displacement mechanism, and more complex calibration or pre-scanning is required before processing.

4. It is difficult to ensure the accuracy of positioning by the laser etching method that uses dual rotary tables to control the multi-degree-of-freedom rotation of the workpiece. This method actually utilizes the rotation characteristics of the workpiece to be processed, and realizes the real-time focusing of the laser on the surface of the workpiece through the rotation of the workpiece and the fixed laser optical path. Since the laser optical path is fixed, it is only necessary to make the rotation center of the workpiece and the laser beam coaxial to ensure that the laser beam is always perpendicular to the plane to be processed, and high-quality focusing effect can be obtained. However, when the multi-axis moves in coordination, the small coaxial error will be amplified. This processing method needs to ensure the high-precision fit between the rotation axis of the double turntable, the center of curvature of the workpiece, and the laser optical axis.

To sum up, there is an urgent need for a laser processing method and device for etching a workpiece with a curved surface of revolution, which has the advantages of high processing accuracy, fast processing efficiency, and good processing quality.

SUMMARY OF THE INVENTION

In view of the defects of the prior art, the purpose of the present invention is to provide a workpiece five-axis adjustment frame, a five-axis motion device, a laser processing system and method, and aims to solve the problem that the multi-axis coordinated movement of the existing processing method is difficult to ensure the positioning accuracy and the etching efficiency is low. The problem.

In order to achieve the above object, in the first aspect, the present invention provides a five-axis adjustment frame for a workpiece, which includes: an upper part, a lower part, a positioning plate, an angle adjustment unit, a displacement adjustment unit and a connection unit;

A groove is arranged in the middle of the upper layer piece;

The positioning plate is a circular platform with a fixing member on the upper end surface, and the fixing member is used for fixing the workpiece to be processed;

The upper layer part and the lower layer part are elastically connected, and a gap is left in the middle, so as to form an installation cavity;

The positioning plate is arranged in the installation cavity, and the bottom surface is fitted with the groove surface of the groove;

The angle adjustment unit penetrates through the surface of the upper layer and abuts on the upper surface of the lower layer, and is used to adjust the pitch angle of the upper layer in space;

The displacement adjusting unit penetrates through the side surface of the upper layer and abuts on the circular platform of the positioning plate, and is used to adjust the relative position of the positioning circular platform in space;

The connecting unit penetrates through the surface of the lower layer and is used for fixing the lower layer and the B-axis rotary table.

Preferably, both the angle adjustment unit and the displacement adjustment unit have N screws, and N≥3.

It should be noted that the present invention adjusts the angle or displacement through a plurality of screws, and can adjust the stepping distance by fine-tuning the rotation angle of the screws, and the stepping amplitude can reach the sub-micron level, so that the pitch angle and displacement distance.

Preferably, the N screws are evenly distributed at equal intervals.

It should be noted that the present invention preferably distributes evenly at equal intervals, so that the weight of each adjustment can be the same, thereby reducing the number of adjustments as much as possible.

Preferably, the angle adjustment range of the five-axis adjustment frame of the workpiece is between 0° and 30°.

Preferably, the displacement adjustment range of the workpiece five-axis adjustment frame is between 0.0001mm and 10mm.

Preferably, fastening screws are provided on the side of the fixing member of the positioning plate.

It should be noted that there are fastening screws on the side of the fixing piece, which can adapt to workpieces of different sizes and fix at different depths.

Preferably, the upper part and the lower part are elastically connected by a plug and a spring, and the two ends of the spring pass through the through holes on the upper part and the lower part respectively, and there is a plug slot for placing the plug in the through hole. To keep the spring in a certain state of compression or extension.

In order to achieve the above purpose, in the second aspect, the present invention provides a five-axis motion device, comprising: the workpiece five-axis adjustment frame described in the first aspect, an A-axis rotary table, a rotary table connector, a B-axis rotary table, XY axis two-dimensional linear displacement platform;

The lower part of the five-axis adjustment frame of the workpiece is fixed with the B-axis rotary table;

The B-axis rotary table is used to drive the lower part to rotate around the B-axis perpendicular to the vertical plane;

The A-axis rotary table is used to drive the rotary table connector to rotate around the A-axis perpendicular to the horizontal plane, and the A-axis is parallel to the Z-axis direction;

The A-axis rotary table and the B-axis rotary table are orthogonally connected by the rotary table connector, so that the rotation center lines of the two rotary tables overlap at one point in space;

The A-axis rotary table is fixed on the XY-axis two-dimensional linear displacement platform;

The XY-axis two-dimensional linear displacement platform is used to drive the A-axis rotary table to translate in space.

In order to achieve the above object, in a third aspect, the present invention provides a five-axis laser processing system, including: the five-axis motion device described in the second aspect, a laser light source, a laser beam expander, a fixed reflector, and a liftable reflector , laser focusing mirror, CCD camera, contact displacement sensor, Z-axis linear displacement platform and controller;

the laser light source for generating laser light entering the laser beam expander;

The laser beam expander is used to obtain a smaller spot size;

The fixed reflector and the liftable reflector are used to deflect and adjust the light path;

The laser focusing mirror is used to focus the light spot on the surface of the workpiece to be processed;

The CCD camera is located on the same Z-axis linear displacement platform as the laser focusing mirror, and is used to find the spatial position of the laser focusing focus;

The contact displacement sensor is located on the same Z-axis linear displacement platform as the laser focusing mirror, and is used to measure the side surface of the connecting piece of the rotary table;

The Z-axis linear displacement platform is used to drive the laser focusing mirror fixed on the Z-axis linear displacement platform to move up and down in space;

The controller is used to control the CCD camera and the contact displacement sensor for positioning, control the A-axis rotary table and the B-axis rotary table, the XY-axis two-dimensional linear displacement platform, and the Z-axis linear displacement platform to move, and control the laser light source. Adjustment of laser parameters.

In order to achieve the above object, in the fourth aspect, the present invention provides a processing method for a five-axis laser processing system as in the third aspect, wherein the workpiece to be processed is a curved workpiece with a center of rotation, and is fixed on the workpiece by a five-axis adjustment frame of the workpiece. On the B-axis rotary table, the method includes:

S1. Adjust the ball axis and the rotation axis of the B-axis rotary table to be coaxial:

Rotate the A-axis rotary table to ensure that the side surface of the rotary table connector is perpendicular to the probe of the contact displacement sensor;

Place the probe of the contact displacement sensor at the root of the workpiece to be processed, rotate the B-axis rotary table, and read the indication of the contact displacement sensor at this time;

Adjust the displacement adjustment unit of the five-axis adjustment frame of the workpiece to adjust the displacement of the positioning plate, until the B-axis rotary table rotates, the contact displacement sensor display remains unchanged;

Place the probe of the contact displacement sensor on the surface of the workpiece to be processed, rotate the B-axis rotary table, and read the indication of the contact displacement sensor at this time;

Adjust the inclination angle of the positioning plate through the angle adjustment unit of the five-axis adjustment frame of the workpiece, until the B-axis rotary table rotates, the indication of the contact displacement sensor remains unchanged;

Repeat the above two steps continuously until the adjustment accuracy of the root and surface of the workpiece to be processed reaches the set threshold, then stop;

S2. Adjust the center of the ball and the intersection of the A-axis rotary table and the B-axis rotary table to be concentric:

Place the probe of the contact displacement sensor on the surface of the workpiece to be processed, and read the indication of the contact displacement sensor at this time;

By adjusting the displacement adjustment unit of the five-axis adjustment frame of the workpiece, the entire five-axis adjustment frame of the workpiece is translated back and forth as a whole, until the A-axis rotary table rotates 90 degrees, the indication of the contact displacement sensor remains unchanged;

S3. According to the graphics to be processed on the surface of the workpiece to be processed, calculate the angle at which the A-axis rotary table and the B-axis rotary table need to be rotated under continuous working conditions, so as to etch the graphics to be processed on the spherical surface at high speed and accurately.

In general, compared with the prior art, the above technical solutions conceived by the present invention have the following beneficial effects:

(1) The present invention proposes a five-axis adjustment frame for the workpiece. By rotating the adjustment unit located on the five-axis adjustment frame, forces in different directions are given to the positioning plate, thereby changing the pitch angle and the pitch angle of the workpiece fixed on the five-axis adjustment frame. The spatial position of the workpiece can be adjusted with high precision, so that the rotation axis of the double turntable, the center of curvature of the workpiece, and the laser optical axis can achieve a high-precision fit.

(2) The present invention proposes a five-axis motion device, which is controlled by the A-axis rotary table and the B-axis rotary table, using the rotation characteristics of the workpiece to be processed, and adopts a processing method in which the laser focus position is fixed, and the workpiece rotates at high speed and high precision. , there is no need to control the lifting and lowering of the Z axis during the processing, and the focusing accuracy error caused by the change of the optical path scanning is eliminated. Since the five-axis adjustment frame can perform high-precision coaxial and concentric adjustment of the workpiece, the workpiece can still be kept high when it rotates. quality focus.

(3) The present invention proposes a five-axis laser processing system, which uses a laser beam expander, a fixed reflector, and a liftable reflector to focus the laser on a point in space along the horizontal direction, and adjusts the Z-axis linear displacement platform to adjust the Lift the mirror and the laser focusing mirror to adjust the focusing position of the laser in the Z-axis direction. Through the CCD camera located on the same Z-axis linear displacement platform as the laser focusing mirror, find the spatial position coordinates of the laser focusing focus, which are the position coordinates to which the workpiece surface to be processed needs to be adjusted; The contact displacement sensor on the Z-axis linear displacement platform cooperates with the five-axis adjustment frame of the workpiece proposed by the present invention to measure and adjust the coaxial and concentric accuracy of the workpiece, so as to realize the spatial focus position and the workpiece surface to be processed. High precision coincidence.

(4) The present invention proposes a processing method for a five-axis laser processing system. By adjusting the spatial pose of the workpiece to be processed by the five-axis adjustment frame, any curved workpiece with a center of rotation can be adjusted to the position to be processed, so that it has one or more of the workpieces to be processed. Multiple rotating shafts are coaxial with one or more of the rotating shafts of the A-axis rotary table and the B-axis rotary table, so as to drive the workpiece to rotate in space through the A-axis rotary table and the B-axis rotary table, and its rotation angle and speed are determined by the to-be-processed The pattern is determined, and the set pattern can be machined on the workpiece surface with high precision and high speed.

Description of drawings

FIG. 1 is a schematic diagram of a five-axis laser processing system provided by the present invention.

FIG. 2 is a schematic structural diagram of the workpiece five-axis adjustment frame provided by the present invention.

FIG. 3 is a working schematic diagram of the five-axis adjustment frame of the workpiece provided by the present invention.

FIG. 4 is a schematic diagram of a laser etching path on the surface of a workpiece provided by the present invention.

Throughout the drawings, the same reference numbers are used to refer to the same elements or structures, wherein:

1-1: Laser light source, 1-2: Laser beam expander, 1-3: Fixed mirror, 1-4: Liftable mirror, 1-5: Laser focusing mirror, 2-1: CCD camera, 2- 2: Contact displacement sensor, 3: Workpiece five-axis adjustment frame, 4-1: A-axis rotary table, 4-2: rotary table connector, 4-3: B-axis rotary table, 5-1: XY-axis two-dimensional Linear displacement platform, 5-2: Z-axis linear displacement platform, 6: Related control system, 7: Workpiece to be processed, 3-1: Positioning plate, 3-2: Fixing piece, 3-3: Fastening screw, 3- 4, 3-7, 3-10: threaded holes, 3-6, 3-9, 3-12: first screw, 3-5, 3-8, 3-11: second screw, 3-13: upper layer Pieces, 3-14: Lower Pieces.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

FIG. 1 is a schematic diagram of a five-axis laser processing system provided by the present invention. As shown in Figure 1, the processing system includes: a laser light source 1-1, a laser beam expander 1-2, a fixed mirror 1-3, a liftable mirror 1-4, a laser focusing mirror 1-5, and a CCD camera 2 -1. Positioning sensor 2-2, workpiece five-axis adjustment frame 3, A-axis rotary table 4-1, rotary table connector 4-2, B-axis rotary table 4-3, XY-axis two-dimensional linear displacement platform 5-1 , Z-axis linear displacement platform 5-2, related control system 6 and workpiece 7 to be processed.

The laser light source 1-1 is used to generate laser light. The laser beam expander 1-2 is used to obtain a smaller spot size. The fixed reflector 1-3 and the liftable reflector 1-4 are used to deflect and adjust the optical path. The laser focusing mirrors 1-5 are used to focus the light spot on the surface of the workpiece 7 to be processed. The light spot is focused on a point in space, and the laser acts on the conductive glass, and with the aid of a CCD camera and a positioning sensor, the three-dimensional position of the laser focus in space is obtained.

The CCD camera 2-1 is used to determine the exact position of the focal plane in space and to assist the positioning of the workpiece, and the positioning sensor 2-2 is used to detect the positioning accuracy and coaxial accuracy before the system is processed.

The workpiece five-axis adjustment frame 3 is used to precisely adjust the spatial positional relationship between the workpiece 7 to be processed, the B-axis rotary table 4-3, and the A-axis rotary table 4-1.

The B-axis rotary table 4-3 and the A-axis rotary table 4-1 are used to control the etching path of the workpiece 7 to be processed.

The XY-axis two-dimensional linear displacement platform 5-1 is used to control the plane movement of the workpiece 7 to be processed, and the Z-axis linear displacement platform 5-2 is used to change the positioning sensor 2-2, the laser focusing mirror 1-5, The relative position of the CCD camera 2-1 and the workpiece 7 to be processed.

The workpiece 7 to be processed is used for processing. The relevant control system 6 is used to control the laser light source 1-1, the positioning sensor 2-2, the Z-axis linear displacement platform 5-2, the CCD camera 2-1, the B-axis rotary table 4-3, and the A-axis rotary table 4 -1, XY axis two-dimensional linear displacement platform 5-1 works together.

FIG. 2 is a schematic structural diagram of the workpiece five-axis adjustment frame provided by the present invention. Among them, (a) is a top view, (b) is a side view, and (c) is an exploded view. As shown in FIG. 2 , the workpiece five-axis adjustment frame 3 is a double-layer structure, and the lower part 3-14 can be fixed on the B-axis through three threaded holes 3-4, 3-7, 3-10 passing through the adjustment frame On the rotary table 4-3, the upper part 3-13 has a positioning plate 3-1 for mounting the workpiece, and the positioning plate 3-1 has a fixing part 3-2 and a fastening screw 3-3, which can be used to fix various types of workpieces. When the workpiece 7 is processed, the upper and lower layers of the workpiece five-axis adjustment frame 3 are closely connected and can rotate coaxially. Through the connection of the workpiece five-axis adjustment frame 3, the motion control of the B-axis rotary table 4-3 can be immediately transmitted to the workpiece 7 to be processed. Between the upper and lower layers of the workpiece five-axis adjustment frame 3 is an air layer, leaving space for adjusting the relative positions of the upper and lower layers.

Further, the upper part 3-13 of the workpiece five-axis adjustment frame 3 has six screws that can be used to adjust the displacement and angle of the workpiece, wherein the screws 3-5, the screws 3-8, and the screws 3-11 are located on the disk of the adjustment frame. The surface can be used to adjust the tilt angle of the workpiece; screws 3-6, 3-9, and 3-12 are located on the side cylindrical surface of the adjustment frame, which can be used to adjust the displacement of the workpiece. When the workpiece 7 to be processed is installed on the workpiece five-axis adjustment frame 3 through the positioning plate 3-1, the position and posture of the workpiece 7 to be processed can be adjusted through the above components, so as to realize the adjustment of the workpiece 7 in the A and B axis directions. The rotary axes are respectively coaxial with the A-axis rotary table 4-1 and the B-axis rotary table 4-3 with high precision.

FIG. 3 is a working schematic diagram of the five-axis adjustment frame of the workpiece provided by the present invention. The present invention is applicable to rotatable workpieces. In this embodiment, a ball shaft workpiece is taken as an example to further illustrate the working principle of the workpiece five-axis adjustment frame 3 . The ball axis of the workpiece to be processed is fixed on the B-axis rotary table through the workpiece five-axis adjustment frame. If it is necessary to ensure that the sphere to be processed is rotating, the laser optical axis is always perpendicular to the spherical surface and points to the center of the sphere. There are two adjustments: adjust the ball axis and the rotation axis of the B-axis rotary table to be coaxial, and adjust the ball center and the intersection of the A-axis rotary table and the B-axis rotary table to be concentric.

As shown in (a)-(b) of Figure 3, after the workpiece 7 to be processed is fixed on the B-axis rotary table 4-3 through the workpiece five-axis adjustment frame 3, the positioning sensor 2-2 is first used to adjust the B-axis rotary table. The side surface of 4-3 is measured, and by rotating the A-axis rotary table 4-1, it is ensured that the side surface of the B-axis rotary table 4-3 is perpendicular to the probe of the positioning sensor 2-2.

As shown in (c)-(d) of Figure 3, place the probe of the positioning sensor 2-2 at the root of the workpiece 7 to be processed, rotate the B-axis rotary table 4-3, read the number, and pass the screw 3- 6. Use screws 3-9 and 3-12 to adjust the displacement of the workpiece five-axis adjustment frame 3. When the B-axis rotary table 4-3 rotates, the indication of the positioning sensor 2-2 remains unchanged, indicating that the axis of the workpiece and the axis of the turntable remain unchanged. Intersect at the root of the workpiece.

As shown in (e)-(f) of Figure 3, place the probe of the positioning sensor 2-2 on the spherical surface of the workpiece 7 to be processed, rotate the B-axis rotary table 4-3, read the number, and pass the screw 3- 5. Use screws 3-8 and 3-11 to adjust the inclination angle of the five-axis adjustment frame 3 of the workpiece until the rotation of the B-axis rotary table 4-3, the indication of the positioning sensor 2-2 remains unchanged, indicating that the axis of the workpiece is in line with the turntable. The axes intersect at the top of the workpiece, where the workpiece axis and the turntable axis are exactly coincident.

In the actual adjustment process, the above adjustment of the root of the ball shaft and the adjustment of the upper part of the ball shaft will affect each other. Repeating the above two steps continuously can reduce the error continuously until the adjustment accuracy of the root of the ball shaft and the upper part of the ball shaft It can be considered that the ball axis and the rotation axis of the B-axis rotary table have been adjusted to the coaxial state at this time. Next, adjust the center of the ball and the intersection of the A-axis rotary table and the B-axis rotary table to be concentric.

As shown in (g)-(h) in Figure 3, the probe of the positioning sensor 2-2 is placed on the spherical surface of the workpiece 7 to be processed, the A-axis rotary table 4-1 is rotated 90 degrees, and the positioning sensor 2-2 is read twice. 2, and through the screws 3-5, 3-8, and 3-11, the workpiece five-axis adjustment frame 3 is translated back and forth as a whole, until the A-axis rotary table 4-1 rotates, the positioning sensor 2-2 The indication remains unchanged, indicating that the rotation axis of the A-axis coincides with the spherical center of the workpiece.

The above example can briefly illustrate the working principle of the workpiece five-axis adjustment frame 3. In the actual processing process, its applicable objects include but are not limited to ball shaft workpieces, but also include the surface to be processed that is a conical surface, a cylindrical surface or other various rotating For the curved workpiece in the center, any adjustment of displacement, inclination angle, etc. of the workpiece 7 to be processed based on this invention is within the scope of protection of the invention.

FIG. 4 is a schematic diagram of a laser etching path on the surface of a workpiece provided by the present invention. As shown in Fig. 4, taking the spherical shaft workpiece as an example, the laser is focused on the surface of the workpiece 7 to be processed by the laser focusing mirror 1-5, and the workpiece 7 to be processed is controlled by the A-axis rotary table 4-1 and the B-axis rotary table 4-3 , the workpiece can be rotated around the A-axis and the B-axis, and the etching path generated by the A-axis and the B-axis of the laser is a curve.

The subsequent processing steps are: driving the double turntable workpiece (A-axis rotary table and B-axis rotary table) rotating device and the workpiece to move to the recorded three-dimensional position of the laser focus in space through the XY-axis two-dimensional linear displacement platform; the laser The focusing system and its front liftable mirror are fixed on the Z-axis linear displacement platform, which can move the optical path in the Z-axis direction before processing. During the processing, the laser light path is fixed, and its spatial focus position has been aligned with the surface of the workpiece before processing. The workpiece to be processed is driven to move by the double turntable workpiece rotating device, so that the workpiece to be processed and the laser focus move relative to each other, thereby obtaining a laser curved surface. The pattern etched by the path.

The laser etching process of the surface of revolution workpiece is as follows: Using the laser beam expander and focusing lens group of the laser beam shaping and focusing device, the approximate position of the focusing spot is obtained within the working distance of about 3mm to 10mm behind the focusing lens group, and the spot diameter is about 0.5μm-50μm. After the focusing is completed, the pre-scanned light spot is accurately measured by the CCD camera to determine and record the exact position of the focus in space; the workpiece is fixed on the five-axis adjustment frame of the workpiece on the B-axis rotary table, and the positioning sensor of the coaxial positioning device is used. Measure the coaxial condition of the rotation axis of the B-axis rotary table, the center of curvature of the workpiece, and the laser optical axis, and adjust the workpiece displacement and angle through the screws of the five-axis adjustment frame of the workpiece. After adjustment, use the positioning sensor to measure again, and repeat this step. , until the positioning accuracy is adjusted to less than 10μm. After the adjustment is completed, use the XY axis two-dimensional linear displacement platform to move and install the double turntable workpiece rotation device with the workpiece to be processed, so that the workpiece surface is located at the recorded focus position; set the movement path of the double turntable through the to-be-processed graphics, so that the workpiece can be During movement, the laser beam etches a preset pattern on the surface to be machined of the curved workpiece.

Those skilled in the art can easily understand that the above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, etc., All should be included within the protection scope of the present invention.

Claims (10)

1. A five-axis workpiece adjustment frame, comprising: the device comprises an upper layer piece, a lower layer piece, a positioning disc, an angle adjusting unit, a displacement adjusting unit and a connecting unit;

a groove is formed in the middle of the upper layer piece;

the positioning disc is a circular table with a fixing piece arranged on the upper end face, and the fixing piece is used for fixing a workpiece to be processed;

the upper layer part and the lower layer part are elastically connected, and a gap is reserved between the upper layer part and the lower layer part, so that an installation cavity is formed;

the positioning disc is arranged in the mounting cavity, and the bottom surface of the positioning disc is attached to the groove surface of the groove;

the angle adjusting unit penetrates through the surface of the upper layer piece and abuts against the upper surface of the lower layer piece, and is used for adjusting the pitching angle of the upper layer piece in the space;

the displacement adjusting unit penetrates through the side face of the upper layer piece, abuts against the circular truncated cone of the positioning disc and is used for adjusting the relative position of the positioning circular truncated cone in space;

the connecting unit penetrates through the surface of the lower layer part and is used for fixing the lower layer part and the B-axis rotating platform.

2. The workpiece five-axis adjusting frame as recited in claim 1, wherein the angle adjusting unit and the displacement adjusting unit are both N screws, N is greater than or equal to 3.

3. The workpiece five-axis adjustment carriage of claim 2, wherein said N screws are equally spaced and evenly distributed.

4. The workpiece five-axis adjusting bracket according to any one of claims 1 to 3, wherein the angular adjustment range of the workpiece five-axis adjusting bracket is between 0 ° and 30 °.

5. The workpiece five-axis adjustment carriage of any of claims 1 to 3, wherein the displacement adjustment range of the workpiece five-axis adjustment carriage is between 0.0001mm and 10 mm.

6. The workpiece five-axis adjusting bracket according to claims 1 to 3, wherein a fastening screw is provided on a side surface of the fixing member of the positioning plate.

7. The workpiece five-axis adjusting frame as recited in claim 1 to 3, wherein the upper member and the lower member are elastically connected by a bolt and a spring, both ends of the spring respectively pass through holes on the upper member and the lower member, the through holes are provided with bolt slots for holding the bolt, and the bolt is used for keeping the spring in a certain compression or extension state.

8. A five-axis exercise device, comprising: the workpiece five-axis adjusting stand, the a-axis rotating table, the rotating table connecting piece, the B-axis rotating table, the XY-axis two-dimensional linear displacement platform according to any one of claims 1 to 7;

the lower layer piece of the workpiece five-axis adjusting frame is fixed with the B-axis rotating table;

the B-axis rotating platform is used for driving the lower layer piece to rotate around a B axis vertical to the vertical plane;

the A-axis rotating platform is used for driving the rotating platform connecting piece to rotate around an A axis vertical to the horizontal plane, and the A axis is parallel to the Z axis direction;

the A-axis rotating table and the B-axis rotating table are orthogonally connected through a rotating table connecting piece, so that the rotating center lines of the two rotating tables are overlapped at one point in space;

the A-axis rotating table is fixed on the XY-axis two-dimensional linear displacement platform;

and the XY-axis two-dimensional linear displacement platform is used for driving the A-axis rotating platform to translate in space.

9. A five-axis laser machining system, comprising: the five-axis motion device, the laser light source, the laser beam expander, the fixed reflector, the liftable reflector, the laser focusing mirror, the CCD camera, the contact type displacement sensor, the Z-axis linear displacement platform and the controller according to claim 8;

the laser light source is used for generating laser entering the laser beam expander;

the laser beam expander is used for obtaining smaller spot size;

the fixed reflector and the liftable reflector are used for deflecting and adjusting the light path;

the laser focusing mirror is used for focusing light spots on the surface of the workpiece to be processed;

the CCD camera is positioned on a Z-axis linear displacement platform which is the same as the laser focusing lens and is used for searching the spatial position of a laser focusing focus;

the contact type displacement sensor is positioned on a Z-axis linear displacement platform which is the same as the laser focusing mirror and is used for measuring the side surface of the rotating platform connecting piece;

the Z-axis linear displacement platform is used for driving the laser focusing mirror fixed on the Z-axis linear displacement platform to do vertical translation motion in space;

the controller is used for controlling the CCD camera and the contact type displacement sensor to be connected for positioning, controlling the A-axis rotating platform and the B-axis rotating platform, the XY-axis two-dimensional linear displacement platform and the Z-axis linear displacement platform to move and controlling the adjustment of laser parameters of the laser light source.

10. A machining method of the five-axis laser machining system according to claim 9, wherein the workpiece to be machined is a curved surface workpiece having a center of rotation and is fixed to the B-axis rotary table by a workpiece five-axis adjusting mount, the method comprising:

s1, adjusting the rotating shafts of the ball shaft and the B shaft rotating platform to be coaxial:

rotating the rotating platform of the A shaft to ensure that the side surface of the connecting piece of the rotating platform is vertical to the probe of the contact type displacement sensor;

placing a probe of the contact type displacement sensor at the root of a workpiece to be processed, rotating the B-axis rotating table, and reading the reading of the contact type displacement sensor at the moment;

the displacement adjusting unit of the five-axis adjusting frame for adjusting the workpiece carries out displacement adjustment on the positioning disc until the reading of the contact type displacement sensor is kept unchanged when the B-axis rotating table rotates;

placing a probe of the contact type displacement sensor on the surface of a workpiece to be processed, rotating the B-axis rotating platform, and reading the reading of the contact type displacement sensor at the moment;

the inclination angle of the positioning disc is adjusted through an angle adjusting unit of the workpiece five-axis adjusting frame until the reading of the contact type displacement sensor is kept unchanged when the B-axis rotating table rotates;

continuously repeating the two steps until the adjusting precision of the root and the surface of the workpiece to be processed reaches a set threshold value, and stopping;

s2, adjusting the intersection point of the spherical center and the rotating table of the A shaft and the rotating table of the B shaft to be concentric:

placing a probe of the contact type displacement sensor on the surface of a workpiece to be processed, and reading the reading of the contact type displacement sensor at the moment;

the workpiece five-axis adjusting frame is integrally translated back and forth by adjusting a displacement adjusting unit of the workpiece five-axis adjusting frame until the A-axis rotating table rotates by 90 degrees, and the reading of a contact type displacement sensor is kept unchanged;

and S3, calculating the required rotating angles of the A-axis rotating table and the B-axis rotating table in a continuous working state according to the graph to be processed on the surface of the workpiece to be processed, so that the graph to be processed is etched on the spherical surface at high speed and accurately.

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