CN115036669B - Antenna packaging structure and manufacturing method thereof - Google Patents
Antenna packaging structure and manufacturing method thereof Download PDFInfo
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- CN115036669B CN115036669B CN202210727612.5A CN202210727612A CN115036669B CN 115036669 B CN115036669 B CN 115036669B CN 202210727612 A CN202210727612 A CN 202210727612A CN 115036669 B CN115036669 B CN 115036669B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 449
- 239000010409 thin film Substances 0.000 claims abstract description 41
- 239000004033 plastic Substances 0.000 claims abstract description 20
- 239000010408 film Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 15
- 229920000620 organic polymer Polymers 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims 2
- 230000008054 signal transmission Effects 0.000 abstract description 18
- 239000005022 packaging material Substances 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 6
- 239000002861 polymer material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
- H01Q5/28—Arrangements for establishing polarisation or beam width over two or more different wavebands
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Abstract
本发明揭示了一种天线封装结构及其制作方法，所述封装结构包括至少一个天线基板和线路基板，天线基板设置于线路基板上方，天线基板内设置有输入天线，天线基板和线路基板之间通过支撑件焊接/固定，天线封装结构还包括一薄膜层，薄膜层完全包覆天线基板上表面和侧壁面，并沿天线基板侧壁面延伸至线路基板上表面，薄膜层与天线基板下表面和线路基板上表面之间围设形成密闭空腔。在天线基板表面形成一薄膜层，该薄膜层与天线基板下表面和线路基板上表面之间围设形成密闭空腔，降低线路基板和天线基板之间因为塑封料填充而导致的信号传输损失，同时也避免了线路基板和天线基板之间信号传输腔体完全暴露在空气中，提升天线封装结构的可靠性。
The present invention discloses an antenna packaging structure and a manufacturing method thereof, wherein the packaging structure includes at least one antenna substrate and a circuit substrate, wherein the antenna substrate is arranged above the circuit substrate, an input antenna is arranged in the antenna substrate, the antenna substrate and the circuit substrate are welded/fixed by a support member, and the antenna packaging structure also includes a thin film layer, wherein the thin film layer completely covers the upper surface and side wall surface of the antenna substrate, and extends along the side wall surface of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate. A thin film layer is formed on the surface of the antenna substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate, thereby reducing the signal transmission loss caused by the filling of the plastic packaging material between the circuit substrate and the antenna substrate, and also avoiding the signal transmission cavity between the circuit substrate and the antenna substrate being completely exposed to the air, thereby improving the reliability of the antenna packaging structure.
Description
Technical Field
The invention relates to the technical field of antenna packaging, in particular to an antenna packaging structure and a manufacturing method thereof.
Background
With the advent of the high-rate communication age such as 5G and VR, millimeter wave communication has become a mainstream, and design and application requirements of millimeter wave antennas have become more and more vigorous. Since the length of the millimeter wave frequency band transmission path has a great influence on the signal amplitude loss, the traditional architecture mode of the ic+pcb+antenna has not been able to meet the high performance requirement, and the architecture of the ic+package antenna becomes the mainstream, which is AiP (ANTENNA IN PACKAGE, package antenna integration) technology.
The antenna packaging structure mainly adopts a mode of stacking two or more substrates, wherein the upper substrate is a multi-frequency band input antenna (28G, 40G and 60G), the lower substrate is used for wiring, the distance between the upper substrate and the lower substrate is different along with the different antenna frequencies, and the lower the antenna frequency is, the larger the distance between the upper substrate and the lower substrate is, so that the consistent interval height can be kept by mixing part of core balls or high-melting-point balls between the upper substrate and the lower substrate. In the prior art, the reliability of the antenna directly exposed in the air is low, the antenna packaging structure is integrally packaged again for improving the reliability and facilitating the follow-up board mounting process, but the transmission performance between the antennas can be reduced by the plastic packaging material around the antenna.
Disclosure of Invention
The invention aims to provide an antenna packaging structure and a manufacturing method thereof.
In order to achieve one of the above objects, an embodiment of the present invention provides an antenna package structure, including at least one antenna substrate and a circuit substrate, wherein the antenna substrate is disposed above the circuit substrate, an input antenna is disposed in the antenna substrate, the antenna substrate and the circuit substrate are fixed by a supporting member, and the antenna substrate and the circuit substrate are fixed by a supporting member,
The antenna packaging structure further comprises a film layer, the film layer completely covers the upper surface and the side wall surface of the antenna substrate, and extends to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and a closed cavity is formed between the film layer and the lower surface of the antenna substrate and between the film layer and the upper surface of the circuit substrate in an enclosing mode.
As a further improvement of an embodiment of the present invention, the thin film layer is an organic polymer film, and has a dielectric constant of less than 3.5 and a dielectric loss of less than 0.006.
As a further improvement of one embodiment of the present invention, the thin film layer has a thickness of more than 40 μm.
As a further improvement of an embodiment of the present invention, the antenna substrate includes a first antenna substrate in which an input antenna of 28G frequency is disposed, a second antenna substrate in which an input antenna of 40G frequency is disposed, and a third antenna substrate in which an input antenna of 60G frequency is disposed.
As a further improvement of an embodiment of the present invention, a distance between the first antenna substrate and the circuit substrate is larger than a distance between the second antenna substrate and the circuit substrate, and a distance between the second antenna substrate and the circuit substrate is larger than a distance between the third antenna substrate and the circuit substrate.
As a further development of an embodiment of the invention, the support is a solder ball and/or a nuclear ball and/or a curing glue.
As a further improvement of an embodiment of the present invention, a plurality of beam bumps are formed on the upper surface of the antenna substrate, where the input antenna is correspondingly disposed, where the beam bumps protrude upward along the antenna substrate, and the film layer further covers the upper surface of the beam bumps.
As a further improvement of an embodiment of the present invention, the beam bump has a conical structure and has a lens function.
As a further improvement of an embodiment of the present invention, an included angle between the conical surface and the bottom surface of the conical structure is smaller than 45 degrees.
As a further improvement of an embodiment of the present invention, the beam bump material is a composition of aluminum oxide and epoxy resin, and has a dielectric constant greater than 4 and a dielectric loss less than 0.006.
As a further improvement of an embodiment of the present invention, the antenna package structure further includes at least 1 radio frequency chip, and a metal solder ball disposed on the lower surface of the circuit substrate, where the metal solder ball is used for electrically connecting with an external circuit.
As a further improvement of an embodiment of the present invention, the antenna packaging structure further includes a plastic package body, and the plastic package body completely covers the film layer and the uncovered upper surface of the circuit substrate.
The invention also provides a manufacturing method of the antenna packaging structure, which comprises the following steps:
providing at least one antenna substrate and a circuit substrate, wherein an input antenna is arranged in the antenna substrate;
a supporting piece is arranged on the upper surface of the circuit substrate, and the antenna substrate is fixed above the circuit substrate through the supporting piece;
and forming a film layer on the upper surface and the side wall surface of the antenna substrate, wherein the film layer extends to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and a closed cavity is formed between the film layer and the lower surface of the antenna substrate and the upper surface of the circuit substrate in a surrounding manner.
As a further improvement of an embodiment of the present invention, there is provided at least an antenna substrate and a circuit substrate, wherein an input antenna is disposed in the antenna substrate, and the method specifically includes:
The method comprises the steps of providing a first antenna substrate, a second antenna substrate and a third antenna substrate, wherein an input antenna with 28G frequency is arranged in the first antenna substrate, an input antenna with 40G frequency is arranged in the second antenna substrate, and an input antenna with 60G frequency is arranged in the third antenna substrate.
As a further improvement of an embodiment of the present invention, the forming a supporting member on an upper surface of the circuit substrate, and fixing the antenna substrate above the circuit substrate by the supporting member, specifically includes:
Solder balls and/or dispensing are welded on the upper surface of the circuit substrate, and the first antenna substrate, the second antenna substrate and the third antenna substrate are fixedly arranged above the circuit substrate through the solder balls and/or dispensing;
The distance between the first antenna substrate and the circuit substrate is larger than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is larger than the distance between the third antenna substrate and the circuit substrate.
As a further improvement of an embodiment of the present invention, the forming a thin film layer on the upper surface and the sidewall of the antenna substrate, the thin film layer extending along the sidewall of the antenna substrate to the upper surface of the circuit substrate, and forming a closed cavity between the thin film layer and the lower surface of the antenna substrate and the upper surface of the circuit substrate, specifically includes:
and forming thin film layers with the thickness of more than 40 mu m on the upper surfaces and the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate by using a film pressing process, wherein the thin film layers extend to the upper surfaces of the circuit substrates along the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate respectively, and a closed cavity is formed between the thin film layers, the lower surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate and the upper surface of the circuit substrate in a surrounding mode.
As a further improvement of an embodiment of the present invention, before the antenna substrate is correspondingly provided with the upper surface and the sidewall surface of the input antenna, the method further comprises the steps of:
And a plurality of conical wave beam convex points are manufactured on the upper surface of the input antenna correspondingly arranged on the antenna substrate, and the wave beam convex points protrude upwards along the antenna substrate.
As a further improvement of an embodiment of the present invention, the manufacturing method further includes the steps of:
and forming a film layer with the thickness of more than 40 mu m on the upper surface of the beam bump by using a film pressing process.
As a further improvement of an embodiment of the present invention, the manufacturing method further includes the steps of:
And plastic packaging the upper surface of the film layer and the uncovered upper surface of the circuit substrate.
The invention has the beneficial effects that the film layer is formed on the surface of the antenna substrate, the sealed cavity is formed between the film layer and the lower surface of the antenna substrate and the upper surface of the circuit substrate, the loss of signal transmission caused by filling of plastic packaging materials between the circuit substrate and the antenna substrate is reduced, the signal transmission cavity between the circuit substrate and the antenna substrate is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.
Drawings
Fig. 1 is a side view of an antenna package structure according to an embodiment of the present invention.
Fig. 2 is a side view of an antenna package structure in embodiment 1 of the present invention.
Fig. 3 is a top view of an antenna package structure (before plastic packaging) in embodiment 1 of the present invention.
Fig. 4 is a side view of an antenna package structure in embodiment 2 of the present invention.
Fig. 5 is a top view of an antenna package structure (before plastic encapsulation) in embodiment 2 of the present invention.
Fig. 6 is a side view of an antenna package structure with another beam bump structure in embodiment 2 of the present invention.
Fig. 7 is a flowchart illustrating a method for manufacturing an antenna package according to an embodiment of the invention.
Fig. 8 is a flow chart of a method for manufacturing an antenna package structure in embodiment 1 of the present invention.
Fig. 9 (a) - (d) are the process steps of manufacturing the antenna package structure in embodiment 1 of the present invention.
Fig. 10 is a flow chart of a method for manufacturing an antenna package structure in embodiment 2 of the present invention.
Fig. 11 (a 1), (a 2) to (d) are the process steps of manufacturing the antenna package structure in embodiment 2 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below in conjunction with the detailed description of the present invention and the corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
For purposes of illustration, terms such as "upper," "lower," "rear," "front," and the like, are used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may include different orientations of the device in use or operation than that illustrated in the figures. For example, if the device in the figures is turned over, elements described as "below" or "over" other elements or features would then be oriented "below" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.
As shown in fig. 1, the present embodiment provides an antenna package structure, which includes at least one antenna substrate 1 and a circuit substrate 2, wherein the antenna substrate 1 is disposed above the circuit substrate 2, and an input antenna is disposed in the antenna substrate 1.
The antenna substrate 1 and the circuit substrate 2 are fixed through the supporting piece 3, and the supporting piece 3 is a tin ball and/or a nuclear ball 31 and/or solidified glue 32. In this embodiment, the intermediate position of the upper surface of the circuit substrate 2 is used for fixing the antenna substrate 1 and the circuit substrate 2 by adhesive dispensing, and the solder balls and/or the core balls 31 with the same height as the cured glue 32 are welded at the two ends of the upper surface of the circuit substrate 2, so that the antenna substrate 1 and the circuit substrate 2 are welded together, and the surface plane of the antenna substrate 1 is ensured to be at the same height.
Of course, in other embodiments of the present invention, the metal posts and glue with the same height may be disposed on the upper surface of the circuit substrate 2 to fix the antenna substrate 1, and the fixing manner between the antenna substrate 1 and the circuit substrate 2 is not limited in the present invention, and only the plane of the antenna substrate 1 fixed above the circuit substrate 2 is required to be at the same height, and signal transmission between the two is not affected.
In particular, the distance between the antenna substrate 1 and the wiring substrate 2, i.e., the antenna cavity height, can be controlled by controlling the height of the support 3. Whereas the antenna cavity height is related to the input antenna frequency provided in the antenna substrate 1, the higher the frequency of the input antenna, the lower the antenna cavity height.
Furthermore, the antenna package structure in this embodiment further includes a film layer 4, where the film layer 4 completely covers the upper surface and the sidewall of the antenna substrate 1, and extends to the upper surface of the circuit substrate 2 along the sidewall of the antenna substrate 1, and a closed cavity 5 is defined between the film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2. The film layer 4 can form a closed cavity structure between the antenna substrate 1 and the circuit substrate 2, so that the loss of signal transmission between the antenna substrate 1 and the circuit substrate 2 can be effectively reduced, the cavity formed between the antenna substrate 1 and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.
The Film layer 4 may be made of one or more organic polymer films selected from ABF (Ajinomoto Build-Up Film) and epoxy resin. Specifically, the thickness of the thin film layer 4 is greater than 40 μm, the dielectric constant is less than 3.5, and the dielectric loss is less than 0.006, so as to reduce the loss of signal transmission.
Here, the thicker the thin film layer 4 is, the higher the manufacturing cost is, and the corresponding dielectric constant and dielectric loss are increased, and the thinner the thin film layer 4 is, the higher the requirements on the manufacturing process are, and the problem that the thin film is easy to break in the manufacturing process is solved. Therefore, in practical application, the thickness of the thin film layer 4 can be specifically set according to the process means and cost consideration, and only needs to ensure that the dielectric constant is less than 3.5 and the dielectric loss is less than 0.006.
The invention provides the following two examples to illustrate some embodiments of the invention.
Example 1
As shown in fig. 2 and 3, the antenna package structure in the embodiment 1 of the present invention is a multi-module antenna package structure, and the antenna substrate 1 specifically includes a first antenna substrate 11, a second antenna substrate 12, and a third antenna substrate 13, where the first antenna substrate 11 is provided with an input antenna 111 with 28G frequency, the second antenna substrate 12 is provided with an input antenna 121 with 40G frequency, and the third antenna substrate 13 is provided with an input antenna 131 with 60G frequency. Specifically, the specific dimensions of the antenna substrate with different frequency input antennas disposed above the circuit substrate 2 can be designed according to practical requirements.
In other embodiments, other numbers of antenna substrates 1 may be provided, and the frequency of the input antenna provided by the antenna substrate 1 may be specifically adjusted.
The first antenna substrate 11 and the circuit substrate 2, the second antenna substrate 12 and the circuit substrate 2, and the third antenna substrate 13 and the circuit substrate 2 are all welded/fixed by the supporting member 3, specifically, the solder balls and/or the core balls 31 and the glue 32 are all welded, and the distances between the antenna substrates with different input frequencies and the circuit substrate 2 are adjusted by controlling the heights of the corresponding solder balls and/or core balls 31 and the glue 32.
Since the antenna cavity height is related to the input antenna frequency set in the antenna substrate 1, the antenna cavity height is lower as the frequency of the input antenna of the antenna substrate is higher, which can be obtained by simulation according to the performance of the antenna substrate with different frequencies. When the input antenna is a millimeter antenna with 28G-60G frequency band, the height of the antenna cavity can be controlled to be 45-250 μm.
Specifically, in the present embodiment, the space between the first antenna substrate 11 and the wiring substrate 2 is larger than the space between the second antenna substrate 12 and the wiring substrate 2, and the space between the second antenna substrate 12 and the wiring substrate 2 is larger than the space between the third antenna substrate 13 and the wiring substrate 2.
Further, the antenna package structure in this embodiment further includes a film layer 4, where the film layer 4 completely covers the upper surface and the sidewall surface of the first antenna substrate 11 and extends along the sidewall surface of the first antenna substrate 11 to the upper surface of the circuit substrate 2, a first sealed cavity 51 is defined between the film layer 4 and the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, the film layer 4 completely covers the upper surface and the sidewall surface of the second antenna substrate 12 and extends along the sidewall surface of the second antenna substrate 12 to the upper surface of the circuit substrate 2, a second sealed cavity 52 is defined between the film layer 4 and the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, the film layer 4 completely covers the upper surface and the sidewall surface of the third antenna substrate 13 and extends along the sidewall surface of the third antenna substrate 13 to the upper surface of the circuit substrate 2, and a third sealed cavity (not shown) is defined between the film layer 4 and the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2. Specifically, the first closed cavity 51 has a height greater than that of the second closed cavity 52, and the second closed cavity 52 has a height greater than that of the third closed cavity.
The film layer 4 can simultaneously form a closed cavity structure between each antenna substrate and the circuit substrate 2 with different antenna cavity heights, so that the loss of signal transmission between each antenna substrate and the circuit substrate 2 can be effectively reduced, the cavity formed between each antenna substrate and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.
The material of the film layer 4 can be one or more organic polymer films composed of organic polymer materials such as ABF, epoxy resin and the like. Specifically, the thickness of the thin film layer 4 is greater than 40 μm, the dielectric constant is less than 3.5, and the dielectric loss is less than 0.006, so as to reduce the loss of signal transmission.
The antenna package structure in this embodiment further includes at least one rf chip 6, where the invention is not limited to the process of packaging the rf chip 6 on the surface of the circuit substrate 2, and the rf chip 6 may be soldered on a specific location on the circuit substrate 2 by a flip-chip process or a conventional flip-chip process, and the invention is not limited thereto, and may be flip-chip soldered on the lower surface of the circuit substrate 2 or soldered on the upper surface of the circuit substrate 2. In this embodiment, the structure of flip-chip ball bonding on the lower surface of the circuit substrate 2 is described, and the bottom filling glue is filled in the bonding position between the radio frequency chip 6 and the circuit substrate 2, so as to prevent the problem of fracture at the bonding position between the radio frequency chip 6 and the circuit substrate 2 caused by thermal stress or mechanical impact, and enhance the bonding force between the two.
Furthermore, in order to realize the transmission between the antenna packaging structure and external signals, a metal solder ball 7 is further disposed on the lower surface of the circuit substrate 2, and the metal solder ball 7 is used for realizing electrical connection with an external circuit.
Furthermore, in order to enhance the reliability of the antenna package structure and to adjust the warpage of the substrate, the antenna package structure in this embodiment further includes a plastic package body 8, and the plastic package body 8 completely covers the upper surface and the lower surface of the film layer 4 and the circuit substrate 2 that are not covered.
The plastic package body 8 is made of EMC (Epoxy Molding Compound, epoxy plastic package material) with low dielectric constant and low dielectric loss, specifically a silicon dioxide and epoxy resin material composition, the material performance of the plastic package body meets the dielectric constant of less than 3, the dielectric loss is less than 0.006, and the loss of signal transmission between substrates is reduced.
Of course, in other embodiments of the present invention, the plastic package 8 may be one or more of phenolic resin, silica gel, amino, and unsaturated resin, and the invention is not limited herein, and the material performance of the plastic package 8 may be that the dielectric constant is less than 3 and the dielectric loss is less than 0.006.
Example 2
As shown in fig. 4 and 5, in the embodiment 2 of the present invention, unlike the structure in the embodiment 1, in this embodiment, a plurality of beam bumps 9 are formed on the upper surface of the antenna substrate 1 corresponding to the input antenna, and the beam bumps 9 protrude upward along the antenna substrate 1, so as to achieve the effect of focusing and transmitting the antenna transmission signal.
Specifically, beam bumps 9 are formed at the corresponding positions of the input antenna 111 having the 28G frequency provided on the upper surface of the first antenna substrate 11, the input antenna 121 having the 40G frequency provided on the upper surface of the second antenna substrate 12, and the input antenna 131 having the 60G frequency provided on the upper surface of the third antenna substrate 13 shown in fig. 3, respectively. The beam convex points 9 are arranged at the positions of the input antennas, so that the directivity of the antenna signals of the antenna substrate can be enhanced, and mutual interference among different transmitted signals is avoided.
The beam bump 9 has a conical structure, and can gather and transmit the transmission signal of the antenna substrate to the greatest extent. In order to facilitate the process, the included angle between the conical surface and the bottom surface of the conical structure is set to be less than 45 degrees, and the lens has a lens function. The manufacturing material of the beam bump 9 is an EMC material with high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin, the larger the dielectric constant of the manufacturing material of the beam bump 9 is, the higher the binding property of a material field is, and in order to further enhance Shu Boneng force of the beam bump 9, the specific manufacturing material of the beam bump 9 has the performance that the dielectric constant is more than 4 and the dielectric loss is less than 0.006.
The beam bump 9 forms a conical lens, and the included angle between the conical surface and the bottom surface of the conical structure is smaller than 45 degrees, so that the signal transmission loss can be reduced while the antenna transmission signal is focused and transmitted.
It is understood that, because of the process manufacturing error, it is difficult to form a standard cone structure at the top corner of the beam bump 9, and therefore, a structure in which the top corner of the beam bump 9 is rounded is also within the scope of the present invention.
In other embodiments of the present invention, as shown in fig. 6, a base 91 is included at the bottom end of the beam bump 9 having a conical structure, so as to enhance the stability of the beam bump 9 on the surface of the antenna substrate, and the base 91 and the beam bump 9 are integrally formed and made of the same material. The specific thickness of the base 91 is not limited herein, and may be designed according to practical application requirements.
The beam bump 9 may be a tower-like structure, a prismatic structure or some other structure with an upward protruding point, which is also within the scope of the present invention, and may form a beam, and signals sent from the beam bumps 9 may not interfere with each other.
In the present embodiment, the film layer 4 completely covers the upper surfaces of the beam bump 9, and the upper surfaces and sidewall surfaces of the first, second and third antenna substrates 11, 12 and 13 not covered by the beam bump 9, and extends to the upper surface of the circuit substrate 2 along the sidewall surfaces of the first, second and third antenna substrates 11, 12 and 13. Similarly, a first sealed cavity 51 is defined between the film layer 4 and the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, a second sealed cavity 52 is defined between the film layer 4 and the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, and a third sealed cavity (not shown) is defined between the film layer 13 and the upper surface of the circuit substrate 2.
Specifically, the first closed cavity 51 has a height greater than that of the second closed cavity 52, and the second closed cavity 52 has a height greater than that of the third closed cavity.
The film layer 4 can simultaneously form a closed cavity structure between the antenna substrate and the circuit substrate 2 with different antenna cavity heights, so that the loss of signal transmission between the antenna substrate and the circuit substrate 2 can be effectively reduced, the cavity formed between the antenna substrate and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.
The material of the film layer 4 can be one or more organic polymer films composed of organic polymer materials such as ABF, epoxy resin and the like. Specifically, the thickness of the thin film layer 4 is greater than 40 μm, the dielectric constant is less than 3.5, and the dielectric loss is less than 0.006, so as to reduce the loss of signal transmission.
The antenna package structure in this embodiment specifically further includes a radio frequency chip 6 reversely disposed on the lower surface of the circuit substrate 2, a metal solder ball 7 for electrically connecting with an external circuit, and a plastic package body 8, and the specific structure arrangement is the same as that in embodiment 1, which is not repeated here.
As shown in fig. 7, the present invention further provides a method for manufacturing an antenna package structure, including the steps of:
s1, providing at least one antenna substrate 1 and a circuit substrate 2, wherein an input antenna is arranged in the antenna substrate 1.
S2, forming a supporting piece 3 on the upper surface of the circuit substrate 2, and fixing the antenna substrate 1 above the circuit substrate 2 through the supporting piece 3.
S3, forming a film layer 4 on the upper surface and the side wall surface of the circuit substrate 2, extending the film layer 4 to the upper surface of the circuit substrate 2 along the side wall surface of the antenna substrate 1, and enclosing a closed cavity 5 between the film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2.
In order to further describe the method for manufacturing the antenna package structure according to some embodiments of the present invention in detail, the method for manufacturing the antenna package structure according to example 1 and example 2 provided by the present invention is specifically described below.
Fig. 8 is a schematic flow chart of a manufacturing method of the antenna package structure in embodiment 1 of the present invention, which specifically includes the steps of:
s11, providing a first antenna substrate 11, a second antenna substrate 12, a third antenna substrate 13, and a circuit board 2.
Specifically, the first antenna substrate 11 is provided with an input antenna having a frequency of 28G, the second antenna substrate 12 is provided with an input antenna having a frequency of 40G, and the third antenna substrate 13 is provided with an input antenna having a frequency of 60G.
And S21, soldering tin balls and/or core balls 31 and/or dispensing on the upper surface of the circuit substrate 2, and fixing the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 above the circuit substrate 2 through soldering the tin balls and/or the core balls 31 and/or dispensing.
Specifically, as shown in fig. 9 (a), the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 are fixed to the circuit substrate 2 by dispensing on the upper surface of the circuit substrate 2, and solder balls and/or core balls 31 having the same height as the cured glue 32 are welded to the upper surface of the circuit substrate 2 with respect to the two ends of each antenna substrate placed thereon, respectively, so that the surface planes of the antenna substrates are parallel to the surface of the circuit substrate 2. In other embodiments of the present invention, the antenna substrates and the circuit substrate may be adhered and fixed together by punching and dispensing on the antenna substrates.
More specifically, since the antenna cavity height is related to the input antenna frequency provided in the antenna substrate, attention is paid to the spacing between the antenna substrate and the wiring substrate 2 for each different antenna frequency. In the present embodiment, the height of the solder ball and/or the core ball 31 and/or the glue 32 between the first antenna substrate 11 and the circuit substrate 2 is controlled to be larger than the height of the solder ball and/or the core ball 31 and/or the glue 32 between the second antenna substrate 12 and the circuit substrate 2, and the height of the solder ball and/or the core ball 31 and/or the glue 32 between the second antenna substrate 12 and the circuit substrate 2 is controlled to be larger than the height of the solder ball and/or the core ball 31 and/or the glue 32 between the third antenna substrate 13 and the circuit substrate 2, i.e., the space formed between the first antenna substrate 11 and the circuit substrate 2 is larger than the space formed between the second antenna substrate 12 and the circuit substrate 2, and the space formed between the second antenna substrate 12 and the circuit substrate 2 is larger than the space formed between the third antenna substrate 13 and the circuit substrate 2.
And S31, forming a thin film layer 4 with the thickness of more than 40 mu m on the upper surfaces and the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 by using a film pressing process, wherein the thin film layer 4 extends to the upper surface of the circuit substrate 2 along the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13, and a closed cavity 5 is formed between the thin film layer 4 and the lower surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 and the upper surface of the circuit substrate 2 in a surrounding manner.
The material of the film layer 4 can be one or more organic polymer films formed by organic polymer materials such as ABF, epoxy resin and the like, the dielectric constant is less than 3.5, and the dielectric loss is less than 0.006, so as to reduce the loss of signal transmission.
Specifically, as shown in fig. 9 b, the film layer 4 forms a first sealed cavity 51 around the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, the film layer 4 forms a second sealed cavity 52 around the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, and the film layer 4 forms a third sealed cavity (not shown in the figure) around the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2. Of course, the first closed cavity 51 has a height greater than the second closed cavity 52, and the second closed cavity 52 has a height greater than the third closed cavity.
S41, flip-chip bonding the radio frequency chip 6 on the lower surface of the circuit substrate 2 by using a flip-chip bonding process.
The invention is not limited to a specific manufacturing process of packaging the rf chip 6 on the lower surface of the circuit substrate 2, and the rf chip 6 may be soldered to the lower surface of the circuit substrate 2 by a conventional flip chip process. Of course, the welding part of the radio frequency chip 6 and the circuit substrate 2 is also filled with underfill, so that the problem that the welding part of the radio frequency chip 6 and the circuit substrate 2 is broken due to thermal stress or mechanical impact is prevented, and the bonding force between the two is enhanced.
The metal solder balls 7 are soldered to the lower surface of the wiring substrate 2 as shown in fig. 9 (c).
In order to realize the transmission of the antenna packaging structure and external signals, the lower surface of the circuit substrate 2 is welded with a metal solder ball 7 for realizing electric connection with an external circuit.
S61, plastic packaging the upper surface of the film layer 4 and the uncovered upper and lower surfaces of the circuit substrate 2, as shown in FIG. 9 (d).
As shown in fig. 10, a flow chart of a manufacturing method of the antenna package structure in embodiment 2 of the present invention is different from the manufacturing method of the structure in embodiment 1 in that the method further includes the following steps before the film pressing process:
Sa, a plurality of beam convex points 9 with conical structures are manufactured on the upper surface of the antenna substrate 1 correspondingly provided with the input antenna, and the beam convex points 9 extend upwards along the antenna substrate.
The beam bump 9 of the conical structure may be injection-molded in the mold of the conical structure using a mold of the conical structure. Specifically, as shown in fig. 11 (a 1), a beam bump 9 having a conical structure is formed at each of the corresponding position of the input antenna having the 28G frequency on the upper surface of the first antenna substrate 11, the corresponding position of the input antenna having the 40G frequency on the upper surface of the second antenna substrate 12, and the corresponding position of the input antenna having the 60G frequency on the upper surface of the third antenna substrate 13.
For the convenience of process, the included angle between the conical surface and the bottom surface of the beam bump 9 forming a conical structure is usually smaller than 45 degrees, and the lens function is achieved. The manufacturing material of the beam bump 9 is an EMC material with high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin, the larger the dielectric constant of the manufacturing material of the beam bump 9 is, the higher the binding property of a material field is, and in order to further enhance Shu Boneng force of the beam bump 9, the specific manufacturing material of the beam bump 9 has the performance that the dielectric constant is more than 4 and the dielectric loss is less than 0.006.
The beam bump 9 is manufactured to form a conical lens, and the included angle between the conical surface and the bottom surface of the conical structure is smaller than 45 degrees, so that the antenna transmission signal can be focused and transmitted, and meanwhile, the loss of signal transmission can be reduced.
It can be understood that, because of the process manufacturing error, the vertex angle of the beam bump 9 is difficult to be made into a standard cone structure, and therefore, the structure that the vertex angle of the beam bump 9 is made into a rounded angle is also within the protection scope of the invention.
In other embodiments of the present invention, as shown in fig. 11 (a 2), a base 91 is further formed at the bottom of the beam bump 9, so as to enhance the stability of the beam bump 9 on the surface of the antenna substrate, and the base 91 and the beam bump 9 are integrally formed and made of the same material. The specific thickness of the base 91 is not limited herein, and may be designed according to practical application requirements.
And S32, forming a film layer 4 with the thickness of more than 40 mu m on the upper surfaces of the beam convex points 9, the upper surfaces and the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 which are not covered by the beam convex points 9 by utilizing a film pressing process, wherein the film layer 4 extends to the upper surface of the circuit substrate 2 along the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13, and a closed cavity 5 is formed between the film layer 4 and the lower surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 and the upper surface of the circuit substrate 2.
Similarly, the material of the thin film layer 4 can be an organic polymer film made of one or more of organic polymer materials such as ABF, epoxy resin and the like, and the dielectric constant is less than 3.5, and the dielectric loss is less than 0.006, so that the loss of signal transmission is reduced.
The film pressing process is described based on the structure in fig. 11 (a 1), as shown in fig. 11 (b), the film layer 4 forms a first sealed cavity 51 around the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, the film layer 4 forms a second sealed cavity 52 around the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, and the film layer 4 forms a third sealed cavity (not shown in the drawing) around the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2. Of course, the first closed cavity 51 has a height greater than the second closed cavity 52, and the second closed cavity 52 has a height greater than the third closed cavity.
The steps of other manufacturing methods are the same as those of the structure manufacturing method in embodiment 1, and are not repeated here, and the specific manufacturing process is shown in fig. 11 (a 1) to 11 (d).
In summary, the invention forms a thin film layer on the surface of the antenna substrate, and a closed cavity is defined between the thin film layer and the lower surface of the antenna substrate and the upper surface of the circuit substrate, so that the loss of signal transmission caused by filling of plastic packaging material between the circuit substrate and the antenna substrate is reduced, and meanwhile, the signal transmission cavity between the circuit substrate and the antenna substrate is prevented from being completely exposed in the air, thereby improving the reliability of the antenna packaging structure. In addition, a plurality of beam convex points are formed at the position where the antenna is arranged on the surface of the antenna substrate to emit, so that the directivity of the signal emission of the antenna substrate is enhanced, and the mutual interference of the signals emitted by different antennas is avoided.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
Claims (19)
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| DE102015226201A1 (en) * | 2015-12-21 | 2017-06-22 | Robert Bosch Gmbh | Electric circuit, method for producing an electrical circuit and body part for a vehicle |
| KR102025906B1 (en) * | 2017-12-06 | 2019-11-04 | 삼성전자주식회사 | Antenna module |
| WO2020077617A1 (en) * | 2018-10-19 | 2020-04-23 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
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| JP2007243448A (en) * | 2006-03-07 | 2007-09-20 | Toshiba Corp | Semiconductor module and method for manufacturing semiconductor module |
| CN105844325A (en) * | 2016-05-20 | 2016-08-10 | 厦门英诺尔信息科技有限公司 | Washable RFID tag and preparation method thereof |
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