CN115014684A - Device testing adjustment system, method, electronic device and storage medium - Google Patents

Abstract

The present application provides a device testing adjustment system, method, electronic device and storage medium, and relates to the technical field of terminal testing. The system includes a stress simulation device, an electronic device and a host computer, wherein the stress simulation device controls the electronic device to perform a simulated test based on the simulated test data input by the user; the electronic device determines the attitude data during the simulated test; the host computer is based on the attitude data and The simulated test data is simulated to determine the adjusted simulated test data; the stress simulation device controls the electronic device to perform the simulated test based on the adjusted simulated test data. Using the embodiments of the present application, the simulation parameters of the stress simulation device can be adjusted based on the attitude data during the test of the electronic device, so that the scene simulated by the stress simulation device meets the needs of the user, thereby improving the accuracy of the device test.

Description

Device testing adjustment system, method, electronic device and storage medium

technical field

The present application relates to the technical field of terminal testing, and in particular, to a device testing adjustment system, method, electronic device and storage medium.

Background technique

With the popularization of electronic devices, the application scenarios of electronic devices are becoming more and more complex. When used in different application scenarios, the stress generated by the electronic device (when the object is deformed due to external factors, the internal force that interacts between the various parts of the object) will directly affect the quality performance of the end product. For example, it can cause damage to electronic equipment or even malfunction. Generally, stress simulation equipment (such as drop test equipment, twist test equipment and other related equipment that can be used to simulate scenarios where electronic equipment will generate stress) can be used to simulate the use of electronic equipment according to application scenarios. Use simulation tests, so as to improve electronic equipment according to the simulation test results .

However, the stress simulation equipment is used for the simulation test based on the simulation test data input by the user. During the test process, the simulation test data will not be adjusted, and the simulation effect of the use of the stress simulation equipment itself cannot be corrected, so it cannot accurately simulate the user's desire. The required application scenarios may even lead to erroneous device test results.

SUMMARY OF THE INVENTION

In view of the above, it is necessary to provide an equipment test adjustment system, method, electronic equipment and storage medium, so as to determine the attitude data during the simulation test according to the electronic equipment, and adjust the simulation parameters of the stress simulation equipment based on the attitude data, so as to Make the scenarios simulated by the stress simulation equipment meet the needs of users, thereby improving the accuracy of the test.

In a first aspect, the present application provides a system for testing and adjusting equipment, the system includes a stress simulation device, an electronic device, and a host computer. The stress simulation device controls the electronic device to perform a simulation test based on simulation test data input by a user; the electronic device determines to perform a simulation test. Attitude data during the test; the host computer determines the adjusted simulation test data based on the attitude data and the simulation test data; the stress simulation device controls the electronic equipment to perform the simulation test based on the adjusted simulation test data.

Through the above technical solution, the actual test data for the simulated test based on the simulated test data input by the user can be determined based on the electronic device, and the adjusted simulated test data can be determined by the upper computer based on the simulated test data and the actual test data input by the user, and The control application simulation device performs simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the test accuracy.

In an implementation manner, the host computer determines the adjusted simulated test data based on the attitude data and the simulated test data, including: the host computer determines, based on the attitude data, the actual test data when the electronic device performs the simulated test; and the simulated test data to determine the adjusted simulated test data. Through the above technical solution, the accuracy and efficiency of calculating actual test data can be improved by using the powerful computing capability of the host computer.

In an implementation manner, after the electronic device establishes communication with the upper computer, the electronic device sends the attitude data to the upper computer. Through the above technical solution, the upper computer can be made to acquire status data.

In one implementation, the host computer determines the adjusted simulated test data based on the attitude data and the simulated test data, including: the electronic device determines the actual test data when the electronic device performs the simulated test based on the attitude data; the host computer based on the actual test data and the simulated test data to determine the adjusted simulated test data. Through the above technical solution, the test information (actual test data) in the simulated stress scenario can be directly viewed in the electronic device, such as the drop posture, the drop angle and/or the drop time, etc., which facilitates the user to the actual test data of the electronic device acquisition.

In an implementation manner, after the electronic device establishes communication with the upper computer, the electronic device sends the actual test data to the upper computer. Through the above technical solution, the upper computer can obtain actual test data.

In an implementation manner, the electronic device determining the attitude data when performing the simulation test includes: the electronic device judging whether a trigger condition is met; if the trigger condition is met, the electronic device turns on a preset sensor; based on the data collected by the preset sensor, The electronic device determines attitude data for the simulation test. Through the above technical solution, it can be avoided that the electronic device determines the attitude data during the simulation test in an unnecessary situation, which causes unnecessary power consumption and reduces the energy consumption.

In an implementation manner, after the upper computer establishes communication with the stress simulation device, the upper computer sends the adjusted simulation test data to the stress simulation device. Through the above technical solution, the stress simulation device can obtain the adjusted simulation test data.

In a second aspect, the present application provides an equipment test adjustment system, the system includes a stress simulation device and an electronic device, and the stress simulation device controls the electronic device to perform a simulation test based on simulation test data input by a user; Attitude data; the stress simulation device determines the adjusted simulation test data based on the attitude data and the simulation test data; the stress simulation device controls the electronic device to perform the simulation test based on the adjusted simulation test data.

Through the above technical solution, the actual test data for the simulation test based on the simulation test data input by the user can be determined based on the electronic device, and the adjusted simulation test data can be determined based on the simulation test data and the actual test data input by the user by applying the simulation device, Then, the application simulation device is controlled to perform a simulation test based on the adjusted simulation test data, and the use simulation effect of the application simulation device itself is corrected, and the application scenario desired by the user can be accurately simulated, thereby improving the test accuracy.

In an implementation manner, determining the adjusted simulation test data based on the attitude data and the simulation test data by the stress simulation device includes: the stress simulation device determines, based on the attitude data, the actual test data when the electronic device performs the simulation test; the stress simulation device is based on the attitude data. Actual test data and simulated test data to determine the adjusted simulated test data. Through the above technical solutions, the accuracy and efficiency of calculating actual test data can be improved.

In an implementation manner, the stress simulation device determines the adjusted simulation test data based on the attitude data and the simulation test data, including: the electronic device determines the actual test data when the electronic device performs the simulation test based on the attitude data; the stress simulation device is based on the actual test data. Test data and mock test data to determine adjusted mock test data. Through the above technical solution, the test information (actual test data) in the simulated stress scenario can be directly viewed in the electronic device, such as the drop posture, the drop angle and/or the drop time, etc., which facilitates the user to the actual test data of the electronic device acquisition.

In an implementation manner, the electronic device determining the attitude data when performing the simulation test includes: the electronic device judging whether a trigger condition is met; if the trigger condition is met, the electronic device turns on a preset sensor; based on the data collected by the preset sensor, The electronic device determines attitude data for the simulation test. Through the above technical solution, it can be avoided that the electronic device determines the attitude data during the simulation test in an unnecessary situation, which causes unnecessary power consumption and reduces the energy consumption.

In a third aspect, an embodiment of the present application provides a device test adjustment method, which is applied to a stress simulation device. The method includes: controlling an electronic device to perform a simulation test based on simulation test data input by a user; after establishing communication with a host computer, from the host computer Obtain the adjusted simulation test data; control the electronic equipment to perform the simulation test according to the adjusted simulation test data; wherein, the adjusted simulation test data is determined by the attitude data and the simulation test data when the host computer performs the simulation test based on the electronic equipment .

In the above technical scheme, the actual test data for the simulation test based on the simulation test data input by the user is determined by the electronic equipment tested, and the adjusted simulation test data is determined according to the simulation test data and the actual test data input by the user, and then the application simulation is controlled. The device performs a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the accuracy of the test.

In a fourth aspect, an embodiment of the present application provides a device test adjustment method, which is applied to a stress simulation device. The method includes: controlling an electronic device to perform a simulation test based on simulation test data input by a user; after establishing communication with the electronic device, from the electronic device , obtain the attitude data of the electronic equipment during the simulation test; determine the adjusted simulation test data based on the attitude data and the simulation test data; control the electronic equipment to perform the simulation test according to the adjusted simulation test data.

In the above technical scheme, the actual test data for the simulation test based on the simulation test data input by the user is determined by the electronic equipment tested, and the adjusted simulation test data is determined according to the simulation test data and the actual test data input by the user, and then the application simulation is controlled. The device performs a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the accuracy of the test.

In a fifth aspect, an embodiment of the present application provides an electronic device, the electronic device includes a memory and a processor; wherein the memory is used to store program instructions; the processor is used to read the program instructions stored in the memory, so as to realize the The above-mentioned equipment test adjustment method.

In a sixth aspect, an embodiment of the present application provides a computer-readable storage medium, where computer-readable instructions are stored in the computer-readable storage medium, and when the computer-readable instructions are executed by a processor, the above-mentioned device testing adjustment method is implemented.

In addition, for the technical effects brought about by the fifth aspect and the sixth aspect, reference may be made to the descriptions related to the designed methods in the above method section, which will not be repeated here.

Description of drawings

FIG. 1 is a schematic diagram of a scenario of a device test adjustment method provided by an embodiment of the present application.

FIG. 2 is a schematic diagram of a device testing and adjustment system provided by an embodiment of the present application.

FIG. 3 is a schematic diagram of a device testing and adjustment system provided by another embodiment of the present application.

FIG. 4 is a schematic diagram of a device testing and adjustment system according to another embodiment of the present application.

FIG. 5 is a schematic diagram of a device testing and adjustment system provided by another embodiment of the present application.

FIG. 6 is a schematic diagram of a scenario of a device test adjustment method provided by another embodiment of the present application.

FIG. 7 is a schematic diagram of a device testing and adjustment system provided by an embodiment of the present application.

FIG. 8 is a schematic diagram of a device testing and adjustment system according to another embodiment of the present application.

FIG. 9 is a flowchart of a device test adjustment method provided by an embodiment of the present application.

FIG. 10 is a flowchart of a device test adjustment method provided by another embodiment of the present application.

FIG. 11 is a flowchart of a device test adjustment method provided by another embodiment of the present application.

FIG. 12 is a flowchart of a device test adjustment method provided by another embodiment of the present application.

FIG. 13 is a schematic structural diagram of an electronic device provided by an embodiment of the application.

Detailed ways

Hereinafter, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the embodiments of the present application, words such as "exemplary", "or", "for example" and the like are used to represent examples, illustrations or illustrations. Any embodiment or design described in the embodiments of the present application as "exemplary" or "such as" should not be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary," "or," "eg," and the like is intended to present the related concepts in a specific manner.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field in this application. Terms used in the specification of the present application are for the purpose of describing specific embodiments only, and are not intended to limit the present application. It should be understood that unless otherwise specified in this application, "/" means or means. For example, A/B can mean A or B. In this application, "and/or" is only an association relationship to describe associated objects, which means that there can be three kinds of relationships. For example, A and/or B can mean that A exists alone, A and B exist at the same time, and B exists alone. "At least one" means one or more, and "plurality" means two or more. For example, at least one of a, b or c can represent: a, b, c, a and b, a and c, b and c, a, b and c seven situations.

With the popularization of electronic devices, the application scenarios of electronic devices are becoming more and more complex, and electronic devices may generate stress in some application scenarios. Stress refers to the internal force that interacts between the various parts of the object when the object is deformed due to external factors, such as drop stress, torsional stress, etc., of which the drop stress is the stress generated by the electronic device in the drop scene, and the torsional stress is the electronic device. Stresses in a twisted scene. Due to the existence of multiple components in electronic equipment, such as display modules, battery modules, sensor modules, etc., the stress generated by electronic equipment will cause deformation of components in electronic equipment, which will directly affect the quality performance of end products, such as Causes damage to electronic equipment, or even can not be used normally. For example, in a fall scenario of an electronic device, the electronic device is dropped from the air to the landing site, and the stress generated after the electronic device collides with the landing site may cause the electronic device to be damaged. For another example, in a twisted scene of an electronic device, the stress generated by the distortion of the electronic device by an external force may cause the screen of the electronic device to be damaged, or cause some components in the electronic device to deviate from their original positions.

Usually, stress simulation equipment can be used to simulate the use of electronic equipment according to the application scenario, so as to improve the electronic equipment according to the simulation test results, such as adjusting the arrangement of components in the electronic equipment, and adjusting the installation method of the components in the electronic equipment. Stress simulation equipment is used to simulate stress scenarios where electronic equipment will generate stress. For example, a drop test equipment can be used to simulate a drop scenario where electronic equipment will generate drop stress, and a twist test equipment can be used to simulate a twisted scene where electronic equipment will generate distorting stress.

However, the stress simulation equipment is used for the simulation test based on the simulation test data input by the user. During the test process, the simulation test data will not be adjusted, and the simulation effect of the use of the stress simulation equipment itself cannot be corrected, so it cannot accurately simulate the user's desire. The required application scenarios may even lead to erroneous device test results.

For example, a user uses a drop test device to simulate a drop scenario in which an electronic device will generate drop stress. The simulated test data input by the user is: a drop angle of 45° and 30 drops. During the test process, the drop test equipment will not adjust the simulated test data, and the simulation effect of the equipment itself cannot be corrected. The drop angle is 47°, the drop test equipment will not correct the simulated test data during the test, and will drop 30 times according to the simulated drop angle of 47°, and the drop scene required by the user is the drop angle of 45°, which is simulated by the drop test equipment. The drop angle is inconsistent with the drop angle that the user needs to test, so the test results obtained may be different from the actual results.

For another example, a user uses a twist test device to simulate a twist scene in which an electronic device generates twist stress, and the simulated test data input by the user is: torque 2N·m, 15 times each of positive and negative twists. During the test process, the distortion test equipment will not adjust the simulated test data, and the simulation effect of the equipment itself cannot be corrected. The twist is 1.7N·m. The twist test equipment will not correct the twist test data during the test process. It will twist 15 times forward and reverse according to the simulated torque of 1.7N·m. The twist scene required by the user is the torque of 2N·m. The torque simulated by the torsion test equipment is inconsistent with the torque that the user needs to test, so the test results obtained may be inaccurate with the actual results.

In order to solve the technical problems that the stress simulation equipment will not adjust the simulated test data during the above equipment testing process, the use simulation effect of the equipment itself cannot be corrected, and the application scenarios desired by users cannot be accurately simulated, the embodiments of the present application provide a The equipment test adjustment method adjusts the simulation parameters of the stress simulation equipment based on the attitude data determined by the electronic equipment during the simulation test, so as to make the scene simulated by the stress simulation equipment meet the needs of the user, thereby improving the performance. test accuracy.

Referring to FIG. 1 , it is a schematic diagram of a scenario of a device testing adjustment method provided by an embodiment of the present application. The stress simulation device 11 performs a simulated test on the electronic device 12 based on the simulated test data input by the user, the electronic device 12 determines the actual test data based on the built-in sensor, and sends the determined actual test data to the upper computer 13, and the upper computer 13 is based on the user input. The simulated test data and the actual test data are obtained, the adjusted simulated test data is determined, and the adjusted simulated test data is sent to the stress simulation device 11, so that the stress simulation device 11 performs the electronic device 12 based on the adjusted simulated test data. Mock test. Wherein, the stress simulation equipment 11 may include a drop simulation test equipment, a twist simulation test equipment, etc.; the electronic equipment 12 may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, a super mobile personal computer ( ultra-mobile personal computer, UMPC), netbooks, as well as cellular phones, personal digital assistant (PDA), augmented reality (AR) devices, virtual reality (VR) devices, artificial intelligence (artificial intelligence, AI) equipment, wearable equipment, in-vehicle equipment, smart home equipment and/or smart city equipment; the host computer 13 refers to a computer that can directly issue control commands, and can include a personal computer (Personal Computer, PC), a host computer (host computer) /master computer) etc.

Through the above-mentioned equipment test adjustment method, the actual test data for the simulated test based on the simulated test data input by the user can be determined based on the electronic equipment being tested; and the adjusted simulated test data can be determined according to the simulated test data and the actual test data input by the user. Data, and then control the application simulation device to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the accuracy of the test.

The above-mentioned equipment testing adjustment method can be applied to the equipment testing adjustment system as shown in FIG. 2 . Referring to FIG. 2 , which is a schematic diagram of a device testing and adjustment system provided in an embodiment of the present application, the device testing and adjustment system may include a stress simulation device 11 , an electronic device 12 and a host computer 13 .

The stress simulation device 11 includes a control module 111 and an execution module 112. The control module 111 is used to receive simulation test data input by the user, and control the execution module 112 to perform simulation tests based on the simulation test data input by the user; the execution module 112 is used to perform simulation tests based on the user input. The input simulation test data performs a simulation test on the electronic device 12 . The execution module 112 may include mechanical components, such as a carrying portion, where the carrying portion is used to fix the electronic device 12 . Based on the movement of the carrying portion, a scenario in which the electronic device 12 generates stress is simulated, so that the electronic device 12 generates stress. The movement of the carrying portion may include up and down movement, left and right movement, clockwise inversion, counterclockwise inversion, or plane rotation, and the like. Based on this, it can be understood that after the carrying portion is fixed to the electronic device 12 , the electronic device 12 is driven to move in the same manner as the carrying portion, thereby simulating a scenario in which the electronic device 12 generates stress. The structure of the carrying portion may include suction cups, robotic arms or clips, and the like.

The electronic device 12 includes a sensor module 121 and a communication module 122 . The sensor module 121 is used to collect attitude data of the electronic device 12 during the simulation test. The sensor module 121 may include one or more sensors, and the sensors may be used to identify the attitude of the electronic device 12 and obtain the attitude data of the electronic device 12. For example, an acceleration sensor and a gyroscope sensor, wherein the acceleration sensor can detect the acceleration of the electronic device 12 in various directions (generally three axes), and can also be used to identify the attitude of the electronic device 12; the gyroscope sensor can be used to determine the electronic device. The motion attitude of the electronic device 12, in some embodiments of the present application, the angular velocity of the electronic device 12 around three axes (ie, x, y and z axes) may be determined by a gyro sensor. The communication module 122 is used to send the real test data collected by the sensor module 121 when the electronic device 12 performs a simulated test to the upper computer 13 . The communication module 122 may include a wired communication module and/or a wireless communication module, wherein the wired communication module may include a Universal Serial Bus (Universal Serial Bus, USB) interface; the wireless communication module may include a wireless communication technology (Wireless Fidelity, Wi-Fi) ) module, a Bluetooth (BT) module, and a mobile communication (Mobile communication) module. The mobile communication module can provide a wireless communication solution including 2G/3G/4G/5G and the like applied on the electronic device 12 .

The host computer 13 includes a communication module 131 , an attitude calculation module 132 and a data adjustment module 133 . The communication module 131 is configured to receive the posture data of the electronic device 12 during the simulation test sent by the electronic device 12 . The communication module 131 is mainly used to realize the communication between multiple devices (for example, the stress simulation device 11 and the electronic device 12 ). Data interaction. For the specific structure of the communication module 131, reference may be made to the relevant description of the communication module 122, which will not be repeated here. The attitude calculation module 132 is configured to determine actual test data corresponding to the electronic device 12 during the simulated test based on the attitude data of the electronic device 12 during the simulated test. For example, the attitude calculation module 132 may convert the attitude data of the electronic device 12 during the simulated test into actual test data corresponding to the electronic device 12 during the simulated test based on a preset conversion relationship. For the specific working principle of the attitude calculation module 132, reference may be made to the relevant descriptions in the following sections 801-807. The data adjustment module 133 is configured to determine the adjusted simulation test data based on the simulation test data and the actual test data input by the user, and the adjusted simulation test data is used to control the stress simulation device 11 to perform the simulation test. For example, the communication module 131 may send the adjusted simulation test data determined by the data adjustment module 133 to the stress simulation device 11, so that the control module 111 of the stress simulation device 11 controls the execution module 112 to perform a test on the electronic device based on the adjusted simulation test data. 12 Do a mock test.

The above-mentioned equipment test adjustment system as shown in Figure 2 can be determined based on the electronic equipment to determine the actual test data of the simulated test based on the simulated test data input by the user, and determine the adjustment based on the simulated test data and the actual test data input by the user by the host computer. After the simulation test data is obtained, the application simulation device is then controlled to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the accuracy of the test. Rate. At the same time, setting the attitude calculation module 132 in the host computer 13 can improve the accuracy and efficiency of calculating the actual test data by using the powerful computing capability of the host computer 13 .

In another embodiment of the present application, the equipment testing adjustment system may be as shown in FIG. 3 . The stress simulation device 11 includes a control module 311 and an execution module 312 . The electronic device 12 includes a sensor module 321, an attitude calculation module 322 and a communication module 323. The attitude calculation module 322 is used to determine the electronic equipment during the simulation test according to the attitude data collected by the sensor module 321 during the simulation test of the electronic device 12. 12 corresponds to the actual test data, and the communication module 323 is used to send the determined actual test data to the upper computer 13 . The upper computer 13 includes a communication module 331 and a data adjustment module 332 . The communication module 331 is configured to receive the actual test data sent by the electronic device 12, and the data adjustment module 332 is configured to determine the adjusted simulated test data based on the simulated test data and the actual test data input by the user. The communication module 331 may send the adjusted simulation test data determined by the communication module 331 to the stress simulation device 11, so that the control module 311 of the stress simulation device 11 controls the execution module 312 to simulate the electronic device 12 based on the adjusted simulation test data. test.

Among them, the relevant descriptions of the control module 311, the execution module 312, the sensor module 321, the attitude calculation module 322, the communication module 323, the communication module 331 and the data adjustment module 332 can be found in the above content for the control module 111, execution module 112, The related descriptions of the sensor module 121 , the communication module 122 , the communication module 131 , the attitude calculation module 132 and the data adjustment module 133 will not be repeated here.

For the equipment testing and adjustment system shown in Figure 3 above, by arranging the attitude calculation module in the electronic equipment, the test information (actual test data) under the simulated stress scenario can be directly viewed in the electronic equipment, such as drop attitude, drop The angle and/or the drop time, etc., facilitate the user to obtain the actual test data of the electronic device.

In another embodiment of the present application, the equipment testing adjustment system may be as shown in FIG. 4 . The stress simulation device 11 includes a control module 411 and an execution module 412 . The electronic device 12 includes a trigger module 421, a sensor module 422 and a communication module 423. The trigger module 421 is used to determine whether the current state of the electronic device 12 satisfies the preset sensor activation conditions. If the current state of the electronic device 12 satisfies the preset sensor activation conditions Starting condition, the sensor module 422 is notified to collect attitude data of the electronic device 12 during the simulation test. If the current state of the electronic device 12 does not meet the preset sensor starting condition, no action may be performed. For the specific introduction of the preset sensor activation conditions, please refer to the relevant descriptions in the following sections 801-807. The host computer 13 includes a communication module 431 , an attitude calculation module 432 and a data adjustment module 433 .

Among them, for the relevant description of the control module 411, the execution module 412, the sensor module 422, the communication module 423, the communication module 431, the attitude calculation module 432 and the data adjustment module 433, please refer to the above content for the control module 111, execution module 112, The related descriptions of the sensor module 121 , the communication module 122 , the communication module 131 , the attitude calculation module 132 and the data adjustment module 133 will not be repeated here.

As shown in the above-mentioned equipment test adjustment system shown in FIG. 4 , by setting the trigger module in the electronic equipment, it can avoid the electronic equipment from determining the attitude data during the simulation test in an unnecessary situation, resulting in unnecessary power consumption and reducing the power consumption. loss of energy.

In another embodiment of the present application, the equipment testing adjustment system may be as shown in FIG. 5 . The stress simulation device 11 includes a control module 511 and an execution module 512 . The electronic device 12 includes a trigger module 521, a sensor module 522, an attitude calculation module 523 and a communication module 524. The trigger module 521 is used to determine whether the current state of the electronic device 12 satisfies the preset sensor activation conditions. If the state meets the preset sensor activation conditions, the sensor module 522 is notified to collect attitude data of the electronic device 12 during the simulation test. If the current state of the electronic device 12 does not meet the preset sensor activation conditions, no action may be performed. The upper computer 13 includes a communication module 531 and a data adjustment module 532 .

Among them, for the description of the control module 511, the execution module 512, the transmission trigger module 521, the sensor module 522, the attitude calculation module 523, the communication module 524, the communication module 531 and the data adjustment module 532, please refer to the above content for the control module 311 , the execution module 312 , the sensor module 321 , the attitude calculation module 322 , the communication module 323 , the communication module 331 and the data adjustment module 332 , which are not repeated here.

The above-mentioned equipment test adjustment system shown in FIG. 5, by setting the trigger module in the electronic equipment, can avoid the electronic equipment to determine the attitude data when the simulation test is not required in an unnecessary situation, resulting in unnecessary power consumption, reducing loss of energy. At the same time, the attitude calculation module is set in the electronic device, and the test information (actual test data) under the simulated stress scenario can be directly viewed in the electronic device, such as the falling attitude, the falling angle and/or the falling time, etc., which is convenient The user obtains the actual test data of the electronic device.

As shown in FIG. 6 , FIG. 6 is a schematic scene diagram of a device testing adjustment method provided by another embodiment of the present application. The stress simulation device 11 performs a simulation test on the electronic device 12 based on the simulation test data input by the user, the electronic device 12 determines the actual test data based on the built-in sensor, and sends the determined actual test data to the stress simulation device 11, and the stress simulation device 11 is based on the The simulated test data and the actual test data input by the user determine the adjusted simulated test data, and perform a simulated test on the electronic device 12 based on the adjusted simulated test data.

The above-mentioned equipment test adjustment method as shown in Figure 6 can be based on the electronic equipment tested, to determine the actual test data of the simulated test based on the simulated test data input by the user; and according to the simulated test data and the actual test data input by the user, determine the adjustment After the simulation test data is obtained, the application simulation device is then controlled to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the accuracy of the test. Rate.

As shown in FIG. 7 , the device testing and adjustment system may include a stress simulation device 11 and an electronic device 12 , wherein the stress simulation device 11 includes a control module 611 , an execution module 612 , a communication module 613 , an attitude calculation module 614 and a data adjustment module 615 . The control module 611 is configured to receive the simulation test data input by the user, and control the execution module 612 to perform a simulation test based on the simulation test data input by the user; the execution module 612 is used to perform a simulation test on the electronic device 12 based on the simulation test data input by the user. The execution module 612 may include mechanical components, such as a carrying portion, where the carrying portion is used to fix the electronic device 12 . Based on the movement of the carrying portion, a scenario in which the electronic device 12 generates stress is simulated, so that the electronic device 12 generates stress. The movement of the carrying portion may include up and down movement, left and right movement, clockwise inversion, counterclockwise inversion, or plane rotation, and the like. Based on this, it can be understood that after the carrying portion is fixed to the electronic device 12 , the electronic device 12 is driven to move in the same manner as the carrying portion, thereby simulating a scenario in which the electronic device 12 generates stress. The structure of the carrying portion may include suction cups, robotic arms or clips, and the like. The communication module 613 is configured to receive the posture data of the electronic device 12 during the simulation test sent by the electronic device 12 . For the specific structure of the communication module 613, reference may be made to the relevant description of the communication module 122, which will not be repeated here. The attitude calculation module 614 is configured to determine actual test data corresponding to the electronic device 12 during the simulated test based on the attitude data of the electronic device 12 during the simulated test. For example, the attitude calculation module 614 may convert the attitude data of the electronic device 12 during the simulated test into actual test data corresponding to the electronic device 12 during the simulated test based on a preset conversion relationship. For the specific working principle of the attitude calculation module 614, reference may be made to the relevant descriptions in the following sections 801-807. The data adjustment module 615 is configured to determine the adjusted simulation test data based on the simulation test data and the actual test data input by the user, and the adjusted simulation test data is used to control the stress simulation device 11 to perform the simulation test. For example, the adjusted simulation test data determined by the data adjustment module 615 may be transmitted to the control module 611, so that the control module 611 controls the execution module 612 to perform a simulation test on the electronic device 12 based on the adjusted simulation test data.

The electronic device 12 includes a sensor module 621 and a communication module 622 . The sensor module 621 is used to collect attitude data of the electronic device 12 during the simulation test. The sensor module 621 may include one or more sensors, and the sensors may be used to identify the attitude of the electronic device 12 and obtain the attitude data of the electronic device 12. For example, an acceleration sensor and a gyroscope sensor, wherein the acceleration sensor can detect the acceleration of the electronic device 12 in various directions (generally three axes), and can also be used to identify the attitude of the electronic device 12; the gyroscope sensor can be used to determine the electronic device. The motion attitude of the electronic device 12, in some embodiments of the present application, the angular velocity of the electronic device 12 around three axes (ie, x, y and z axes) may be determined by a gyro sensor. The communication module 622 is configured to send the real test data collected by the sensor module 121 when the electronic device 12 performs a simulation test to the stress simulation device 11 . The communication module 622 may include a wired communication module and/or a wireless communication module, wherein the wired communication module may include a Universal Serial Bus (Universal Serial Bus, USB) interface; the wireless communication module may include a wireless communication technology (Wireless Fidelity, Wi-Fi) ) module, a Bluetooth (BT) module, and a mobile communication (Mobile communication) module. The mobile communication module can provide a wireless communication solution including 2G/3G/4G/5G and the like applied on the electronic device 12 .

The above-mentioned equipment testing adjustment system as shown in Figure 7 can be based on the electronic equipment to determine the actual test data for the simulated test based on the simulated test data input by the user, and by applying the simulated equipment based on the simulated test data and the actual test data input by the user, determine The adjusted simulation test data, and then control the application simulation device to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario that the user wants, thereby improving the test accuracy. Accuracy. At the same time, setting the attitude calculation module in the stress simulation equipment can improve the accuracy and efficiency of calculating the actual test data.

In another embodiment of the present application, the device test adjustment system may be as shown in FIG. 8 . The stress simulation device 11 includes a control module 711 , an execution module 712 , a communication module 713 and a data adjustment module 714 . The electronic device 12 includes a sensor module 721, an attitude calculation module 722 and a communication module 723. The attitude calculation module 722 is used to determine the electronic equipment during the simulation test according to the attitude data collected by the sensor module 721 during the simulation test of the electronic device 12. 12 corresponds to the actual test data, and the communication module 723 is configured to send the determined actual test data to the stress simulation device 11 . The communication module 713 is used for receiving actual test data sent by the electronic device 12 . The data adjustment module 714 is configured to determine the adjusted simulated test data based on the actual test data sent by the electronic device 12 and the simulated test data input by the user. The adjusted simulation test data determined by the data adjustment module 714 may be transmitted to the control module 711, so that the control module 711 controls the execution module 712 to perform a simulation test on the electronic device 12 based on the adjusted simulation test data.

Among them, for the relevant description of the control module 711, the execution module 712, the communication module 713, the data adjustment module 714, the sensor module 721, the attitude calculation module 722 and the communication module 723, please refer to the above content for the control module 611, execution module 612, The related descriptions of the communication module 613 , the attitude calculation module 614 , the data adjustment module 615 , the sensor module 621 and the communication module 622 will not be repeated here.

For the equipment testing and adjustment system shown in Figure 8 above, by arranging the attitude calculation module in the electronic equipment, the test information (actual test data) under the simulated stress scenario can be directly viewed in the electronic equipment, such as the falling attitude, falling The angle and/or the drop time, etc., facilitate the user to obtain the actual test data of the electronic device.

In other embodiments of the present application, as shown in FIG. 7 , the electronic device 12 may further include a trigger module, or as in the device test and adjustment system shown in FIG. 8 , the electronic device 12 may further include a trigger module . The trigger module is used to determine whether the current state of the electronic device 12 satisfies the preset sensor activation condition, and if the current state of the electronic device 12 satisfies the preset sensor activation condition, the sensor module 621 (sensor module 721 ) is notified to collect the electronic device 12 for simulation. For the attitude data during the test, if the current state of the electronic device 12 does not meet the preset sensor activation conditions, no action may be performed. For the specific introduction of the preset sensor activation conditions, please refer to the relevant descriptions in the following sections 801-807.

The above-mentioned equipment test adjustment system, by setting the trigger module in the electronic equipment, can avoid the situation that the electronic equipment determines the attitude data during the simulation test in an unnecessary situation, which causes unnecessary power consumption and reduces energy. loss.

Referring to FIG. 9 , it is a flowchart of a device test adjustment method provided by an embodiment of the present application. The method can be applied to any stress simulation device, electronic device and upper computer as shown in FIG. 1 to FIG. 8 .

801. The stress simulation device controls the electronic device to perform a simulation test based on the simulation test data input by the user.

In some embodiments of the present application, the stress simulation device may include a control module and an execution module, where the control module is configured to receive simulation test data input by a user, and control the execution module to perform a simulation test based on the simulation test data input by the user. Exemplarily, the user may input simulated test data on the stress simulation device, or input simulated test data on the host computer that controls the stress simulation device. The execution module is used to perform a simulated test on the electronic device based on the simulated test data input by the user. Wherein, the execution module may include a mechanical part, such as a carrying part, and the carrying part is used for fixing the electronic device. Based on the movement of the carrying portion, a scenario in which the electronic device is stressed is simulated, so that the electronic device is stressed. The movement of the carrying portion may include up and down movement, left and right movement, clockwise inversion, counterclockwise inversion, or plane rotation, and the like. Based on this, it can be understood that after the carrying portion and the electronic device are fixed, the electronic device is driven to move in the same manner as the carrying portion, thereby simulating a scenario where the electronic device generates stress and causing the electronic device to generate stress. The structure of the carrying portion may include suction cups, robotic arms or clips, and the like.

In some embodiments of the present application, the stress simulation device determines an execution action based on a preset test data conversion table and simulation test data input by a user, and controls the electronic device to perform a simulation test based on the execution action.

The preset test data conversion table may include a drop test data conversion report and a twist test data conversion report. Among them, the drop test data conversion report can include the mapping relationship between the drop angle and the execution action of the execution module, the mapping relationship between the drop height and the execution action of the execution module, etc.; the twist test data conversion report can include the torque and execution module. Mapping relationships between execution actions, etc. According to the preset test data conversion table, it can be determined that the stress simulation device needs to simulate the stress scene corresponding to the simulated test data input by the user, and the execution action to be realized.

Based on the preset test data conversion table, it is possible to quickly determine the execution actions that the stress simulation device needs to perform according to the simulation test data input by the user, thereby speeding up the simulation of the stress scene of the electronic device required by the user to generate stress, and improving the equipment testing efficiency. efficiency.

802. The electronic device determines attitude data when it performs the simulation test.

The electronic device includes sensors, and the electronic device can determine its own posture data during the simulation test based on the sensors. Sensors can be used to identify the posture of electronic devices and obtain posture data of electronic devices, such as acceleration sensors and gyroscope sensors. Among them, acceleration sensors can detect the acceleration of electronic devices in various directions (generally three axes), and can also be used for Identify the posture of the electronic device; the gyro sensor can be used to determine the motion posture of the electronic device, in some embodiments of the present application, the electronic device can be determined around three axes (ie, x, y and z axes) by the gyro sensor angular velocity.

In some embodiments of the present application, the data collection conditions may be preset, and if the data collection conditions are met, the attitude data of the self during the simulation test is collected. For example, turn on the preset sensor on the electronic device, and collect the attitude data of the electronic device when it is to be tested. The data collection condition may include that the user turns on a certain function on the electronic device, such as a test function. By setting the data collection conditions, it is possible to avoid data collection in unneeded scenarios, resulting in unnecessary power consumption and reducing energy consumption.

803 , the electronic device sends the attitude data when the electronic device performs the simulation test to the upper computer.

In some embodiments of the present application, the electronic device and the upper computer include a communication module, and based on the communication module, the communication between the electronic device and the upper computer can be realized. The communication module may include a wired communication module and/or a wireless communication module, wherein the wired communication module may include a Universal Serial Bus (Universal Serial Bus, USB) interface; the wireless communication module may include a wireless communication technology (Wireless Fidelity, Wi- Fi) module, Bluetooth (Bluetooth, BT) module, mobile communication (Mobile communication) module, the mobile communication module can provide solutions including 2G/3G/4G/5G wireless communication applied on electronic devices and/or upper computers.

804, the upper computer determines actual test data when the electronic device performs the simulation test based on the attitude data when the electronic device performs the simulation test.

Exemplarily, the host computer may perform attitude calculation on the attitude data of the electronic device during the simulation test based on the attitude calculation method, and determine the actual measurement data when the electronic device performs the simulation test. The attitude calculation method is used to convert the collected state data into coordinates in a preset coordinate system, and realize the conversion of data in different coordinate systems, such as converting the state data from the value in one coordinate system to the corresponding value in another coordinate system. The value of , which can include Euler angle method, cosine function method, quaternion method, etc. The Euler angle method can be used to describe the positional relationship between the moving coordinate system (a coordinate system fixed on other reference bodies moving relative to the earth) relative to the reference coordinate system with a set of Euler angles, such as using the navigation system to The three rotation angles of the carrier system (heading angle ψ\psiψ, pitch angle θ\thetaθ, roll angle γ\gammaγ) are represented, and the attitude data during the simulation test of the electronic equipment is calculated according to the three rotation angles, and the electronic equipment is obtained. The coordinates of the device relative to the reference coordinate system during the simulation test. The reference coordinate system can be set according to the stress simulation equipment, which is not limited here. The cosine function method may include a directional cosine matrix method. The direction cosine matrix method is a method of representing the attitude matrix by the direction cosine of the vector, and the relationship between the two coordinate systems rotating around the fixed point can be represented by the direction cosine matrix. It should be understood that the attitude calculation method described above is only for illustration, and does not constitute a limitation on the attitude calculation method. Other existing attitude calculation methods can also be used to simulate electronic equipment according to different application scenarios. The attitude data during the test is used for attitude calculation.

In some embodiments of the present application, the host computer determines the coordinate data relative to a preset reference coordinate system when the simulation test is performed based on the electronic device based on the attitude data of the electronic device, and determines the electronic device based on the coordinate data. The actual test data when the device is subjected to a simulation test. Actual test data when the electronic device performs the simulation test may be determined based on the test content corresponding to the stress simulation device and the coordinate data. The test content may include test types, such as drop test, twist test. According to different test contents, determine the actual test data of the electronic equipment during the simulation test. For example, the test content corresponding to the stress simulation device is a drop test, and based on the coordinate data, the actual test drop angle when the electronic device performs the simulation test is determined; for another example, the test content corresponding to the stress simulation device is a twist test, based on the coordinates data to determine the actual test torque when the electronic equipment is subjected to a simulated test.

Coordinate conversion tables corresponding to different test contents can be preset. The coordinate conversion table includes the mapping relationship between the coordinate data of the electronic device relative to the preset reference coordinate system and the test data in each test content, such as a coordinate conversion table corresponding to the drop test. The coordinate data corresponds to a drop angle, and in the coordinate conversion table corresponding to the twist test, a coordinate data corresponds to a torque, and the mapping relationship can be set according to the actual situation, which is not limited here.

For example, according to the coordinate conversion table corresponding to the drop test, the actual test drop angle corresponding to the coordinate data of the electronic device relative to the preset reference coordinate system can be determined; for another example, according to the coordinate conversion table corresponding to the twist test, it can be determined that the electronic device is relatively The actual test torque corresponding to the coordinate data of the preset reference coordinate system.

In some embodiments of the present application, the host computer determines the actual test data when the electronic device performs the simulation test based on the attitude data when the electronic device performs the simulation test may include:

The host computer performs data processing on the attitude data when the electronic device performs a simulated test to obtain test attitude data, and determines the actual test data when the electronic device performs a simulated test based on the test attitude data.

The data processing may include abnormal data processing and rejection. For example, in a drop test, state data corresponding to the electronic device before being dropped and/or state data corresponding to the electronic device being dropped are rejected. The actual measurement data is the test data when the electronic device performs the simulation test under the simulated stress scenario, such as the test drop angle, the test torque, etc. By performing data processing on the attitude data during the simulated test of the electronic device, the amount of data can be reduced and the rate of determining the actual test data can be improved. At the same time, abnormal data can be eliminated during data processing, thereby improving the accuracy of determining the actual test data.

805, the upper computer determines the adjusted simulation test data based on the actual test data when the electronic device performs the simulation test.

The host computer can calculate the error between the simulation test data input by the user and the actual test data when the electronic device performs the simulation test, and determine the adjusted simulation test data based on the error, so as to realize the adjustment of the application simulation device. The adjusted simulation test is used to control the application simulation device to continue the simulation test, which can correct the use simulation effect of the application simulation device itself, and can accurately simulate the application scenario desired by the user, thereby improving the test accuracy.

For example, a user uses a drop test device to simulate a drop scenario where the electronic device will generate drop stress. As shown in Table 1, the simulated drop angle of the electronic device input by the user is: α. Since the actual drop angle of the electronic device is: β during the test, the error between the simulated drop angle and the actual drop angle is calculated as: δ, where δ=α-β, the attitude adjustment data of the drop test equipment is determined based on the error δ, That is, the adjusted simulated test data.

project Simulate drop angle Actual drop angle Error (δ=α-β) Data adjustment Case 1 alpha beta δ If δ>0, adjust in positive direction Scenario 2 alpha beta δ If δ<0, adjust in the opposite direction Scenario 3 alpha beta δ If δ=0, no adjustment

In some embodiments, the calculation formula of δ can be set according to the actual situation, δ=β−α, as shown in Table 2.

project Simulate drop angle actual drop angle Error (δ=β-α) Data adjustment Case 1 alpha beta δ If δ>0, adjust in the opposite direction Scenario 2 alpha beta δ If δ<0, adjust in positive direction Scenario 3 alpha beta δ If δ=0, no adjustment

The simulated drop angle and actual drop angle shown in the table are used to represent the position information of the electronic device, which can be the included angle of the electronic device relative to the reference coordinate system, and can include one or more included angles. limited.

It should be understood that the above embodiments are only illustrative. In some embodiments, due to the detection accuracy, the conditions for data adjustment may be different from those in the above examples, for example, δ=α−β, if δ>threshold A, adjust in the positive direction; if δ < threshold B, adjust in the reverse direction, if threshold A > δ > threshold B, then do not adjust, where the value of threshold A is greater than the value of threshold B. For another example, δ=β-α, if δ>threshold A, adjust in the reverse direction; if δ<threshold B, adjust in the positive direction, if threshold A>δ>threshold B, then do not adjust, where the value of threshold A is A value greater than the threshold B.

807, the stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data.

After the stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data, it can obtain actual test data consistent with the simulation test data input by the user. For example, in a drop scenario where a user uses a drop test device to simulate a drop stress on an electronic device, in the simulated test data input by the user, the test drop angle of the electronic device is: 45°, and the electronic device is tested based on the simulated test data input by the user. During the process, the actual drop angle of the electronic device is 47°. During the process of testing the electronic device based on the adjusted simulated test data, the actual drop angle of the electronic device can be adjusted to the test drop angle required by the user, that is, the drop angle of 45°. °, corrected the use simulation effect of the application simulation device itself, and simulated the application scene that the user wants. For another example, in a twisting scenario where a user uses a twisting test device to simulate a twisting stress on an electronic device, in the simulated test data input by the user, the test torque of the electronic device is: 2N m, and the electronic device is tested based on the simulated test data input by the user. During the process, the actual torque of the electronic device is: 1.7N·m. During the test process of the electronic device based on the adjusted simulation test data, the actual torque of the electronic device can be adjusted to the test twist required by the user, that is, the torque of 2N·m m, the use simulation effect of the application simulation device itself is corrected to simulate the application scenario that the user wants.

The above-mentioned equipment test adjustment method shown in Figure 9 is applied to the stress simulation equipment, the host computer and the electronic equipment, and the actual test data of the simulated test based on the simulated test data input by the user is determined by the electronic equipment tested, and according to the simulated test data input by the user. The test data and the actual test data, determine the adjusted simulation test data, and then control the application simulation device to perform a simulation test based on the adjusted simulation test data, correct the use simulation effect of the application simulation device itself, and can accurately simulate the user. The desired application scenario, thereby improving the accuracy of the test.

Referring to FIG. 10 , it is a flowchart of a device test adjustment method provided by another embodiment of the present application. The method can be applied to stress simulation equipment, electronic equipment and upper computer.

901. The stress simulation device controls the electronic device to perform a simulation test based on the simulation test data input by the user.

902. The electronic device determines attitude data when it performs the simulation test.

903. Based on the attitude data, the electronic device determines actual test data during the simulation test.

904, the electronic device sends the determined actual test data to the upper computer.

905, the upper computer determines the adjusted simulation test data based on the actual test data when the electronic device performs the simulation test.

906, the host computer sends the adjusted simulation test data to the stress simulation device.

907, the stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data.

For the specific implementation method of 901-907, reference may be made to the relevant descriptions of 801-807, which will not be repeated here.

The above-mentioned equipment test adjustment method shown in Figure 10 is applied to the stress simulation equipment, the host computer and the electronic equipment, and the actual test data for the simulated test based on the simulated test data input by the user is determined by the electronic equipment tested, and the simulated test data input by the user is used. The test data and the actual test data, determine the adjusted simulation test data, and then control the application simulation device to perform a simulation test based on the adjusted simulation test data, correct the use simulation effect of the application simulation device itself, and can accurately simulate the user. The desired application scenario, thereby improving the accuracy of the test. At the same time, the actual test data during the simulation test is determined in the electronic device, and the test information (actual test data) under the simulated stress scenario can be directly viewed in the electronic device, such as drop posture, drop angle and/or drop time, etc. , which is convenient for users to obtain the actual test data of electronic equipment.

Referring to FIG. 11 , it is a flowchart of a device test adjustment method provided by another embodiment of the present application. The method can be applied to stress simulation devices and electronic devices.

1001, the stress simulation device controls the electronic device to perform a simulation test based on the simulation test data input by the user.

1002 , the electronic device determines attitude data when it performs the simulation test.

1003, the electronic device sends the attitude data when the electronic device performs the simulation test to the host computer.

1004 , the stress simulation device determines actual test data when the electronic device performs the simulation test based on the attitude data when the electronic device performs the simulation test.

1005, the stress simulation device determines the adjusted simulation test data based on the actual test data when the electronic device performs the simulation test.

1006, the stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data.

For the specific implementation methods of 1001-1006, reference may be made to the relevant descriptions of 801-807, which will not be repeated here.

The above-mentioned device test adjustment method shown in FIG. 11 is applied to the stress simulation device and the electronic device, and the actual test data for the simulation test based on the simulation test data input by the user is determined by the electronic device tested, and the simulation test data and the simulation test data input by the user are used. For the actual test data, the adjusted simulation test data is determined, and then the application simulation device is controlled to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate and obtain what the user wants. application scenarios, thereby improving the accuracy of the test.

Referring to FIG. 12 , it is a flowchart of a device test adjustment method provided by another embodiment of the present application. The method can be applied to stress simulation devices and electronic devices.

1101, the stress simulation device controls the electronic device to perform a simulation test based on the simulation test data input by the user.

1102 , the electronic device determines attitude data when it performs the simulation test.

1103. Based on the attitude data, the electronic device determines actual test data during the simulation test.

1104, the electronic device sends the determined actual test data to the upper computer.

1105 , the stress simulation device determines the adjusted simulation test data based on the actual test data when the electronic device performs the simulation test.

1106, the stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data.

For the specific implementation methods of 1101-1106, reference may be made to the relevant descriptions of 801-807, which will not be repeated here.

The above-mentioned device test adjustment method shown in FIG. 12 is applied to stress simulation equipment and electronic equipment, and the actual test data for the simulation test based on the simulation test data input by the user is determined by the electronic device tested, and the simulation test data and the simulation test data input by the user are used. For the actual test data, the adjusted simulation test data is determined, and then the application simulation device is controlled to perform a simulation test based on the adjusted simulation test data, which corrects the use simulation effect of the application simulation device itself, and can accurately simulate and obtain what the user wants. application scenarios, thereby improving the accuracy of the test. At the same time, the actual test data during the simulation test is determined in the electronic device, and the test information (actual test data) under the simulated stress scenario can be directly viewed in the electronic device, such as drop posture, drop angle and/or drop time, etc. , which is convenient for users to obtain the actual test data of electronic equipment.

FIG. 13 is a schematic structural diagram of an electronic device 12 provided by an embodiment of the application in FIG. 13 . The electronic device 12 can implement the device testing and adjustment methods in the above-mentioned embodiments. The electronic device 12 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2 , mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, sensor module 180, buttons 190, motor 191, indicator 192, camera 193, display screen 194, and A subscriber identification module (SIM) card interface 195 and the like. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, and ambient light. Sensor 180L, bone conduction sensor 180M, etc.

It can be understood that, the structures illustrated in the embodiments of the present invention do not constitute a specific limitation on the electronic device 12 . In other embodiments of the present application, the electronic device 12 may include more or less components than shown, or combine some components, or separate some components, or arrange different components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units, for example, the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor ( image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural-network processing unit (neural-network processing unit, NPU), etc. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.

The controller can generate an operation control signal according to the instruction operation code and timing signal, and complete the control of fetching and executing instructions. In some embodiments of the present application, the processor 110 may be configured to control sensors on the electronic device 12 to collect attitude data when the electronic device 12 performs a simulation test.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments of the present application, the memory in the processor 110 is a cache memory. This memory may hold instructions or data that have just been used or recycled by the processor 110 . If the processor 110 needs to use the instruction or data again, it can be called directly from the memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby increasing the efficiency of the system. For example, the memory may store the above-mentioned data collection conditions, and the data collection conditions may be used to determine whether to collect the attitude data of the electronic device 12 during the simulation test.

In some embodiments of the present application, the processor 110 may include one or more interfaces. The interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous receiver (universal asynchronous receiver) /transmitter, UART) interface, mobile industry processor interface (MIPI), general-purpose input/output (GPIO) interface, subscriber identity module (SIM) interface, and/or Universal serial bus (universal serial bus, USB) interface, etc. In some embodiments of the present application, the communication between the electronic device 12 and the upper computer may be realized based on the USB interface; or, the communication between the electronic device 12 and the stress simulation device may be realized.

The I2C interface is a bidirectional synchronous serial bus. In some embodiments of the present application, the processor 110 may include multiple sets of I2C buses. The processor 110 can be respectively coupled to the touch sensor 180K, the charger, the flash, the camera 193 and the like through different I2C bus interfaces.

The I2S interface can be used for audio communication. In some embodiments of the present application, the processor 110 may include multiple sets of I2S buses. The processor 110 may be coupled with the audio module 170 through an I2S bus to implement communication between the processor 110 and the audio module 170 . The PCM interface can also be used for audio communications, sampling, quantizing and encoding analog signals.

The UART interface is a universal serial data bus used for asynchronous communication. The bus may be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments of the present application, a UART interface is generally used to connect the processor 110 and the wireless communication module 160 . For example, the processor 110 communicates with the Bluetooth module in the wireless communication module 160 through the UART interface to implement the Bluetooth function. In some embodiments of the present application, the Bluetooth communication between the electronic device 12 and the host computer may be implemented based on the UART interface; or, the Bluetooth communication between the electronic device 12 and the stress simulation device may be implemented.

The USB interface 130 is an interface that conforms to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, and the like. The USB interface 130 can be used to connect a charger to charge the electronic device 12, and can also be used to transmit data between the electronic device 12 and peripheral devices (eg, a host computer, a stress simulation device, etc.).

It can be understood that the interface connection relationship between the modules illustrated in the embodiment of the present invention is only a schematic illustration, and does not constitute a structural limitation of the electronic device 12 . In other embodiments of the present application, the electronic device 12 may also adopt different interface connection manners in the foregoing embodiments, or a combination of multiple interface connection manners.

The charging management module 140 is used to receive charging input from the charger. The charger may be a wireless charger or a wired charger.

The power management module 141 is used for connecting the battery 142 , the charging management module 140 and the processor 110 . The power management module 141 receives input from the battery 142 and/or the charging management module 140, and supplies power to the processor 110, the internal memory 121, the display screen 194, the camera 193, and the wireless communication module 160.

The wireless communication function of the electronic device 12 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modulation and demodulation processor, the baseband processor, and the like.

Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 12 may be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, the antenna 1 can be multiplexed as a diversity antenna of the wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 can provide wireless communication solutions including 2G/3G/4G/5G etc. applied on the electronic device 12 . The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA) and the like. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, filter and amplify the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and then turn it into an electromagnetic wave for radiation through the antenna 1 . In some embodiments of the present application, the communication between the electronic device 12 and the upper computer may be realized based on the mobile communication module 150; or, the communication between the electronic device 12 and the stress simulation device may be realized.

The modem processor may include a modulator and a demodulator. Wherein, the modulator is used to modulate the low frequency baseband signal to be sent into a medium and high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator transmits the demodulated low-frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and passed to the application processor.

The wireless communication module 160 can provide wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), and global navigation satellite systems applied on the electronic device 12 . (global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions. The wireless communication module 160 may be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2 , frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110 . The wireless communication module 160 can also receive the signal to be sent from the processor 110 , perform frequency modulation on it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2 . In some embodiments of the present application, the communication between the electronic device 12 and the upper computer may be realized based on the wireless communication module 160; or, the communication between the electronic device 12 and the stress simulation device may be realized.

In some embodiments of the present application, the antenna 1 of the electronic device 12 is coupled with the mobile communication module 150, and the antenna 2 is coupled with the wireless communication module 160, so that the electronic device 12 can communicate with the network and other devices through wireless communication technology. The wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and/or IR technology etc. The GNSS may include a global positioning system (GPS), a global navigation satellite system (GLONASS), a Beidou navigation satellite system (BDS), a quasi-zenith satellite system (quasi). -zenithsatellite system, QZSS) and/or satellite based augmentation systems (SBAS).

The electronic device 12 implements a display function through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

Display screen 194 is used to display images, videos, and the like. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode). , AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro-oLed, quantum dot light-emitting diodes (quantum dot light emitting diodes, QLED) and so on. In some embodiments of the present application, the electronic device 12 may include one or N display screens 194 , where N is a positive integer greater than 1, and the display screen 194 may be used to display actual test data when the electronic device performs a simulation test.

The electronic device 12 can realize the shooting function through the ISP, the camera 193, the video codec, the GPU, the display screen 194 and the application processor.

The ISP is used to process the data fed back by the camera 193 . For example, when taking a photo, the shutter is opened, the light is transmitted to the camera photosensitive element through the lens, the light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye.

Camera 193 is used to capture still images or video. The object is projected through the lens to generate an optical image onto the photosensitive element. The photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. DSP converts digital image signals into standard RGB, YUV and other formats of image signals. In some embodiments of the present application, the electronic device 12 may include 1 or N cameras 193 , where N is a positive integer greater than 1.

A digital signal processor is used to process digital signals, in addition to processing digital image signals, it can also process other digital signals. For example, when the electronic device 12 selects a frequency point, the digital signal processor is used to perform Fourier transform on the frequency point energy, and the like.

Video codecs are used to compress or decompress digital video. Electronic device 12 may support one or more video codecs.

The NPU is a neural-network (NN) computing processor. By drawing on the structure of biological neural networks, such as the transfer mode between neurons in the human brain, it can quickly process the input information, and can continuously learn by itself.

The internal memory 121 may include one or more random access memories (RAM) and one or more non-volatile memories (NVM).

Random access memory may include static random-access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous Dynamic random access memory (double data rate synchronous dynamic random access memory, DDR SDRAM, such as fifth-generation DDR SDRAM is generally referred to as DDR5 SDRAM), etc.; non-volatile memory may include disk storage devices, flash memory (flash memory) .

Flash memory can be divided into NOR FLASH, NAND FLASH, 3D NAND FLASH, etc. according to the operation principle, and can include single-level cell (SLC), multi-level memory cell (multi-level cell) according to the level of storage cell potential cell, MLC), triple-level cell (TLC), fourth-level storage cell (quad-level cell, QLC), etc., according to the storage specification can include universal flash storage (English: universal flash storage, UFS), Embedded multimedia memory card (embedded multi media Card, eMMC) and so on.

The random access memory can be directly read and written by the processor 110, and can be used to store executable programs (eg, machine instructions) of an operating system or other running programs, and can also be used to store data of users and application programs.

The non-volatile memory can also store executable programs and store data of user and application programs, etc., and can be loaded into the random access memory in advance for the processor 110 to directly read and write.

The external memory interface 120 can be used to connect an external non-volatile memory to expand the storage capacity of the electronic device 12 . The external non-volatile memory communicates with the processor 110 through the external memory interface 120 to realize the data storage function. For example, save music, video, etc. files in external non-volatile memory.

External memory interface 120 or internal memory 121 is used to store one or more computer programs. One or more computer programs are configured to be executed by the processor 110 . The one or more computer programs include a plurality of instructions, and when the plurality of instructions are executed by the processor 110, the device test adjustment method executed on the electronic device 12 in the above-mentioned embodiment can be implemented.

Wherein, in one embodiment, when the processor 110 executes the multiple instructions, it is used to realize: determine the attitude data when it performs the simulation test; based on the attitude data, determine the actual test data when the simulation test is performed; The determined actual test data is sent to the upper computer (or stress simulation device). Or it is used to realize: determine the attitude data when it performs the simulation test; send the attitude data to the upper computer (or stress simulation device).

The electronic device 12 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, and an application processor. Such as music playback, recording, etc.

The audio module 170 is used for converting digital audio information into analog audio signal output, and also for converting analog audio input into digital audio signal. Audio module 170 may also be used to encode and decode audio signals.

Speaker 170A, also referred to as a "speaker", is used to convert audio electrical signals into sound signals. Electronic device 12 may listen to music through speaker 170A, or listen to hands-free calls.

The receiver 170B, also referred to as "earpiece", is used to convert audio electrical signals into sound signals. When the electronic device 12 answers a call or a voice message, the voice can be answered by placing the receiver 170B close to the human ear.

The microphone 170C, also called "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can make a sound by approaching the microphone 170C through a human mouth, and input the sound signal into the microphone 170C. The electronic device 12 may be provided with at least one microphone 170C. In other embodiments, the electronic device 12 may be provided with two microphones 170C, which can implement a noise reduction function in addition to collecting sound signals.

The earphone jack 170D is used to connect wired earphones. The earphone port 170D may be a USB port 130, or a 3.5mm open mobile terminal platform (OMTP) standard port, a cellular telecommunications industry association of the USA (CTIA) standard port.

The pressure sensor 180A is used to sense pressure signals, and can convert the pressure signals into electrical signals. In some embodiments of the present application, the pressure sensor 180A may be disposed on the display screen 194 . There are many types of pressure sensors 180A, such as resistive pressure sensors, inductive pressure sensors, capacitive pressure sensors, and the like. The capacitive pressure sensor may be comprised of at least two parallel plates of conductive material. When a force is applied to the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device 12 determines the intensity of the pressure from the change in capacitance. When a touch operation acts on the display screen 194, the electronic device 12 detects the intensity of the touch operation according to the pressure sensor 180A. The electronic device 12 may also calculate the touched position according to the detection signal of the pressure sensor 180A. In some embodiments of the present application, the actual torque of the electronic device during the simulation test may be determined based on the pressure sensor 180A.

The gyro sensor 180B may be used to determine the motion attitude of the electronic device 12 . In some embodiments of the present application, the angular velocity of electronic device 12 about three axes (ie, x, y, and z axes) may be determined by gyro sensor 180B. The gyro sensor 180B can be used for image stabilization. Exemplarily, when the shutter is pressed, the gyroscope sensor 180B detects the shaking angle of the electronic device 12, calculates the distance to be compensated by the lens module according to the angle, and allows the lens to counteract the shaking of the electronic device 12 through reverse motion to achieve anti-shake. The gyro sensor 180B can also be used for navigation and somatosensory game scenarios. In some embodiments of the present application, the attitude data of the electronic device 12 during the simulation test may be determined based on the gyro sensor 180B.

The air pressure sensor 180C is used to measure air pressure. In some embodiments of the present application, the electronic device 12 calculates the altitude through the air pressure value measured by the air pressure sensor 180C to assist in positioning and navigation.

The magnetic sensor 180D includes a Hall sensor. The electronic device 12 can utilize the magnetic sensor 180D to detect the opening and closing of the flip holster.

The acceleration sensor 180E can detect the magnitude of the acceleration of the electronic device 12 in various directions (generally three axes). The magnitude and direction of gravity can be detected when the electronic device 12 is stationary. It can also be used to identify the posture of the electronic device 12, and can be used in applications such as horizontal and vertical screen switching, and pedometers. In some embodiments of the present application, the attitude data of the electronic device 12 during the simulation test may be determined based on the acceleration sensor 180E.

Distance sensor 180F for measuring distance. The electronic device 12 can measure distance by infrared or laser.

Proximity light sensor 180G may include, for example, light emitting diodes (LEDs) and light detectors, such as photodiodes. The light emitting diodes may be infrared light emitting diodes.

The ambient light sensor 180L is used to sense ambient light brightness. The electronic device 12 can adaptively adjust the brightness of the display screen 194 according to the perceived ambient light brightness.

The fingerprint sensor 180H is used to collect fingerprints. The electronic device 12 can use the collected fingerprint characteristics to realize fingerprint unlocking, accessing application locks, taking photos with fingerprints, answering incoming calls with fingerprints, and the like.

The temperature sensor 180J is used to detect the temperature. In some embodiments of the present application, the electronic device 12 uses the temperature detected by the temperature sensor 180J to execute a temperature processing strategy.

Touch sensor 180K, also called "touch device". The touch sensor 180K may be disposed on the display screen 194 , and the touch sensor 180K and the display screen 194 form a touch screen, also called a “touch screen”.

The bone conduction sensor 180M can acquire vibration signals. In some embodiments of the present application, the bone conduction sensor 180M may acquire the vibration signal of the vibrating bone mass of the human voice.

The keys 190 include a power-on key, a volume key, and the like. Keys 190 may be mechanical keys. It can also be a touch key. The electronic device 12 may receive key inputs and generate key signal inputs related to user settings and functional control of the electronic device 12 .

Motor 191 can generate vibrating cues. The motor 191 can be used for vibrating alerts for incoming calls, and can also be used for touch vibration feedback. For example, touch operations acting on different applications (such as taking pictures, playing audio, etc.) can correspond to different vibration feedback effects.

The indicator 192 can be an indicator light, which can be used to indicate the charging state, the change of the power, and can also be used to indicate a message, a missed call, a notification, and the like.

The SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into the SIM card interface 195 or pulled out from the SIM card interface 195 to achieve contact and separation with the electronic device 12 . The electronic device 12 may support 1 or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 195 can support Nano SIM card, Micro SIM card, SIM card and so on. The same SIM card interface 195 can insert multiple frame cards at the same time. The types of the multi-frame cards may be the same or different. The SIM card interface 195 can also be compatible with different types of SIM cards. The SIM card interface 195 is also compatible with external memory cards. The electronic device 12 interacts with the network through the SIM card to realize functions such as call and data communication. In some embodiments of the present application, the electronic device 12 adopts an eSIM, that is, an embedded SIM card. The eSIM card can be embedded in the electronic device 12 and cannot be separated from the electronic device 12 .

This embodiment also provides a computer storage medium, where a computer program is stored in the computer storage medium, and the computer program contains computer instructions, when the computer program runs on an electronic device, the electronic device executes the above-mentioned related methods to realize the above-mentioned embodiments. Any one of the device test adjustment methods.

This embodiment also provides a computer program product, including computer-executable instructions stored on a non-volatile storage medium, and when the computer-executable instructions are run on an electronic device, the electronic device executes the above-mentioned related methods, so as to Any one of the device test adjustment methods in the above embodiments is implemented.

In addition, the embodiments of the present application also provide an apparatus, which may specifically be a chip, a component or a module, and the apparatus may include a connected processor and a memory; wherein, the memory is used for storing computer execution instructions, and when the apparatus is running, The processor can execute the computer-executed instructions stored in the memory, so that the chip executes any one of the device testing and adjustment methods in the foregoing method embodiments.

Wherein, the electronic device, computer storage medium, computer program product or chip provided in this embodiment are all used to execute the corresponding method provided above. Therefore, for the beneficial effects that can be achieved, reference can be made to the corresponding provided above. The beneficial effects in the method will not be repeated here.

From the description of the above embodiments, those skilled in the art can clearly understand that for the convenience and brevity of the description, only the division of the above functional modules is used as an example for illustration. In practical applications, the above functions can be allocated as required. It is completed by different functional modules, that is, the internal structure of the device is divided into different functional modules, so as to complete all or part of the functions described above.

In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined. Or it may be integrated into another device, or some features may be omitted, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and components shown as units may be one physical unit or multiple physical units, that is, may be located in one place, or may be distributed to multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.

The integrated unit, if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application can be embodied in the form of software products in essence, or the parts that contribute to the prior art, or all or part of the technical solutions, which are stored in a storage medium , including several instructions to make a device (which may be a single chip microcomputer, a chip, etc.) or a processor (processor) to execute all or part of the steps of the methods in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be Modifications or equivalent substitutions can be made without departing from the spirit and scope of the technical solutions of the present application.

Claims (15)

1. a device testing adjustment system, comprising stress simulation equipment, electronic equipment and host computer, is characterized in that: The stress simulation device controls the electronic device to perform a simulation test based on simulation test data input by a user; The electronic device determines the attitude data when the simulation test is performed; The host computer determines the adjusted simulated test data based on the attitude data and the simulated test data; The stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data. 2. The device test adjustment system according to claim 1, wherein the host computer determines that the adjusted simulated test data comprises: based on the attitude data and the simulated test data: The host computer determines, based on the attitude data, actual test data when the electronic device performs a simulated test; The host computer determines the adjusted simulated test data based on the actual test data and the simulated test data. 3. equipment testing adjustment system according to claim 2 is characterized in that: After the electronic device establishes communication with the upper computer, the electronic device sends the attitude data to the upper computer. 4. The device test adjustment system according to claim 1, wherein the host computer determines that the adjusted simulated test data comprises: based on the attitude data and the simulated test data: The electronic device determines, based on the attitude data, actual test data when the electronic device performs a simulation test; The host computer determines the adjusted simulated test data based on the actual test data and the simulated test data. 5. equipment testing adjustment system according to claim 4 is characterized in that: After the electronic device establishes communication with the upper computer, the electronic device sends the actual test data to the upper computer. 6. The device testing adjustment system according to claim 1, wherein the electronic device determines that the attitude data when performing the simulation test comprises: The electronic device determines whether the trigger condition is met; If the trigger condition is met, the electronic device turns on the preset sensor; Based on the data collected by the preset sensor, the electronic device determines attitude data during the simulation test. 7. equipment testing adjustment system according to claim 1, is characterized in that: After the upper computer establishes communication with the stress simulation device, the upper computer sends the adjusted simulation test data to the stress simulation device. 8. An equipment testing adjustment system, comprising stress simulation equipment and electronic equipment, is characterized in that: The stress simulation device controls the electronic device to perform a simulation test based on simulation test data input by a user; The electronic device determines the attitude data when the simulation test is performed; The stress simulation device determines the adjusted simulation test data based on the attitude data and the simulation test data; The stress simulation device controls the electronic device to perform a simulation test based on the adjusted simulation test data. 9 . The device testing adjustment system according to claim 8 , wherein the stress simulation device determines, based on the attitude data and the simulated test data, that the adjusted simulated test data comprises: 10 . The stress simulation device determines, based on the attitude data, actual test data when the electronic device performs a simulation test; The stress simulation device determines adjusted simulated test data based on the actual test data and the simulated test data. 10. The device test adjustment system according to claim 8, wherein the stress simulation device determines the adjusted simulation test data based on the attitude data and the simulation test data, comprising: The electronic device determines, based on the attitude data, actual test data when the electronic device performs a simulation test; The stress simulation device determines adjusted simulated test data based on the actual test data and the simulated test data. 11. The device test adjustment system according to claim 8, wherein the electronic device determines the attitude data when performing the simulation test, comprising: The electronic device determines whether the trigger condition is met; If the trigger condition is met, the electronic device turns on the preset sensor; Based on the data collected by the preset sensor, the electronic device determines attitude data during the simulation test. 12. A method for testing and adjusting equipment, applied to stress simulation equipment, wherein the method comprises: Based on the simulated test data input by the user, control the electronic equipment to perform the simulated test; After establishing communication with the host computer, obtain the adjusted simulation test data from the host computer; control the electronic device to perform a simulated test according to the adjusted simulated test data; The adjusted simulated test data is determined by the host computer based on the attitude data and the simulated test data when the electronic device performs a simulated test. 13. A method for testing and adjusting equipment, applied to stress simulation equipment, wherein the method comprises: Based on the simulated test data input by the user, control the electronic equipment to perform the simulated test; After establishing communication with the electronic device, obtain the attitude data of the electronic device during the simulation test from the electronic device; determining the adjusted simulated test data based on the attitude data and the simulated test data; According to the adjusted simulation test data, the electronic device is controlled to perform a simulation test. 14. An electronic device, characterized in that the electronic device comprises a memory and a processor; the memory for storing program instructions; The processor is configured to read the program instructions stored in the memory, so as to implement the device test adjustment method as claimed in claim 12 or claim 13 . 15. A computer-readable storage medium, wherein computer-readable instructions are stored in the computer-readable storage medium, and when the computer-readable instructions are executed by a processor, the method described in claim 12 or claim 13 is implemented. The equipment test adjustment method described above.

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