CN114758891A - Encapsulating lead Y-type capacitor and preparation method thereof - Google Patents

Abstract

The invention provides a potting lead Y-type capacitor and a preparation method thereof, comprising two chip groups arranged at intervals, a common lead, two separate leads, a first insulating layer, a casing, a fixing mechanism and a potting glue, and the two chips are arranged side by side at intervals , the chip set includes at least one ceramic chip, the conductive terminals on the same side of all the ceramic chips of a chip set are conductively connected to form a total conductive terminal, the common lead is connected with the two total conductive terminals on the same side of the two chip sets, and the two separate leads It is respectively connected with the other general conductive end of the two chip sets. The first insulating layer is arranged between the two chip sets to isolate the two chip sets. The two chip sets are placed in the casing. The common lead and the two individual leads extend out of the casing and are fixed. The mechanism is arranged between the common lead and the two individual leads and the casing, and the potting glue is arranged between the chip set and the casing. The invention can realize the function of suppressing common mode interference, and has high reliability, strong mechanical performance and strong shock resistance, and can meet the needs of mass production.

Description

A kind of potting lead Y-type capacitor and preparation method thereof

technical field

The invention relates to a potting lead Y-type capacitor and a preparation method thereof.

Background technique

In the prior art, as shown in FIG. 1 , the common mode interference suppression circuit is two capacitors connected in series, the free ends of the two capacitors are connected to the power supply, and the common end is grounded. However, in actual use, when designing a PCB board, sometimes the entire circuit design becomes complicated due to the common mode interference suppression circuit. Furthermore, during use, the circuit may be damaged due to environmental reasons, thereby affecting the reliability of the common mode interference suppression circuit, and its shockproof performance is poor, and it is easily damaged and loses its function in extreme environments.

SUMMARY OF THE INVENTION

The invention provides a potting lead Y-type capacitor and a preparation method thereof, which can realize the function of suppressing common mode interference, and have high reliability, strong mechanical performance and strong shock resistance, and can meet the needs of mass production.

The present invention is achieved through the following technical solutions:

A potting lead Y-type capacitor, comprising two chip sets arranged at intervals, a common lead, two separate leads, a first insulating layer, a casing, a fixing mechanism and a potting glue, the two chips are arranged side by side at intervals, and the chip set comprises at least one ceramic Chip, the conductive terminals on the same side of all the ceramic chips of a chip set are conductively connected to form a total conductive terminal, the common lead is connected to the two general conductive terminals on the same side of the two chip sets, and the two separate leads are respectively connected to the other two chip sets. The main conductive terminals are connected, the first insulating layer is arranged between the two chip groups to isolate the two chip groups, the two chip groups are placed in the casing, the common lead and the two individual leads extend out of the casing, and the fixing mechanism is arranged on the common lead and the two chip groups. Between the individual leads and the casing, the potting glue is arranged between the chip set and the casing.

Further, a first copper sheet is provided on the two general conductive ends of the two chip sets on the same side, and one end of the common lead is welded on the first copper sheet.

Further, the upper end of the casing has an opening, and the lower end is provided with a hole for the common lead and the two separate leads to pass through, and the fixing mechanism includes a red glue that is arranged on the common lead and the two separate leads and the corresponding positions of the give-away holes. .

Further, the housing is made of high-strength insulating and high temperature and high pressure resistant materials.

Further, it also includes a second insulating layer, the ceramic chip includes two conductive ends and a porcelain body disposed between the two conductive ends, and the second insulating layer is disposed on the periphery of the porcelain body.

Further, the second insulating layer is insulating paint coated on the periphery of the porcelain body.

Further, the first insulating layer is a rectangular sheet made of polyimide material, the area of the rectangular sheet is not less than the area of the ceramic chip, and the thickness of the rectangular sheet is not less than 1 mm.

The present invention also realizes through the following technical solutions:

A preparation method of a potted lead Y-type capacitor. First, a first insulating layer is arranged between two chip groups, and then a common lead is connected to two general conductive terminals on the same side of the two chip groups. The other general conductive end of the chip set is connected, and then the chip set is placed in the casing, the common lead and the individual lead are passed out of the casing, and a potting glue is introduced between the chip set and the casing to cure.

The present invention has the following beneficial effects:

1. In the present invention, a first insulating layer is firstly arranged between the two chip groups to ensure insulation isolation of the two chip groups, and then the common lead is connected to the two general conductive terminals on the same side of the two chip groups respectively, and the two individual leads are connected to the two chip groups respectively. The other general conductive ends of the two chip sets are connected, and then the chip is placed in the casing and the common lead and the individual lead are passed out of the casing, and the potting glue is introduced between the chip set and the casing to cure. It is connected to the power supply and the common lead is grounded to realize the function of suppressing the common mode interference; the present invention is a modular design, and the common mode interference circuit is integrated into a capacitor module, and a simple welding operation can be performed during use to make the PCB board The design is simpler; a fixing mechanism is arranged between the common lead, the two individual leads and the casing, so that the two chip sets after the welding of the common lead and the independent lead can be fixed in the casing, and the chip set and the casing can be introduced between the chip set and the casing. The potting compound can improve the reliability, polarity performance and anti-vibration performance of the present invention; the ceramic chip of the present invention is a standard ceramic chip in the market. When using, the number of ceramic chips included in the chip set can be selected according to the specific use situation. , so as to obtain suitable capacitance, strong adaptability, and can also meet the needs of mass production.

Description of drawings

The present invention will be further described in detail below in conjunction with the accompanying drawings.

FIG. 1 is a circuit diagram of a common mode interference suppression circuit in the prior art.

FIG. 2 is a schematic structural diagram of the present invention.

FIG. 3 is a schematic diagram of the decomposition mechanism of the present invention.

FIG. 4 is a schematic structural diagram of the present invention after removing the casing and the potting glue.

Among them, 11, conductive end; 2, common lead; 21, first copper sheet; 3, individual lead; 4, first insulating layer; 5, second insulating layer; 6, shell; 61, opening; 7, potting Glue; 8. Red glue.

Detailed ways

As shown in FIGS. 2 to 4 , the potted lead Y-type capacitor includes two chip groups arranged at intervals, a common lead 2 , two separate leads 3 , a first insulating layer 4 , a second insulating layer 5 , a housing 6 , a fixing mechanism and Potting glue 7. In this embodiment, the chip set includes a ceramic chip, and the ceramic chip includes two conductive ends 11 and a porcelain body disposed between the two conductive ends 11 . The conductive end 11 of the ceramic chip is the total conductive end of the chip set. The two conductive ends 11 of the two ceramic chips located on the same side are provided with a first copper sheet 21 so that the two conductive ends 11 are electrically connected. The upper ends of the common leads are welded on the first copper sheet 21 , and the upper ends of the two individual leads 3 are respectively welded to the other conductive ends 11 of the two ceramic chips, and the two ceramic chips are arranged side by side at intervals. The first insulating layer 4 is disposed between the two ceramic chips to isolate the two ceramic chips. The second insulating layer 5 is an insulating varnish coated on the periphery of the ceramic body to further ensure that the two ceramic chips will not contact and short-circuit. The two ceramic chips to which the common lead 2 and the two individual leads 3 are welded are placed in the casing 6 , and the common lead 2 and the two individual leads 3 extend out of the casing 6 . The fixing mechanism is arranged between the common lead 2 and the casing 6 and between the two individual leads 3 and the casing 6 . The potting glue 7 is arranged between the ceramic chip and the casing 6 .

In another embodiment, the chip set includes a plurality of ceramic chips, and the conductive terminals 11 of the plurality of ceramic chips on the same side are conductively connected to form a total conductive terminal, and the conductive connections of the conductive terminals 11 on the same side The second copper sheet on the end 11 is realized. The common lead is connected to the two general conductive ends of the two chip sets on the same side, the two individual leads 3 are respectively connected to the other general conductive end of the two chip sets, the two chips are arranged side by side at intervals, and the first insulating layer 4 is arranged between the two chip sets. During the time, the two chip sets are placed in the casing 6, and the periphery of each ceramic chip of each chip set is coated with insulating paint, the common lead 2 and the two individual leads 3 protrude out of the casing 6, and the fixing mechanism is arranged on the common lead 2. And between the two individual leads 3 and the casing 6 , the potting glue 7 is arranged between the chip set and the casing 6 .

The shell 6 is made of high-strength insulation and high temperature and high pressure resistant materials, specifically polybenzimidazole PBI can be used. The casing is set as a hollow cuboid. In order to facilitate the insertion of the ceramic chip, the upper end of the cuboid is provided with an opening 61, and the lower end is provided with a hole for the common lead 2 and the two individual leads 3 to pass through. The red glue 8 on the common lead 2 and the two individual leads 3 at the positions corresponding to the escape holes.

In this embodiment, the first insulating layer 4 is a rectangular sheet made of polyimide material, the area of the rectangular sheet is not less than that of the ceramic chip, and the thickness of the rectangular sheet is not less than 1 mm to ensure the insulation strength of the product.

The preparation method of the potted lead Y-type capacitor is as follows: coating a first insulating layer 4 on the periphery of the porcelain body of the ceramic chip, then disposing the first insulating layer 4 between the two chip groups, and then placing the common lead 2 and the two chip groups in the same position. Connect the two general conductive ends on the same side, respectively connect the two individual leads 3 to the other general conductive ends of the two chip groups, and then place the chip group in the casing 6 and make the common lead 2 and the individual lead 3 pass out of the casing 6, And the potting glue 7 is poured between the chip set and the casing 6 to be cured.

The above descriptions are only the preferred embodiments of the present invention, and therefore cannot limit the scope of the present invention. That is, equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description should still belong to the present invention. covered by the patent.

Claims (8)

1. A potting lead Y-type capacitor is characterized in that: comprising two chip groups arranged at intervals, a common lead, two separate leads, a first insulating layer, a casing, a fixing mechanism and a potting glue, and the two chips are arranged side by side at intervals, The chip set includes at least one ceramic chip, the conductive terminals on the same side of all the ceramic chips of a chip set are conductively connected to form a total conductive terminal, the common lead is connected with the two general conductive terminals on the same side of the two chip sets, and the two separate leads are respectively It is connected to the other general conductive end of the two chip groups, the first insulating layer is arranged between the two chip groups to isolate the two chip groups, the two chip groups are placed in the casing, the common lead and the two individual leads extend out of the casing, and the fixing mechanism It is arranged between the common lead and the two individual leads and the casing, and the potting glue is arranged between the chip set and the casing. 2 . The potted lead Y-type capacitor according to claim 1 , wherein the two general conductive ends of the two chip groups located on the same side are provided with a first copper sheet, and one end of the common lead is welded on the same side. 3 . on the first copper sheet. 3 . The potted lead Y-type capacitor according to claim 1 , wherein the upper end of the casing is provided with an opening, and the lower end is provided with an escape hole for the common lead and two separate leads to pass through, and the fixing mechanism 3 . Including the red glue arranged on the common lead and the two individual leads corresponding to the position of the abdication hole. 4. A potting lead Y-type capacitor according to claim 1, 2 or 3, characterized in that: the shell is made of high-strength insulation and high temperature and high pressure resistant materials. 5. A potting lead Y-type capacitor according to claim 1, 2 or 3, characterized in that: further comprising a second insulating layer, and the ceramic chip comprises two conductive ends and a The porcelain body, the second insulating layer is arranged on the periphery of the porcelain body. 6 . The potted lead Y-type capacitor according to claim 5 , wherein the second insulating layer is an insulating varnish coated on the periphery of the porcelain body. 7 . 7. The potted lead Y-type capacitor according to claim 1, 2 or 3, wherein the first insulating layer is a rectangular sheet made of polyimide material, and the rectangular sheet has an area not larger than Less than the area of the ceramic chip, the thickness of the rectangular sheet is not less than 1mm. 8. A method for preparing a potted lead Y-type capacitor, characterized in that: firstly, a first insulating layer is arranged between two chip groups, and then a common lead is connected to two general conductive ends on the same side of the two chip groups, respectively. The two individual leads are connected to the other general conductive end of the two chip sets, the chip sets are placed in the casing, the common lead and the individual lead go out of the casing, and a potting glue is introduced between the chip set and the casing to cure.

Images