CN114678332A - ITO (indium tin oxide) patterning method, preparation method of display panel and display panel - Google Patents

Abstract

The present application relates to an ITO patterning method, a preparation method of a display panel, and a display panel. The method includes: providing an organic adhesive layer; patterning the organic adhesive layer, opening a plurality of recesses spaced apart from each other in the upper surface layer of the organic adhesive layer; depositing an ITO material on the organic adhesive layer, The deposition thickness of the ITO material is smaller than the depth of the depression, the ITO material deposited on the upper surface layer forms a first ITO film, the ITO material deposited in the depression forms a second ITO film, and the first ITO film is formed. The ITO film is isolated from the second ITO film. By adopting the method, the production capacity can be increased and the cost can be reduced.

Description

ITO patterning method, manufacturing method of display panel, and display panel

technical field

The present application relates to the field of display technology, and in particular, to an ITO patterning method, a method for preparing a display panel, and a display panel.

Background technique

The under-screen camera has become a trend, and with the development of display technology, under-screen camera technology has emerged. Under-screen camera is to completely build the front camera under the screen, which can achieve a true full screen. However, it is not difficult to put the front camera on the inner layer of the screen, the difficulty is how to solve the problem of light transmission.

In the traditional technology, transparent leads, such as a thin ITO film layer, are used to electrically connect the light-emitting unit in the under-screen camera area with the pixel circuit outside the under-screen camera area to increase the transmittance of the under-screen camera area.

However, the number of ITO film layers is generally more than two, and the patterning of the ITO film layers will limit the overall production capacity and increase the cost.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide an ITO patterning method, a manufacturing method of a display panel, and a display panel that can improve the productivity and reduce the cost, aiming at the above technical problems.

In a first aspect, the present application provides an ITO patterning method. The method includes:

provide an organic adhesive layer;

patterning the organic adhesive layer, and opening a plurality of recesses spaced apart from each other in the upper surface layer of the organic adhesive layer;

An ITO material is deposited on the organic adhesive layer, and the deposition thickness of the ITO material is smaller than the depth of the depression, the ITO material deposited on the upper surface layer forms a first ITO film, and the ITO deposited in the depression The material forms a second ITO film, the first ITO film and the second ITO film being isolated.

In the above-mentioned ITO patterning method, an organic adhesive layer is provided first, and the organic adhesive layer is patterned, a plurality of recesses spaced apart from each other are opened in the upper surface layer of the organic adhesive layer, and then the ITO material is deposited on the organic adhesive layer. The ITO material on the upper surface layer forms the first ITO film, and the ITO material deposited in the recess forms the second ITO film. The first ITO film and the second ITO film are isolated. The special structure inside the organic adhesive layer can be used to make thinner The ITO material is automatically divided into a first ITO film and a second ITO film isolated from each other at the corners of the thicker recesses, and the distribution area of the recesses can be consistent with the distribution area of the patch cords, thereby reducing the patterning of the ITO film layer The number of times, improve the overall production capacity and reduce the realization cost.

In one of the embodiments, the cross-sectional area of the recessed portion perpendicular to the opening direction increases gradually along the opening direction;

Preferably, the recessed portion is in the shape of a regular trapezoid.

The cross-sectional area of the depression perpendicular to the opening direction gradually increases along the opening direction. The overall top is small and the bottom is large. The angle between the side wall and the bottom surface is an acute angle. The ITO material cannot be attached to the side wall, and the ITO material deposited inside and outside the depression Disconnect automatically.

In one of the embodiments, at least two of the recesses have different depths;

Preferably, the recessed portion includes at least a first recessed portion and a second recessed portion, and the depth of the second recessed portion is greater than that of the first recessed portion.

The depth of the recess is different, and the ITO material deposited in the recess can be located on different planes, which is conducive to the formation of different traces, and can separate adjacent traces to reduce the distance between adjacent traces on the plane, which is convenient for walking. line design.

In one embodiment, in the patterning of the organic adhesive layer, a plurality of recesses spaced apart from each other are provided in the upper surface layer of the organic adhesive layer, including:

exposing the organic adhesive layer through a mask, the mask including a fully transparent area, a semi-transparent area and a non-transparent area, and the organic adhesive layer includes a negative photoresist;

The organic adhesive layer is developed, the area of the organic adhesive layer opposite to the semi-transparent area forms the first concave portion, and the area opposite to the non-transparent area of the organic adhesive layer forms the the second recess.

Negative photoresists are soluble substances before exposure to light, and insoluble substances are formed after exposure to light. The area opposite the organic adhesive layer and the non-transparent area has no light, and is still a soluble substance, which will dissolve after development; the area opposite the organic adhesive layer and the fully transparent area is fully illuminated, and all become insoluble substances, which will become insoluble after development. All are reserved; the area of the organic adhesive layer opposite to the semi-transparent area is illuminated but not sufficient, and there are still some soluble substances, and some of them will dissolve after developing. Therefore, the area of the organic adhesive layer opposite to the semi-transparent area forms a first recessed portion with a smaller depth, and the area of the organic adhesive layer opposite to the non-transparent area forms a second recessed portion with a larger depth.

In one embodiment, in the patterning of the organic adhesive layer, a plurality of recesses spaced apart from each other are provided in the upper surface layer of the organic adhesive layer, including:

patterning the organic adhesive layer to form a plurality of the first recesses spaced apart from each other in the organic adhesive layer;

Part of the first recessed portion is etched to form the second recessed portion.

The organic adhesive layer is first patterned, a first recessed portion with a smaller depth is formed in the organic adhesive layer, and then part of the first recessed portion is further etched to turn it into a second recessed portion with a larger depth, so as to realize the A first recessed portion and a second recessed portion with different depths are formed in the organic adhesive layer.

In one embodiment, the deposition thickness of the ITO material ranges from 200 angstroms to 1000 angstroms.

The deposition thickness of the ITO material is 200 angstroms to 1000 angstroms, and a thinner thickness is conducive to the automatic separation of the ITO material deposited inside and outside the recess at the corners of the thicker recess. Moreover, the larger the deposition thickness of the ITO material, the better the orientation; the smaller the deposition thickness of the ITO material, the better the light transmission; the deposition thickness of the ITO material is 200 angstroms to 1000 angstroms, which can better balance the conductivity and light transmission. sex.

In one embodiment, the method further includes:

Part of the first ITO film is etched to expose the upper surface layer.

Part of the first ITO film is etched to expose the upper surface layer, so that the distribution area of the first ITO film is consistent with the distribution area of the patch wire, so that the first ITO film is used to realize the electrical connection between the light-emitting unit and the pixel circuit, which is convenient for wiring design.

In one embodiment, the method further includes:

The organic adhesive layer is patterned to form vias in the organic adhesive layer.

A via hole is formed in the organic adhesive layer, so that the ITO material deposited on the organic adhesive layer is electrically connected to the pixel circuit under the organic adhesive layer through the via hole. Specifically, the via hole penetrating the organic adhesive layer realizes the electrical connection between the first ITO film and the pixel circuit, and the via hole connected with the recess realizes the electrical connection between the second ITO film and the pixel circuit.

In a second aspect, the present application also provides a method for manufacturing a display panel. The method includes:

A substrate provided with a pixel driving circuit is provided, the substrate includes a main screen area, a sub-screen area, and a transition area between the main screen area and the sub-screen area, the pixel driving circuit includes a a plurality of pixel circuits in the main screen area and the transition area;

An organic adhesive layer is laid on the side of the substrate where the pixel driving circuit is arranged;

Patterning the organic adhesive layer, opening via holes in the organic adhesive layer that are connected to the pixel circuits in a one-to-one correspondence, on the organic adhesive layer located in the secondary screen area and the transition area A concave portion communicating with the corresponding via hole is provided in the surface layer;

ITO material is deposited on the side of the organic adhesive layer away from the pixel driving circuit, the deposition thickness of the ITO material is less than the depth of the recessed portion, and the ITO material deposited on the upper surface layer forms a first ITO film, The ITO material deposited in the recessed portion forms a second ITO thin film, and the first ITO thin film is isolated from the second ITO thin film; wherein, the light-emitting unit located in the main screen area is connected to the second ITO thin film through the first ITO thin film. The pixel circuits in the main screen area are electrically connected, and the light-emitting units located in the sub-screen area and the transition area are respectively connected to the light-emitting units located in the transition area through one of the first ITO film and the second ITO film. The pixel circuit is electrically connected;

Preferably, the cross-sectional area of the via hole communicating with the recessed portion is perpendicular to the opening direction, and gradually decreases along the opening direction;

Preferably, the via hole communicating with the recessed portion is in the shape of an inverted trapezoid.

In a third aspect, the present application also provides a display panel.

The display panel includes:

a substrate, including a main screen area, a sub-screen area, and a transition area between the main screen area and the sub-screen area;

a pixel driving circuit, including a plurality of pixel circuits arranged in the main screen area and the transition area;

An organic adhesive layer is located on the side of the substrate where the pixel driving circuit is arranged, and the organic adhesive layer has via holes connected to the pixel circuits in a one-to-one correspondence, located in the sub-screen area and the transition The upper surface layer of the organic adhesive layer in the region has a concave portion communicating with the corresponding via hole;

a first ITO film, located on the upper surface layer;

The second ITO film is located in the recessed portion, and the first ITO film is isolated from the second ITO film;

a light-emitting layer group, located on the side where the organic adhesive layer is provided with the first ITO thin film, and the light-emitting layer group includes a plurality of light-emitting units located in the main screen area, the sub-screen area and the transition area, The light-emitting unit located in the main screen area is electrically connected to the pixel circuit located in the main screen area through the first ITO film, and the light-emitting units located in the secondary screen area and the transition area pass through the first ITO film and the transition area, respectively. One of the second ITO films is electrically connected to the pixel circuit located in the transition region.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the traditional technology, the following briefly introduces the accompanying drawings that are used in the description of the embodiments or the traditional technology. Obviously, the drawings in the following description are only the For some embodiments of the application, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

Fig. 1 is the application environment diagram of the ITO graphical method in one embodiment;

2 is a schematic diagram of a partial structure of a display panel in one embodiment;

3 is a schematic flowchart of an ITO graphic method in one embodiment;

4 is a schematic structural diagram of an organic adhesive layer formed after step S302 is performed in one embodiment;

FIG. 5 is a schematic structural diagram of a recessed portion formed after step S304 is performed in one embodiment;

6 is a schematic structural diagram of an ITO film formed after step S306 is performed in one embodiment;

7 is a schematic flowchart of step S304 in one embodiment;

8 is a schematic structural diagram of a recessed portion formed after step S304 is performed in another embodiment;

9 is a schematic flowchart of step S304 in another embodiment;

10 is a schematic flowchart of step S304 in another embodiment;

11 is a schematic structural diagram of a via hole formed in one embodiment;

12 is a schematic flowchart of an ITO graphic method in another embodiment;

13 is a schematic flowchart of a method for manufacturing a display panel in one embodiment;

14 is a schematic flowchart of step S1306 in one embodiment;

FIG. 15 is a schematic structural diagram of the concave portion formed after step S1404 is performed in one embodiment;

Figure 16 is a cross-sectional view taken along the direction A-A in Figure 15 in one embodiment;

Figure 17 is a sectional view taken along the direction B-B in Figure 15 in one embodiment;

18 is a schematic structural diagram of a recessed portion formed after step S1406 is performed in one embodiment;

Figure 19 is a cross-sectional view taken along the direction A-A in Figure 18 in one embodiment;

Figure 20 is a cross-sectional view taken along direction C-C in Figure 18 in one embodiment;

FIG. 21 is a schematic diagram of the connection between the pixel circuit and the light-emitting unit in one embodiment.

Description of reference numbers:

10-display panel, 11-substrate, 12-pixel circuit, 13-light-emitting unit, 14-via hole, 15-connection wire;

A-Main screen area, B-Secondary screen area, C-Transition area;

21-organic glue layer, 22-recess, 23-via hole;

31-the first ITO film layer, 32-the second ITO film layer.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

The ITO graphing method provided in the embodiment of the present application can be applied to the application environment shown in FIG. 1 . The display panel 10 has a main screen area A, a sub screen area B and a transition area C. The main screen area A at least partially surrounds the sub screen area B, and the transition area C is located between the main screen area A and the sub screen area B. As shown in FIG. 2 , the display panel 10 includes a substrate 11 , and pixel circuits 12 and light-emitting units 13 that are electrically connected in one-to-one correspondence. The pixel circuits 12 are distributed in the main screen area A and the transition area C, and the light-emitting units 13 are distributed in the main screen area A, the auxiliary screen area B and the transition area C. The light emitting unit 13 located in the main screen area A is disposed opposite to the pixel circuit 12 located in the main screen area A, and the two can be directly connected through the via hole 14 . The light emitting units 13 located in the sub-screen area B and the transition area C and the pixel circuits 12 located in the transition area C are arranged in a dislocation, and the connection between the two needs to be connected by an adapter wire 15 . In this way, the space between the light-emitting unit 13 located in the sub-screen area B and the substrate 11 can be vacated, and the arrangement of the pixel circuit 12 in the sub-screen area B can avoid affecting the incidence of AUG light, which is beneficial to the photosensitive device disposed in the sub-screen area B. Receive optical signals to realize off-screen photography.

As shown in FIG. 2 , in order to facilitate wiring design, the patch cords 15 are distributed on at least two layers. In order to increase the transmittance of the secondary screen area 12, the transition line 15 is realized by using a transparent ITO film layer. Since the patterning process of the ITO film is complicated and time-consuming, the patterning of the ITO film at least twice will limit the overall production capacity and increase the implementation cost.

In order to solve the above problems, the embodiments of the present application provide an ITO patterning method, a preparation method of a display panel, and a display panel. First, an organic adhesive layer is provided, and the organic adhesive layer is patterned. Open a plurality of recesses spaced apart from each other, and then deposit ITO material on the organic adhesive layer. The deposition thickness of the ITO material is less than the depth of the recessed part. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO deposited in the recessed part. The material forms the second ITO film, and the first ITO film and the second ITO film are isolated. The special structure inside the organic adhesive layer can be used to make the thinner ITO material automatically divide into the first ITO isolated from each other at the corners of the thicker recesses The film and the second ITO film, and the distribution area of the concave portion can be consistent with the distribution area of the patch wire, thereby reducing the patterning times of the ITO film layer, improving the overall productivity, and reducing the implementation cost.

The ITO graphic method disclosed in the embodiments of the present application can be applied to the preparation of display panels, and the display panels can be applied to various display devices, such as mobile phone terminals, wearable devices, vehicle-mounted devices, tablet computers, notebook computers, computer monitors, and the like.

In order to facilitate better understanding, before going into detail, some contents are explained first:

ITO (Indium tin oxide, indium tin oxide): a mixture, transparent brown film or yellowish gray block, made of 90% In2O3 and 10% SnO2, mainly used to make liquid crystal displays, flat panel displays, plasma Displays, touch screens, electronic paper, organic light-emitting diodes, solar cells, antistatic coatings, transparent conductive coatings for EMI (Electromagnetic Interference) shielding, various optical coatings, etc. The main property of indium tin oxide is its combination of electrical conductivity and optical transparency. A compromise between conductivity and transparency is required for thin film deposition, as a high concentration of charge carriers will increase the conductivity of the material but reduce its transparency. Indium tin oxide films are usually deposited onto surfaces by physical vapor deposition or some sputter deposition techniques.

Patterning: A series of processes that create patterns within a structure or surface layer that are sized and positioned according to the requirements of the physical "parts" in an integrated circuit.

In one embodiment, as shown in FIG. 3, a kind of ITO patterning method is provided, including the following steps:

Step S302, providing an organic adhesive layer.

Wherein, the organic adhesive layer is a layered structure formed by an organic gelling material. Organic gelling materials refer to a class of gelling materials based on natural or synthetic polymer compounds. Cementitious materials refer to materials that can cement other materials into a whole and have a certain strength.

Exemplarily, the organic adhesive layer is a photoresist layer, which can be directly patterned, thereby simplifying the process flow and reducing the implementation cost.

As shown in FIG. 4 , after step S302 is performed, an organic adhesive layer 21 is formed. In practical applications, the organic adhesive layer 21 may be disposed on a surface with a supporting function, such as the surface of a substrate. Specifically, step S302 includes: using a glue spinner to evenly throw off the organic glue, and laying the organic glue on the surface to form an organic glue layer.

In step S304, the organic adhesive layer is patterned, and a plurality of recessed portions spaced apart from each other are formed in the upper surface layer of the organic adhesive layer.

Wherein, the organic adhesive layer has an upper surface and a lower surface arranged oppositely, and the upper surface is located on the lower surface. The upper surface layer is the part of the organic adhesive layer close to the upper surface, and the distance between each point in the upper surface layer and the upper surface is less than or equal to the set threshold. Illustratively, the organic subbing layer may consist of an upper surface layer and other layers located below the upper surface layer. For example, if the thickness of the organic adhesive layer is a and the thickness of the upper surface layer is b, the distance between each point in the upper surface layer and the upper surface is less than or equal to b, and b<a.

As shown in FIG. 5 , after step S304 is performed, a plurality of recessed portions 22 spaced apart from each other are formed in the upper surface layer of the organic adhesive layer 21 . In practical applications, the distribution area of the recessed portion 22 can be the same as the distribution area of the patch cords that electrically connect the light-emitting unit and the pixel circuit, so that the ITO material deposited in the recessed portion 22 can directly form patch cords, so that no ITO patterning is required. .

Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a mask, and then the organic adhesive layer is developed, so that the patterning of the organic adhesive layer can be realized. A plurality of recesses spaced apart from each other are opened in the upper surface layer of the .

When the organic adhesive layer is not a photoresist layer, first lay a photoresist layer on the organic adhesive layer, then expose the photoresist layer through a mask, and develop the photoresist layer to realize the photoresist layer. Layer patterning, then transfer the pattern of the photoresist layer to the organic adhesive layer, and finally remove the photoresist layer.

It should be noted that although the patterning of the organic adhesive layer and the patterning of ITO are both patterned, due to the different material properties, the specific process flow is different. The process flow of ITO patterning is more complicated, time-consuming, and has a greater impact on productivity. Therefore, changing from ITO patterning to organic adhesive layer patterning can reduce production time and increase productivity.

Step S306, depositing an ITO material on the organic adhesive layer, the deposition thickness of the ITO material is less than the depth of the depression, the ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the depression forms a second ITO film, The first ITO film and the second ITO film are isolated.

The inside and outside of the depression are located on different planes, and the ITO material deposited inside and outside the depression is also located on different planes. The corners of the depression cut off the ITO material inside and outside the depression, so the inside and outside of the depression automatically form ITO films that are separated from each other. That is, the ITO material deposited on the upper surface layer forms a first ITO thin film, and the ITO material deposited in the recess forms a second ITO thin film, and the first ITO thin film and the second ITO thin film are isolated.

As shown in FIG. 6 , after step S306 is performed, a first ITO film 31 is formed on the upper surface layer, a second ITO film 32 is formed in the recess, and the first ITO film 31 and the second ITO film 32 are disconnected.

Specifically, the ITO material is deposited on the organic adhesive layer by using a physical vapor deposition technique or a magnetron sputtering deposition technique.

In the above-mentioned ITO patterning method, an organic adhesive layer is provided first, and the organic adhesive layer is patterned, a plurality of recesses spaced apart from each other are opened in the upper surface layer of the organic adhesive layer, and then the ITO material is deposited on the organic adhesive layer. The ITO material on the upper surface layer forms the first ITO film, and the ITO material deposited in the recess forms the second ITO film. The first ITO film and the second ITO film are isolated. The special structure inside the organic adhesive layer can be used to make thinner The ITO material is automatically divided into a first ITO film and a second ITO film isolated from each other at the corners of the thicker recesses, and the distribution area of the recesses can be consistent with the distribution area of the patch cords, thereby reducing the patterning of the ITO film layer The number of times, improve the overall production capacity and reduce the realization cost.

In one embodiment, as shown in FIG. 6 , the deposition thickness d of the ITO material is 200 angstroms to 1000 angstroms.

The deposition thickness of the ITO material is 200 angstroms to 1000 angstroms, and a thinner thickness is conducive to the automatic separation of the ITO material deposited inside and outside the recess at the corners of the thicker recess. Moreover, the larger the deposition thickness of the ITO material, the better the orientation; the smaller the deposition thickness of the ITO material, the better the light transmission; the deposition thickness of the ITO material is 200 angstroms to 1000 angstroms, which can better balance the conductivity and light transmission. sex.

In one embodiment, as shown in FIG. 5 , the cross-sectional area of the concave portion 22 perpendicular to the opening direction (indicated by arrows in FIG. 5 ) gradually increases along the opening direction.

The cross-sectional area of the depression perpendicular to the opening direction gradually increases along the opening direction. The overall top is small and the bottom is large. The angle between the side wall and the bottom surface is an acute angle. The ITO material cannot be attached to the side wall, and the ITO material deposited inside and outside the depression Disconnect automatically.

Exemplarily, as shown in FIG. 5 , the recessed portion 22 is in the shape of a regular trapezoid.

The concave portion is in the shape of a regular trapezoid, which is conducive to automatic disconnection of the ITO material deposited inside and outside the concave portion, and is easy to realize in the process.

In an implementation manner of this embodiment, the organic glue includes negative photoresist.

As shown in Figure 7, step S304 includes:

Step S702 , exposing the organic adhesive layer through a mask, the mask including a plurality of non-light-transmitting regions spaced apart from each other, and light-transmitting regions located between the non-light-transmitting regions.

In step S704, the organic adhesive layer is developed, and the area of the organic adhesive layer opposite to the non-light-transmitting area forms a positive trapezoidal depression.

Negative photoresists are soluble substances before exposure to light, and insoluble substances are formed after exposure to light. The area opposite the organic adhesive layer and the non-transparent area has no light, and is still a soluble substance, which will dissolve after development; the area opposite the organic adhesive layer and the translucent area is illuminated and becomes an insoluble substance, which will remain after development. In the area opposite to the junction of the non-transmitting area and the translucent area, the upper part of the organic adhesive layer has light and becomes insoluble matter, which will be retained after development; will dissolve. Therefore, a depression in the shape of a regular trapezoid is finally formed in the area where the organic adhesive layer is opposite to the non-light-transmitting area.

In one embodiment, as shown in FIG. 8 , the depths of the at least two recesses 22 are different.

The depth of the recess is different, and the ITO material deposited in the recess can be located on different planes, which is conducive to the formation of different traces, and can separate adjacent traces to reduce the distance between adjacent traces on the plane, which is convenient for walking. line design.

Exemplarily, as shown in FIG. 8 , the recessed portion includes at least a first recessed portion and a second recessed portion, and the depth of the second recessed portion is greater than that of the first recessed portion.

In an implementation manner of this embodiment, as shown in FIG. 9 , step S304 includes:

In step S902, the organic adhesive layer is exposed through a mask, the mask includes a fully transparent area, a semi-transparent area and a non-transparent area, and the organic adhesive layer includes a negative photoresist.

In step S904, the organic adhesive layer is developed, the area of the organic adhesive layer opposite to the semi-transparent area forms a first concave portion, and the area of the organic adhesive layer opposite to the non-transparent area forms a second concave portion.

Negative photoresists are soluble substances before exposure to light, and insoluble substances are formed after exposure to light. The area opposite the organic adhesive layer and the non-transparent area has no light, and is still a soluble substance, which will dissolve after development; the area opposite the organic adhesive layer and the fully transparent area is fully illuminated, and all become insoluble substances, which will become insoluble after development. All are reserved; the area of the organic adhesive layer opposite to the semi-transparent area is illuminated but not sufficient, and there are still some soluble substances, and some of them will dissolve after developing. Therefore, the area of the organic adhesive layer opposite to the semi-transparent area forms a first recessed portion with a smaller depth, and the area of the organic adhesive layer opposite to the non-transparent area forms a second recessed portion with a larger depth.

In another implementation manner of this embodiment, as shown in FIG. 10 , step S304 includes:

Step S1002 , patterning the organic adhesive layer, and forming a plurality of first recesses spaced apart from each other in the organic adhesive layer.

Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a mask, and then the organic adhesive layer is developed, so that the patterning of the organic adhesive layer can be realized. A plurality of first recesses spaced apart from each other are set in the upper surface layer of the .

When the organic adhesive layer is not a photoresist layer, first lay a photoresist layer on the organic adhesive layer, then expose the photoresist layer through a mask, and develop the photoresist layer to realize the photoresist layer. Layer patterning, then transfer the pattern of the photoresist layer to the organic adhesive layer, and finally remove the photoresist layer.

Step S1004, etching part of the first recessed portion to form a second recessed portion.

Specifically, step S1004 may be similar to step S1002, and the difference mainly lies in that the selected masks are different, specifically, the distribution positions of the light-transmitting regions and the non-light-transmitting regions in the mask are different.

In this embodiment, the organic adhesive layer is patterned first, a first recessed portion with a smaller depth is formed in the organic adhesive layer, and then part of the first recessed portion is further etched to become a second recessed portion with a larger depth. A recessed portion is formed, thereby realizing the formation of a first recessed portion and a second recessed portion with different depths in the organic adhesive layer.

In one embodiment, the method further includes: etching a portion of the first ITO thin film to expose the upper surface layer.

Specifically, a photoresist layer is first laid on the ITO material, then the photoresist layer is exposed through a mask, and the photoresist layer is developed to realize the patterning of the photoresist layer, and then the photoresist layer is The pattern of the adhesive layer is transferred to the first ITO film, and finally the photoresist layer is removed.

In this embodiment, part of the first ITO film is etched to expose the upper surface layer, so that the distribution area of the first ITO film is consistent with the distribution area of the patch wire, so that the first ITO film is used to realize the electrical connection between the light-emitting unit and the pixel circuit , which is convenient for wiring design.

It should be noted that although ITO is patterned here, only one ITO patterning is performed in the entire process, which reduces the number of ITO patterning, improves overall productivity and reduces implementation costs.

In one embodiment, the method further includes: patterning the organic adhesive layer to form via holes in the organic adhesive layer. This step is performed after step S304 and before step S306.

As shown in FIG. 11 , after the above steps are performed, via holes 23 are formed in the organic adhesive layer 21 .

Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a mask, and then the organic adhesive layer is developed, so that the patterning of the organic adhesive layer can be realized. vias are formed inside.

When the organic adhesive layer is not a photoresist layer, first lay a photoresist layer on the organic adhesive layer, then expose the photoresist layer through a mask, and develop the photoresist layer to realize the photoresist layer. Layer patterning, then transfer the pattern of the photoresist layer to the organic adhesive layer, and finally remove the photoresist layer.

In this embodiment, via holes are formed in the organic adhesive layer, so that the ITO material deposited on the organic adhesive layer is electrically connected to the pixel circuit under the organic adhesive layer through the via holes. Specifically, the via hole penetrating the organic adhesive layer realizes the electrical connection between the first ITO film and the pixel circuit, and the via hole connected with the recess realizes the electrical connection between the second ITO film and the pixel circuit.

Exemplarily, as shown in FIG. 11 , the cross-sectional area of the via hole 23 perpendicular to the opening direction (indicated by arrows in FIG. 11 ) gradually decreases along the opening direction.

The cross-sectional area of the vias perpendicular to the opening direction gradually decreases along the opening direction, the overall upper surface is smaller and the lower surface is larger, and the angle between the sidewall and the bottom surface is an obtuse angle, which is conducive to the attachment of the ITO material to the sidewall to achieve electrical connection.

As shown in FIG. 12, an ITO graphic method is provided, which is a specific implementation of the ITO graphic method shown in FIG. 3, including the following steps:

Step S1202, providing an organic adhesive layer.

In step S1204, the organic adhesive layer is patterned, and a plurality of recesses spaced apart from each other are formed in the upper surface layer of the organic adhesive layer.

Step S1206, patterning the organic adhesive layer to form via holes in the organic adhesive layer.

Step S1208, depositing an ITO material on the organic adhesive layer, the deposition thickness of the ITO material is less than the depth of the depression, the ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the depression forms a second ITO film, The first ITO film and the second ITO film are isolated.

Step S1210, etching a part of the first ITO thin film to expose the upper surface layer.

It should be understood that, although the steps in the flowcharts involved in the above embodiments are sequentially displayed according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, the execution of these steps is not strictly limited to the order, and these steps may be performed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but may be performed at different times The execution order of these steps or phases is not necessarily sequential, but may be performed alternately or alternately with other steps or at least a part of the steps or phases in the other steps.

Based on the same inventive concept, an embodiment of the present application also provides a method for manufacturing a display panel, as shown in FIG. 13 , including the following steps:

Step S1302, providing a substrate provided with a pixel driving circuit, the substrate includes a main screen area, a sub-screen area, and a transition area between the main screen area and the sub-screen area, and the pixel driving circuit includes the main screen area and the transition area. multiple pixel circuits.

Step S1304, laying an organic adhesive layer on the side of the substrate where the pixel driving circuit is provided.

Step S1306, patterning the organic adhesive layer, opening vias in the organic adhesive layer that communicate with the pixel circuits in one-to-one correspondence, and opening the upper surface layer of the organic adhesive layer located in the secondary screen area and the transition area to communicate with the corresponding vias the depression.

Step S1308, depositing an ITO material on the side of the organic adhesive layer away from the pixel driving circuit, the deposition thickness of the ITO material is less than the depth of the depression, the ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the depression A second ITO film is formed, and the first ITO film is isolated from the second ITO film.

Wherein, the light-emitting unit located in the main screen area is electrically connected to the pixel circuit located in the main screen area through the first ITO film, and the light-emitting unit located in the sub-screen area and the transition area is connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film respectively. The pixel circuits of the regions are electrically connected.

In one embodiment, the cross-sectional area of the via hole that communicates with the recessed portion is perpendicular to the opening direction, and gradually decreases along the opening direction.

Exemplarily, the via hole communicating with the recessed portion has an inverted trapezoid shape.

In an implementation manner of this embodiment, the organic adhesive layer includes a positive photoresist and a negative photoresist stacked in sequence.

As shown in Figure 14, step S1306 includes:

Step S1402 , exposing the organic adhesive layer through a first mask, where the first mask includes a plurality of opaque areas spaced apart from each other, and transparent areas located between the opaque areas.

In step S1404 , the organic adhesive layer is developed, and a positive trapezoidal concave portion is formed in an area of the organic adhesive layer opposite to the opaque area.

FIG. 15 is a schematic structural diagram of the concave portion formed after step S1404 is performed in one embodiment, FIG. 16 is a cross-sectional view taken along A-A in FIG. 15 in one embodiment, and FIG. 17 is a cross-sectional view taken along B-B in FIG. 15 in one embodiment . As shown in FIGS. 15-17 , after step S1404 is performed, a regular trapezoidal recess 22 is formed in the organic adhesive layer 21 .

Step S1406 , exposing the organic adhesive layer through a second mask, where the second mask includes a plurality of light-transmitting regions spaced apart from each other, and non-light-transmitting regions located between the light-transmitting regions.

In step S1408, the organic adhesive layer is developed, and an inverted trapezoidal via hole is formed in an area of the organic adhesive layer opposite to the light-transmitting area.

FIG. 18 is a schematic structural diagram of the concave portion formed after step S1406 is performed in one embodiment, FIG. 19 is a cross-sectional view along A-A in FIG. 18 in one embodiment, and FIG. 20 is a cross-sectional view in C-C direction in FIG. 18 in one embodiment . As shown in FIGS. 18-20 , after step S1408 is performed, an inverted trapezoidal via hole 23 is formed in the organic adhesive layer 21 . Wherein, the inverted trapezoidal via hole 23 can pass through the organic adhesive layer 21 alone, so that the pixel circuit and the light-emitting unit are connected through ITO, as shown in FIG. 20 . The inverted trapezoidal via 23 can also penetrate the organic adhesive layer 21 together with the positive trapezoidal recess 22 to connect the pixel circuit and the light-emitting unit through ITO, as shown in FIG. 19 .

In practical applications, after the ITO material is deposited on the side of the organic adhesive layer away from the pixel driving circuit, the ITO material is automatically divided into a first ITO film deposited on the upper surface layer and a second ITO film deposited in the recess. The first ITO film and the second ITO film that are automatically separated can be used to form different transition lines, and an insulating medium with via holes can be deposited on the ITO material to realize the connection between different pixel circuits and light-emitting units, as shown in Figure 21. Show. A multilayer patch cord may also be formed using the second ITO thin film formed multiple times.

Based on the same inventive concept, an embodiment of the present application also provides a display panel (not shown in the figure) prepared by implementing the above-mentioned method for manufacturing a display panel. The display panel includes a substrate, a pixel driving circuit, an organic adhesive layer, a first ITO thin film, a second ITO thin film and a light-emitting layer group. The substrate includes a primary screen area, a secondary screen area, and a transition area between the primary screen area and the secondary screen area. The pixel driving circuit includes a plurality of pixel circuits arranged in the main screen area and the transition area. The organic adhesive layer is located on the side of the substrate where the pixel driving circuit is arranged, and the organic adhesive layer has via holes that are connected with the pixel circuits in one-to-one correspondence, and the upper surface layer of the organic adhesive layer located in the sub-screen area and the transition area has corresponding holes. The recessed portion communicated by the via hole. The first ITO film is on the upper surface layer. The second ITO thin film is located in the recessed portion, and the first ITO thin film and the second ITO thin film are isolated. The light-emitting layer group is located on the side of the organic adhesive layer where the first ITO film is arranged, the light-emitting layer group includes a plurality of light-emitting units located in the main screen area, the sub-screen area and the transition area, and the light-emitting units located in the main screen area pass through the first ITO film. The pixel circuits in the main screen area are electrically connected, and the light emitting units in the sub-screen area and the transition area are respectively electrically connected with the pixel circuits in the transition area through one of the first ITO film and the second ITO film.

The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, all It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the present application should be determined by the appended claims.

Claims (10)

1. A method of patterning ITO, the method comprising:

providing an organic glue layer;

patterning the organic adhesive layer, and forming a plurality of mutually spaced concave parts in the upper surface layer of the organic adhesive layer;

and depositing an ITO material on the organic glue layer, wherein the deposition thickness of the ITO material is smaller than the depth of the concave part, the ITO material deposited on the upper surface layer forms a first ITO thin film, the ITO material deposited in the concave part forms a second ITO thin film, and the first ITO thin film is isolated from the second ITO thin film.

2. The method according to claim 1, wherein the cross-sectional area of the recess perpendicular to the opening direction is gradually increased along the opening direction;

preferably, the recess is in the shape of a regular trapezoid.

3. The method of claim 1 or 2, wherein the depths of at least two of the recesses are different;

preferably, the recess includes at least a first recess and a second recess, and a depth of the second recess is greater than a depth of the first recess.

4. The method of claim 3, wherein patterning the organic glue layer to form a plurality of spaced apart recesses in an upper surface of the organic glue layer comprises:

exposing the organic adhesive layer through a mask, wherein the mask comprises a full-light-transmitting area, a semi-light-transmitting area and a non-light-transmitting area, and the organic adhesive layer comprises negative photoresist;

and developing the organic adhesive layer, wherein the first concave part is formed in the area of the organic adhesive layer opposite to the semi-light-transmitting area, and the second concave part is formed in the area of the organic adhesive layer opposite to the non-light-transmitting area.

5. The method of claim 3, wherein patterning the organic glue layer to form a plurality of spaced apart recesses in an upper surface of the organic glue layer comprises:

Patterning the organic adhesive layer, and forming a plurality of first sunken parts which are spaced from each other in the organic adhesive layer;

and etching part of the first concave part to form the second concave part.

6. The method of claim 1 or 2, wherein the ITO material is deposited to a thickness of 200 to 1000 angstroms.

7. The method according to claim 1 or 2, characterized in that the method further comprises:

and etching part of the first ITO film to expose the upper surface layer.

8. The method according to claim 1 or 2, characterized in that the method further comprises:

and patterning the organic glue layer, and forming a via hole in the organic glue layer.

9. A method for manufacturing a display panel, the method comprising:

providing a substrate provided with a pixel driving circuit, wherein the substrate comprises a main screen area, an auxiliary screen area and a transition area positioned between the main screen area and the auxiliary screen area, and the pixel driving circuit comprises a plurality of pixel circuits arranged in the main screen area and the transition area;

paving an organic adhesive layer on one side of the substrate, which is provided with the pixel driving circuit;

patterning the organic glue layer, forming through holes which are communicated with the pixel circuits in a one-to-one correspondence mode in the organic glue layer, and forming concave parts which are communicated with the corresponding through holes in the upper surface of the organic glue layer positioned in the auxiliary screen area and the transition area;

Depositing an ITO material on one side of the organic adhesive layer, which is far away from the pixel driving circuit, wherein the deposition thickness of the ITO material is smaller than the depth of the depressed part, the ITO material deposited on the upper surface layer forms a first ITO thin film, the ITO material deposited in the depressed part forms a second ITO thin film, and the first ITO thin film is isolated from the second ITO thin film; the light-emitting units positioned in the main screen area are electrically connected with the pixel circuits positioned in the main screen area through the first ITO thin film, and the light-emitting units positioned in the auxiliary screen area and the transition area are electrically connected with the pixel circuits positioned in the transition area through one of the first ITO thin film and the second ITO thin film respectively;

preferably, the cross-sectional area of the via hole communicated with the recessed portion, which is perpendicular to the opening direction, is gradually reduced along the opening direction;

preferably, the through hole communicated with the recess is in an inverted trapezoid shape.

10. A display panel, comprising:

the substrate comprises a main screen area, an auxiliary screen area and a transition area positioned between the main screen area and the auxiliary screen area;

the pixel driving circuit comprises a plurality of pixel circuits arranged in the main screen area and the transition area;

The organic glue layer is positioned on one side of the substrate, which is provided with the pixel driving circuit, through holes which are communicated with the pixel driving circuit in a one-to-one correspondence mode are formed in the organic glue layer, and concave parts which are communicated with the corresponding through holes are formed in the upper surface of the organic glue layer positioned in the auxiliary screen area and the transition area;

the first ITO film is positioned on the upper surface layer;

the second ITO film is positioned in the concave part, and the first ITO film is isolated from the second ITO film;

and the light-emitting layer group is positioned on one side of the first ITO film, and comprises a main screen area, an auxiliary screen area and a plurality of light-emitting units of the transition area, wherein the light-emitting units of the main screen area are electrically connected with pixel circuits of the main screen area through the first ITO film, and the light-emitting units of the auxiliary screen area and the transition area are electrically connected with the pixel circuits through one of the first ITO film and the second ITO film.

Images