CN103862865A - Printed board - Google Patents
Printed board Download PDFInfo
- Publication number
- CN103862865A CN103862865A CN201410093332.9A CN201410093332A CN103862865A CN 103862865 A CN103862865 A CN 103862865A CN 201410093332 A CN201410093332 A CN 201410093332A CN 103862865 A CN103862865 A CN 103862865A
- Authority
- CN
- China
- Prior art keywords
- insulation board
- superficial layer
- insulation plate
- surface layer
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 239000005011 phenolic resin Substances 0.000 claims abstract description 4
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 5
- 239000002344 surface layer Substances 0.000 abstract 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 238000007641 inkjet printing Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The invention discloses a printed board, which comprises a base plate, an insulation plate and a surface layer, wherein the base plate is provided with a plurality of grooves, a heat radiating material is filled into the grooves, the insulation plate is arranged on the base plate and the heat radiating material, the surface layer is arranged on the insulation plate, the insulation plate and the surface layer are respectively of a strip structure, the insulation plate adopts the phenolic resin glass fiber, and the surface layer is a rein film and is adhered to the insulation plate. The printed board has the advantages that by filling the heat radiating material, the printing heat is reduced during printing; by arranging the insulation plate and the surface layer, the better insulation effect is realized, the easiness in conduction is avoided, and the printing efficiency is improved.
Description
Technical field
The field that the present invention relates to printing, particularly relates to a kind of printed panel.
Background technology
Ink jet printing plate is the equipment that converts the electrical signal to physics pulse and spray the black drop storing.Along with ink jet printing plate can be produced in a large number, it not only for office's printing machine also for industrial printing machine.For example, ink jet printing plate not only uses in office, and with the printed document by ink-jet on paper, ink jet printing plate also uses in factory, to pass through carrying out direct generative circuit pattern to printed circuit board (PCB) (PCB) atomizing of liquids metal material.
Common ink jet printing plate can comprise multiple balancing gate pits and multiple nozzle.Ink jet printing plate can spray by described multiple nozzles the China ink of monochromatic China ink or multiple color simultaneously, thereby the print speed printing speed that has not only increased ink jet printing plate can also realize lively printing.
But in the structure of above-mentioned ink jet printing plate, the interval between balancing gate pit is very little, therefore, probably crosstalk, wherein, the expulsion pressure being formed in predetermined balancing gate pit affects adjacent balancing gate pit.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of printed panel, is filled with heat sink material, has reduced the heat of printing in the time of printing, and be provided with insulation board and superficial layer, can reach good insulation effect, not be prone to the phenomenon of conduction, thereby accelerate the efficiency of printing.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of printed panel is provided, comprise substrate, insulation board and superficial layer, on described substrate, be provided with multiple grooves, in described groove, be filled with heat sink material, described insulation board is arranged on the top of substrate and heat sink material, described superficial layer is arranged on the top of insulation board, described insulation board and superficial layer are strip structure, described insulation board adopts phenolic resins glass fibre, and described superficial layer is that resin molding is bonded on insulation board.
In a preferred embodiment of the present invention, described substrate is that metal material is made.
In a preferred embodiment of the present invention, described heat sink material is graphite.
In a preferred embodiment of the present invention, the thickness of described insulation board is 0.05mm.
In a preferred embodiment of the present invention, the thickness of described superficial layer is 0.08mm.
The invention has the beneficial effects as follows: printed panel of the present invention, be filled with heat sink material, in the time of printing, reduce the heat of printing, and be provided with insulation board and superficial layer, can reach good insulation effect, not be prone to the phenomenon of conduction, thereby accelerate the efficiency of printing.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of printed panel one preferred embodiment of the present invention;
Being labeled as in accompanying drawing: 1, substrate, 2, insulation board, 3, superficial layer, 4, heat sink material, 11, groove.
Detailed description of the invention
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of printed panel, comprise substrate 1, insulation board 2 and superficial layer 3, on described substrate 1, be provided with multiple grooves 11, in described groove 11, be filled with heat sink material 4, described insulation board 2 is arranged on the top of substrate 1 and heat sink material 4, and described superficial layer 3 is arranged on the top of insulation board 2, and described insulation board 2 and superficial layer 3 are strip structure, described insulation board 2 adopts phenolic resins glass fibre, and described superficial layer 3 is bonded on insulation board 2 for resin molding.
In above-mentioned, described substrate 1 is that metal material is made, generally uses steel or aluminum alloy materials, has reached good printing effect.
Further, described heat sink material 4 is graphite.Graphite chemical stability, has good chemical stability at normal temperatures, can be acidproof, alkaline-resisting and the corrosion of organic solvent-resistant, there is good heat dispersion.
In the present invention, the thickness of described insulation board 2 is 0.05mm; The thickness of described superficial layer 3 is 0.08mm.
The printed panel that the present invention discloses, is filled with heat sink material 4, has reduced the heat of printing, and be provided with insulation board 2 and superficial layer 3 in the time of printing, can reach good insulation effect, is not prone to the phenomenon of conduction, thereby has accelerated the efficiency of printing.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a printed panel, it is characterized in that, comprise substrate, insulation board and superficial layer, on described substrate, be provided with multiple grooves, in described groove, be filled with heat sink material, described insulation board is arranged on the top of substrate and heat sink material, described superficial layer is arranged on the top of insulation board, described insulation board and superficial layer are strip structure, and described insulation board adopts phenolic resins glass fibre, and described superficial layer is that resin molding is bonded on insulation board.
2. printed panel according to claim 1, is characterized in that, described substrate is that metal material is made.
3. printed panel according to claim 1, is characterized in that, described heat sink material is graphite.
4. printed panel according to claim 1, is characterized in that, the thickness of described insulation board is 0.05mm.
5. printed panel according to claim 1, is characterized in that, the thickness of described superficial layer is 0.08mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410093332.9A CN103862865A (en) | 2014-03-14 | 2014-03-14 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410093332.9A CN103862865A (en) | 2014-03-14 | 2014-03-14 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103862865A true CN103862865A (en) | 2014-06-18 |
Family
ID=50902154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410093332.9A Pending CN103862865A (en) | 2014-03-14 | 2014-03-14 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103862865A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5057853A (en) * | 1990-09-04 | 1991-10-15 | Xerox Corporation | Thermal ink jet printhead with stepped nozzle face and method of fabrication therefor |
| JPH1016229A (en) * | 1996-07-04 | 1998-01-20 | Matsushita Electric Ind Co Ltd | Ink jet recording head and method of manufacturing the same |
| JPH11216872A (en) * | 1997-11-17 | 1999-08-10 | Xerox Corp | Manufacture of ink jet print head |
| CN1919605A (en) * | 2005-08-27 | 2007-02-28 | 三星电子株式会社 | Inkjet printhead and method of manufacturing the same |
| CN101001752A (en) * | 2004-07-22 | 2007-07-18 | 佳能株式会社 | Inkjet recording head and inkjet recording device |
| CN102303455A (en) * | 2007-02-16 | 2012-01-04 | 兄弟工业株式会社 | Method of manufacturing piezoelectric actuator and method of manufacturing liquid transporting apparatus |
-
2014
- 2014-03-14 CN CN201410093332.9A patent/CN103862865A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5057853A (en) * | 1990-09-04 | 1991-10-15 | Xerox Corporation | Thermal ink jet printhead with stepped nozzle face and method of fabrication therefor |
| JPH1016229A (en) * | 1996-07-04 | 1998-01-20 | Matsushita Electric Ind Co Ltd | Ink jet recording head and method of manufacturing the same |
| JPH11216872A (en) * | 1997-11-17 | 1999-08-10 | Xerox Corp | Manufacture of ink jet print head |
| CN101001752A (en) * | 2004-07-22 | 2007-07-18 | 佳能株式会社 | Inkjet recording head and inkjet recording device |
| CN1919605A (en) * | 2005-08-27 | 2007-02-28 | 三星电子株式会社 | Inkjet printhead and method of manufacturing the same |
| CN102303455A (en) * | 2007-02-16 | 2012-01-04 | 兄弟工业株式会社 | Method of manufacturing piezoelectric actuator and method of manufacturing liquid transporting apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140618 |