CN103840045A - Light emitting device with multiple light emitting stacks - Google Patents
Light emitting device with multiple light emitting stacks Download PDFInfo
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- CN103840045A CN103840045A CN201310594256.5A CN201310594256A CN103840045A CN 103840045 A CN103840045 A CN 103840045A CN 201310594256 A CN201310594256 A CN 201310594256A CN 103840045 A CN103840045 A CN 103840045A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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Abstract
Description
技术领域technical field
本发明涉及一种发光装置,特别是涉及一种具有多个发光叠层的发光装置。The invention relates to a light-emitting device, in particular to a light-emitting device with multiple light-emitting laminated layers.
背景技术Background technique
发光二极管(Light-emitting Diode;LED)是一种固态半导体元件,其至少包含一p-n接面(p-n junction),此p-n接面形成于p型与n型半导体层之间。当于p-n接面上施加一定程度的偏压时,p型半导体层中的空穴与n型半导体层中的电子会结合而释放出光。此光产生的区域一般又称为发光区(light-emitting region)。A light-emitting diode (Light-emitting Diode; LED) is a solid-state semiconductor element that includes at least one p-n junction (p-n junction), which is formed between p-type and n-type semiconductor layers. When a certain degree of bias is applied to the p-n junction, holes in the p-type semiconductor layer and electrons in the n-type semiconductor layer will combine to release light. The region where this light is generated is generally called the light-emitting region.
LED的主要特征在于尺寸小、高演色性、可靠度高发光效率高、寿命长和反应快速,目前已经广泛地使用在光学显示装置、交通号志、数据储存装置、通讯装置、照明装置与医疗器材上。随着全彩LED的问世,LED已逐渐取代传统的照明设备,如荧光灯和白炽灯泡。The main features of LED are small size, high color rendering, high reliability, high luminous efficiency, long life and fast response. At present, it has been widely used in optical display devices, traffic signs, data storage devices, communication devices, lighting devices and medical equipment. With the advent of full-color LEDs, LEDs have gradually replaced traditional lighting equipment such as fluorescent lamps and incandescent bulbs.
在LED的制造成本中,基板的价格占据很大的比重,所以如何降低基板在LED中的使用量是引人关注的议题。In the manufacturing cost of the LED, the price of the substrate occupies a large proportion, so how to reduce the usage of the substrate in the LED is an issue that attracts attention.
发明内容Contents of the invention
为解决上述问题,本发明提供一发光装置,包含可射出具有第一主波长的第一光的一第一发光元件,其中第一发光元件具有包含第一数量的多重量子阱对的一第一多重量子阱结构;包含第二数量的多重量子阱对的一第二多重量子阱结构,位于第一多重量子阱结构之上;以及一穿隧层位于第一多重量子阱结构与第二多重量子阱结构之间;以及可射出具有第三主波长的第三光的一第二发光元件,其中第一数量不同于第二数量。In order to solve the above problems, the present invention provides a light-emitting device, including a first light-emitting element capable of emitting first light having a first dominant wavelength, wherein the first light-emitting element has a first number of multiple quantum well pairs comprising a first number Multiple quantum well structure; a second multiple quantum well structure including a second number of multiple quantum well pairs, located on the first multiple quantum well structure; and a tunneling layer between the first multiple quantum well structure and between the second multiple quantum well structures; and a second light-emitting element capable of emitting third light with a third dominant wavelength, wherein the first number is different from the second number.
一发光元件,具有包含第一数量的多重量子阱对的一第一多重量子阱结构;包含第二数量的多重量子阱对的一第二多重量子阱结构,位于第一多重量子阱结构之上;以及一第一穿隧层位于第一多重量子阱结构与第二多重量子阱结构之间,其中第一数量不同于第二数量A light-emitting element having a first multiple quantum well structure including a first number of multiple quantum well pairs; a second multiple quantum well structure including a second number of multiple quantum well pairs located in the first multiple quantum well structure; and a first tunneling layer located between the first multiple quantum well structure and the second multiple quantum well structure, wherein the first number is different from the second number
附图说明Description of drawings
图1绘示本申请案一实施例的发光元件的剖面示意图;FIG. 1 shows a schematic cross-sectional view of a light-emitting element according to an embodiment of the present application;
图2绘示本申请案另一实施例的发光元件的剖面示意图;FIG. 2 shows a schematic cross-sectional view of a light-emitting element according to another embodiment of the present application;
图3绘示本申请案一实施例的发光装置的剖面示意图;FIG. 3 shows a schematic cross-sectional view of a light emitting device according to an embodiment of the present application;
图4绘示本申请案一实施例的光源产生装置的示意图;FIG. 4 shows a schematic diagram of a light source generating device according to an embodiment of the present application;
图5绘示本申请案一实施例的背光模块的示意图。FIG. 5 is a schematic diagram of a backlight module according to an embodiment of the present application.
符号说明Symbol Description
1、2 发光元件1, 2 Light-emitting elements
10 基板10 Substrate
11 接触层11 Contact layer
12 第一粘结层12 First bonding layer
14、21 第一发光叠层14, 21 The first light-emitting stack
142 第一半导体层142 first semiconductor layer
144、212 第一主动层144, 212 The first active layer
146 第二半导体层146 Second semiconductor layer
16、22 第一穿隧层16, 22 The first tunneling layer
18、23 第二发光叠层18, 23 The second light-emitting stack
182 第三半导体层182 Third semiconductor layer
184、232 第二主动层184, 232 The second active layer
186 第四半导体层186 Fourth semiconductor layer
24 第二穿隧层24 Second tunneling layer
25 第三发光叠层25 Third light stack
252 第三主动层252 The third active layer
3 第二发光元件3 Second light-emitting element
4 发光装置4 Lighting device
40 载体40 carriers
5 光源产生装置5 light source generating device
51 光源51 light source
52 电源供应系统52 Power supply system
53 控制元件53 control elements
6 背光模块6 backlight module
61 光学元件61 Optics
具体实施方式Detailed ways
本发明的实施例会被详细地描述,并且绘制于附图中,相同或类似的部分会以相同的号码在各附图以及说明出现。Embodiments of the present invention will be described in detail and drawn in the accompanying drawings, and the same or similar parts will appear with the same numbers in the drawings and descriptions.
图1绘示一发光元件1具有一基板10;一第一粘结层12,形成于基板10之上;一第一发光叠层14,形成于第一粘结层12之上;一第一穿隧层16,形成于第一发光叠层14之上;一第二发光叠层18,形成于第一穿隧层16之上;以及一接触层11,形成于第二发光叠层18之上。第一发光叠层14具有一第一半导体层142、一第一主动层144以及一第二半导体层146形成于基板10与第一穿隧层16之间;第二发光叠层18具有一第三半导体层182、一第二主动层184以及一第四半导体层186形成于第一穿隧层16与接触层11之间。本实施例的第一发光元件1具有两层发光叠层位于基板10之上,相较于具有一层发光叠层位于基板上的一传统发光元件,优点之一是第一发光元件1所产生的流明约等于两个各自仅具有一主动层的传统发光元件的流明总和。此外,相较于各自具有基板的两个传统发光元件,因为第一发光元件1只使用一块基板,因此减少基板的使用量而降低制造成本。流明增加且成本降低,每块钱所产生的流明(流明/元)因而增加。第一发光元件1的输入功率也大于传统发光元件。因为第一发光元件1具有两层发光叠层且顺向电压增加,在输入与传统发光元件相同的操作电流下,第一发光元件1的输入功率增加,所以第一发光元件1所产生的流明增加。此外,因为串联电阻大于片电阻,所以提升电流扩散。第一发光叠层14经电流通过的面积增加,发光效率因此提升。1 shows a light-emitting element 1 with a
此外,第一主动层144具有包含第一数量的多重量子阱对的第一多重量子阱结构,其中多重量子阱对包含一阱层与一阻障层,阻障层的能隙高于阱层的能隙。第二主动层184具有包含第二数量的多重量子阱对的第二多重量子阱结构,第一数量不同于第二数量。另一实施例中,第一数量可大于第二数量。当第一数量与第二数量的总合固定,此实施例的第一发光元件1的发光效率高于第一数量等于第二数量的另一传统双接面发光元件的发光效率。例如第一数量与第二数量的总合为10,此实施例的第一数量为7,第二数量为3,第一多重量子阱结构与第二多重量子阱结构所产生之光的流明与第一数量和第二数量皆为5的传统双接面发光元件所产生之光的流明相同。然而因为第一发光元件的第二数量小于第一数量,较少的多重量子阱对可吸收第一多重量子阱结构所发之光,所以第一发光元件1的发光效率大于传统双接面发光元件的发光效率。In addition, the first
基板10可用以成长及/或支持位于其上的发光叠层,其材料可为绝缘材料或导电材料。绝缘材料包含但不限于蓝宝石(Sapphire)、钻石(Diamond)、玻璃(Glass)、石英(Quartz)、压克力(Acryl)或氮化铝(AlN)。导电材料包含但不限于铜(Cu)、铝(Al)、类钻碳薄膜(Diamond Like Carbon;DLC)、碳化硅(SiC)、金属基复合材料(Metal Matrix Composite;MMC)、陶瓷基复合材料(Ceramic Matrix Composite;CMC)、硅(Si)、磷化碘(IP)、砷化镓(GaAs)、锗(Ge)、磷化镓(GaP)、磷砷化镓(GaAsP)、硒化锌(ZnSe)、氧化锌(ZnO)、磷化铟(InP)、镓酸锂(LiGaO2)或铝酸锂(LiAlO2)。其中可用以成长发光叠层的材料例如为蓝宝石、砷化镓或碳化硅。当基板10用以成长发光叠层,第一粘结层12可以用作成长发光叠层的缓冲层取代。The
第一粘结层12可连接基板10与第一发光叠层14,以及包含多个附属层(未显示)。第一粘结层12的材料可为导电材料,包含但不限于氧化铟锡(ITO)、氧化铟(InO)、氧化锡(SnO)、氧化镉锡(CTO)、氧化锑锡(ATO)、氧化铝锌(AZO)、氧化锌锡(ZTO)、氧化镓锌(GZO)、氧化锌(ZnO)、氧化钇锌(YZO)、氧化铟锌(IZO)、类钻碳薄膜、铜(Cu)、铝(Al)、锡(Sn)、金(Au)、铂(Pt)、锌(Zn)、银(Ag)、钛(Ti)、镍(Ni)、铅(Pb)、钯(Pd)、锗(Ge)、铬(Cr)、镉(Cd)、钴(Co)、锰(Mn)、锑(Sb)、铋(Bi)、镓(Ga)、钨(W)、银-钛(Ag-Ti)、铜-锡(Cu-Sn)、铜-锌(Cu-Zn)、铜-镉(Cu-Cd)、锡-铅-锑(Sn-Pb-Sb)、锡-铅-锌(Sn-Pb-Zn)、镍-锡(Ni-Sn)、镍-钴(Ni-Co)或金合金(Au alloy)等。缓冲层的材料可为半导体材料,包含一种以上的元素,此元素可选自镓(Ga)、铝(Al)、铟(In)、磷(P)、氮(N)、锌(Zn)、镉(Cd)与硒(Se)所构成的群组。第一粘结层12可更包含反射层(未显示)以反射发光叠层所产生之光。反射层的材料可包含但不限于铜(Cu)、铝(Al)、锡(Sn)、金(Au)、铂(Pt)、锌(Zn)、银(Ag)、钛(Ti)、镍(Ni)、铅(Pb)、银-钛(Ag-Ti)、铜-锡(Cu-Sn)、铜-锌(Cu-Zn)、铜-镉(Cu-Cd)、锡-铅-锑(Sn-Pb-Sb)、锡-铅-锌(Sn-Pb-Zn)、镍-锡(Ni-Sn)、镍-钴(Ni-Co)、银-铜(Ag-Cu)或金合金(Au alloy)The first
第一发光叠层14及/或第二发光叠层18可直接成长于基板10之上,或通过第一粘结层12固定于基板10之上。第一发光叠层14及第二发光叠层18的材料可为半导体材料,包含一种以上的元素,此元素可选自镓(Ga)、铝(Al)、铟(In)、磷(P)、氮(N)、锌(Zn)、镉(Cd)与硒(Se)所构成的群组。第一半导体层142与第二半导体层146的电性相异,第三半导体层182与第二半导体层186的电性相异。第一主动层144与第二主动层184可发光,其中第一主动层144具有第一能隙及第二主动层184具有第二能隙,此实施例中第一能隙不同于第二能隙。第一能隙与第二能隙的能隙差介于0.3eV与0.5eV之间,第一能隙可小于或大于第二能隙,例如第一能隙为1.45eV,第二能隙为1.9eV。又一实施例中,第一主动层144所产生之光是人眼无法辨识的不可见光,此实施例的不可见光波长约为小于400nm或大于780nm,较佳为介于780nm与2500nm之间或介于300nm与400nm之间,更佳为介于780nm与900nm之间。第二主动层184所产生之光是人眼可辨识的可见光,此实施例的可见光波长约介于400nm与780nm之间,较佳为介于560nm与750nm之间。另一实施例中,第一主动层144所产生之光具有一第一主波长,第二主动层184所产生之光具有一第二主波长,第一主波长与第二主波长的波长差约为150nm至220nm,第一主波长可大于或小于第二主波长。此实施例可应用于医疗领域,优点之一是一个发光元件可同时具有不同功能;例如第一主波长为815nm,可促进伤口愈合,第二主波长为633nm,有助于消除细纹。The first
另一实施例中,第一主动层144由一第一量子阱与一第二量子阱交互堆叠形成,其中第一量子阱具有一第一量子阱能隙,第二量子阱具有一第二量子阱能隙,第一量子阱能隙与第二量子阱能隙相异,第一量子阱能隙与第二量子阱能隙的能隙差约为0.06eV至0.1eV,第一量子阱能隙可小于或大于第二量子阱能隙。第二主动层184由一第三量子阱与一第四量子阱交互堆叠形成,其中第三量子阱具有一第三量子阱能隙,第四量子阱具有一第四量子阱能隙,第三量子阱能隙与第四量子阱能隙相异,第三量子阱能隙与第四量子阱能隙的能隙差约为0.06eV至0.1eV,第一量子阱能隙可小于或大于第二量子阱能隙。In another embodiment, the first
第一穿隧层16成长于第一发光叠层14之上,其掺杂浓度大于8x1018/cm3,所以电子可利用穿隧效应通过第一穿隧层16。第一穿隧层16的材料可为半导体材料,包含一种以上的元素,此元素可选自镓(Ga)、铝(Al)、铟(In)、磷(P)、氮(N)、锌(Zn)、镉(Cd)与硒(Se)所构成的群组。另一实施例中,第一穿隧层16可被一第二粘结层置换,以粘结第一发光叠层14与第二发光叠层18。第二粘结层的材料包含透明导电材料,例如氧化铟锡(ITO)、氧化铟(InO)、氧化锡(SnO)、氧化镉锡(CTO)、氧化锑锡(ATO)、氧化锌(ZnO)、氧化镁(MgO)、砷化铝镓(AlGaAs)、氮化镓(GaN)、磷化镓(GaP)、氧化铝锌(AZO)、氧化锌锡(ZTO)、氧化镓锌(GZO)、氧化铟锌(IZO)或氧化钽(Ta2O5);或是绝缘材料,例如Su8、苯并环丁烯(BCB)、过氟环丁烷(PFCB)、环氧树脂(Epoxy)、丙烯酸树脂(Acrylic Resin)、环烯烃聚合物(COC)、聚甲基丙烯酸甲酯(PMMA)、聚对苯二甲酸乙二酯(PET)、聚亚酰胺(PI)、聚碳酸酯(PC)、聚醚酰亚胺(Polyetherimide)、氟碳聚合物(FluorocarbonPolymer)、玻璃(Glass)、氧化铝(Al2O3)、氧化硅(SiO2)、氧化钛(TiO2)、氮化硅(SiNx)、旋涂玻璃(SOG)或四乙氧基硅烷(TEOS)。接触层11用以传导电流,其材料包含GaP、AlxGa1-xAs(0≤x≤1)或AlaGabIn1-a-bP(0≤a≤1,0≤b≤1,0≤a+b≤1)。The
图2绘示一第一发光元件2具有一基板10;一第一粘结层12,形成于基板10之上;一第一发光叠层21,形成于第一粘结层12之上;一第一穿隧层22,形成于第一发光叠层21之上;一第二发光叠层23,形成于第一穿隧层22之上;一第二穿隧层24,形成于第二发光叠层23之上;一第三发光叠层25,形成于第二穿隧层24之上;以及一接触层11,形成于第三发光叠层25之上。第一发光叠层21具有一第一主动层212;第二发光叠层23具有一第二主动层232;以及第三发光叠层25具有一第三主动层252。本实施例的第一发光元件2具有三层发光叠层位于基板10之上,优点之一是第一发光元件2所产生的流明约等于三个传统发光元件的流明总和。此外,相较三个传统发光元件使用三块基板,因为第一发光元件2只使用一块基板,因此减少基板的使用量而降低制造成本。流明增加且成本降低,每块钱所产生的流明(流明/元)也因而增加。第一发光元件2的输入功率也大于传统发光元件。因为第一发光元件2具有三层发光叠层且顺向电压增加,在输入与传统发光元件相同的操作电流下,第一发光元件2的输入功率增加,所以第一发光元件2所产生的流明增加。此外,因为串联电阻大于片电阻,所以提升电流扩散。第一发光叠层21经电流通过的面积增加,发光效率因此提升。2 shows a first light-emitting
此外,第一主动层212具有包含第一数量的多重量子阱对的第一多重量子阱结构,其中多重量子阱对包含一阱层与一阻障层,阻障层的能隙高于阱层的能隙。第二主动层232具有包含第二数量的多重量子阱对的第二多重量子阱结构。第三主动层252具有一第三多重量子阱结构,其中第三多重量子阱结构可发出一具有第四主波长的第四光,且具有一第三数量的多重量子阱对,第一数量、第二数量与第三数量皆不相同。另一实施例中,第一数量可大于第二数量且第二数量可大于第三数量。当第一数量、第二数量与第三数量的总合固定,此实施例的第一发光元件2的发光效率会高于第一数量、第二数量与第三数量皆相等的另一传统三接面发光元件的发光效率。例如第一数量、第二数量与第三数量的总合为15,此实施例的第一数量为7,第二数量为5,第三数量为3,第一多重量子阱结构、第二多重量子阱结构与第三多重量子阱结构所产生之光的流明与第一数量、第二数量和第三数量皆为5的传统双接面发光元件所产生之光的流明相同。然而因为第一发光元件2的第二数量或第三数量小于第一数量,较少的多重量子阱对可吸收第一多重量子阱结构所发之光,所以第一发光元件2的发光效率大于传统三接面发光元件的发光效率。In addition, the first
如图3所示,一发光装置4包含一载体40;第一发光元件1形成于载体40一部分之上;以及一第二发光元件3形成于载体40另一部分之上。第一发光元件1具有可发出具有第一主波长的第一光的第一发光叠层14,以及可发出具有第二主波长的第二光的第二发光叠层18,其中第一主波长不同于第二主波长。第二发光元件3具有可发出具有第三主波长的第三光的第三发光叠层(未显示),其中第三主波长可不同于第一主波长与第二主波长。因为第一光、第二光与第三光具有不同的主波长,可显示不同颜色,所以第一光、第二光与第三光混合所产生的混合光具有较好的演色性指数(CRI)。例如混合光是白光,白光具有第一光是红光;第二光是绿光;以及第三光是蓝光。另一实施例中,一波长转换层(未显示)可位于第二发光元件3之上,以致于所产生的第三光是色温约介于5700K与6500K之间的冷白光。第一发光元件1可射出主波长不同的第一光与第二光,第一光、第二光与第三光可混合后产生色温约介于2700K与3700K的暖白光,所以发光装置4的演色性指数较第一发光元件仅具有一种主波长的传统发光装置为佳。发光装置4的演色性指数至少为80,更佳为90,且红色指数R9至少为50。第一光与第二光可显示相同颜色,例如红色。一实施例中,第一主动层144具有一多重量子阱结构,多重量子阱结构由多个第一阱层与多个第一阻障层交互堆叠形成,第二主动层184具有另一多重量子阱结构,另一多重量子阱结构由多个第二阱层与多个第二阻障层交互堆叠形成。第一阱层与第二阱层的材料可由化学式InxGa1-xP或InxGa1-xAs表示,且0<x<1,其中第一阱层中x所显示铟的比例大于第二阱层。第一阱层中铟的比例与第二阱层中铟的比例差异约介于1%与6%,较佳为约介于2%与5%。第一主波长与第二主波长之差可约介于5纳米与30纳米,较佳为约介于10纳米与25纳米。此实施例中,第一主波长例如为615纳米至635纳米,第二主波长例如为605纳米至625纳米。As shown in FIG. 3 , a
载体40可用以成长且/或支持位于其上的发光元件,其材料可为绝缘材料或导电材料。绝缘材料包含但不限于蓝宝石(Sapphire)、钻石(Diamond)、玻璃(Glass)、石英(Quartz)、压克力(Acryl)、氧化锌(ZnO)或氮化铝(AlN)。导电材料包含但不限于铜(Cu)、铝(Al)、类钻碳薄膜(Diamond Like Carbon;DLC)、碳化硅(SiC)、金属基复合材料(Metal Matrix Composite;MMC)、陶瓷基复合材料(Ceramic Matrix Composite;CMC)、硅(Si)、磷化碘(IP)、砷化镓(GaAs)、锗(Ge)、磷化镓(GaP)、磷砷化镓(GaAsP)、硒化锌(ZnSe)、氧化锌(ZnO)、磷化铟(InP)、镓酸锂(LiGaO2)或铝酸锂(LiAlO2)。其中可用以成长发光叠层的材料例如为蓝宝石、砷化镓或碳化硅。The
图4是绘示出一光源产生装置示意图,一光源产生装置5包含本发明任一实施例中的发光元件或发光装置。光源产生装置5可以是一照明装置,例如路灯、车灯或室内照明光源,也可以是交通号志或一平面显示器中背光模块的一背光光源。光源产生装置5具有前述发光装置组成的一光源51、一电源供应系统52以供应光源51一电流、以及一控制元件53,用以控制电源供应系统52。FIG. 4 is a schematic diagram of a light source generating device. A light source generating device 5 includes the light emitting element or light emitting device in any embodiment of the present invention. The light source generating device 5 can be a lighting device, such as a street lamp, a car lamp or an indoor lighting source, and can also be a traffic signal or a backlight source of a backlight module in a flat panel display. The light source generating device 5 has a
图5是绘示出一背光模块剖面示意图,一背光模块6包含前述实施例中的光源产生装置5,以及一光学元件61。光学元件61可将由光源产生装置5发出的光加以处理,以应用于平面显示器,例如散射光源产生装置5发出的光。FIG. 5 is a schematic cross-sectional view of a backlight module. A
上述实施例仅为例示性说明本申请案的原理及其功效,而非用于限制本申请案。任何本申请案所属技术领域中具有通常知识者均可在不违背本申请案的技术原理及精神的情况下,对上述实施例进行修改及变化。因此本申请案的权利保护范围如上述的申请专利范围所列。The above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present application, but are not intended to limit the present application. Anyone with ordinary knowledge in the technical field to which this application belongs can modify and change the above embodiments without violating the technical principle and spirit of this application. Therefore, the scope of protection of the rights of this application is listed in the scope of patent application mentioned above.
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| US13/683,476 | 2012-11-21 | ||
| US13/683,476 US8927958B2 (en) | 2011-07-12 | 2012-11-21 | Light-emitting element with multiple light-emitting stacked layers |
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| JP (1) | JP2014103391A (en) |
| KR (2) | KR20140065340A (en) |
| CN (1) | CN103840045A (en) |
| DE (1) | DE102013108782B4 (en) |
| TW (1) | TWI589019B (en) |
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| CN102593289A (en) * | 2011-01-10 | 2012-07-18 | 晶元光电股份有限公司 | Light emitting element |
| CN108365062A (en) * | 2017-01-26 | 2018-08-03 | 晶元光电股份有限公司 | Semiconductor device with a plurality of semiconductor chips |
| CN113140657A (en) * | 2021-05-13 | 2021-07-20 | 西安瑞芯光通信息科技有限公司 | Ultraviolet LED epitaxial structure and preparation method thereof |
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| US10396240B2 (en) * | 2015-10-08 | 2019-08-27 | Ostendo Technologies, Inc. | III-nitride semiconductor light emitting device having amber-to-red light emission (>600 nm) and a method for making same |
| DE102017103856A1 (en) * | 2017-02-24 | 2018-08-30 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip |
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| CN113140657B (en) * | 2021-05-13 | 2022-04-19 | 西安瑞芯光通信息科技有限公司 | Ultraviolet LED epitaxial structure and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140065340A (en) | 2014-05-29 |
| DE102013108782B4 (en) | 2024-05-08 |
| TWI589019B (en) | 2017-06-21 |
| DE102013108782A1 (en) | 2014-05-22 |
| KR20180064348A (en) | 2018-06-14 |
| JP2014103391A (en) | 2014-06-05 |
| TW201421737A (en) | 2014-06-01 |
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