CN103717050A - Thin-type flexible thermally-cured electromagnetic shielding glue film - Google Patents
Thin-type flexible thermally-cured electromagnetic shielding glue film Download PDFInfo
- Publication number
- CN103717050A CN103717050A CN201310653896.9A CN201310653896A CN103717050A CN 103717050 A CN103717050 A CN 103717050A CN 201310653896 A CN201310653896 A CN 201310653896A CN 103717050 A CN103717050 A CN 103717050A
- Authority
- CN
- China
- Prior art keywords
- hot curing
- electromagnetic shielding
- particle
- low profile
- glued membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title abstract description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 239000012528 membrane Substances 0.000 claims abstract description 15
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 10
- 230000005389 magnetism Effects 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229920000180 alkyd Polymers 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical class [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 2
- -1 iron silicon aluminum series Chemical class 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 abstract description 3
- 230000032798 delamination Effects 0.000 abstract description 2
- 238000002845 discoloration Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a thin-type flexible thermally-cured electromagnetic shielding glue film. The film comprises a press-fit high-temperature-resistant protection membrane, a composite flexible insulating layer, thermally-cured conducting adhesive, and a release protection membrane, which are laminated sequentially from the bottom to the top. The film is extremely small in thickness and excellent in flexibility, thereby being capable of satisfying the repeated bending and sliding of a soft board during the using process. The whole shielding glue film has a relatively high heat resisting property and does not have delamination and discoloration problems after being subjected to multiple times of reflow soldering tests.
Description
Technical field
The present invention relates to flexible circuit board technical field, relate in particular to a kind of low profile flexible hot curing electromagnetic shielding glued membrane.
Background technology
Along with consumer electronics produces brilliant develop rapidly, product function day by day perfect, in use there is the mutual interference problem of a large amount of electromagnetic signals in flexible circuit board, affects the transmission quality of the signal of telecommunication between circuit, so electromangnetic spectrum becomes inevitable.
Current at flexible circuitry board industry, be generally to change blind and head it off with electromagnetic shielding film.The electromagnetic shielding film existing on the market mainly contains following several structure:
The first structure: skin is a kind of insulating barrier, forms layer of metal conductor layer on it, the structure that is coated with conducting resinl on metal conducting layer realizes function of shielding.Owing to there being one deck continuous metal conductor layer, there is higher shielding properties, but this structure is more than frequency is increased to 1GHz, screening effectiveness declines to a great extent, and in production process technique this is more loaded down with trivial details.
If notification number is CN101448362B, name is called the ultra-thin shielding film that < < can change circuit impedance, the Chinese invention patent of circuit board and preparation method thereof > >, and notification number is CN101176388A, name is called < < screened film, shielded printed circuit board, shielded flexible printed circuit board, the Chinese invention patent of method of manufacturing shielding film and method of manufacturing shielded printed circuit board > >, all adopt the first structure, there is certain deficiency.
The second structure: skin is metal conducting layer, internal layer is conductive adhesive layer, if publication number is CN1842245A, name is called < < with the electronic building brick of conductive layer and the Chinese invention patent of conductive adhesive film and its manufacture method > >, this material is not owing to there is no insulating barrier, and the scope of application is subject to certain limitation.
The third structure: sputter layer of metal target on film, or the copper-clad surface coating conducting resinl in the copper-clad plate of the thin property of one deck single-sided flexible, if notification number is CN1819758A, name is called the Chinese invention patent of < < double electromagnetic shielding membrane > >, notification number is CN101521985A, name is called < < shielding construction and has the Chinese invention patent of the flexible printed circuit board > > of this shielding construction.These 2 kinds of structure fabrication technique more complicated, to equipment requirement, this is higher, and cost is high, nocompetitive.
Several structures, having problem more or less aspect shielding properties, bending property, production technology, cost, have certain gap with light, thin, the short and small instructions for use of flexible circuit board above.
Summary of the invention
The present invention is in order to solve the above-mentioned deficiency of prior art, proposed a kind of anti-children that lift sleep by.
In order to solve the problems of the technologies described above; the present invention is by the following technical solutions: a kind of low profile flexible hot curing electromagnetic shielding glued membrane, comprises from bottom to up the superimposed successively high temperature resistant diaphragm of pressing, composite and flexible insulating barrier, hot curing conductive adhesive and release diaphragm.
Described pressing is high temperature resistant, and diaphragm is one or more compound the making in MODIFIED PP film, PET film, PEN film, PI film.
Described composite and flexible insulating barrier is by flexible insulating layer and compound the making of soft magnetism powder thin layer.
Described flexible insulating layer is that one or more in acrylic resin, epoxy resin, polyimide based resin, Modified Epoxy Resin by Elastomers, rubber-like acrylate, alkyd based resin, phenolic resinoid and carbamate resinoid are compounded to form.
Described soft magnetism powder thin layer is that one or more in iron Si system alloy, iron aluminum series alloy, iron silicon aluminum series alloy, nickel iron-based alloy, iron Co-based alloy, soft magnetic ferrite, amorphous soft magnetic alloy and super-microcrystalline soft magnetic alloy are combined to form, and this soft magnetism powder thin layer thickness is 0.1um to 1um.
One or more in acrylic resin, epoxy resin, polyimide based resin, Modified Epoxy Resin by Elastomers, rubber-like acrylate, alkyd based resin, phenolic resinoid and carbamate resinoid of described hot curing conductive adhesive are compounded to form, and conducting particles in this hot curing conductive adhesive fusion.
Described conducting particles comprises carbon powder particle, silver-colored particle, nickel, copper particle, nickel gold grain, copper nickel particle, silver-colored copper-clad particle, silver-colored nickel coat particle, nickel gold grain, silver bag plastic grain and Yin Bao glass particle, and the average diameter of described conducting particles is 1um to 20um.
According to actual service condition, hot curing conductive adhesive is preferentially selected epoxy resin and the acrylic resin that hot curing performance is good, the thickness of hot curing conductive adhesive is preferentially selected 5um to 30um, conducting particles is from the viewpoint of cost and the silver-colored copper-clad of the preferential selection of conductivity, the average diameter of conducting particles is preferentially selected 1um to 20um, and the proportion of conducting particles and glue is preferentially selected 20%-100%.
A kind of manufacture method of low profile flexible hot curing electromagnetic shielding glued membrane comprises following steps:
The first, on the high temperature resistant diaphragm of pressing, form composite and flexible insulating barrier;
The second, on composite and flexible insulating barrier, form conductive layer;
The 3rd, on conductive layer, there is release diaphragm.
Compared with prior art, the present invention has thickness as thin as a wafer, excellent pliability, can meet bending repeatedly and slip in soft board use procedure, and have higher peel strength, whole screened film has higher thermal endurance, through multi-reflow, not delamination nondiscolouring is tested in weldering.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with drawings and Examples, invention is described in detail.
Embodiment 1
As shown in Figure 1; pressing is high temperature resistant, and diaphragm 105 selection thickness are on 25um to 100um; by coating method, form flexible insulating layer 104, flexible insulating layer adopts the mixture of acrylic resin, epoxy resin, polyimide based resin, Modified Epoxy Resin by Elastomers, rubber-like esters of acrylic acid and phenolic resinoid.
On flexible insulating layer 104, by chemical plating mode, electron gun evaporation plating, sputter plating, plating or its combination process, form soft magnetism powder thin layer 103, thickness is 0.1um to 1um, whole composite and flexible insulating barrier 106 comprises soft magnetism powder thin layer 103 and flexible insulating layer 104, and gross thickness is at 10um to 30um.
On composite and flexible insulating barrier 106, form hot curing conductive adhesive 102, hot curing conductive adhesive is the mixture of olefin(e) acid esters resin, epoxy resin, Modified Epoxy Resin by Elastomers, rubber-like acrylate, phenolic resinoid, the conducting particles wherein adding is carbon dust, silver, nickel, copper particle, nickel gold, copper nickel, silver-colored copper-clad, silver-colored nickel coat, the plastic material of nickel gold, silver, silver bag glass particle, for a kind of or two kinds of above mixtures wherein, conducting particles is from the viewpoint of cost and the silver-colored copper-clad of the preferential selection of conductivity.The thickness of hot curing conductive adhesive 102 is 5um to 30um, and the proportion of conducting particles and glue is preferentially selected 20%-100%.
On hot curing conductive adhesive 102, be compounded with release protective film 101, thickness is 25um to 100um, and material is polyester, mainly protects conductive adhesive not contaminated.Thermal endurance and pressing are high temperature resistant, and diaphragm 105 has gap, and it is indeformable that the latter can carry out 170 ℃ to 190 ℃ pressings.
Embodiment 2 to embodiment 3, and what composite insulation layer resin all adopted is the improved epoxy resin of special process, and the thickness of this resin bed coating is different, and conductive layer resin is ordinary hot thermoset epoxy resin, adds partially modified resin, and thickness is different.
Comparative example 1 and this is example 2, and the matrix resin of composite insulation layer is replaced by LNBR modified epoxy, and other are all identical with embodiment.Concrete testing differentia sees table 1.
In embodiment and comparative example, due to the difference of matrix resin that composite insulation layer adopts, cause the slip test of whole electromagnetic shielding glued membrane to have great difference.Use the epoxy resin of the mixing modification of special process to guarantee splendid flexible, can meet flexible circuit board bending, slide and use.Aspect screening effectiveness, because conductive layer is consistent with soft magnetism powder film layer structure, no significant difference, all can meet user demand.Aspect the peel strength with lamination matrix Copper Foil, all show good adhesive force, meet instructions for use.
Above-described embodiment has only been expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, patent of the present invention and protection range should be as the criterion with appended claims.
Claims (7)
1. a low profile flexible hot curing electromagnetic shielding glued membrane, is characterized in that: comprise from bottom to up the superimposed successively high temperature resistant diaphragm of pressing, composite and flexible insulating barrier, hot curing conductive adhesive and release diaphragm.
2. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 1, is characterized in that: described pressing is high temperature resistant, and diaphragm is one or more compound the making in MODIFIED PP film, PET film, PEN film, PI film.
3. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 1, is characterized in that: described composite and flexible insulating barrier is by flexible insulating layer and compound the making of soft magnetism powder thin layer.
4. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 3, is characterized in that: described flexible insulating layer is that one or more in acrylic resin, epoxy resin, polyimide based resin, Modified Epoxy Resin by Elastomers, rubber-like acrylate, alkyd based resin, phenolic resinoid and carbamate resinoid are compounded to form.
5. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 3, it is characterized in that: described soft magnetism powder thin layer is that one or more in iron Si system alloy, iron aluminum series alloy, iron silicon aluminum series alloy, nickel iron-based alloy, iron Co-based alloy, soft magnetic ferrite, amorphous soft magnetic alloy and super-microcrystalline soft magnetic alloy are combined to form, and this soft magnetism powder thin layer thickness is 0.1um to 1um.
6. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 1, it is characterized in that: one or more in acrylic resin, epoxy resin, polyimide based resin, Modified Epoxy Resin by Elastomers, rubber-like acrylate, alkyd based resin, phenolic resinoid and carbamate resinoid of described hot curing conductive adhesive are compounded to form, and conducting particles in this hot curing conductive adhesive fusion.
7. low profile flexible hot curing electromagnetic shielding glued membrane as claimed in claim 6, it is characterized in that: described conducting particles comprises carbon powder particle, silver-colored particle, nickel, copper particle, nickel gold grain, copper nickel particle, silver-colored copper-clad particle, silver-colored nickel coat particle, nickel gold grain, silver bag plastic grain and Yin Bao glass particle, and the average diameter of described conducting particles is 1um to 20um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310653896.9A CN103717050A (en) | 2013-12-03 | 2013-12-03 | Thin-type flexible thermally-cured electromagnetic shielding glue film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310653896.9A CN103717050A (en) | 2013-12-03 | 2013-12-03 | Thin-type flexible thermally-cured electromagnetic shielding glue film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103717050A true CN103717050A (en) | 2014-04-09 |
Family
ID=50409468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310653896.9A Pending CN103717050A (en) | 2013-12-03 | 2013-12-03 | Thin-type flexible thermally-cured electromagnetic shielding glue film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103717050A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517422A (en) * | 2016-01-15 | 2016-04-20 | 深圳市金凯新瑞光电股份有限公司 | Composite film material |
| CN107227120A (en) * | 2017-07-20 | 2017-10-03 | 海宁卓泰电子材料有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN107513351A (en) * | 2017-10-11 | 2017-12-26 | 广东正业科技股份有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN108297502A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of soft magnetic materials base material |
| CN108928056A (en) * | 2018-08-01 | 2018-12-04 | 京东方科技集团股份有限公司 | Membrane material and preparation method thereof, display base plate |
| CN110556195A (en) * | 2019-09-09 | 2019-12-10 | 常州斯威克光伏新材料有限公司 | Dampproofing anti warpage encapsulation glued membrane |
| WO2020020195A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市弘海电子材料技术有限公司 | Fpc electromagnetic shielding film with polyimide film as insulating layer, and preparation method therefor |
| CN111697517A (en) * | 2020-07-01 | 2020-09-22 | 睿惢思工业科技（苏州）有限公司 | Manufacturing method of flexible cable shielding grounding device |
| CN116072010A (en) * | 2021-11-02 | 2023-05-05 | 武汉华星光电半导体显示技术有限公司 | Splicing display panels and display devices |
| CN116179103A (en) * | 2023-01-29 | 2023-05-30 | 深圳雷曼光电科技股份有限公司 | Magnetic anisotropic conductive adhesive film and preparation method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1819211A1 (en) * | 2004-12-03 | 2007-08-15 | Nitta Corporation | Electromagnetic interference inhibitor, antenna device and electronic communication apparatus |
| CN101704312A (en) * | 2009-11-06 | 2010-05-12 | 电子科技大学 | Composite electromagnetic shield materials and method for preparing same |
| CN102300399A (en) * | 2011-07-12 | 2011-12-28 | 祝琼 | Multifunctional laminated electronic diaphragm and production method thereof |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN103002725A (en) * | 2011-09-16 | 2013-03-27 | 藤森工业株式会社 | Electromagnetic wave shielding material for FPC |
| US20130206315A1 (en) * | 2010-06-23 | 2013-08-15 | Inktec Co., Ltd. | Method for Manufacturing Electromagnetic Interference Shielding Film |
-
2013
- 2013-12-03 CN CN201310653896.9A patent/CN103717050A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1819211A1 (en) * | 2004-12-03 | 2007-08-15 | Nitta Corporation | Electromagnetic interference inhibitor, antenna device and electronic communication apparatus |
| CN101704312A (en) * | 2009-11-06 | 2010-05-12 | 电子科技大学 | Composite electromagnetic shield materials and method for preparing same |
| US20130206315A1 (en) * | 2010-06-23 | 2013-08-15 | Inktec Co., Ltd. | Method for Manufacturing Electromagnetic Interference Shielding Film |
| CN102300399A (en) * | 2011-07-12 | 2011-12-28 | 祝琼 | Multifunctional laminated electronic diaphragm and production method thereof |
| CN103002725A (en) * | 2011-09-16 | 2013-03-27 | 藤森工业株式会社 | Electromagnetic wave shielding material for FPC |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517422A (en) * | 2016-01-15 | 2016-04-20 | 深圳市金凯新瑞光电股份有限公司 | Composite film material |
| CN108297502A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of soft magnetic materials base material |
| CN107227120A (en) * | 2017-07-20 | 2017-10-03 | 海宁卓泰电子材料有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN107513351A (en) * | 2017-10-11 | 2017-12-26 | 广东正业科技股份有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| WO2020020195A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市弘海电子材料技术有限公司 | Fpc electromagnetic shielding film with polyimide film as insulating layer, and preparation method therefor |
| CN108928056A (en) * | 2018-08-01 | 2018-12-04 | 京东方科技集团股份有限公司 | Membrane material and preparation method thereof, display base plate |
| CN110556195A (en) * | 2019-09-09 | 2019-12-10 | 常州斯威克光伏新材料有限公司 | Dampproofing anti warpage encapsulation glued membrane |
| CN111697517A (en) * | 2020-07-01 | 2020-09-22 | 睿惢思工业科技（苏州）有限公司 | Manufacturing method of flexible cable shielding grounding device |
| CN116072010A (en) * | 2021-11-02 | 2023-05-05 | 武汉华星光电半导体显示技术有限公司 | Splicing display panels and display devices |
| WO2023077546A1 (en) * | 2021-11-02 | 2023-05-11 | 武汉华星光电半导体显示技术有限公司 | Spliced display panel and display apparatus |
| US12205929B2 (en) | 2021-11-02 | 2025-01-21 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Spliced display panel and display device |
| CN116179103A (en) * | 2023-01-29 | 2023-05-30 | 深圳雷曼光电科技股份有限公司 | Magnetic anisotropic conductive adhesive film and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103717050A (en) | Thin-type flexible thermally-cured electromagnetic shielding glue film | |
| CN108323144B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| CN108323143B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| KR20140142708A (en) | Ultrathin shielding film of high shielding effectiveness and manufacturing method therefor | |
| CN104885587B (en) | Electromagnetic wave absorbing plate, manufacturing method thereof, and electronic device including same | |
| US9609792B2 (en) | Electromagnetic wave shielding film and method for producing a circuit board comprising the shielding film | |
| CN101448362B (en) | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | |
| CN102510712B (en) | Ultra-thin shielding film of a kind of high screening effectiveness and preparation method thereof | |
| KR101931274B1 (en) | Electrically conductive sheet and process for producing same, and electronic component | |
| KR101160497B1 (en) | Flat cable | |
| CN108495543B (en) | Electromagnetic wave shielding film, method for manufacturing printed circuit board, and method for manufacturing electromagnetic wave shielding film | |
| CN105246313B (en) | A kind of electromagnetic shielding film, the preparation method containing the printed wiring board of the screened film and the wiring board | |
| CN202635003U (en) | Ultrathin shielding film with high shielding effectiveness | |
| TWI881197B (en) | Matte type electromagnetic interference shielding film and preparation method thereof | |
| CN105578851A (en) | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof | |
| WO2017010447A1 (en) | Ferrite laminate and noise suppression sheet | |
| KR20180071072A (en) | Metal composite sheet | |
| KR102442175B1 (en) | Alloy Film Shielding Electromagnetic Field by Frequency Band and Manufacturing Method Thereof | |
| CN110769667B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| CN110691499B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| KR102459013B1 (en) | Electromagnetic wave absorber and preparing method thereof | |
| CN203157257U (en) | Compound type copper foil base plate with electromagnetic shielding effect | |
| KR102458691B1 (en) | FCCL and FPCB Cable for RF | |
| CN201332571Y (en) | Super-thin screened film capable of changing circuit impedance and circuit board | |
| TWM527127U (en) | Structure of cover film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140409 |