CN103681949A - 包含铅-碲基氧化物的导电组合物在具有轻掺杂发射器的半导体装置的制造中的用途 - Google Patents
包含铅-碲基氧化物的导电组合物在具有轻掺杂发射器的半导体装置的制造中的用途 Download PDFInfo
- Publication number
- CN103681949A CN103681949A CN201210472608.5A CN201210472608A CN103681949A CN 103681949 A CN103681949 A CN 103681949A CN 201210472608 A CN201210472608 A CN 201210472608A CN 103681949 A CN103681949 A CN 103681949A
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- 239000000203 mixture Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Abstract
Description
| 玻璃# | PbO | B2O3 | Na2O | Li2O | Bi2O3 | Cr2O3 | TeO2 |
| 1 | 44.36 | 0.49 | 0 | 0.78 | 6.79 | 0 | 47.58 |
| 2 | 44.19 | 0.49 | 0.72 | 0.43 | 6.77 | 0 | 47.40 |
| 3 | 44.42 | 0.49 | 0.40 | 0.24 | 6.80 | 0 | 47.64 |
| 4 | 44.31 | 0.51 | 0.56 | 0.34 | 6.76 | 0 | 47.53 |
| 5 | 49.12 | 0.50 | 0.35 | 0.43 | 6.66 | 0 | 42.93 |
| 6 | 44.44 | 0.51 | 0 | 0.61 | 6.78 | 0 | 47.67 |
| 7 | 44.25 | 0.50 | 0.46 | 0.56 | 6.75 | 0 | 47.47 |
| 8 | 44.45 | 0.51 | 0.26 | 0.31 | 6.78 | 0 | 47.68 |
| 9 | 44.35 | 0.51 | 0.36 | 0.43 | 6.77 | 0 | 47.58 |
| 10 | 43.69 | 0.52 | 0.46 | 0.44 | 6.91 | 1.13 | 46.86 |
| 组分 | 重量% |
| 2,2,4-三甲基-1,3-戊二醇单异丁酸酯 | 48.46% |
| 乙基纤维素(50-52%乙氧基) | 0.10% |
| 乙基纤维素(48-50%乙氧基) | 0.05% |
| 牛脂二胺二油酸盐 | 11.11% |
| 氢化蓖麻油 | 5.56% |
| 全氢松香酸(perhydroabietic acid)的季戊四醇四酯 | 6.94% |
| 己二酸二甲酯 | 25.00% |
| 戊二酸二甲酯 | 2.78% |
| 组分 | 重量% |
| 2,2,4-三甲基-1,3-戊二醇单异丁酸酯 | 39.32% |
| 乙基纤维素(50-52%乙氧基) | 0.17% |
| 乙基纤维素(48-50%乙氧基) | 0.03% |
| 牛脂二胺二油酸盐 | 10.75% |
| 氢化蓖麻油 | 5.38% |
| 全氢松香酸(perhydroabietic acid)的季戊四醇四酯 | 6.72% |
| 己二酸二甲酯 | 33.87% |
| 戊二酸二甲酯 | 3.76% |
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/598,861 US8969709B2 (en) | 2012-08-30 | 2012-08-30 | Use of a conductive composition containing lead—tellurium-based oxide in the manufacture of semiconductor devices with lightly doped emitters |
| US13/598,861 | 2012-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103681949A true CN103681949A (zh) | 2014-03-26 |
| CN103681949B CN103681949B (zh) | 2017-08-15 |
Family
ID=47627909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210472608.5A Active CN103681949B (zh) | 2012-08-30 | 2012-11-20 | 包含铅‑碲基氧化物的导电组合物在具有轻掺杂发射器的半导体装置的制造中的用途 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8969709B2 (zh) |
| EP (1) | EP2703368A1 (zh) |
| JP (1) | JP6185232B2 (zh) |
| KR (1) | KR20140030009A (zh) |
| CN (1) | CN103681949B (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104193166A (zh) * | 2014-09-05 | 2014-12-10 | 广东风华高新科技股份有限公司 | 玻璃料及其制备方法 |
| CN104692668A (zh) * | 2015-02-11 | 2015-06-10 | 西北大学 | 一种太阳能电池正面电极浆料用快速结晶型玻璃粉 |
| CN104795126A (zh) * | 2014-01-17 | 2015-07-22 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | 具有改进的粘着性能的铅-铋-碲-硅酸盐无机反应体系 |
| CN104715804B (zh) * | 2013-12-17 | 2017-07-28 | 三星Sdi株式会社 | 用于太阳能电池电极的组合物以及使用其制造的电极 |
| CN109524482A (zh) * | 2017-09-18 | 2019-03-26 | 江西佳银科技有限公司 | 具有多个离散熔块的厚膜浆料以及用于接触晶体硅太阳能电池发射极表面的方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103038186B (zh) | 2010-05-04 | 2018-11-09 | E·I·内穆尔杜邦公司 | 包含铅氧化物和碲氧化物的厚膜糊料及其在半导体装置制造中的用途 |
| KR101608123B1 (ko) * | 2013-09-13 | 2016-03-31 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
| EP2848657A1 (en) * | 2013-09-16 | 2015-03-18 | Heraeus Precious Metals North America Conshohocken LLC | Electroconductive paste with adhesion promoting glass |
| WO2015039023A1 (en) * | 2013-09-16 | 2015-03-19 | Heraeus Precious Metals North America Conshohocken Llc | Electroconductive paste with adhesion promoting glass |
| KR101780531B1 (ko) * | 2013-12-17 | 2017-09-22 | 삼성에스디아이 주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
| JP5816738B1 (ja) * | 2014-11-27 | 2015-11-18 | 株式会社ノリタケカンパニーリミテド | 導電性組成物 |
| TWI591652B (zh) | 2014-12-08 | 2017-07-11 | 碩禾電子材料股份有限公司 | 一種含無鉛玻璃熔塊之導電漿(五) |
| JP6580383B2 (ja) * | 2015-06-17 | 2019-09-25 | ナミックス株式会社 | 導電性ペースト、太陽電池及び太陽電池の製造方法 |
| JP5990315B2 (ja) * | 2015-09-17 | 2016-09-14 | 株式会社ノリタケカンパニーリミテド | 導電性組成物 |
| JP6074483B1 (ja) * | 2015-11-10 | 2017-02-01 | 株式会社ノリタケカンパニーリミテド | 導電性組成物 |
| NL2018042B1 (en) * | 2016-12-22 | 2018-06-29 | Stichting Energieonderzoek Centrum Nederland | Method for manufacturing photovoltaic cells with a rear side polysiliconpassivating contact |
| TWI745562B (zh) * | 2017-04-18 | 2021-11-11 | 美商太陽帕斯特有限責任公司 | 導電糊料組成物及用其製成的半導體裝置 |
| WO2019023444A1 (en) * | 2017-07-28 | 2019-01-31 | Corning Incorporated | SINK PASTE AND METHOD OF SEALING A GLASS ASSEMBLY COMPRISING THE SAME |
| WO2019117809A1 (en) * | 2017-12-11 | 2019-06-20 | National University Of Singapore | A method of manufacturing a photovoltaic device |
| KR102342518B1 (ko) * | 2019-12-31 | 2021-12-23 | 엘에스니꼬동제련 주식회사 | 태양전지 전극용 도전성 페이스트 조성물 및 이를 사용하여 제조된 전극을 포함하는 태양전지 |
| CN114213018B (zh) * | 2021-12-29 | 2022-08-16 | 江苏日御光伏新材料科技有限公司 | 一种陶瓷玻璃粉及含有该玻璃粉的太阳能电池金属化浆料 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188990A (en) * | 1991-11-21 | 1993-02-23 | Vlsi Packaging Materials | Low temperature sealing glass compositions |
| CN1873836A (zh) * | 2005-04-14 | 2006-12-06 | E.I.内穆尔杜邦公司 | 制造半导体器件的方法以及用于该方法的导电组合物 |
| US20110232746A1 (en) * | 2010-05-04 | 2011-09-29 | E. I. Du Pont De Nemours And Company | Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5240884A (en) | 1991-09-05 | 1993-08-31 | Johnson Matthey, Inc. | Silver-glass die attach paste |
| JPH0897011A (ja) * | 1994-09-26 | 1996-04-12 | Matsushita Electric Ind Co Ltd | 酸化亜鉛バリスタ用電極材料 |
| US7608206B1 (en) | 2008-04-18 | 2009-10-27 | E.I. Dupont De Nemours & Company | Non-lead resistor composition |
| DE112010001377B4 (de) * | 2009-03-27 | 2019-09-05 | Hitachi Powdered Metals Co., Ltd. | Glaszusammensetzung, Zusammensetzung für eine elektrische Leitpaste, welche dieseenthält, Elektrodenverdrahtungselement und elektronisches Bauteil |
| JP5559510B2 (ja) * | 2009-10-28 | 2014-07-23 | 昭栄化学工業株式会社 | 太陽電池素子及びその製造方法 |
| CN102770963B (zh) | 2010-02-08 | 2016-02-03 | E·I·内穆尔杜邦公司 | 用于制备mwt硅太阳能电池的方法 |
| JP2014512073A (ja) | 2011-03-24 | 2014-05-19 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 導電性ペースト組成物およびそれで製造される半導体デバイス |
| JP5756447B2 (ja) * | 2012-10-31 | 2015-07-29 | 株式会社ノリタケカンパニーリミテド | 太陽電池用導電性ペースト組成物 |
-
2012
- 2012-08-30 US US13/598,861 patent/US8969709B2/en active Active
- 2012-11-20 JP JP2012254184A patent/JP6185232B2/ja active Active
- 2012-11-20 CN CN201210472608.5A patent/CN103681949B/zh active Active
- 2012-11-20 KR KR1020120131630A patent/KR20140030009A/ko not_active Ceased
- 2012-12-10 EP EP12196399.5A patent/EP2703368A1/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188990A (en) * | 1991-11-21 | 1993-02-23 | Vlsi Packaging Materials | Low temperature sealing glass compositions |
| CN1873836A (zh) * | 2005-04-14 | 2006-12-06 | E.I.内穆尔杜邦公司 | 制造半导体器件的方法以及用于该方法的导电组合物 |
| US20110232746A1 (en) * | 2010-05-04 | 2011-09-29 | E. I. Du Pont De Nemours And Company | Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104715804B (zh) * | 2013-12-17 | 2017-07-28 | 三星Sdi株式会社 | 用于太阳能电池电极的组合物以及使用其制造的电极 |
| CN104795126A (zh) * | 2014-01-17 | 2015-07-22 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | 具有改进的粘着性能的铅-铋-碲-硅酸盐无机反应体系 |
| CN104795126B (zh) * | 2014-01-17 | 2017-07-18 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | 具有改进的粘着性能的铅‑铋‑碲‑硅酸盐无机反应体系 |
| CN104193166A (zh) * | 2014-09-05 | 2014-12-10 | 广东风华高新科技股份有限公司 | 玻璃料及其制备方法 |
| CN104692668A (zh) * | 2015-02-11 | 2015-06-10 | 西北大学 | 一种太阳能电池正面电极浆料用快速结晶型玻璃粉 |
| CN109524482A (zh) * | 2017-09-18 | 2019-03-26 | 江西佳银科技有限公司 | 具有多个离散熔块的厚膜浆料以及用于接触晶体硅太阳能电池发射极表面的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2703368A1 (en) | 2014-03-05 |
| US20140060632A1 (en) | 2014-03-06 |
| KR20140030009A (ko) | 2014-03-11 |
| JP6185232B2 (ja) | 2017-08-23 |
| US8969709B2 (en) | 2015-03-03 |
| JP2014049743A (ja) | 2014-03-17 |
| CN103681949B (zh) | 2017-08-15 |
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Application publication date: 20140326 Assignee: Jiangsu SOTE Electronic Material Co.,Ltd. Assignor: Sun paster Co.,Ltd. Contract record no.: X2021990000521 Denomination of invention: Use of conductive compositions containing lead tellurium based oxides in the manufacture of semiconductor devices with lightly doped emitters Granted publication date: 20170815 License type: Common License Record date: 20210826 |
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