CN103686566A - Acoustic transducer apparatus and method for manufacturing the same, sensing device and method for determining an acoustic signal - Google Patents

Abstract

The invention relates to a sound transducer device (100). The sound transducer device (100) comprises a membrane (110) which has an electrically conductive material (115), wherein the membrane (110) is deflectable by an acoustic signal occurring on the membrane. The sound transducer device (100) also comprises a collection device (120) configured to induce eddy currents (I) in the membrane (110) and to collect in the form of, The eddy current, which is dependent on the impedance of the eddy current, can be influenced by a deflection of the membrane ( 110 ) that can be generated by the sound signal to determine the sound pressure represented by the sound signal.

Description

Sound transducer device and method for producing such a sound transducer device, sensor arrangement and method for determining a sound signal

technical field

The invention relates to a sound transducer device, a sensor device for determining a sound signal, a method for producing a sound transducer device, a method for determining a sound signal and a corresponding computer program product .

Background technique

Sound transducers use one of the different physical effects in the form of conventional microphones to convert sound pressure into electrical signals. For example, membrane deflection can be detected optically, piezoresistively, piezoelectrically or capacitively. Patent LiteratureUS 2002/0067663 A1 discloses a small broadband sound converter.

Contents of the invention

Against this background, the invention provides an improved sound transducer device, an improved sensor device for determining a sound signal, an improved method for producing a sound transducer device, An improved method and an improved computer program product for determining a sound signal. Advantageous refinements are given by the subclaims and the following description.

The invention relates to a sound transducer device, which has the following characteristics:

- a membrane having an electrically conductive material, wherein the membrane can be deflected by an acoustic signal occurring on the membrane; and

- Acquisition means configured to induce eddy currents in the membrane and to collect the impedance of the acquisition means depending on the eddy currents to determine the sound pressure represented by the sound signal, the eddy currents being able to be subjected to The deflection of the membrane can be influenced by the acoustic signal.

The electrically conductive material of the membrane can be formed as at least one coating of the membrane or as at least one partial section of the membrane. Thus, the film can exhibit at least one coating of the electrically conductive material or be formed at least partially from the electrically conductive material. The electrically conductive material in or on the membrane can be produced or produced by separating the electrically conductive material, in particular in the form of a metallic coating or similar. In particular, the conductivity of a film composed of silicon can also be produced or produced by dosing. The electrically conductive material can thus be present in the form of a film, an electrically conductive coating, associated material elements, continuous material sites or the like. The deflection of the membrane can be effected elastically and deformably. In this case, the offset can be brought about by the sound pressure of the sound signal. The collection device is configured to induce at least one eddy current in the membrane. The detection device can be an electrical coil with at least one winding. The at least one winding can have at least one electrical conductor. In this case, the windings of the coil can be arranged in at least one winding plane. Thus, the coil can be a so-called planar coil or a three-dimensional coil. In this case, the membrane with the electrically conductive material and the detection device can be arranged or arranged with respect to each other at a predeterminable initial distance, including the initial ambient pressure and the initial conditions in which the membrane is detached from the acoustic signal. In particular, the membrane can have a defined initial deflection relative to the acquisition device in initial conditions. When the initial conditions are changed, in particular when an acoustic signal is present on the membrane, the initial spacing or initial offset can also be changed. In this case, the distance between the membrane and the acquisition device can be reduced or increased when an acoustic signal is incident on the membrane. An inductive coupling can be produced between the membrane comprising the electrically conductive material and the acquisition device. In this case, the distance or changes in the distance between the membrane having the electrically conductive material and the detection device or changes in the deflection or deflection of the membrane relative to the detection device can be detected by means of an eddy current measuring device. In this case, the electrically conductive membrane is deflected at least in sections due to the changing sound pressure, thereby causing a change in the induced eddy current. Changes in the induced eddy currents in turn cause changes in the magnetic field generated by said eddy currents. This eddy current magnetic field counteracts the magnetic field of the acquisition device, which leads to a change in the impedance of the acquisition device. The impedance of the acquisition device can be measured or tapped between two electrical connections of the acquisition device. The sound signal determination based on the eddy current-dependent impedance can be carried out in a computing device separate from the acquisition device.

The invention also relates to a sensor device for determining an acoustic signal, wherein the sensor device has the following features:

- Variations of the aforementioned sound converter devices; and

- Calculation means electrically connectable or electrically connectable to the acquisition means of the sound transducer device, wherein the calculation means are configured to read and calculate the impedance of the acquisition means in order to determine the sound signal.

The variant of the sound transducer device presented here can advantageously be sampled or used in conjunction with a sensor device in order to determine a sound signal. The computing device can have electronic components with circuits, for example application-specific integrated circuits or ASICs (Application-Specific Integrated Circuits) or such circuits. The sensor device can be used as a microphone.

The invention also relates to a method for producing a sound transducer device, wherein the method has the following steps:

- providing a membrane, said membrane having an electrically conductive material, wherein said membrane can be deflected by an acoustic signal occurring on the membrane; and providing an acquisition device configured to induce eddy currents in said membrane and acquiring an impedance of the acquisition device dependent on the vortex capable of being affected by a deflection of the membrane producible by the acoustic signal to determine an acoustic pressure represented by the acoustic signal; and

- the membrane and the acquisition device are arranged relative to one another in such a way that the acquisition device is inductively or coupleable to the membrane.

Variations of the advantageous sound transducer devices presented herein can be manufactured by implementing the method for manufacturing.

The invention also relates to a method for determining an acoustic signal, wherein the method has the following steps:

- Loading a membrane deflectable by an acoustic signal, said membrane having a material capable of conducting electricity, with an acoustic signal;

- conducting an electric current through the acquisition means in order to induce eddy currents in said membrane, said eddy currents being able to be influenced by a deflection of said membrane which can be produced by said acoustic signal;

- acquiring an impedance of said acquisition device dependent on said eddy currents to determine an acoustic pressure represented by said acoustic signal; and

- calculating the impedance of said acquisition means in order to determine said sound signal.

A variant of the sensor device presented here can advantageously be used or used in conjunction with the method for determining in order to determine the sound signal. Impedance can be measured in the acquisition device as a change in magnitude and phase from a sinusoidal alternating voltage to a sinusoidal alternating current.

Also advantageous is a computer program product with a program code stored on a machine-readable carrier, such as a semiconductor memory, hard disk memory or optical memory, and which, when executed on a computer or device, uses Program code to implement the above-mentioned method for determination.

Embodiments according to the invention can provide a sound transducer which is able to detect sound pressure according to the eddy current measurement principle. In other words, therefore, an eddy current sensor is used as a microphone, in particular as a MEMS (microelectromechanical systems; microsystems) microphone. Embodiments according to the invention make it possible to realize the microphone by means of the eddy current measurement principle, in which a membrane comprising an electrically conductive material which is movable by the sound pressure can be displaced as a microphone membrane. This offset is detected. In this case, the eddy current coil as detection means can be arranged or arranged with respect to the membrane in the region of the inductive coupling, for example in a location directly integrated in the MEMS sensor element or similar. Eddy currents are induced in the membrane by means of eddy current coils or detection devices. The impedance of the coil can be considered as a calculation signal.

The advantage of the invention is that a very simple construction of the sound transducer device or of the sensor device or of the microphone is possible. This enables such a sensor or device to be realized inexpensively. On the basis of the eddy current measurement principle, a high degree of freedom of penetration is also achieved in the plane of the coil or the plane of the acquisition device with very good measurement capability and signal strength. Embodiments of the invention can be implemented with microphones based on the eddy current measurement principle with not only very fast or high-frequency but also very high-resolution or high-sensitivity implementation. The sound converter device and the sensor device or the measuring signal of the sensor device are insensitive to dirt, dust particles, moisture, oil. In addition, eddy current sensors are also very immune to interference in electromagnetic environments. This provides a greater degree of freedom with regard to the placement of the sound transducer device or the sensor device as a microphone, for example in a housing of a mobile phone or the like. In addition, the cross-sensitivity (Querempfindlichkeit) to moisture and non-conductive particles is low. Further advantages of the sound transducer device or sensor device in its function as a microphone are high reception quality at low supply voltage or low current consumption and inexpensive production. Furthermore, low sample distribution, possible miniaturization and a high degree of resistance to external influences such as heat, humidity, particles or vibrations are advantageous. In particular, parasitic capacitances can advantageously be avoided on the basis of the eddy current measurement principle.

According to one embodiment of the sound converter device, the electrically conductive material of the membrane can be electrically insulating, in particular from at least one further component of the sound converter device. This embodiment offers the advantage that a very simple construction of the sound transducer device is achieved, since only the acquisition device is electrically connected to the computing electronics. The electrically conductive membrane surface, which is deflected by the sound pressure and induces eddy current losses, must therefore advantageously be non-electrically contacting. In this way, a sound transducer device can be realized at low cost.

The electrically conductive material of the membrane can also comprise a ferromagnetic material. This embodiment offers the advantage that an increase in the signal level for detecting eddy currents or sound signals can be achieved by means of the electrically conductive material having ferromagnetic properties.

In addition, a micro-electromechanical support arrangement can be provided. In this case, the membrane can have a membrane section of the support device. Additionally or alternatively, the acquisition device is integrally formed in or on a subsection of the carrier device. The carrier arrangement can be provided as at least part of a microsystem or microelectromechanical system or MEMS. The stent device can be fabricated from silicon, plastic or similar material. In this case, the membrane can be formed as a membrane section of the stent device. The subsection of the stent device can be arranged at a distance from or adjacent to the membrane section of the stent device, in or on which the acquisition device is arranged. The bracket device can have integral components or separate components. In particular, the membrane can be part of a first component of the stent device and the acquisition device can be part of a second component of the stent device. In this case, the first component and the second component of the support device can be connected or connected by means of a joint connection. The harvesting device and the membrane can be present as part of two separate components, wherein the components can be connectable or connected by adhesive, eutectic bonding or other joining process. It is possible, for example, to combine an eddy current coil produced as a circuit board structure as a detection device with a MEMS sensor holder device, for example. The circuit board on which the acquisition device is arranged can be mounted directly on the MEMS sensor holder device. A clear advantage of the use of microelectromechanical devices in sound transducer devices is the miniaturization of the device, so that in particular miniaturized silicon microphones or similar components are also possible. In addition to commercial advantages, this sound transducer device has improved mechanical properties of the membrane for miniaturized silicon microphones. Through miniaturization and the use of thin coatings, the microphone membrane has a very low mass and is therefore insensitive to vibrations. Alternatively, the membrane and the collection device can also be part of an integrally formed component as the stent device. Here, there is the possibility of integrating the acquisition device directly into the housing of the MEMS sensor or into the mounting arrangement. The advantage of this variant is a very precise, reproducible distance between the acquisition device and the movable membrane or the surface of the microphone membrane. In this case, the acquisition device and the membrane can be positioned at a precisely defined distance from one another.

In this case, the membrane section of the stent device can be mechanically connected to the main section of the stent device by means of at least one connection section of the stent device, or the membrane section of the stent device can be freely arranged relative to the main section of the stent device. In this case, the membrane section, the at least one connecting section and the main section of the stent device can be formed in one piece. At least one connecting section can be configured to mechanically and tension-free connect the membrane section to the main section of the support device. If the membrane section of the stent device is freely arranged relative to the main section of the stent device, then the membrane section of the stent device is arranged mechanically without contact with the main section of the stent device. In this way, the membrane can be arranged or arranged advantageously relative to the collection device.

According to one embodiment of the sensor device, the acquisition device and the computing device of the sound transducer device are arranged in a common circuit housing and additionally or alternatively on a common circuit board. The circuit housing can comprise plastic, filler material or molded material (mold mass) or the like, wherein the computing device and the acquisition device are packaged or injected or encapsulated in the housing. In particular, the computing device and the acquisition device can be co-injected or injectable. The circuit housing can be the housing of the computing device or of the sensor device, into which the acquisition device is integrated. The acquisition device can also be arranged on a circuit board which is part of the computing device or the sensor device. This embodiment offers the advantage that the acquisition device is protected against environmental influences in the housing or that it can be easily connected to the computing device on the circuit board by means of platinum-specific conductor tracks. Furthermore, this embodiment has the advantage that the integration or monolithic integration of the computing device or the signal processing and acquisition device, in particular on the microphone chip, leads to a further miniaturization and cost reduction of the sensor device, Because the mixed assembly of electronic components is cancelled. Due to the shorter signal path, such an integrated sensor arrangement has improved electromagnetic compatibility.

Furthermore, the sound transducer device can have a plurality of membranes and at least one acquisition device. Thus, the sound converter device can have a set of membranes or a set of membranes and acquisition means. This embodiment offers the advantage that the sound signal can be determined more precisely, more sensitively and more reliably.

Description of drawings

The invention is explained in more detail by way of example with the aid of the drawings. The accompanying drawings show:

1A to 9C are diagrams of sound transducer devices, sensor devices and/or components thereof according to embodiments of the invention; and

10 and 11 are flowcharts of methods according to embodiments of the invention.

In the following description of preferred exemplary embodiments of the present invention, identical or similar reference symbols are used for elements that are shown in different figures and act similarly, wherein a repeated description of these elements is omitted.

Detailed ways

Figure 1A shows a cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. The sound transducer device 100 has a carrier arrangement with a main section 102 and a connecting section 104 , a sensor assembly 105 , a pressure compensation opening 106 , a membrane with an electrically conductive material in the form of an electrically conductive coating 115 or surface. 110. Acquisition device in the form of an electrical coil 120 having eg three windings and a coil substrate 130 arranged around the coil 120, wherein the membrane 110 and the coil 120 are arranged inductively coupled in a coupling region 125 symbolically shown in FIG. 1A.

The sensor assembly 105 has a carrier arrangement with a main section 102 and a connecting section 104 , a pressure compensation opening 106 and a membrane 110 with an electrically conductive coating 115 or surface. The membrane 110 according to the embodiment of the invention shown in FIG. 1A shows a membrane section of a stent device. The membrane 110 is mechanically connected to the main section 102 of the carrier device by means of a connecting section 104 . The pressure compensation opening 106 is formed in the membrane 110 in the form of a through-opening or through-slit. By way of example, electrically conductive coating 115 is arranged on the surface of membrane 110 facing coil 120 or is formed in membrane 110 .

Coil 120 is, for example, part of coil base body 130 . In this case, the coil 120 is formed in the form of a so-called air-core coil, wherein the windings of the coil 120 are arranged, for example, independently of the coil base body 130 . Even when not explicitly shown in FIG. 1A due to the limitations of the illustration, the electrical connections of the coil 120 are embedded in the coil base body by way of example. In this case, the coil base body 130 can be arranged at a distance from the winding of the coil 120 . In this case, the coil base body 130 can arrange the winding of the coil 120 circumferentially in the winding plane of the coil 120 . According to the exemplary embodiment of the invention shown in FIG. 1A , coil base body 130 with coil 120 is arranged, in particular mounted on sensor component 105 by means of a joint connection. Rather, coil base body 130 is mounted on sensor component 105 in such a way that electrically conductive coating 115 is arranged in coupling region 125 of the inductive coupling part of coil 120 . In this case, the coil 120 is arranged in the region of the electrically conductive coating 115 of the membrane 110 . In particular, the windings of the coil 120 are arranged at least partially covering the electrically conductive coating 115 of the film 110 . In particular, the windings of the coil 120 are arranged at a distance from the electrically conductive coating 115 of the membrane 110 along the spatial axis. In this case, a gap or cavity is formed between the coil 120 and the electrically conductive coating 115 of the membrane 110 . In the undeflected state, the main planes of extension of the membrane 110 are, for example, coplanar with respect to the winding plane of the coil 120 and arranged at a distance within manufacturing tolerances. Coil 120 is arranged covering film 110 or electrically conductive coating 115 .

FIG. 1B shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. In this case, the illustration in FIG. 1B corresponds to the illustration in FIG. 1A or the sound transducer device 100 in FIG. 1B corresponds to the sound transducer device 100 in FIG. The sound pressure p of the sound signal acting on the membrane 110 is shown by two arrows, wherein the membrane 110 is deflected by the sound pressure p towards the coil 120 .

FIG. 1C shows a schematic top view of an electrically conductive coating 115 of a membrane of the sound transducer device of FIG. 1A or FIG. 1B . The eddy current I generated by the coil of the sound transducer device is shown symbolically in the electrically conductive coating 115 .

FIG. 1D shows a schematic plan view of the electrical coil 120 . The coil 120 can be the coil of the sound transducer device of FIG. 1A or FIG. 1B , wherein in FIG. 1D the coil 120 has only four coils instead of three coils.

Accordingly, an exemplary structure of a sound transducer device 100 according to an embodiment of the present invention is shown in FIGS. 1A to 1D . The sound transducer device 100 includes a pressure-sensitive membrane 110 that is deflectable by the sound pressure p that occurs. Depending on the design, the sound pressure p can be directed onto the membrane 110 from the coil 120 (for so-called “top-port” microphones) or from the side facing away from the coil (for so-called “bottom-port” microphones). The sound transducer device 100 can be used for a microphone based on the eddy current measurement principle. The membrane 110 with the electrically conductive coating 115 deflects due to the variable sound pressure p. This causes changes in the eddy currents I of the electrically conductive coating 115 , which in turn cause a changing magnetic field. This magnetic field counteracts the magnetic field of the coil 120 or of the exciter coil, which leads to a change in the impedance of the coil 120 . The impedance is measured as a change in magnitude and phase of the current or voltage in the coil 120 . The coil 120 is, for example, a flat air-core coil, such as a front plate coil, which can supply an alternating current for forming a magnetic field surrounding the coil 120 .

FIG. 2A shows a schematic plan view of an electrical coil 120 with a coil base body 130 according to an exemplary embodiment of the invention. The coil 120 and the coil base body 130 can be the coil and the coil base body of the sound transducer device of FIG. 1A or FIG. 1B , wherein the coil 120 in FIG. 2A has only one winding by way of example. Furthermore, the current flow 222 is symbolically shown in FIG. 2A by a directional arrow in the coil. The winding of the coil 120 extends in the form of a loop of an electrical conductor from a first connection arranged on the coil base body 130 to a second connection arranged on the coil base body 130 . Furthermore, in addition to the connection, the coil 120 has, for example, a suspension element by means of which the coil 120 is mounted on the coil base body 130 . The coil base body 130 surrounds the winding of the coil 120 at a distance.

FIG. 2B shows a schematic diagram of an electrical coil 120 for use with the sound transducer device shown in FIG. 1A or FIG. 1B according to an embodiment of the present invention. In other words, the coil 120 can be the coil of the sound transducer device of FIG. 1A or FIG. 1B , wherein the coil 120 in FIG. 2B is formed as a so-called three-dimensional coil or as a so-called three-dimensional coil with windings in multiple planes. 3D coils. The current flow 222 in the coil 120 is also shown symbolically by a directional arrow in FIG. 2B .

FIG. 2C shows a schematic diagram of an electrical coil 120 for use with the sound transducer device of FIG. 1A or FIG. 1B according to an embodiment of the invention. In other words, the coil 120 can be the coil of the sound transducer device of FIG. 1A or FIG. 1B , wherein the coil 120 is only exemplary formed in FIG. Coil (Mehrdrahtspule). Coil 120 with one winding is only shown as an example in FIG. 2C .

FIG. 2D shows a section of coil 120 from FIG. 2C in an enlarged illustration. The embodiment of several coils can be seen here.

Thus, a possible coil 120 according to an embodiment of the invention is shown in FIGS. 2A to 2D . Square-shaped, circular, etc.-shaped variants of the coil 120 as well as multi-position or 3D coils are thus also possible. Such a shape of the coil 120 can represent optimization measures to increase the inductance or reduce the space requirement of the coil 120 .

Fig. 3A shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 3A corresponds to the illustration in FIG. 1A or the sound transducer device 100 in FIG. 3A corresponds to the sound transducer device in FIG. 110 is embedded in the region of electrically conductive coating 115 and, for example, in coil base body 130 . In particular, the windings of the coil 120 are arranged at a distance from the electrically conductive coating 115 of the membrane 110 along the three spatial axes.

Fig. 3B shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 3B corresponds to the illustration in FIG. 3A or the sound transducer device 100 in FIG. 3B corresponds to the sound transducer device 100 in FIG. The sound pressure p of the sound signal acting on the membrane 110 is shown by the arrow, wherein the membrane 110 is deflected by the sound pressure p towards the winding plane of the coil 120 .

3A and 3B thus show another exemplary embodiment of a sound transducer device 100, wherein, unlike in FIG. 1A or FIG. 110 is arranged in the region of main section 102 of sensor assembly 105 , or on “land”, so to speak. The advantage of this variant is the simple structure of the sound transducer device 100 without a cavity between the membrane 110 and the coil 120 . The particles are therefore unable to get stuck in the membrane.

的能导电的材料在膜110上能够实现信号电平的提高用于计算线圈120的电感系数。 Fig. 4A shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. In this case, the representation in FIG. 4A corresponds to the representation in FIG. 3A or the sound transducer device 100 in FIG. 4A corresponds to the sound transducer device in FIG. Alternatively, the electrically conductive coating 115 is arranged in or adjacent to the main plane of extent of the film 110 or the electrically conductive coating 115 and is spaced laterally from the film 110 or the electrically conductive coating 115 . open. Even if this is not explicitly shown in the illustration of FIG. 4A , the electrically conductive coating 115 can comprise a ferromagnetic material. Utilize ferromagnetic properties, especially high magnetic permeability

An electrically conductive material on the membrane 110 enables an increase in the signal level for calculating the inductance of the coil 120 .

Fig. 4B shows a schematic cross-sectional view of the sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 4B corresponds to the illustration in FIG. 4A or the sound transducer device 100 in FIG. 4B corresponds to the sound transducer device 100 in FIG. The sound pressure p of the sound signal acting on the membrane 110 is shown by the arrow, wherein the membrane 110 is displaced by the sound pressure p with respect to the winding plane of the coil 120 .

Fig. 5A shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 5A corresponds to the illustration in FIG. 1A or the sound transducer device 100 in FIG. 5A corresponds to the sound transducer device in FIG. In coil base body 130 , coil 120 and coil base body 130 are arranged with cover film 110 or electrically conductive coating 115 . The coil 120 is thus a flat or planar coil 120 embedded in a coil base body 130 , which is realized, for example, in the form of a printed circuit board. Coil base body 130 has through-holes which provide access to the cavity between winding base body 130 with coil 120 and membrane 110 with electrically conductive coating 115 . The passages or recesses are realized here, for example, by milling the coil base body 130 or the printed circuit board. Coil 120 is integrated in coil base body 130 or circuit board or directly in the housing (not shown) of sound transducer device 100 and accommodates membrane 110 or MEMS sensor membrane.

Fig. 5B shows a schematic cross-sectional view of the sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 5B corresponds to the illustration in FIG. 5A or the sound transducer device 100 in FIG. 5B corresponds to the sound transducer device 100 in FIG. The sound pressure p of the sound signal acting on the membrane 110 is shown by the arrow, wherein the membrane 110 is deflected towards the coil 120 by the sound pressure p.

Fig. 6A shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. In this case, the illustration in FIG. 6A corresponds to the illustration in FIG. 5A or the sound transducer device 100 in FIG. 6A corresponds to the sound transducer device 100 in FIG. The through holes in the coil base body 130 are formed.

Fig. 6B shows a schematic cross-sectional view of the sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 6B corresponds to the illustration in FIG. 6A or the sound transducer device 100 in FIG. 6B corresponds to the sound transducer device 100 in FIG. The sound pressure p of the sound signal acting on the membrane 110 is shown by the arrow, wherein the membrane 110 is deflected towards the coil 120 by the sound pressure p.

FIG. 7A shows a schematic cross-sectional view of a sensor device 700 according to an exemplary embodiment of the invention. The sensor device 700 has a sound converter device 100 . Here, the sound transducer device 100 in FIG. 7A corresponds to the sound transducer devices of FIGS. 1A , 1B, 3A to 6B, 8A and 8B. Sensor device 700 also has computing device 740 . Computing device 740 can be a circuit, in particular an application-specific integrated circuit or ASIC (Application Specific Integrated Circuit) or similar. The computing device 740 is electrically connected to the coil 120 . Computing device 740 is arranged in coil base body 130 . In this case, coil base body 130 can also represent at least a part of the housing of computing device 740 . Sensor device 700 is realized here, for example, as a two-chip version. The coil 120 or the eddy current coil is formed in close proximity to the surface of the coil base body 130 , or the ASIC component, which represents the housing of the computing device 740 . The coil base body 130 or the ASIC component can be mounted directly on the sensor component 105 in a stacked or stacked manner, for example by gluing or the like. Furthermore, the illustration in FIG. 7A corresponds to the illustration in FIG. 5A or FIG. 6A .

FIG. 7B shows a schematic cross-sectional view of a sensor device 700 according to an exemplary embodiment of the invention. In this case, the illustration in FIG. 7B corresponds to the illustration in FIG. 7A or the sensor arrangement 700 in FIG. 7B corresponds to the sensor arrangement in FIG. The sound pressure p of the sound signal acts on the membrane 110 , wherein the membrane 110 is deflected towards the coil 120 by the sound pressure p. Computing device 740 is designed to calculate the impedance of coil 120 as a function of the deflection of the membrane in order to determine the sound pressure p or the sound signal.

Fig. 8A shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 8A corresponds to the illustration in FIG. 5A or FIG. 6A or the sound transducer device 100 in FIG. 8A corresponds to the sound transducer device in FIG. 5A or FIG. 6A with the following exceptions, namely In FIG. 8A , coil 120 is arranged only partially covering film 110 or electrically conductive coating 115 , coil base body 130 has a smaller thickness dimension and the distance between coil base body and electrically conductive coating 115 is smaller. In this case, the membrane 110 is mechanically anchored to the main section 102 of the sensor assembly 105 or to the base body by means of the connection section 104 as a mechanical anchor. A tension-free membrane suspension in combination with the eddy current measurement method is thus achieved for the sound transducer device 100 .

Fig. 8B shows a schematic cross-sectional view of a sound transducer device 100 according to an embodiment of the invention. Here, the illustration in FIG. 8B corresponds to the illustration in FIG. 8A or the sound transducer device 100 in FIG. 8B corresponds to the sound transducer device 100 in FIG. The membrane 110 is realized in the form of a free membrane 110 with no mechanical connection to the main section 102 of the sensor assembly 105 . The connection section is therefore omitted here.

FIG. 9A shows a schematic top view of a sensor assembly 105 according to an embodiment of the invention. The sensor assembly 105 can be the sensor assembly of one of FIGS. 1A , 1B, 3A to 6B and 8A. Thus, the sensor assembly 105 in FIG. 9A can be part of the sound transducer device of one of FIGS. 1A, 1B, 3A to 6B and 8A or part of the sensor arrangement of FIG. 7A or 7B. In FIG. 9A the main section 102 , the connection section 104 , the pressure compensation opening 106 , the electrically conductive coating 115 and the eddy currents generated in the electrically conductive coating 115 are shown symbolically by the sensor assembly 105 I. In FIG. 9A , the electrically conductive coating 115 formed on the membrane is surrounded in the illustration by the main section 102 of the sensor component 105 in the form of a frame.

FIG. 9B shows a schematic top view of an arrangement of the plurality of sensor assemblies 105 of FIG. 9A and the plurality of coils 120 of FIG. 1D , for example, according to an embodiment of the invention. In this case, sensor assembly 105 and coil 120 are, for example, part of the sound transducer device of one of FIGS. 1A , 1B, 3A to 6B and 8A or part of the sensor arrangement of FIG. 7A or 7B . Sensor assemblies 105 and coils 120 are arranged alternately in a checkerboard pattern. A checkerboard array or 4×4 array of eight sensor assemblies 105 and eight coils 120 is only shown by way of example in FIG. 9B . According to another embodiment of the invention, the pattern of the arrangement and the number of sensor assemblies 105 and coils 120 can be different than that shown in FIG. 9B .

FIG. 9C shows a schematic top view of an arrangement of the plurality of sensor assemblies 105 of FIG. 9A and, for example, the coil 120 of FIG. 1D , according to an embodiment of the invention. In this case, sensor assembly 105 and coil 120 are, for example, part of the sound transducer device of one of FIGS. 1A , 1B, 3A to 6B and 8A or part of the sensor arrangement of FIG. 7A or 7B . The sensor assemblies 105 are here arranged in a 3×3 arrangement. Coil 120 is arranged around sensor component 105 in plan view.

FIGS. 9A to 9C thus show an untensioned membrane suspension and possible array arrangements in which, for example, a plurality of small coils 120 or a plurality of small membranes 110 and one coil 120 can be provided.

Fig. 10 shows a flowchart of a method 1000 for manufacturing a sound transducer device according to an embodiment of the invention. Method 1000 has a preparatory step 1010 of providing a membrane and a collection device. The membrane has an electrically conductive material and can be deflected by an acoustic signal that strikes the membrane. The acquisition device is designed to induce eddy currents in the membrane which can be influenced by a deflection of the membrane which can be generated by the acoustic signal. The acquisition device is also designed to detect eddy currents in the form of the impedance of the acquisition device in relation to the eddy currents. Method 1000 also includes a step 1020 in which the membrane and the acquisition device are arranged relative to one another in such a way that the acquisition device can be inductively coupled to the membrane. Using the method 1000 for producing a sound transducer device, for example one of FIGS. 1A to 9C can advantageously be produced.

Fig. 11 shows a flowchart of a method 1100 for determining a sound signal according to an embodiment of the present invention. Method 1100 has a step 1110 of applying an acoustic signal to a membrane deflectable by the acoustic signal, the membrane having an electrically conductive material. Method 1100 also has a step 1120 of conducting an electric current through the acquisition device in order to induce eddy currents in the membrane, which can be influenced by a deflection of the membrane that can be generated by the acoustic signal. Method 1100 also has a step 1130 of detecting eddy currents in the form of an impedance of a detection device dependent on the eddy currents. Furthermore, the method 1100 has a step 1140 of calculating the impedance of the acquisition device in order to determine the sound signal. The method 1100 can be advantageously implemented in conjunction with a sensor device or sound transducer device such as any one of FIGS. 1A to 9C .

The exemplary embodiments described and shown in the drawings are selected as examples only. Different exemplary embodiments can be combined with one another completely or with respect to individual features. An exemplary embodiment can also be supplemented by features of another exemplary embodiment. Furthermore, the method steps according to the invention can be carried out repeatedly and in a sequence different from that described.

Claims (11)

1. A sound transducer device (100) having the following characteristics: - a membrane (110) having an electrically conductive material (115), wherein the membrane (110) can be deflected by an acoustic signal (p) occurring on the membrane; and - collection means (120) configured to induce eddy currents (I) in said membrane (110) and to collect an impedance of said collection means (120) dependent on said eddy currents (I) to determine Via the sound pressure represented by the sound signal, the eddy current can be influenced by a deflection of the membrane ( 110 ), which can be generated by the sound signal (p). 2 . The sound transducer device ( 100 ) according to claim 1 , characterized in that the electrically conductive material ( 115 ) of the membrane ( 110 ) is electrically insulating, in particular from the sound transducer device ( 100 ). ) at least one additional component is electrically insulated. 3 . The sound transducer device ( 100 ) as claimed in claim 1 , characterized in that the electrically conductive material ( 115 ) of the membrane ( 110 ) is a ferromagnetic material. 4 . 4 . The sound transducer device ( 100 ) as claimed in claim 1 , characterized by a microelectromechanically produced carrier device ( 105 ), wherein the membrane ( 110 ) has the carrier device ( 105 ). and/or the collection device ( 120 ) is molded in or on a subsection of the support device ( 105 ). 5 . The sound transducer device ( 100 ) according to claim 4 , characterized in that the membrane sections of the carrier device ( 105 ) are mechanically connected by means of at least one connection section ( 104 ) of the carrier device ( 105 ). is connected to the main section (102) of the support device (105), or the membrane section of the support device (105) is freely arranged with respect to the main section (102) of the support device (105). 6. A sensor device (700) for determining an acoustic signal (p), wherein said sensor device (700) is characterized by: - A sound transducer device (100) according to any one of the preceding claims; and - computing means (740), said computing means being electrically connectable or electrically connectable to the acquisition means (120) of said sound transducer device (100), wherein said computing means (740) is configured to read and calculate the acquisition means (120) impedance, thereby determining the sound signal (p). 7. The sensor device (700) according to claim 6, characterized in that the acquisition device (120) and the calculation device (740) of the sound transducer device (100) are arranged and/or fixed in a common circuit case body (130) and/or arranged and/or fixed on a common circuit board (130). 8 . The sensor device ( 700 ) according to claim 6 , characterized in that the sound transducer device ( 100 ) has a plurality of membranes ( 110 ) and at least one acquisition device ( 120 ). 9. A method (1000) for manufacturing a sound transducer device (100), wherein said method (1000) has the steps of: - providing (1010) a membrane (110) having an electrically conductive material (115), wherein said membrane (110) is deflectable by an acoustic signal (p) occurring on the membrane; and providing (1010) a collection device (120) configured to induce eddy currents (I) in the membrane (110) and to collect an impedance of the collection device (120) dependent on the eddy currents (I) to determine passing the sound pressure represented by the sound signal, the vortex can be influenced by the deflection of the membrane (110), which can be produced by the sound signal (p); and - The membrane ( 110 ) and the acquisition device ( 120 ) are arranged ( 1020 ) relative to one another in such a way that the acquisition device ( 120 ) is inductively coupled or coupled to the membrane ( 110 ). 10. A method (1100) for determining a sound signal (p), wherein said method (1100) has the steps of: - loading (1110) with an acoustic signal (p) a membrane (110) deflectable by the acoustic signal (p), said membrane having an electrically conductive material (115); - conduct (1120) an electric current through the acquisition means (120) in order to induce eddy currents (I) in said membrane (110), said eddy currents being able to be affected by said membrane (110), capable of passing said acoustic signal (p) The effect of the resulting offset; - acquiring (1130) an impedance of said acquisition device (120) dependent on said eddy current (I) in order to determine an acoustic pressure represented by said acoustic signal; and - calculating (1140) an impedance of said acquisition device (120) in order to determine said sound signal (p). 11. A computer program product with a program code for carrying out the method (1100) according to claim 10 when the program is executed on a device (700).

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