CN103640294B - A kind of compound package material - Google Patents
A kind of compound package material Download PDFInfo
- Publication number
- CN103640294B CN103640294B CN201310615630.5A CN201310615630A CN103640294B CN 103640294 B CN103640294 B CN 103640294B CN 201310615630 A CN201310615630 A CN 201310615630A CN 103640294 B CN103640294 B CN 103640294B
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- China
- Prior art keywords
- microns
- thickness
- package material
- compound package
- film
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 44
- 239000000463 material Substances 0.000 title claims abstract description 39
- 239000004952 Polyamide Substances 0.000 claims abstract description 9
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 9
- VRNCRGHDRGGBLW-UHFFFAOYSA-N cyclopenta-1,2-diene Chemical compound C1CC=C=C1 VRNCRGHDRGGBLW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920002647 polyamide Polymers 0.000 claims abstract description 9
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 9
- 239000005022 packaging material Substances 0.000 abstract description 11
- 238000009835 boiling Methods 0.000 abstract description 5
- 238000010411 cooking Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of compound package material, compound package material is four layers, the pet film that the polyamide film that ground floor is thickness 18 microns ~ 27 microns, the second layer are thickness 35 microns ~ 50 microns, third layer be thickness 43 microns ~ 55 microns polyphenylene oxide film, the 4th layer be 1,2-cyclopentadiene film of thickness 26 microns ~ 42 microns.The packaging material of compound have the advantage of higher peeling force and resistance to boiling, can be used in the packaging material of association area.
Description
Technical field
The present invention relates to a kind of packaging material, particularly relate to a kind of compound package material with higher peeling force and resistance to cooking property.
Background technology
Packaging material in use there will be a lot of problem, as some compound package materials, due to the restriction of property of raw material, and the problem of processing method, the compound package material prepared in use time easily break and layering, there is lower peeling force, due to the peeling force that it is lower, very large restriction is created to its application.In addition, packaging material possess good resistance to cooking property, can widen the purposes of packaging material.Therefore, develop a kind of compound package material with higher peeling force and resistance to boiling to be necessary very much.
Summary of the invention
The technical problem solved: the problem of conventional low, the not resistance to boiling of compound package material peeling force.
Technical scheme: the invention discloses a kind of compound package material, compound package material is four layers, the pet film that the polyamide film that ground floor is thickness 18 microns ~ 27 microns, the second layer are thickness 35 microns ~ 50 microns, third layer be thickness 43 microns ~ 55 microns polyphenylene oxide film, the 4th layer be 1,2-cyclopentadiene film of thickness 26 microns ~ 42 microns.The packaging material first melting of compound, is secondly extruded by extruder, extrudes rear adhesion-molded, then cool to room temperature, obtains compound package material.In compound package material, the thickness of polyamide film is preferably 27 microns.In compound package material, the thickness of pet film is preferably 50 microns.In compound package material, the thickness of polyphenylene oxide film is preferably 43 microns.In compound package material, the thickness of 1,2-cyclopentadiene film is 42 microns.
Beneficial effect: the compound package material of preparation has higher peeling force and resistance to cooking property, under ASTMD903 testing standard, the peeling force of compound package material is 87N/25mm to 93N/25mm, and boiling water put into by packaging material, and to boil 30min to 60min unchanged.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of compound package material, 1 for polyamide film, 2 for pet film, 3 for polyphenylene oxide film, 4 be 1,2-cyclopentadiene film.
Detailed description of the invention
Embodiment 1
A kind of compound package material, compound package material is four layers, the pet film 2 that the polyamide film 1 that ground floor is thickness 27 microns, the second layer are thickness 35 microns, third layer be thickness 55 microns polyphenylene oxide film 3, the 4th layer be 1,2-cyclopentadiene film 4 of thickness 26 microns.The packaging material first melting of compound, is secondly extruded by extruder, extrudes rear adhesion-molded, then cool to room temperature, obtains compound package material.
Embodiment 2
A kind of compound package material, compound package material is four layers, the pet film 2 that the polyamide film 1 that ground floor is thickness 18 microns, the second layer are thickness 40 microns, third layer be thickness 43 microns polyphenylene oxide film 3, the 4th layer be 1,2-cyclopentadiene film 4 of thickness 33 microns.The packaging material first melting of compound, is secondly extruded by extruder, extrudes rear adhesion-molded, then cool to room temperature, obtains compound package material.
Embodiment 3
A kind of compound package material, compound package material is four layers, the pet film 2 that the polyamide film 1 that ground floor is thickness 23 microns, the second layer are thickness 50 microns, third layer be thickness 48 microns polyphenylene oxide film 3, the 4th layer be 1,2-cyclopentadiene film 4 of thickness 42 microns.The packaging material first melting of compound, is secondly extruded by extruder, extrudes rear adhesion-molded, then cool to room temperature, obtains compound package material.
Determine embodiment 1, embodiment 2, the peeling force of embodiment 3 and cooking property, peel test force standard is ASTMD903, and embodiment 1, embodiment 2, embodiment 3 are put into boiling water respectively and boiled 30min, 45min, 60min, observes its change.Measurement result is as following table.
| Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Peeling force | 91N/25mm | 87N/25mm | 93N/25mm |
| Resistance to cooking property | 30min is unchanged | 45min is unchanged | 60min is unchanged |
The compound package material of preparation is provided with higher peeling force and resistance to cooking property.
Claims (5)
1. a compound package material, it is characterized in that compound package material is four layers, the pet film (2) that the polyamide film (1) that ground floor is thickness 18 microns ~ 27 microns, the second layer are thickness 35 microns ~ 50 microns, third layer be thickness 43 microns ~ 55 microns polyphenylene oxide film (3), the 4th layer be 1,2-cyclopentadiene film (4) of thickness 26 microns ~ 42 microns.
2. a kind of compound package material according to claim 1, is characterized in that the thickness of polyamide film in compound package material (1) is 27 microns.
3. a kind of compound package material according to claim 1, is characterized in that the thickness of pet film in compound package material (2) is 50 microns.
4. a kind of compound package material according to claim 1, is characterized in that the thickness of polyphenylene oxide film (3) in compound package material is 43 microns.
5. a kind of compound package material according to claim 1, is characterized in that the thickness of 1,2-cyclopentadiene film (4) in compound package material is 42 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310615630.5A CN103640294B (en) | 2013-11-28 | 2013-11-28 | A kind of compound package material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310615630.5A CN103640294B (en) | 2013-11-28 | 2013-11-28 | A kind of compound package material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103640294A CN103640294A (en) | 2014-03-19 |
| CN103640294B true CN103640294B (en) | 2015-08-12 |
Family
ID=50245650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310615630.5A Expired - Fee Related CN103640294B (en) | 2013-11-28 | 2013-11-28 | A kind of compound package material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103640294B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104760347A (en) * | 2015-03-28 | 2015-07-08 | 桐城市福润包装材料有限公司 | Baking packaging material |
| CN105035526A (en) * | 2015-05-29 | 2015-11-11 | 桐城市福润包装材料有限公司 | Baking packaging material |
| CN107471793A (en) * | 2017-08-15 | 2017-12-15 | 安徽华猫软包装有限公司 | A kind of firm Polywoven Bag of multilayer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262995A (en) * | 1998-12-18 | 2000-08-16 | 德山株式会社 | Laminated film |
| CN2721390Y (en) * | 2003-10-14 | 2005-08-31 | Flexo制造公司 | Flavoured laminated sheet structure |
| CN202656531U (en) * | 2012-06-14 | 2013-01-09 | 海宁市粤海彩印有限公司 | High barrier transparent steaming-boiling resistance composite membrane |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000202937A (en) * | 1999-01-14 | 2000-07-25 | Toppan Printing Co Ltd | Deposition film laminated packaging material |
| US8998027B2 (en) * | 2011-09-02 | 2015-04-07 | Sonoco Development, Inc. | Retort container with thermally fused double-seamed or crimp-seamed metal end |
-
2013
- 2013-11-28 CN CN201310615630.5A patent/CN103640294B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262995A (en) * | 1998-12-18 | 2000-08-16 | 德山株式会社 | Laminated film |
| CN2721390Y (en) * | 2003-10-14 | 2005-08-31 | Flexo制造公司 | Flavoured laminated sheet structure |
| CN202656531U (en) * | 2012-06-14 | 2013-01-09 | 海宁市粤海彩印有限公司 | High barrier transparent steaming-boiling resistance composite membrane |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103640294A (en) | 2014-03-19 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151218 Address after: Xinqiao Town Temple three road 201612 Shanghai city Songjiang District No. 18 standard factory Patentee after: Jiayi (Shanghai) packing product Co., Ltd. Address before: No. D802 530 building 214000 Jiangsu province Wuxi city Wuxi District Taihu international science and Technology Park of University Science and Technology Park Qingyuan Road Patentee before: WUXI HEZHONG INFORMATION TECHNOLOGY CO., LTD. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20181128 |
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| CF01 | Termination of patent right due to non-payment of annual fee |