CN103600553B - Cover strip on a kind of SMD heat-sealing type - Google Patents
Cover strip on a kind of SMD heat-sealing type Download PDFInfo
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- CN103600553B CN103600553B CN201310585410.2A CN201310585410A CN103600553B CN 103600553 B CN103600553 B CN 103600553B CN 201310585410 A CN201310585410 A CN 201310585410A CN 103600553 B CN103600553 B CN 103600553B
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- Prior art keywords
- layer
- wax
- cover strip
- sealing type
- rubber layer
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- 238000007789 sealing Methods 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000001993 wax Substances 0.000 claims abstract description 16
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000004200 microcrystalline wax Substances 0.000 claims abstract description 7
- 229920002545 silicone oil Polymers 0.000 claims abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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Abstract
The invention discloses cover strip on a kind of SMD heat-sealing type, comprise the pet layer, PE layer, rubber layer and the wax layer that superpose successively, rubber layer comprises ethylene bis stearamide 65%-75%, resin 25%-15%, transparent powder 10%; Wax layer comprises PE micro-wax powder 85-97%, silicone oil 15-3%.Beneficial effect of the present invention is: 1. cost of material is lower, the constant product quality of production; 2. without too high technological requirement; 3. sticking effect is good, and pulling force is suitable simultaneously.
Description
Technical field
The present invention relates to cover strip on a kind of SMD heat-sealing type.
Background technology
SMD is the abbreviation of SurfaceMountedDevices, means: surface mount device.In prior art, after producing SMD finished product, usually all can be loaded in packing box, and then on package cover last layer cover strip, but due to very high to the requirement of upper cover strip, so good sealing effect, the upper cover strip that only needs suitable pulling force just can pull open when needing to pull open can just become present urgent problem when how to be produced on sealing.
Summary of the invention
The invention provides cover strip on a kind of SMD heat-sealing type, solve the defect on SMD existing for cover strip in prior art.
The present invention is realized by following technical scheme:
Cover strip on a kind of SMD heat-sealing type, it is characterized in that, comprise the pet layer, PE layer, rubber layer and the wax layer that superpose successively, described rubber layer comprises ethylene bis stearamide 65%-75%, resin 25%-15%, transparent powder 10%; Described wax layer comprises PE micro-wax powder 85-97%, silicone oil 15-3%.
Cover strip on above-mentioned a kind of SMD heat-sealing type, is characterized in that, wax layer comprises the micro-wax powder 95% of PE, silicone oil 5%.
Cover strip on above-mentioned a kind of SMD heat-sealing type, it is characterized in that, described rubber layer comprises ethylene bis stearamide 65%, resin 25%, transparent powder 10%.
Cover strip on above-mentioned a kind of SMD heat-sealing type, it is characterized in that, described rubber layer comprises ethylene bis stearamide 75%, resin 15%, transparent powder 10%.
Cover strip on above-mentioned a kind of SMD heat-sealing type, is characterized in that, the thickness of described pet layer is 23 μm, the thickness of PE layer is 15 μm, the thickness of rubber layer is 10 μm, and the thickness of wax is 1 μm.
Beneficial effect of the present invention is:
1. cost of material is lower, the constant product quality of production;
2. without too high technological requirement;
3. sticking effect is good, and pulling force is suitable simultaneously.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1
Cover strip on a kind of SMD heat-sealing type, it is characterized in that, comprise the pet layer, PE layer, rubber layer and the wax layer that superpose successively, described rubber layer comprises ethylene bis stearamide 65%, resin 25%, transparent powder 10%; Described wax layer comprises the micro-wax powder 95% of PE, silicone oil 5%.The thickness of pet layer is 23 μm, the thickness of PE layer is 15 μm, the thickness of rubber layer is 10 μm, and the thickness of wax is 1 μm.
Embodiment 2
Cover strip on a kind of SMD heat-sealing type, it is characterized in that, comprise the pet layer, PE layer, rubber layer and the wax layer that superpose successively, described rubber layer comprises ethylene bis stearamide 75%, resin 15%, transparent powder 10%; Described wax layer comprises the micro-wax powder 95% of PE, silicone oil 5%.The thickness of pet layer is 23 μm, the thickness of PE layer is 15 μm, the thickness of rubber layer is 10 μm, and the thickness of wax is 1 μm.
Beneficial effect of the present invention is:
1. cost of material is lower, the constant product quality of production;
2. without too high technological requirement;
3. sticking effect is good, and pulling force is suitable simultaneously.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; the just principle of the present invention described in above-described embodiment and description; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in claimed scope of the present invention.The protection domain of application claims is defined by appending claims and equivalent thereof.
Claims (5)
1. a cover strip on SMD heat-sealing type, is characterized in that, comprise the pet layer, PE layer, rubber layer and the wax layer that superpose successively, described rubber layer comprises ethylene bis stearamide 65%-75%, resin 25%-15%, transparent powder 10%; Described wax layer comprises PE micro-wax powder 85-97%, silicone oil 15-3%.
2. cover strip on a kind of SMD heat-sealing type as claimed in claim 1, is characterized in that, wax layer comprises the micro-wax powder 95% of PE, silicone oil 5%.
3. cover strip on a kind of SMD heat-sealing type as claimed in claim 2, it is characterized in that, described rubber layer comprises ethylene bis stearamide 65%, resin 25%, transparent powder 10%.
4. cover strip on a kind of SMD heat-sealing type as claimed in claim 2, it is characterized in that, described rubber layer comprises ethylene bis stearamide 75%, resin 15%, transparent powder 10%.
5. cover strip on a kind of SMD heat-sealing type as described in claim 3 or 4, is characterized in that, the thickness of described pet layer is 23 μm, the thickness of PE layer is 15 μm, the thickness of rubber layer is 10 μm, and the thickness of wax is 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310585410.2A CN103600553B (en) | 2013-11-19 | 2013-11-19 | Cover strip on a kind of SMD heat-sealing type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310585410.2A CN103600553B (en) | 2013-11-19 | 2013-11-19 | Cover strip on a kind of SMD heat-sealing type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103600553A CN103600553A (en) | 2014-02-26 |
| CN103600553B true CN103600553B (en) | 2015-12-30 |
Family
ID=50118849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310585410.2A Active CN103600553B (en) | 2013-11-19 | 2013-11-19 | Cover strip on a kind of SMD heat-sealing type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103600553B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106633143A (en) * | 2016-06-24 | 2017-05-10 | 江西若邦科技股份有限公司 | Manufacturing method for heat active adhesive |
| CN113858743A (en) * | 2021-09-30 | 2021-12-31 | 江西若邦科技股份有限公司 | SMD heat-seal type upper cover tape |
| CN113752663A (en) * | 2021-09-30 | 2021-12-07 | 江西若邦科技股份有限公司 | Upper cover tape |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1777547A (en) * | 2003-04-24 | 2006-05-24 | 大日本印刷株式会社 | Electronic part taping packaging cover tape |
| CN101142869A (en) * | 2005-03-11 | 2008-03-12 | 栗村化学株式会社 | Cover tape for encapsulating electronic components and method for preparing same |
| CN102119108A (en) * | 2008-08-12 | 2011-07-06 | 住友电木株式会社 | Cover tape for packaging electronic part and electronic-part package |
| CN202400434U (en) * | 2011-11-17 | 2012-08-29 | 庄素珠 | A top cover belt structure with static electricity elimination |
| CN103043302A (en) * | 2011-10-14 | 2013-04-17 | 电气化学工业株式会社 | Cover tape |
| CN103273714A (en) * | 2013-06-03 | 2013-09-04 | 靖江瑞泰电子材料有限公司 | Heat seal cover tape and preparation method of heat seal cover tape |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4509264B2 (en) * | 1999-10-08 | 2010-07-21 | 日東電工株式会社 | Cover tape for electronic component carrier and electronic component carrier |
| JP2002019796A (en) * | 2000-07-07 | 2002-01-23 | Daishowa Paper Products Co Ltd | Easy-open bag |
-
2013
- 2013-11-19 CN CN201310585410.2A patent/CN103600553B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1777547A (en) * | 2003-04-24 | 2006-05-24 | 大日本印刷株式会社 | Electronic part taping packaging cover tape |
| CN101142869A (en) * | 2005-03-11 | 2008-03-12 | 栗村化学株式会社 | Cover tape for encapsulating electronic components and method for preparing same |
| CN102119108A (en) * | 2008-08-12 | 2011-07-06 | 住友电木株式会社 | Cover tape for packaging electronic part and electronic-part package |
| CN103043302A (en) * | 2011-10-14 | 2013-04-17 | 电气化学工业株式会社 | Cover tape |
| CN202400434U (en) * | 2011-11-17 | 2012-08-29 | 庄素珠 | A top cover belt structure with static electricity elimination |
| CN103273714A (en) * | 2013-06-03 | 2013-09-04 | 靖江瑞泰电子材料有限公司 | Heat seal cover tape and preparation method of heat seal cover tape |
Non-Patent Citations (1)
| Title |
|---|
| 《SEBS应用—PS载带封口材料》;张磊;《应用科技》;20120531;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103600553A (en) | 2014-02-26 |
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Address after: 335400 Guixi Industrial Park, Jiangxi, Guixi Applicant after: JIANGXI RUOBANG ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 335400 Guixi Industrial Park, Jiangxi, Yingtan Applicant before: GUIXI RUOBANG ELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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Address after: 335400 Guixi Industrial Park, Jiangxi, Guixi Applicant after: JIANGXI RUOBANG TECHNOLOGY CO.,LTD. Address before: 335400 Guixi Industrial Park, Jiangxi, Guixi Applicant before: JIANGXI RUOBANG ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: SMD heat sealing type upper cover belt Effective date of registration: 20220428 Granted publication date: 20151230 Pledgee: Guixi sub branch of Postal Savings Bank of China Pledgor: JIANGXI RUOBANG TECHNOLOGY CO.,LTD. Registration number: Y2022980004947 |
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Date of cancellation: 20230726 Granted publication date: 20151230 Pledgee: Guixi sub branch of Postal Savings Bank of China Pledgor: JIANGXI RUOBANG TECHNOLOGY CO.,LTD. Registration number: Y2022980004947 |
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