CN102821557A - Method for splicing circuit boards - Google Patents
Method for splicing circuit boards Download PDFInfo
- Publication number
- CN102821557A CN102821557A CN 201210280608 CN201210280608A CN102821557A CN 102821557 A CN102821557 A CN 102821557A CN 201210280608 CN201210280608 CN 201210280608 CN 201210280608 A CN201210280608 A CN 201210280608A CN 102821557 A CN102821557 A CN 102821557A
- Authority
- CN
- China
- Prior art keywords
- splicing
- wiring board
- circuit boards
- close
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 7
- 239000011265 semifinished product Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for splicing circuit boards, comprising the flowing steps of: 1, splicing layers, sorting and splicing the circuit boards designed in the same layer; 2, arranging an anti-welding layer on the surface of the spliced board, namely, arranging the anti-welding layer on the circuit boards on the same layer; 3, arranging a splicing circuit; and 4, setting the cooper thickness of the spliced board, namely, setting the required copper thickness on the circuit board according to an electroplating requirement. The method for splicing circuit boards can be used for performing the splicing design to similar products and reducing the material waste in the production process of the spliced board; in addition, the initial method needs to be followed by several workers, but the method provided by the invention is implemented by only one worker by splicing several part numbers on one semi-finished board, and therefore, the working time is greatly saved and the production development of an enterprise is enhanced.
Description
Technical field
The present invention relates to a kind of splicing method that closes of wiring board, refer in particular to and a kind ofly can the wiring board of a plurality of different item numbers be closed the splicing method that closes of piecing together a wiring board on the big plate of semi-finished product.
Background technology
When making less small lot of client's finished size or sample wiring board because customer demand finished product negligible amounts; The just enough clients' of the finished product quantity that cut out of the big plate of a slice delivery amount often; And opening of wiring board expects that characteristic and pressing press require must produce 4 half-finished product plates at every turn; So just cause a large amount of production boards too much to scrap and the production material waste, be unfavorable for the production development of enterprise.
Summary of the invention
Technical problem to above-mentioned existence the objective of the invention is: proposed a kind ofly can the wiring board of a plurality of different item numbers be closed the splicing method that closes of piecing together a wiring board on the big plate of semi-finished product.
Technical solution of the present invention is achieved in that a kind of splicing method that closes of wiring board, may further comprise the steps: the first step, close the assembly level, and the wiring board of same level design is sorted out closed assembly; Second step, close the jigsaw surface welding resisting layer is set, on the wiring board of said same level, welding resisting layer is set; In the 3rd step, be provided with and close the assembly circuit; In the 4th step, it is thick that the copper that closes jigsaw is set, and according to electroplating requirement, satisfactory copper thickness is set in the circuit board.
Preferably, before the first step, select the wiring board of same level through lamination design comparison.
Because the utilization of technique scheme, the present invention compared with prior art has advantage:
The described wiring board of the present invention program close splicing method; All can close the assembly design to similar products like;, production not only reduced the waste of material in closing the process of jigsaw; And needed many people several item numbers that followed up to close and piece together on the half-finished product plate staff's follow-up and can accomplish originally, and practiced thrift the operating time greatly, promote the production development of enterprise.
Embodiment
A kind of wiring board of the present invention close splicing method, may further comprise the steps: a kind of combination method of wiring board may further comprise the steps: the first step, select the wiring board of same level through lamination design comparison; Second step, close the assembly level, the wiring board of same level design is sorted out closed assembly; The 3rd step, close the jigsaw surface welding resisting layer is set, on the wiring board of said same level, welding resisting layer is set; In the 4th step, be provided with and close the assembly circuit; In the 5th step, it is thick that the copper that closes jigsaw is set, and according to electroplating requirement, satisfactory copper thickness is set in the circuit board; The thickness of slab of said same level wiring board requires to close assembly again after then need adjusting when inconsistent, preferentially the plank of the wiring board of the item number of no resistance design is adjusted; The wiring board of the item number that hierarchical Design is inequality can not close assembly; Wiring board of the present invention close splicing method, exactly the figure on the wiring board of different item numbers is designed into respectively on the big plate of same semi-finished product; The circuit of the wiring board of different item numbers requires inconsistent, then adjusts respectively.
Wiring board of the present invention close splicing method; All can close the assembly design to similar products like;, production not only reduced the waste of material in closing the process of jigsaw; And needed many people several item numbers that followed up to close and piece together on the half-finished product plate staff's follow-up and can accomplish originally, and practiced thrift the operating time greatly, promote the production development of enterprise.
The foregoing description only is explanation technical conceive of the present invention and characteristics; Its purpose is to let the personage that is familiar with this technology can understand content of the present invention and implements; Can not limit protection scope of the present invention with this; All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (2)
- A wiring board close splicing method, may further comprise the steps: the first step, close the assembly level, the wiring board of same level design is sorted out is closed assembly; Second step, close the jigsaw surface welding resisting layer is set, on the wiring board of said same level, welding resisting layer is set; In the 3rd step, be provided with and close the assembly circuit; In the 4th step, it is thick that the copper that closes jigsaw is set, and according to electroplating requirement, satisfactory copper thickness is set in the circuit board.
- 2. wiring board according to claim 1 closes splicing method, it is characterized in that: before the first step, select the wiring board of same level through lamination design comparison.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210280608 CN102821557A (en) | 2012-08-09 | 2012-08-09 | Method for splicing circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210280608 CN102821557A (en) | 2012-08-09 | 2012-08-09 | Method for splicing circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102821557A true CN102821557A (en) | 2012-12-12 |
Family
ID=47305319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210280608 Pending CN102821557A (en) | 2012-08-09 | 2012-08-09 | Method for splicing circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102821557A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072813A (en) * | 2015-08-13 | 2015-11-18 | 广州杰赛科技股份有限公司 | Printed board combination production method |
| CN105678408A (en) * | 2015-12-30 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Printed circuit board (PCB) combining and joining method and system |
| CN107567188A (en) * | 2017-08-10 | 2018-01-09 | 勤基电路板（深圳）有限公司 | Processing method, equipment and the printed circuit board of printed circuit board |
-
2012
- 2012-08-09 CN CN 201210280608 patent/CN102821557A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072813A (en) * | 2015-08-13 | 2015-11-18 | 广州杰赛科技股份有限公司 | Printed board combination production method |
| CN105678408A (en) * | 2015-12-30 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Printed circuit board (PCB) combining and joining method and system |
| WO2017113838A1 (en) * | 2015-12-30 | 2017-07-06 | 广州兴森快捷电路科技有限公司 | Pcb panelization method and system |
| US10614386B2 (en) | 2015-12-30 | 2020-04-07 | Guangzhou Fastprint Circuit Tech Co., Ltd. | PCB board assembling method and assembling system |
| CN107567188A (en) * | 2017-08-10 | 2018-01-09 | 勤基电路板（深圳）有限公司 | Processing method, equipment and the printed circuit board of printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121212 |