CN102768348A - System for automatically testing service life of probe - Google Patents
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Abstract
本发明公开了一种探针寿命自动测试系统,包括触力传感器、探针、探针夹具、探针电极引出线、上下运动装置、四线式测试仪和对测试数据进行自动保存和实时数据分析的数据处理系统,其特征在于:所述上下运动装置的运动端上安装有所述探针夹具,所述探针夹具下方安装有探针,所述探针夹具上方安装有将所述探针的电极引出的电路板,所述电路板通过所述探针电极引出线与四线式测试仪的输入端连接,所述触力传感器固定在所述探针的正下方,所述触力传感器通过导线与所述数据处理系统连接,所述四线式测试仪的输出端与所述数据处理系统连接。本发明结构简单,测试数据精确,能实现探针使用寿命的自动评估。
The invention discloses an automatic probe life testing system, which includes a force sensor, a probe, a probe clamp, a probe electrode lead wire, an up and down movement device, a four-wire tester and automatic storage of test data and real-time data The data processing system for analysis is characterized in that: the probe clamp is installed on the moving end of the up and down movement device, the probe is installed below the probe clamp, and the probe clamp is installed above the probe clamp. The circuit board from which the electrode of the needle is drawn, the circuit board is connected to the input end of the four-wire tester through the electrode lead wire of the probe, the force sensor is fixed directly below the probe, and the force sensor is fixed directly below the probe. The sensor is connected to the data processing system through wires, and the output terminal of the four-wire tester is connected to the data processing system. The invention has the advantages of simple structure, accurate test data and automatic evaluation of the service life of the probe.
Description
技术领域 technical field
本发明涉及一种探针寿命自动测试系统。 The invention relates to an automatic test system for probe life. the
背景技术 Background technique
每一个集成电路(IC)封装后,都需要对产品的性能进行测试,IC测试与IC设计、IC制造和IC封装并列,构成IC产业的四大支柱。半导体工业成本发展的特点就是它的单位功能制造成本以每年平均25%~30%的比例下降,而测试成本却以每年平均10.5%的比例提高。采用微探针(针头直径50~500微米)与IC芯片的凸点接触,可向芯片输入电压/电流信号,并从微探针获得IC芯片的电信号,从而分析IC芯片的电性能是否满足IC产品要求,这种微探针测试方法已经成为IC产品电性能测试的重要方式之一。 After each integrated circuit (IC) is packaged, the performance of the product needs to be tested. IC testing is juxtaposed with IC design, IC manufacturing and IC packaging, forming the four pillars of the IC industry. The characteristic of the cost development of the semiconductor industry is that its unit function manufacturing cost decreases by an average of 25% to 30% per year, while the test cost increases by an average of 10.5% per year. Use a microprobe (needle diameter 50-500 microns) to contact the bump of the IC chip, input voltage/current signals to the chip, and obtain the electrical signal of the IC chip from the microprobe, so as to analyze whether the electrical performance of the IC chip meets the requirements IC product requirements, this micro-probe test method has become one of the important ways to test the electrical performance of IC products. the
然而,微探针在测试过程中探针与IC接触,接触压力的大小与所测得的电信号值相关,大量IC产品的测试探针接触针头、探针内部弹簧、针头与针管的磨损等导致探针失效,所以制造的微探针需要对它进行性能和寿命评估。为此需要研发微探针性能和寿命自动测试系统,满足微探针产品评估要求。 However, the microprobe contacts the IC during the test process, and the contact pressure is related to the measured electrical signal value. The test probes of a large number of IC products contact the needle, the internal spring of the probe, the wear of the needle and the needle tube, etc. lead to probe failure, so the manufactured microprobe needs to be evaluated for its performance and lifetime. Therefore, it is necessary to develop an automatic test system for microprobe performance and life to meet the requirements of microprobe product evaluation. the
发明内容 Contents of the invention
本发明要解决的技术问题是提供一种结构简单,测试数据精确,能实现探针使用寿命的自动评估的探针寿命自动测试系统。 The technical problem to be solved by the present invention is to provide an automatic probe life testing system with simple structure, accurate test data, and automatic evaluation of probe service life. the
一种探针寿命自动测试系统,包括触力传感器、探针、探针夹具、探针电极引出线、上下运动装置、四线式测试仪和对测试数据进行自动保存和实时数据分析的数据处理系统,所述上下运动装置的运动端上安装有所述探针夹具,所述探针夹具下方安装有探针,所述探针夹具上方安装有将所述探针的电极引出的电路板,所述电路板通过所述探针电极引出线与四线式测试仪的输入端连接,所述触力传感器固定在所述探针的正下方,所述触力传感器通过导线与所述数据处理系统连接,所述四线式测试仪的输出端与所述数据处理系统连接。 An automatic test system for probe life, including force sensors, probes, probe fixtures, probe electrode leads, up and down movement devices, four-wire testers, and data processing for automatic storage of test data and real-time data analysis system, the moving end of the up and down movement device is equipped with the probe clamp, the probe is installed below the probe clamp, and the circuit board for leading the electrodes of the probe is installed above the probe clamp, The circuit board is connected to the input terminal of the four-wire tester through the electrode lead wire of the probe, the force sensor is fixed directly below the probe, and the force sensor is connected to the data processing device through wires. System connection, the output end of the four-wire tester is connected to the data processing system. the
本发明中,所述触力传感器为高频响触力传感器。 In the present invention, the touch force sensor is a high frequency response touch force sensor. the
本发明中,所述上下运动装置上安装有实现所述上下运动装置精确定位的运动控制器。 In the present invention, a motion controller for realizing precise positioning of the up and down movement device is installed on the up and down movement device. the
本发明中,所述探针可以为单根或多根探针。 In the present invention, the probe can be single or multiple probes. the
由于采用上述方案,本发明具有如下优点: Owing to adopting said scheme, the present invention has following advantage:
1、采用上下运动装置来模拟探针在测试过程中与集成电路IC的循环接触,然后通过将触力传感器和探针的数据反馈到数据处理系统中,从而实现探针使用寿命的自动评估。 1. The up and down movement device is used to simulate the cyclic contact of the probe with the integrated circuit IC during the test, and then the data of the force sensor and the probe is fed back to the data processing system, so as to realize the automatic evaluation of the service life of the probe. the
2、上下运动装置通过运动控制器实现精确定位和上下运动,使得试验数据更加精确。 2. The up and down movement device realizes precise positioning and up and down movement through the motion controller, making the test data more accurate. the
3、同时采集探针接触电阻和接触压力,获得二者的内在关系,为探针合理使用提供指导。 3. Simultaneously collect the contact resistance and contact pressure of the probe to obtain the internal relationship between the two, and provide guidance for the rational use of the probe. the
4、通过探针夹具上安装的探针数量,可实现单根或多根探针同时测试。 4. Through the number of probes installed on the probe fixture, single or multiple probes can be tested at the same time. the
附图说明 Description of drawings
图1为本发明的结构示意图; Fig. 1 is a structural representation of the present invention;
具体实施方式 Detailed ways
下面结合附图和具体实施方式对本发明作进一步详细的说明。 The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. the
如图1所示:一种探针寿命自动测试系统,如图1所示,把高频响触力传感器1放置于平台上,将待测试的单根探针或多跟探针2装入探针夹具3,根据探针2尺寸,其直径一般为50-300微米,固定探针2的探针夹具3可将一个或多个探针2同时固定于一个探针夹具3中,以满足单根探针和多根探针同时测量要求,通过固定在探针夹具3上的电路板10将探针2的电极引出,再通过与电路板10连接的探针电极引出线4与四线式测试仪8相连,通过四线式测试仪8采集探针2接触电阻的变化,探针夹具3固定于运动导轨5上,上下运动装置5通过运动控制器6和电机驱动电源7实现上下运动,采用伺服电机通过软件程序和运动控制器6手动获取探针的精确位置并记录下此坐标,再输给自动运动模式下的限位坐标,从而精确实现探针定位与往复运动,运动导轨5向下运动使得探针2接触高频响触力传感器1,通过探针2循环触及到高频响触力传感器1,高频响触力传感器1通过采集卡获取探针接触过程的实时压力信号,并通过电脑9与四线式测试仪8的数据线相连获取四线式测试仪8的接触电阻数据。所述电脑9内安装有数据处理系统,数据处理系统对整个测试过程实现自动循环测试,并对测试数据进行自动保存和实时数据分析,评估探针的循环寿命和电阻/压力性能。
As shown in Figure 1: An automatic test system for probe life, as shown in Figure 1, the high-frequency response force sensor 1 is placed on the platform, and the single or
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293503A (en) * | 2013-05-24 | 2013-09-11 | 上海宏力半导体制造有限公司 | Probe card detecting method |
| CN104237695A (en) * | 2014-09-24 | 2014-12-24 | 苏州博众精工科技有限公司 | Probe service life testing mechanism |
| CN106468724A (en) * | 2015-08-20 | 2017-03-01 | 三星电子株式会社 | Attachment structure component and its module and probe card assembly and wafer sort equipment |
| CN108398581A (en) * | 2018-03-01 | 2018-08-14 | 常州市都威电子有限公司 | The detection jig of data line |
| CN108872917A (en) * | 2018-06-28 | 2018-11-23 | 北京铂阳顶荣光伏科技有限公司 | A kind of test device for probe contact class testing equipment |
| CN109061445A (en) * | 2018-09-17 | 2018-12-21 | 扬州晶新微电子有限公司 | A kind of chip test circuit that data automatically save, test macro and test method |
| CN110297110A (en) * | 2018-03-21 | 2019-10-01 | 科磊股份有限公司 | Probe structure, fixture, container, automation probe replacement system and method |
| CN110308352A (en) * | 2019-07-16 | 2019-10-08 | 珠海达明科技有限公司 | An intelligent probe test platform and its test method |
| CN110794176A (en) * | 2018-08-03 | 2020-02-14 | 矽品精密工业股份有限公司 | Detection device |
| CN111766544A (en) * | 2020-05-28 | 2020-10-13 | 苏州华兴源创科技股份有限公司 | Testing device and method for POGO Pin connector |
| CN116243034A (en) * | 2022-12-20 | 2023-06-09 | 福建星云电子股份有限公司 | Automatic test method, system, equipment and medium for service life of current probe |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293503A (en) * | 2013-05-24 | 2013-09-11 | 上海宏力半导体制造有限公司 | Probe card detecting method |
| CN103293503B (en) * | 2013-05-24 | 2017-02-08 | 上海华虹宏力半导体制造有限公司 | Probe card detecting method |
| CN104237695A (en) * | 2014-09-24 | 2014-12-24 | 苏州博众精工科技有限公司 | Probe service life testing mechanism |
| CN104237695B (en) * | 2014-09-24 | 2017-01-25 | 苏州博众精工科技有限公司 | Probe service life testing mechanism |
| CN106468724A (en) * | 2015-08-20 | 2017-03-01 | 三星电子株式会社 | Attachment structure component and its module and probe card assembly and wafer sort equipment |
| CN108398581A (en) * | 2018-03-01 | 2018-08-14 | 常州市都威电子有限公司 | The detection jig of data line |
| CN108398581B (en) * | 2018-03-01 | 2020-03-20 | 常州市都威电子有限公司 | Detection tool of data line |
| CN110297110A (en) * | 2018-03-21 | 2019-10-01 | 科磊股份有限公司 | Probe structure, fixture, container, automation probe replacement system and method |
| CN110297110B (en) * | 2018-03-21 | 2022-02-15 | 科磊股份有限公司 | Probe structure, clamp, containing box, automatic probe replacing system and method |
| CN108872917A (en) * | 2018-06-28 | 2018-11-23 | 北京铂阳顶荣光伏科技有限公司 | A kind of test device for probe contact class testing equipment |
| CN110794176A (en) * | 2018-08-03 | 2020-02-14 | 矽品精密工业股份有限公司 | Detection device |
| CN109061445A (en) * | 2018-09-17 | 2018-12-21 | 扬州晶新微电子有限公司 | A kind of chip test circuit that data automatically save, test macro and test method |
| CN109061445B (en) * | 2018-09-17 | 2024-04-23 | 扬州晶新微电子有限公司 | Chip test circuit, test system and test method for automatically storing data |
| CN110308352A (en) * | 2019-07-16 | 2019-10-08 | 珠海达明科技有限公司 | An intelligent probe test platform and its test method |
| CN111766544A (en) * | 2020-05-28 | 2020-10-13 | 苏州华兴源创科技股份有限公司 | Testing device and method for POGO Pin connector |
| CN116243034A (en) * | 2022-12-20 | 2023-06-09 | 福建星云电子股份有限公司 | Automatic test method, system, equipment and medium for service life of current probe |
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