CN102566111A - Touch control type display panel - Google Patents
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Abstract
Description
【技术领域】 【Technical field】
本发明系有关于一种显示面板,且特别是有关于一种触控式显示面板。The present invention relates to a display panel, and in particular to a touch display panel.
【背景技术】 【Background technique】
随着科技日新月异的进步,消费性电子产品的应用也越来越多样化,目前的许多电子产品中,除了以轻、薄、短、小为主外,许多可携式的电子产品(例如个人数字助理(personal digital assistant,PDA)或移动电话)已广泛地使用触控式面板(touch panel)。With the rapid advancement of science and technology, the application of consumer electronic products is becoming more and more diversified. Among many current electronic products, in addition to being light, thin, short and small, many portable electronic products (such as personal A digital assistant (personal digital assistant, PDA) or mobile phone) has widely used a touch panel (touch panel).
传统的触控式显示面板系将触控面板与显示面板分开制作,再将触控面板与显示面板组装在一起,而触控式面板又可分为电阻式(Resistive)、电容式(Capacitive)、超音波式(Surface Acoustic Wave)及光学式(Optics)等四种,其中电容式又可分为表面电容式(Surface Capacitive)与投射式电容(Projective Capacitive)两种。The traditional touch display panel is made separately from the touch panel and the display panel, and then the touch panel and the display panel are assembled together, and the touch panel can be divided into resistive and capacitive , ultrasonic (Surface Acoustic Wave) and optical (Optics) and other four, of which capacitive can be divided into surface capacitive (Surface Capacitive) and projected capacitive (Projective Capacitive) two.
请参见图1,此为现有电容触控式显示面板的剖面图,电容触控式显示面板10包括液晶显示面板20与设置于液晶显示面板20之上的触控面板40,两而板之间通过一黏着层30(例如双面胶或是水胶)进行黏合,其中液晶显示面板20包括薄膜晶体管基板21、液晶层23与彩色滤光基板25,触控面板40包括基板41、金属层43、绝缘层45、氧化铟锡层(ITO)47、保护层49等各层,由于触控面板40的基板41具有一定厚度,使得整体触控式面板的厚度与重量无法降低。再者,当光线通过黏着层时,会造成反射,使得触控式显示面板的反射率上升,进而影响光线穿透质量。此外,当液晶显示面板20与触控面板40黏合时,亦会有对准的问题。Please refer to FIG. 1 , which is a cross-sectional view of an existing capacitive touch display panel. The capacitive
因此,业界亟需发展一种触控式显示面板,此面板能够解决上述的问题,且能降低显示面板的厚度与重量,进而简化制程与降低制程成本。Therefore, the industry urgently needs to develop a touch display panel, which can solve the above problems, and can reduce the thickness and weight of the display panel, thereby simplifying the manufacturing process and reducing the manufacturing cost.
【发明内容】 【Content of invention】
本发明提供一种触控式显示面板(touch panel),包括:一第一基板;一第二基板,相对于第一基板设置,其中第一基板或第二基板的厚度小于或等于0.3毫米(mm);一液晶层,设置于第一基板与第二基板之间;以及一触控感测组件(touch sensor),直接(directly)形成于第二基板的一远离液晶层的表面上,其中该触控感测组件包括一图案化透明导电层(patternedtransparent conducting layer)。The present invention provides a touch display panel (touch panel), comprising: a first substrate; a second substrate arranged relative to the first substrate, wherein the thickness of the first substrate or the second substrate is less than or equal to 0.3 mm ( mm); a liquid crystal layer disposed between the first substrate and the second substrate; and a touch sensing element (touch sensor), directly (directly) formed on a surface of the second substrate away from the liquid crystal layer, wherein The touch sensing component includes a patterned transparent conducting layer.
为让本发明之上述和其它目的、特征、和优点能更明显易懂,下文特举出较佳实施例,并配合所附图式,作详细说明如下:In order to make the above-mentioned and other objects, features, and advantages of the present invention more clearly understood, the preferred embodiments are listed below, together with the accompanying drawings, and are described in detail as follows:
【附图说明】 【Description of drawings】
图1为一剖面图,用以说明现有的触控式显示面板。FIG. 1 is a cross-sectional view for illustrating a conventional touch display panel.
图2A-2D为一系列剖而图,用以说明本发明一实施例的触控式显示面板。2A-2D are a series of cross-sectional views for illustrating a touch display panel according to an embodiment of the present invention.
图3A-3B为一系列剖面图,用以说明本发明触控感测组件的结构。3A-3B are a series of cross-sectional views for illustrating the structure of the touch sensing device of the present invention.
【主要组件符号说明】[Description of main component symbols]
10~触控式显示而板;10~Touch display panel;
20~液晶显示面板;20 ~ liquid crystal display panel;
21~薄膜晶体管基板;21~Thin film transistor substrate;
23~液晶层;23 ~ liquid crystal layer;
25~彩色滤光基板;25~color filter substrate;
30~黏着层;30~adhesive layer;
40~触控面板;40~touch panel;
41~基板;41 ~ substrate;
43~金属层;43 ~ metal layer;
45~绝缘层;45 ~ insulating layer;
47~氧化铟锡层;47~indium tin oxide layer;
49~保护层;49 ~ protective layer;
200~触控式显示面板;200~touch display panel;
210~第一基板;210~the first substrate;
210a~薄化的第一基板;210a - a thinned first substrate;
220~液晶层;220~liquid crystal layer;
230~第二基板;230~second substrate;
230a~薄化的第二基板;230a - a thinned second substrate;
232~表面;232 ~ surface;
240~触控感测组件;240~touch sensing components;
241~图案化透明导电层;241~patterned transparent conductive layer;
241a~平面图案化透明导电层;241a~plane patterned transparent conductive layer;
241b~桥接图案化透明导电层;241b~bridge patterned transparent conductive layer;
243~金属层;243~metal layer;
243a~平面金属层;243a~plane metal layer;
243b~桥接金属层;243b ~ bridging metal layer;
245~介电层;245~dielectric layer;
247~保护层。247 ~ protective layer.
【具体实施方式】 【Detailed ways】
以下特举出本发明的实施例,并配合所附图式作详细说明,而在图式或说明中所使用的相同符号表示相同或类似的部分,且在图式中,实施例的形状或是厚度可扩大,并以简化或是方便标示。再者,图式中各组件的部分将以分别描述说明的,值得注意的是,图式中未绘示或描述的组件,为所属技术领域中具有通常知识者所知的形状,另外,特定的实施例仅为揭示本发明使用的特定方式,其并非用以限定本发明。The following specifically cites the embodiments of the present invention, and describes them in detail in conjunction with the accompanying drawings, and the same symbols used in the drawings or descriptions represent the same or similar parts, and in the drawings, the shape or shape of the embodiments Yes, the thickness can be expanded and marked with simplification or convenience. Furthermore, parts of components in the drawings will be described separately. It should be noted that components not shown or described in the drawings are shapes known to those skilled in the art. In addition, specific The above-mentioned embodiments are only used to disclose specific methods used in the present invention, and are not intended to limit the present invention.
请参见图2A,其显示本发明一实施例的触控式显示面板200的剖面图。触控式显示面板200包括一第一210、一第二基板230、一液晶层220及一触控感测组件(touch sensor)240,其中第二基板230相对于第一基板210设置;液晶层220设置于第一基板210与第二基板230之间。本发明的主要特征为触控感测组件240系直接(directly)形成于第二基板230的一远离液晶层220的表面232上,其中触控感测组件240包括一图案化透明导电层(patterned transparent conducting layer)。Please refer to FIG. 2A , which shows a cross-sectional view of a touch-
于本发明一实施例中,第一基板210为薄膜晶体管基板,第二基板230为彩色滤光基板。于另一实施例中,第一基板210为彩色滤光基板,第二基板230为薄膜晶体管基板。In an embodiment of the present invention, the
薄膜晶体管基板包括次基板与数组层(array layer)(图中未显示),而次基板包括玻璃、石英、塑料、树脂或其它适合的材料,常用的次基板例如为玻璃。数组层包括薄膜晶体管结构、画素电极、扫描线与数据线等画素控制结构(图中未显示)。The thin film transistor substrate includes a sub-substrate and an array layer (not shown in the figure), and the sub-substrate includes glass, quartz, plastic, resin or other suitable materials, and a commonly used sub-substrate is, for example, glass. The array layer includes a thin film transistor structure, pixel electrodes, scan lines and data lines and other pixel control structures (not shown in the figure).
彩色滤光基板与液晶层220之间尚包括彩色滤光片与黑色矩阵(blackmatrix,BM)(图中未显示),其中彩色滤光片包括红色滤光片、蓝色滤光片与绿色滤光片,而黑色矩阵(BM)介于各种不同颜色滤光片之间。A color filter and a black matrix (blackmatrix, BM) (not shown in the figure) are included between the color filter substrate and the
须注意的是,本案图2A中的第一基板210与第二基板230的厚度为约0.50毫米(mm),此两基板的总合厚度会决定整体触控式面板的厚度(液晶层220的厚度为约2-5μm(micrometer),相对小于第一基板210与第二基板230许多),因此,触控式显示面板的厚度会局限于(limited)第一基板210与第二基板230的总合厚度。It should be noted that the thickness of the
于本发明其它实施例中,可将本案图2A中的第一基板210或第二基板230的厚度加以调整,请参见本案图2B-2D,利用薄化(thinning)步骤形成薄化的第一基板210a或薄化的第二基板230a,其中薄化步骤例如物理方式(如研磨方法)或化学方式(如蚀刻方法)。In other embodiments of the present invention, the thickness of the
于图2B中提供薄化的第一基板210a,其厚度为小于或等于0.30毫米(mm),较佳为约0.15~0.30毫米(mm)。A thinned
于图2C中提供薄化的第二基板230a,其厚度为小于或等于0.30毫米(mm),较佳为约0.15~0.30毫米(mm)。A thinned
于图2D中同时提供薄化的第一基板210a与薄化的第二基板230a,其厚度为小于或等于0.30毫米(mm),较佳为约0.15~0.30毫米(mm)。In FIG. 2D , a thinned
如此一来,如图2B-2D中的触控式面板200的厚度更可降低至约0.80~0.30mm,达到更轻薄的需求。In this way, the thickness of the
请参见图3A,此图显示本发明一实施例的触控感测组件240形成于第二基板230之上的剖面图,其中触控感测组件240包括图案化透明导电层241、金属层243、介电层245与保护层247,其中图案化透明导电层241包括平面图案化透明导电层241a与桥接图案化透明导电层241b。Please refer to FIG. 3A , which shows a cross-sectional view of a
图3A的形成步骤如下,首先,先利用沉积制程形成透明导电层,再通过图案化制程形成平面图案化透明导电层241a。之后利用沉积制程,于平面图案化透明导电层241a的外部侧边形成金属层243。接着,于平面图案化透明导电层241a之间形成介电层245。再经由沉积制程于欲连接的平面图案化透明导电层241a之间形成桥接(bridge)图案化透明导电层241b。最后,再沉积一保护层247,用以保护触控感测组件240内的各个组件,以使各个组件免受外界湿气或尘埃污染。The forming steps in FIG. 3A are as follows. Firstly, the transparent conductive layer is formed by a deposition process, and then the planar patterned transparent
另外,请参见图3B,此图显示本发明另一实施例的触控感测240形成于第二基板230之上的剖面图,其中触控感测组件240包括图案化透明导电层241、金属层243、介电层245与保护层247,其中金属层243包括平面金属层243a与桥接(bridge)金属层243b。In addition, please refer to FIG. 3B , which shows a cross-sectional view of a
图3B的形成步骤如下,首先,先利用沉积制程形成透明导电层,再通过图案化制程形成图案化透明导电层241。之后利用沉积制程,于图案化透明导电层241之间形成介电层245。接着,于图案化透明导电层241a的外部侧边形成平面金属层243a,以及于欲连接的图案化透明导电层241之间形成桥接金属层243b。最后,再沉积一保护层247,用以保护触控感测组件内的各个组件,以使各个组件免受外界湿气或尘埃污染。The forming steps of FIG. 3B are as follows. Firstly, a deposition process is used to form a transparent conductive layer, and then a patterned transparent
须注意的是,图3A与图3B的差别在于,图3A使用桥接图案化透明导电层241b电性连接欲连接的平面图案化透明导电层241a,而图3B则使用桥接金属层243b电性连接欲连接的图案化透明导电层241。It should be noted that the difference between FIG. 3A and FIG. 3B is that FIG. 3A uses a bridge patterned transparent
上述图案化制程通过光刻制程(photolithography)而达成,光刻制程包括光阻涂布(photoresist coating)、软烘烤(soft baking)、光罩对准(maskaligning)、曝光(exposure)、曝光后烘烤(post-exposure)、光阻显影(developing photoresist)与硬烘烤(hard baking),这些制程为本领域人士所熟知,在此不再赘述。The above patterning process is achieved through photolithography, which includes photoresist coating, soft baking, mask alignment, exposure, post-exposure Post-exposure, developing photoresist and hard baking are well known in the art and will not be repeated here.
本发明的图案化透明导电层241的材料包括氧化铟锡(indium tinoxide,ITO)、氧化铟锌(indium zinc oxide,IZO)、氧化镉锡(cadmium tinoxide,CTO)、氧化铝锌(aluminum zinc oxide,AZO)、氧化铟锡锌(indiumtin zinc oxide,ITZO)、氧化锌(zinc oxide)、氧化镉(cadmium oxide,CdO)、氧化铪(hafnium oxide,HfO)、氧化铟镓锌(indium gallium zinc oxide,InGaZnO)、氧化铟镓锌镁(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化铟镓镁(indium gallium magnesium oxide,InGaMgO)或氧化铟镓铝(indium gallium aluminum oxide,InGaAlO)。The material of the patterned transparent
于一较佳实施例中,由于氧化铟锡层(ITO)于可见光具有大于90%的穿透率,因此使用氧化铟锡层作为透明导电层的材料。In a preferred embodiment, since the indium tin oxide (ITO) layer has a transmittance greater than 90% in visible light, the indium tin oxide layer is used as the material of the transparent conductive layer.
此外,本案的图案化透明导电层241可为独立矩阵或交错矩阵的结构。于一实施例中,本发明的触控感测组件包括一层ITO透明导电矩阵,为一种独立矩阵感测单元(Independent-matrix sense elements)。于另一实施例中,本发明的触控感测组件包括两层相互隔离水平(列)及垂直(栏)ITO透明导电层组成交错矩阵,为一种交错矩阵感测单元(Intersection-matrix ofrow and column sense elements)。In addition, the patterned transparent
触控感测组件240的图案化透明导电层241系通过一沉积法直接形成于第二基板230之上,沉积法包括化学气相沉积法(chemical vapor deposition,CVD)或物理气相沉积法(physical vapor deposition,PVD)。The patterned transparent
于一较佳实施例,系可使用物理气相沉积法(例如溅镀(sputter))将透明导电层直接(directly)沉积于第二基板230之上,再通过图案化制程,形成图案化透明导电层241。In a preferred embodiment, the transparent conductive layer can be directly deposited on the
此外,请再次参见图1,于现有技术中,触控面板20与显示面板40组通过黏着层30组装在一起,亦即显示面板40的基板41具有一定厚度,且两面板的结合需要额外黏着层30的辅助。In addition, please refer to FIG. 1 again. In the prior art, the
须注意的是,相对于现有技术,本发明将触控感测组件240直接整合于第二基板230之上,不但可以减少现有触控面板的基板厚度(如图1的基板41),且不需要黏着层(如图1的黏着层30)。此外,由于本发明的图案化透明导电层作为电极时(例如,通入交流电(AC)),会有一自身频率产生,此自身频率不会受到下方液晶显示面板(由第一基板210、液晶层220与第二基板230所组成)的影响,因此,本发明的图案化透明导电层241不但可作为电极,亦可同时扮演信号屏蔽层(shielding layer)的角色。It should be noted that, compared with the prior art, the present invention directly integrates the
于本发明的一实施例中,本发明的触控式面板的制程系可先于第二基板230之上形成如图3A或图3B所述的触控感测组件240,再将第二基板230翻转(flip),再依序形成黑色矩阵(BM)与彩色滤光片,之后再将第二基板230与第一基板210相对设置并组装的,使液晶层220填入第一基板210与第二基板230之间。于此实施例中,可于组装第二基板230与第一基板210之后,亦即未填入液晶层220之前,对第一基板210进行薄化步骤,以得到薄化的第一基板210a。上述制程步骤中会利用现有的光刻制程(photolithography),此亦为本领域人士所熟知,在此不再赘述。于本发明另一实施例中,亦可将第二基板230与第一基板210先相对设置并组装后,进行单侧基板或双侧基板的薄化步骤,藉此得到薄化的第一基板210a与第二基板230a后,再于薄化的第二基板230a之上直接形成触控感测组件240。须注意的是,于触控式面板的制程过程中,可依实际应用的需要,对第一基板210或第二基板230进行薄化步骤,以得到薄化的第一基板210a或薄化的第二基板230a(请参见图2B-2D)。In one embodiment of the present invention, the manufacturing process of the touch panel of the present invention can first form the
本发明的触控式显示面板200可继续进行后续制程,例如包括形成一偏光片(polarizer)于触控感测组件之上,以及形成一玻璃(cover glass),于偏光片之上。亦可依据实际制程的需求,形成其它组件于触控式显示面板200之上或的下。The
本发明将触控感测组件240直接整合于第二基板230之上,此设计亦可称为显示组件上的(on-cell)触控式面板,于操作时,使用者可通过手指或是触控笔等方式碰触于触控感测组件240的外侧表面,使图案化透明导电层241受到感应而导致电容的变化,以产生感测信号。所产生的感测信号可传送到信号处理电路,进而定位出碰触处的位置。In the present invention, the
须注意的是,先前技术的触控式显示面板系将触控面板与显示面板分开制作,再将触控面板与显示面板组装在一起,两面板之间需通过黏着层(例如双面胶或是水胶)进行黏合,然而,当光线通过不同介质时(如黏着层或是触控而板的玻璃基材),会产生部分反射,而造成整体组件反射率上升。It should be noted that the touch display panel of the prior art is manufactured separately from the touch panel and the display panel, and then the touch panel and the display panel are assembled together, and an adhesive layer (such as double-sided tape or However, when light passes through different media (such as the adhesive layer or the glass substrate of the touch panel), partial reflection will occur, resulting in an increase in the reflectivity of the overall component.
相较于先前技术,本发明的触控感测组件240(内有图案化透明导电层241)系直接形成于第二基板230之上,因此,可降低触控式显示面板的反射率,提高穿透率,以提升触控式显示面板的光学显示质量。Compared with the prior art, the touch sensing component 240 (with the patterned transparent
综上所述,本发明的触控式显示面板由于不需额外设置触控面板的基板(例如玻璃),因此,整体触控式显示面板的厚度与重量得以降低,特别是可使薄膜晶体管基板或彩色滤光基板的厚度降低至小于或等于0.3毫米(mm),以达到轻薄的目的,此外亦能降低触控面板的制程复杂度与降低制程成本。In summary, since the touch display panel of the present invention does not need an additional substrate (such as glass) for the touch panel, the thickness and weight of the overall touch display panel can be reduced, especially the thin film transistor substrate can be reduced. Alternatively, the thickness of the color filter substrate is reduced to less than or equal to 0.3 millimeters (mm), so as to achieve the goal of thinness, and also reduce the process complexity and cost of the touch panel.
本发明的触控式显示面板可应用于液晶显示器(liquid crystaldisplay,LCD),例如平面切换液晶显示器(in-plane switching,IPS LCD)或边缘电场开关液晶显示器(fringe field switching,FFS LCD)。The touch display panel of the present invention can be applied to a liquid crystal display (LCD), such as an in-plane switching liquid crystal display (IPS LCD) or a fringe field switching liquid crystal display (FFS LCD).
虽然本发明已以数个较佳实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作任意的更动与润饰,因此本发明的保护范围当视后附的申请专利范围所界定者为准。Although the present invention has been disclosed above with several preferred embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make arbitrary changes without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.
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| TW099145660 | 2010-12-22 | ||
| TW099145660A TWI460640B (en) | 2010-12-22 | 2010-12-22 | Touch panel |
| TW100100027A TWI437318B (en) | 2011-01-04 | 2011-01-04 | Touch panel |
| TW100100027 | 2011-01-04 |
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