CN102194835A - Wafer-level lens module, manufacturing method thereof, and wafer-level camera - Google Patents

Abstract

A wafer-level lens module comprises a first optical layer, a spacing layer and a second optical layer. The spacing layer is arranged on the first optical layer and is provided with a hole penetrating through the spacing layer for transmitting light, wherein the surface of the hole substantially avoids light reflection, and the second optical layer is arranged on the spacing layer.

Description

Wafer-level lens module, manufacturing method thereof, and wafer-level camera

technical field

The present invention relates to a wafer-level lens module and a related manufacturing method thereof, in particular to a wafer-level lens module for eliminating/reducing unnecessary stray light and a related manufacturing method.

Background technique

With the advancement of optical technology, image capture devices are also popular in the application of various products. For example, in addition to digital cameras, some mobile devices: such as mobile phones, personal digital assistants (personal digital assistant, PDA) ) and a notebook computer (notebook, NB) also have a device with image capture function installed in it.

The lens module is one of the most important components in the image capture device. However, the image sensor disposed under the lens module will be affected by stray light, thus causing noise or deterioration of image contrast. Therefore, how to effectively prevent the image sensor from receiving unnecessary stray light and enhance the overall performance of the image capture device has become an important issue to be solved in the related industries.

Contents of the invention

Therefore, one of the objectives of the present invention is to provide a wafer-level lens module, a wafer-level camera and related manufacturing methods to solve the above problems.

According to an embodiment of the present invention, a wafer-level lens module is provided. The wafer-level lens module includes a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed on the first optical layer and has a hole penetrating therethrough for light transmission, wherein the surface of the hole substantially avoids light reflection, and the second optical layer is disposed on the spacer layer .

According to another embodiment of the present invention, a wafer-level camera is provided. The wafer-level camera includes an image sensor, a spacer layer and a wafer-level lens module. The spacer layer is disposed on the image sensor and has a hole penetrating therethrough for light transmission, wherein the surface of the hole substantially avoids light reflection, and the wafer-level lens module is disposed on the spacer layer .

According to another embodiment of the present invention, a method for manufacturing a wafer-level lens module is provided. The method includes the steps of: providing a first optical layer, a spacer layer and a second optical layer, wherein a hole penetrates the spacer layer to transmit light; disposing the spacer layer on the first optical layer, and the second optical layer The optical layer is arranged on the spacer layer; and the specific film layer is arranged on the surface of the hole.

According to another embodiment of the present invention, a method for manufacturing a wafer-level lens module is provided. The method includes the steps of: providing a first optical layer, a spacer layer, and a second optical layer; disposing the spacer layer on the first optical layer, and disposing the second optical layer on the spacer layer; Holes penetrating the spacer layer have rough surfaces.

Description of drawings

FIG. 1 is a structural sectional view of a wafer-level camera according to a first embodiment of the present invention;

FIG. 2 is a partial enlarged view of the spacer layer in the wafer-level camera in FIG. 1;

3 is a cross-sectional view of a wafer-level camera according to a second embodiment of the present invention;

FIG. 4 is a partial enlarged view of the spacer layer in the wafer-level camera in FIG. 3;

FIG. 5 is a flowchart of an embodiment of a method for manufacturing a wafer-level lens module according to the present invention; and

FIG. 6 is a flow chart of another embodiment of the method for manufacturing a wafer-level lens module of the present invention.

[Description of main component symbols]

100, 300 Wafer-level cameras

110, 310 Image sensor

120, 132, 134, 320, 332, 334 Spacers

130, 330 Wafer-level lens module

131, 133, 331, 333 Lens carrier plate

135, 335 Aperture

140 Specific film layer

Detailed ways

Certain terms are used in the description and claims to refer to particular elements. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same element. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. The term "comprising" mentioned throughout the description and the claims in the claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" herein includes any direct and indirect means of electrical connection. Therefore, if it is described herein that a first device is coupled to a second device, it means that the first device may be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means.

FIG. 1 is a cross-sectional view of a wafer-level camera 100 according to a first embodiment of the present invention. The wafer-level camera 100 includes (but not limited to) an image sensor 110 , a first spacer layer 120 , a wafer-level lens module 130 and a plurality of specific film layers 140 . As shown in FIG. 1 , the wafer-level lens module 130 includes a first lens carrier plate (lens plate) 131 arranged on the first spacer layer 120, a second lens plate 133 arranged on the second spacer layer 132 and a lens plate arranged on the second spacer layer 132. A diaphragm 135 on the third spacer layer 134 . Please note that in this embodiment, the specific film layers 140 are respectively disposed on the surfaces of the holes in the spacer layers 120 , 132 and 134 (as shown in FIG. 2 ), but the invention is not limited thereto. In other words, the specific film layer can be disposed on any spacer layer in the wafer-level camera 100 according to actual design requirements.

For example, the wafer-level camera 100 can be a miniature camera module (compact camera module, CCM) and is set in the image capture device, but the present invention is not limited thereto. In addition, the number and thickness of the specific film layer 140 There are also no specific restrictions. That is to say, without departing from the spirit of the present invention, the quantity and thickness of the specific film layer 140 can be adjusted and modified according to actual needs, and such design changes are within the scope of the present invention.

In one embodiment, these specific thin film layers 140 are light-shielding (light-shielding) layers, so when the stray light is irradiated on the surfaces of the holes in the spacer layers 120, 132 and 134, most or all of the stray light will be Absorbed by these light-shielding layers, the image sensor 110 disposed under the wafer-level lens module 130 will not be affected by unnecessary stray light, thereby improving image quality. However, the present invention is not limited thereto, that is, other film layers that can largely avoid or greatly reduce light reflection also fall within the scope of the present invention. In addition, the structure of the wafer-level camera 100 in FIG. 1 is only used as an example, and the present invention is not limited thereto.

FIG. 3 is a cross-sectional view of a wafer-level camera 300 according to a second embodiment of the present invention, which is similar to the wafer-level camera 100 shown in FIG. 1 . The wafer-level camera 300 includes (but not limited to) an image sensor 310 , a first spacer layer 320 and a wafer-level lens module 330 . As shown in FIG. 3 , the wafer-level lens module 330 includes a first lens carrier 331 disposed on the first spacer layer 320 , a second lens carrier 333 disposed on the second spacer layer 332 , and a second lens carrier 333 disposed on the third spacer layer 320 . Aperture 335 on layer 334 . Please note that in this embodiment, the surfaces of the holes in the spacer layers 320, 332, and 334 (as shown in FIG. 4 ) are all rough surfaces, but the present invention is not limited thereto. In other words, the holes in the spacer layers Any surface can be roughened individually according to design requirements. When the stray light is irradiated on the rough surfaces of the holes in the spacer layers 320 , 332 and 334 , the incident stray light will be scattered in random directions, so that the image sensor 310 is not easily affected by the stray light.

Please note that the above-mentioned embodiments are only used to illustrate the technical features of the present invention, and are not intended to limit the scope of the present invention. Those skilled in the art should understand that the structures of the wafer-level cameras in FIG. 1 and FIG. 3 can also be appropriately changed and modified without departing from the spirit of the present invention.

Referring to FIG. 5 , FIG. 5 is a flowchart of an embodiment of a method for manufacturing a wafer-level lens module according to the present invention. Please note that the steps do not have to be performed sequentially in the order shown in FIG. 5 if substantially the same result can be obtained. The method includes the following steps:

Step 502: Provide a first optical layer, a spacer layer, and a second optical layer, wherein a hole penetrates the spacer layer to transmit light.

Step 504: disposing the spacer layer on the first optical layer, and disposing the second optical layer on the spacer layer.

Step 506: Disposing a specific film layer on the surface of the hole.

In step 502, the first optical layer may be a lens carrier, and the second optical layer may be an aperture or a lens carrier. In step 506, the specific film layer is a light shielding layer. The steps of manufacturing the wafer-level lens module (such as the wafer-level lens module 130 ) can be clearly understood by referring to the steps of FIG. 5 and the components in FIG. 1 and FIG. 2 , and the detailed description of the steps will not be repeated here.

Referring to FIG. 6 , FIG. 6 is a flow chart of another embodiment of the method for manufacturing a wafer-level lens module according to the present invention. The method includes (but is not limited to) the following steps:

Step 602: providing a first optical layer, a spacer layer and a second optical layer.

Step 604: disposing the spacer layer on the first optical layer, and disposing the second optical layer on the spacer layer.

Step 606 : Make the holes penetrating through the spacer layer have a rough surface.

In step 602, the first optical layer may be a lens carrier, and the second optical layer may be an aperture or a lens carrier. The steps of manufacturing the wafer-level lens module (such as the wafer-level lens module 330 ) can be clearly understood by combining the steps of FIG. 6 and the elements in FIG. 3 and FIG. 4 , so the detailed description of the steps will not be repeated here.

The steps in the above flow chart are only used as a practical example of the present invention, and the present invention is not limited thereto. Those skilled in the art should understand that without departing from the spirit of the present invention, other steps may be inserted into the above-mentioned manufacturing method or several steps may be combined into a single step, all of which belong to the scope of the present invention. For example, under one design change, the steps in FIG. 5 and FIG. 6 can be combined selectively.

In summary, these embodiments of the present invention provide a wafer-level lens module, a wafer-level camera, and related methods for manufacturing the wafer-level lens module. In one embodiment, the present invention arranges a specific film layer on the surface of the hole in the spacer layer in the wafer-level camera. Therefore, when stray light irradiates the surface of the hole in the spacer layer, the stray light will be absorbed by the specific film layer. , therefore, the image sensor in the wafer-level camera will not be affected by unwanted stray light. In another embodiment, the hole in the spacer layer in the wafer-level camera has a rough surface, so when the stray light illuminates the rough surface of the hole in the spacer layer, the incident stray light will randomly scatter in different directions, by This prevents the image sensor inside the wafer-level camera from being severely affected by stray light. In short, any image capturing device adopting the technical features of the present invention can greatly improve its overall performance.

The above descriptions are only preferred embodiments of the present invention, and all equivalent variations and modifications made according to the scope of the claims of the present application shall fall within the scope of the present invention.

Claims (19)

1. A wafer-level lens module, comprising: first optical layer; a spacer layer disposed on the first optical layer, the spacer layer has a hole penetrating therethrough for light transmission, wherein the surface of the hole substantially avoids light reflection; and The second optical layer is disposed on the spacer layer. 2. The wafer-level lens module according to claim 1, wherein a specific thin film layer is disposed on a surface of the hole in the spacer layer. 3. The wafer level lens module of claim 2, wherein the first optical layer comprises a lens carrier. 4. The wafer level lens module of claim 2, wherein the second optical layer comprises an aperture or a lens carrier. 5. The wafer level lens module according to claim 2, wherein the specific thin film layer is a light shielding layer. 6. The wafer-level lens module according to claim 1, wherein the surface of the hole in the spacer layer is a rough surface. 7. The wafer level lens module of claim 6, wherein the first optical layer comprises a lens carrier. 8. The wafer level lens module of claim 6, wherein the second optical layer comprises an aperture or a lens carrier. 9. A wafer-level camera comprising: image sensor; a spacer layer disposed on the image sensor, the spacer layer has a hole penetrating therethrough for light transmission, wherein the surface of the hole substantially avoids light reflection; and The wafer-level lens module is arranged on the spacer layer. 10. The wafer-level camera according to claim 9, wherein a specific thin film layer is disposed on a surface of the hole in the spacer layer. 11. The wafer-level camera according to claim 10, wherein the specific thin film layer is a light shielding layer. 12. The wafer-level camera according to claim 9, wherein the surface of the hole in the spacer layer is a rough surface. 13. A method of manufacturing a wafer-level lens module, comprising: providing a first optical layer, a spacer layer and a second optical layer, wherein a hole penetrates the spacer layer to transmit light; disposing the spacer layer on the first optical layer, and disposing the second optical layer on the spacer layer; and A specific film layer is disposed on the surface of the hole. 14. The method of claim 13, wherein the first optical layer comprises a lens carrier. 15. The method of claim 13, wherein the second optical layer comprises an aperture or a lens carrier. 16. The method of claim 13, wherein the specific film layer is a light shielding layer. 17. A method of manufacturing a wafer-level lens module, comprising: providing a first optical layer, a spacer layer, and a second optical layer; disposing the spacer layer on the first optical layer, and disposing the second optical layer on the spacer layer; and The holes penetrating through the spacer layer are made to have a rough surface. 18. The method of claim 17, wherein the first optical layer comprises a lens carrier. 19. The method of claim 17, wherein the second optical layer comprises an aperture or a lens carrier.

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