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CN102119588B - Method for manufacturing module with built-in component, and module with built-in component - Google Patents

Method for manufacturing module with built-in component, and module with built-in component Download PDF

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Publication number
CN102119588B
CN102119588B CN200980131635.2A CN200980131635A CN102119588B CN 102119588 B CN102119588 B CN 102119588B CN 200980131635 A CN200980131635 A CN 200980131635A CN 102119588 B CN102119588 B CN 102119588B
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resin bed
resin layer
circuit elements
elements device
parts
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CN102119588A (en
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野村雅人
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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Abstract

The invention provides a method for manufacturing a module with a built-in component, which can be easily manufactured without using a tape or an adhesive, and the module with the built-in component. A core board (1) having an opening (2) is laminated on a first resin layer (10) in an uncured state, and a first circuit component (3) is attached to a portion of the opening where the first resin layer is exposed. Then, a second resin layer (20) in an uncured state is laminated on the core board (1), the second resin layer is filled in the gap between the inner wall of the opening (2) and the first circuit component (3), and then the first resin layer (10) and the second resin layer (20) are cured.

Description

元器件内置模块的制造方法及元器件内置模块Manufacturing method of component built-in module and component built-in module

技术领域 technical field

本发明涉及一种元器件内置模块的制造方法及元器件内置模块。所谓本发明中的元器件内置模块，是指将芯板置于中间且在其正反面具有树脂层、而在两层树脂层之间内置了至少一个电路元器件的模块。也可以在各树脂层中埋设有元器件。此外，也可以在正反面的树脂层上进一步层叠树脂层。The invention relates to a manufacturing method of a component built-in module and a component built-in module. The component built-in module in the present invention refers to a module in which a core board is placed in the middle, resin layers are provided on the front and back sides, and at least one circuit component is built between the two resin layers. Components may be embedded in each resin layer. In addition, a resin layer may be further laminated on the front and back resin layers.

背景技术 Background technique

近年来，随着电子设备的小型化，要求用于安装片状电容器等电路元器件的电路基板实现小型化。据此，通过在电路基板内部埋设电路元器件来制作模块，从而削减电路元器件的安装面积，力图实现电路基板的小型化。其中，在树脂层的内部埋设有电路元器件的元器件内置基板有以下优点：重量轻，而且，由于无需像陶瓷基板那样进行高温烧制，因此，对内置的电路元器件的限制少。In recent years, along with the miniaturization of electronic equipment, circuit boards on which circuit components such as chip capacitors are mounted have been required to be miniaturized. Accordingly, by manufacturing a module by embedding circuit components inside the circuit board, the mounting area of the circuit components is reduced, and miniaturization of the circuit board is attempted. Among them, a component-embedded substrate in which circuit components are embedded in a resin layer has the following advantages: it is light in weight, and since it does not require high-temperature firing like a ceramic substrate, there are few restrictions on the built-in circuit components.

在专利文献1中，揭示了如下的元器件内置模块的制造方法：在芯板上形成贯穿孔，在该芯板的底面粘贴胶带，并且，在贯穿孔的底面所露出的胶带上附着电路元器件，利用粘接剂固定电路元器件的周围与贯穿孔的内表面之间的间隙，之后，将胶带剥离，在芯板的两面层叠树脂层。Patent Document 1 discloses a method of manufacturing a component built-in module in which a through hole is formed in a core board, an adhesive tape is attached to the bottom surface of the core board, and circuit elements are attached to the tape exposed on the bottom face of the through hole. For the device, the gap between the periphery of the circuit component and the inner surface of the through-hole is fixed with an adhesive, and then the tape is peeled off to laminate resin layers on both sides of the core board.

在该方法中，为了临时固定电路元器件而需要胶带，但由于在使用后将该胶带废弃，因此，存在导致制造成本上升的问题。此外，需要在电路元器件与芯板的贯穿孔之间的间隙中涂布粘接剂，但在狭窄空间内涂布粘接剂的操作需要时间和精度。此外，由于粘接剂和层叠于芯板的两面的树脂层一般是不同种类的材料，因此，热膨胀系数不同，随着温度变化，基板有可能产生翘曲。虽然为了抑制翘曲，优选仅在电路元器件与贯穿孔之间的间隙的一部分中涂布粘接剂，但在该情况下，由于电路元器件的固定强度变低，因此，在将胶带从芯板剥离时，电路元器件有可能因胶带的粘接力而从贯穿孔脱落。In this method, an adhesive tape is required to temporarily fix the circuit components, but since the adhesive tape is discarded after use, there is a problem that the manufacturing cost increases. In addition, the adhesive needs to be applied in the gap between the circuit component and the through-hole of the core board, but the operation of applying the adhesive in a narrow space requires time and precision. In addition, since the adhesive and the resin layers laminated on both sides of the core board are generally made of different materials, the thermal expansion coefficients are different, and the board may warp due to temperature changes. In order to suppress warping, it is preferable to apply the adhesive only to a part of the gap between the circuit component and the through hole, but in this case, since the fixing strength of the circuit component becomes low, the adhesive tape is removed from the When the core board is peeled off, circuit components may come off from the through hole due to the adhesive force of the tape.

专利文献1：日本专利特开2008-131039号公报Patent Document 1: Japanese Patent Laid-Open No. 2008-131039

发明内容 Contents of the invention

本发明的目的在于提供一种能解决上述那样的问题的元器件内置模块的制造方法及元器件内置模块。An object of the present invention is to provide a method of manufacturing a module with built-in components and a module with built-in components that can solve the above problems.

为了达到上述目的，本发明所涉及的元器件内置模块的制造方法的特征在于，包括：工序A，该工序A将具有贯穿正反面方向的开口部的芯板层叠在未固化状态的第一树脂层上；工序B，该工序B使第一电路元器件附着于在所述开口部内露出的未固化状态的所述第一树脂层的露出部分；工序C，该工序C将未固化状态的第二树脂层层叠在所述芯板上，并在所述开口部的内壁与所述第一电路元器件之间的间隙中填充第二树脂层；工序D，该工序D使所述第一树脂层固化；以及工序E，该工序E使所述第二树脂层固化。In order to achieve the above object, the method of manufacturing a module with built-in components according to the present invention is characterized by comprising: a step A of laminating a core plate having an opening penetrating through the front and back directions on the first resin in an uncured state. layer; step B, the step B attaches the first circuit component to the exposed portion of the first resin layer in the uncured state exposed in the opening; step C, the step C attaches the first circuit component in the uncured state Two resin layers are stacked on the core board, and the second resin layer is filled in the gap between the inner wall of the opening and the first circuit component; process D, the process D makes the first resin layer curing; and step E of curing the second resin layer.

此外，本发明所涉及的元器件内置模块的特征在于，包括：第一树脂层；芯板，该芯板层叠在所述第一树脂层上，并具有贯穿正反面方向的开口部；第一电路元器件，该第一电路元器件收纳于所述芯板的开口部，且底面附着在所述第一树脂层上；第二树脂层，该第二树脂层层叠在所述芯板上，且填充到所述芯板的开口部与所述第一电路元器件之间的间隙中；以及电极，该电极形成于所述第一树脂层，并且，与所述第一电路元器件进行电连接。Furthermore, the component built-in module according to the present invention is characterized by comprising: a first resin layer; a core plate laminated on the first resin layer and having an opening extending through the front and back directions; a circuit component, the first circuit component is accommodated in the opening of the core board, and the bottom surface is attached to the first resin layer; a second resin layer, the second resin layer is laminated on the core board, and filling the gap between the opening of the core board and the first circuit component; and an electrode formed on the first resin layer and electrically connected to the first circuit component. connect.

在本发明中，将具有开口部的芯板层叠在未固化的第一树脂层上，并使第一电路元器件附着于开口部内的第一树脂层露出的部分。所谓未固化，是指半固化状态(例如B阶段)、或者比其更柔软的状态。由于未固化的第一树脂层具有粘接性，因此，芯板和第一电路元器件能临时保持在第一树脂层上。即，能不使用胶带，而临时保持第一电路元器件。在临时保持第一电路元器件的状态下，若将未固化的第二树脂层压接在芯板上，则第二树脂层进行流动，填充到开口部的内壁与第一电路元器件之间的间隙中。即，芯板和第一电路元器件埋设于第一树脂层与第二树脂层之间，形成一体化。之后，若使第一树脂层和第二树脂层固化，则完成元器件内置模块。这样，由于能不使用胶带和粘接剂，而临时保持第一电路元器件，并能将用于保持第一电路元器件的第一树脂层照原样用作为层叠层，从而，能实现制造工序简化、成本低廉的制造方法。此外，也没有在将胶带剥离时电路元器件脱落的问题。虽然由于在芯板形成开口部，从而模块的机械强度有可能降低，但通过利用树脂(第二树脂层)密封开口部和芯板的表面，能提高机械强度。In the present invention, the core board having the opening is laminated on the uncured first resin layer, and the first circuit component is attached to the exposed portion of the first resin layer in the opening. The term "uncured" refers to a semi-cured state (for example, B stage), or a softer state than that. Since the uncured first resin layer has adhesiveness, the core board and the first circuit components can be temporarily held on the first resin layer. That is, the first circuit component can be temporarily held without using an adhesive tape. When the uncured second resin layer is crimped on the core board while the first circuit component is temporarily held, the second resin layer flows and fills between the inner wall of the opening and the first circuit component in the gap. That is, the core board and the first circuit component are embedded between the first resin layer and the second resin layer to be integrated. Thereafter, when the first resin layer and the second resin layer are cured, the module with built-in components is completed. In this way, since the first circuit component can be temporarily held without using a tape or an adhesive, and the first resin layer for holding the first circuit component can be used as it is as a lamination layer, thereby realizing a manufacturing process. Simplified, low-cost manufacturing method. In addition, there was no problem that circuit components came off when the tape was peeled off. Although the mechanical strength of the module may decrease due to openings formed in the core plate, the mechanical strength can be improved by sealing the openings and the surface of the core plate with resin (second resin layer).

作为将第一电路元器件与第一树脂层进行电连接的方法，也可以在附着第一电路元器件之前的第一树脂层中，形成由贯穿第一树脂层的层间连接导体用孔、和填充到层间连接导体用孔中的未固化的导电糊料构成的电极，在工序B中，将第一电路元器件以与电极接触的方式附着于第一树脂层，在工序D中，在使第一树脂层固化的同时，使导电糊料固化，将第一电路元器件和电极进行电连接。在该情况下，不是在第一树脂层固化之后安装第一电路元器件，而是通过导电糊料在未固化的第一树脂层中形成未固化的电极，配置第一电路元器件处于与电极相接触的状态，之后使第一树脂层和电极同时进行固化，从而，未固化的导电糊料具有导电性，将第一电路元器件和电极进行电连接。在该情况下，能省略对第一电路元器件和第一树脂层特别进行的安装操作。As a method of electrically connecting the first circuit component and the first resin layer, it is also possible to form a hole for an interlayer connection conductor penetrating through the first resin layer in the first resin layer before the first circuit component is attached, An electrode composed of an uncured conductive paste filled in the hole for the interlayer connecting conductor, in the step B, the first circuit component is attached to the first resin layer so as to be in contact with the electrode, and in the step D, While curing the first resin layer, the conductive paste is cured to electrically connect the first circuit component and the electrodes. In this case, instead of mounting the first circuit component after the first resin layer is cured, an uncured electrode is formed in the uncured first resin layer by a conductive paste, and the first circuit component is arranged in contact with the electrode. In the contact state, the first resin layer and the electrodes are cured at the same time, so that the uncured conductive paste has conductivity, and the first circuit components and the electrodes are electrically connected. In this case, it is possible to omit the mounting operation especially performed on the first circuit component and the first resin layer.

作为将第一电路元器件与第一树脂层进行电连接的其他方法，也可以在固化后的第一树脂层中以到达第一电路元器件的方式形成层间连接导体用孔，并在该层间连接导体用孔中形成层间连接导体，从而形成与第一电路元器件进行电连接的电极。即，在使第一树脂层固化之后，形成贯穿第一树脂层的层间连接导体用孔(过孔)，并在该孔中形成层间连接导体(通路)，从而能形成电极。在该情况下，由于能通过形成于层间连接导体用孔的内表面的镀膜、或填充到层间连接导体用孔中的导电糊料来形成层间连接导体，因此，能实现层间连接导体的低电阻化，提高连接可靠性。As another method of electrically connecting the first circuit component and the first resin layer, it is also possible to form a hole for an interlayer connection conductor in the cured first resin layer so as to reach the first circuit component, and Interlayer connection conductors are formed in the holes for interlayer connection conductors to form electrodes electrically connected to the first circuit component. That is, after the first resin layer is cured, holes (vias) for interlayer connection conductors are formed penetrating through the first resin layer, and interlayer connection conductors (vias) are formed in the holes to form electrodes. In this case, since the interlayer connection conductor can be formed by the plating film formed on the inner surface of the hole for the interlayer connection conductor or the conductive paste filled in the hole for the interlayer connection conductor, the interlayer connection can be realized. The low resistance of the conductor improves the connection reliability.

可以同时实施第一树脂层的固化和第二树脂层的固化，也可以在层叠第二树脂层之前实施第一树脂层的固化。在使第一树脂层和第二树脂层同时进行固化的情况下，能减少热处理次数，并且，第一树脂层的固化和第二树脂层的固化变成同时进行，能抑制因固化收缩而引起的元器件内置模块的翘曲的产生。此外，由于能减少对电路元器件进行的热过程次数，因此，能减小对电路元器件的损坏。The curing of the first resin layer and the curing of the second resin layer may be performed simultaneously, or the curing of the first resin layer may be performed before laminating the second resin layer. When the first resin layer and the second resin layer are cured at the same time, the number of times of heat treatment can be reduced, and the curing of the first resin layer and the curing of the second resin layer become carried out simultaneously, which can suppress the occurrence of shrinkage due to curing. The generation of warpage of the components built-in modules. In addition, since the number of thermal processes performed on circuit components can be reduced, damage to circuit components can be reduced.

优选第一电路元器件是比芯板的厚度要高的元器件。虽然电路元器件中也有片状元器件之类的高度较低的元器件，但也有SAW元件之类的高度较高的元器件。通过将这样较高的第一电路元器件收纳在芯板的开口部中，第一电路元器件在芯板的上表面只有一部分突出，能实现整体薄型的元器件内置模块。Preferably, the first circuit component is a component thicker than the thickness of the core board. Although there are also low-profile components such as chip components among circuit components, there are also high-profile components such as SAW components. By accommodating such a tall first circuit component in the opening of the core board, only a part of the first circuit component protrudes from the upper surface of the core board, and an overall thin module with built-in components can be realized.

优选在工序C之前，包括将比第一电路元器件要低的第二电路元器件安装在芯板上的工序，在工序C中，将第二电路元器件埋设在第二树脂层中。为了提高元器件内置模块的安装密度，优选在芯板上也安装电路元器件。通过将比第一电路元器件要低的第二电路元器件安装在芯板上，第一电路元器件的上表面和第二电路元器件的上表面变平均，能实现整体薄型、且高安装密度的元器件内置模块。Preferably, prior to step C, a step of mounting a second circuit component lower than the first circuit component on the core board is included, and in step C, the second circuit component is embedded in the second resin layer. In order to increase the mounting density of the module with built-in components, it is preferable to mount circuit components on the core board as well. By mounting the second circuit component lower than the first circuit component on the core board, the upper surface of the first circuit component and the upper surface of the second circuit component become even, and the overall thinness and high mounting can be realized Density of components built-in modules.

也可以在第一树脂层的背面形成面内导体(图案布线)。在该情况下，若将铜箔压接于未固化的第一树脂层的背面，在使第一树脂层固化之后，将铜箔形成图案，则能容易形成面内导体。同样地，也可以在第二树脂层的背面形成面内导体(图案布线)。在该情况下，若将铜箔压接于未固化的第二树脂层的背面，在使第二树脂层固化之后，将铜箔形成图案，则能容易形成面内导体。另外，面内导体的形成方法并不限于使用铜箔的方法，也可以使用镀覆法或印刷导电糊料的方法等。An in-plane conductor (pattern wiring) may also be formed on the back surface of the first resin layer. In this case, the in-plane conductor can be easily formed by crimping the copper foil to the back surface of the uncured first resin layer, curing the first resin layer, and then patterning the copper foil. Similarly, in-plane conductors (pattern wiring) may also be formed on the back surface of the second resin layer. In this case, the in-plane conductor can be easily formed by crimping the copper foil to the back surface of the uncured second resin layer, curing the second resin layer, and then patterning the copper foil. In addition, the method of forming the in-plane conductor is not limited to the method of using copper foil, and a plating method, a method of printing a conductive paste, or the like may be used.

优选第一树脂层和第二树脂层由相同材质形成。若是相同材质，则由于其热膨胀系数也相等，因此，能抑制温度变化所带来的模块翘曲、变形。作为树脂层，例如可以由环氧树脂等热固化性树脂、热固化性树脂和无机填料的混合物、使玻璃纤维浸渍热固化性树脂的树脂组成物等构成。Preferably, the first resin layer and the second resin layer are formed of the same material. If they are made of the same material, their thermal expansion coefficients are also equal, so module warpage and deformation caused by temperature changes can be suppressed. The resin layer may be composed of, for example, a thermosetting resin such as epoxy resin, a mixture of a thermosetting resin and an inorganic filler, a resin composition obtained by impregnating glass fibers with a thermosetting resin, or the like.

作为本发明中的芯板，可以使用树脂基板、玻璃环氧基板之类的印刷布线板，也可以使用LTCC(低温烧成陶瓷基板)之类的陶瓷基板。As the core board in the present invention, printed wiring boards such as resin substrates and glass epoxy substrates may be used, and ceramic substrates such as LTCC (low temperature fired ceramic substrates) may be used.

如上所述，根据本发明，由于将具有开口部的芯板层叠在未固化的第一树脂层上，将第一电路元器件附着于开口部内的第一树脂层露出的部分，并将未固化状态的第二树脂层层叠在芯板上，在开口部的内壁与第一电路元器件之间的间隙中填充第二树脂层，之后使第一树脂层及第二树脂层固化，因此，即使第一电路元器件是比芯板要高的元器件，也能实现整体厚度较薄的元器件内置模块。此外，由于第一树脂层具有临时固定芯板及第一电路元器件、和作为层叠层的功能，因此，能简化制造工序，降低制造成本。As described above, according to the present invention, since the core board having the opening is laminated on the uncured first resin layer, the first circuit component is attached to the exposed portion of the first resin layer in the opening, and the uncured The second resin layer in the state is laminated on the core board, the gap between the inner wall of the opening and the first circuit component is filled with the second resin layer, and then the first resin layer and the second resin layer are cured. Therefore, even The first circuit component is a component that is taller than the core board, and can also realize a built-in module with a thinner component. In addition, since the first resin layer has the function of temporarily fixing the core board and the first circuit component, and serving as a laminated layer, the manufacturing process can be simplified and the manufacturing cost can be reduced.

附图说明 Description of drawings

图1是本发明所涉及的元器件内置模块的实施方式1的剖视图。FIG. 1 is a cross-sectional view of Embodiment 1 of a module with built-in components according to the present invention.

图2是图1所示的元器件内置模块的制造方法的一个示例的工序图。FIG. 2 is a process diagram of an example of a method of manufacturing the module with built-in components shown in FIG. 1 .

图3是图1所示的元器件内置模块的制造方法的其他示例的工序图。FIG. 3 is a process diagram of another example of the method of manufacturing the module with built-in components shown in FIG. 1 .

图4是本发明所涉及的元器件内置模块的实施方式2的剖视图。4 is a cross-sectional view of Embodiment 2 of the module with built-in components according to the present invention.

图5是本发明所涉及的元器件内置模块的实施方式3的剖视图。5 is a cross-sectional view of Embodiment 3 of the module with built-in components according to the present invention.

图6是图5所示的元器件内置模块的制造方法的一个示例的工序图。FIG. 6 is a process diagram of an example of a method of manufacturing the module with built-in components shown in FIG. 5 .

具体实施方式 Detailed ways

[实施方式1][Embodiment 1]

参照图1，说明本发明所涉及的元器件内置模块的实施方式1。Embodiment 1 of the component built-in module according to the present invention will be described with reference to FIG. 1 .

在图1中，本实施方式的元器件内置模块A由芯板1、层叠于芯板1的下侧的第一树脂层10、以及层叠于芯板1的上侧的第二树脂层20构成。芯板1除了树脂基板等印刷布线板之外，还可以是LTCC这样的陶瓷基板。这里，虽然芯板1示出了多层基板的示例，但也可以是单层基板。第一树脂层10是比芯板1要薄的树脂层，可使用环氧树脂等热固化性树脂、含有无机填料和热固化性树脂的材料、以及预浸料。希望第二树脂层20是与第一树脂层10相同材质的树脂层，但也可以是其他材质。In FIG. 1 , the component built-in module A of this embodiment is composed of a core board 1 , a first resin layer 10 laminated on the lower side of the core board 1 , and a second resin layer 20 laminated on the upper side of the core board 1 . . The core board 1 may be a ceramic substrate such as LTCC other than a printed wiring board such as a resin substrate. Here, although the core board 1 shows an example of a multi-layer substrate, it may also be a single-layer substrate. The first resin layer 10 is a resin layer thinner than the core board 1, and thermosetting resins such as epoxy resins, materials containing inorganic fillers and thermosetting resins, and prepregs can be used. The second resin layer 20 is desirably made of the same material as the first resin layer 10, but may be made of other materials.

在芯板1上形成有贯通正反面的开口部2，利用树脂层10封闭开口部2的底面。在开口部2中收纳有第一电路元器件3，该电路元器件3的端子电极3a与形成于树脂层10的电极(层间连接导体)11a进行电连接。第一电路元器件3是例如SAW元件这样的、高度比芯板1的厚度要高的较高元器件。利用形成于芯板1上的第二树脂层20覆盖第一电路元器件3的上表面及周围。即，在开口部2的内壁与第一电路元器件3的周围之间的间隙中也填充第二树脂层20。在芯板1的上表面及下表面形成有面内导体4、5的图案，在上表面的面内导体4上安装有第二电路元器件6。第二电路元器件6例如是片状电容器或集成电路元件之类的、高度比第一电路元器件3要低的较低元器件，利用形成于芯板1上的第二树脂层20将其覆盖。An opening 2 penetrating the front and back is formed on the core plate 1 , and the bottom surface of the opening 2 is closed by the resin layer 10 . The first circuit component 3 is housed in the opening 2 , and the terminal electrode 3 a of the circuit component 3 is electrically connected to the electrode (interlayer connection conductor) 11 a formed on the resin layer 10 . The first circuit component 3 is a relatively tall component such as a SAW component whose height is higher than the thickness of the core board 1 . The upper surface and the periphery of the first circuit component 3 are covered with the second resin layer 20 formed on the core board 1 . That is, the second resin layer 20 is also filled in the gap between the inner wall of the opening 2 and the periphery of the first circuit component 3 . Patterns of in-plane conductors 4 and 5 are formed on the upper and lower surfaces of the core board 1, and the second circuit component 6 is mounted on the in-plane conductors 4 on the upper surface. The second circuit component 6 is, for example, a chip capacitor or an integrated circuit component and the like, which is lower than the first circuit component 3 in height, and is formed by the second resin layer 20 formed on the core board 1. cover.

芯板1的下表面的面内导体5与形成于树脂层10的层间连接导体11b进行电连接。树脂层10的层间连接导体11a、11b分别与在树脂层10的下表面形成图案的面内导体12a、12b进行电连接。The in-plane conductor 5 on the lower surface of the core board 1 is electrically connected to the interlayer connection conductor 11 b formed on the resin layer 10 . Interlayer connection conductors 11 a and 11 b of resin layer 10 are electrically connected to in-plane conductors 12 a and 12 b patterned on the lower surface of resin layer 10 , respectively.

这样，由于将较高的第一电路元器件3配置于开口部2，将较低的第二电路元器件6安装在芯板1上，因此，第一电路元器件3的上表面和第二电路元器件6的上表面变平均，能实现整体薄型、且高安装密度的元器件内置模块A。此外，虽然具有开口部2的芯板1的机械强度变低，但由于利用同一树脂(第二树脂层)20密封开口部2和芯板1的表面，因此，能提高机械强度。In this way, since the higher first circuit component 3 is arranged in the opening 2 and the lower second circuit component 6 is mounted on the core board 1, the upper surface of the first circuit component 3 and the second The upper surface of the circuit component 6 is averaged, and the module A with built-in components can be realized to be thin as a whole and have a high mounting density. In addition, although the mechanical strength of the core plate 1 having the opening 2 becomes low, since the opening 2 and the surface of the core plate 1 are sealed with the same resin (second resin layer) 20, the mechanical strength can be improved.

—第一制造方法——First manufacturing method—

这里，参照图2，对所述元器件内置模块A的制造方法的一个示例进行说明。另外，虽然图2中对单一的元器件内置模块A的制造方法进行说明，但在实际的制造工序中，制作母基板状态的元器件内置模块，之后切割成子基板状态。Here, an example of a method of manufacturing the component built-in module A will be described with reference to FIG. 2 . In addition, although the method of manufacturing a single component-embedded module A is described in FIG. 2 , in an actual manufacturing process, a component-embedded module in the form of a mother board is produced, and then cut into a daughter board state.

图2的(a)是第一工序，表示准备了芯板1和第一树脂层10的状态。芯板1是硬质基板，形成有开口部2和面内导体4、5。虽然预先在上表面的面内导体4上安装有第二电路元器件6，但也可以在将芯板1与第一树脂层10粘接之后安装第二电路元器件6。另一方面，第一树脂层10是未固化的树脂片材，可利用例如含有无机填料和热固化性树脂的未固化的片材、不含无机填料而由热固化性树脂形成的未固化的片材、以及预浸料等。在第一树脂层10中，在与第一电路元器件3的端子电极3a及芯板1的面内导体5相对应的位置，分别形成有层间连接导体11a、11b。该层间连接导体11a、11b是将未固化的导体糊料填充到贯穿第一树脂层10的层间连接导体用孔中的部件。而且，铜箔12利用第一树脂层10的粘接力粘贴在第一树脂层10的下表面的整个表面上。(a) of FIG. 2 is a 1st process, and has shown the state in which the core board 1 and the 1st resin layer 10 were prepared. The core board 1 is a rigid substrate, and an opening 2 and in-plane conductors 4 and 5 are formed. Although the second circuit component 6 is preliminarily mounted on the in-plane conductor 4 on the upper surface, the second circuit component 6 may be mounted after bonding the core board 1 and the first resin layer 10 . On the other hand, the first resin layer 10 is an uncured resin sheet, and for example, an uncured sheet containing an inorganic filler and a thermosetting resin, an uncured sheet formed of a thermosetting resin without an inorganic filler, Sheets, and prepregs, etc. In the first resin layer 10 , interlayer connection conductors 11 a and 11 b are respectively formed at positions corresponding to the terminal electrodes 3 a of the first circuit component 3 and the in-plane conductors 5 of the core board 1 . These interlayer connection conductors 11 a and 11 b are members in which uncured conductor paste is filled into holes for interlayer connection conductors penetrating through the first resin layer 10 . Furthermore, the copper foil 12 is stuck on the entire lower surface of the first resin layer 10 by the adhesive force of the first resin layer 10 .

图2的(b)是第二工序，将芯板1压接在第一树脂层10上，并且，将第一电路元器件3压接于开口部2内的第一树脂层10露出的部分。此时，芯板1的面内导体5与层间连接导体11b相对应，且第一电路元器件3的端子电极3a与层间连接导体11a相对应，以这样的方式进行压接。由于未固化的第一树脂层10具有粘接性，因此，芯板1及第一电路元器件3临时固定于第一树脂层10。此时，由于构成层间连接导体11a的导电糊料也未固化，因此，第一电路元器件3的端子电极3与层间连接导体11a未进行电连接。(b) of FIG. 2 is the second process, the core board 1 is crimped on the first resin layer 10, and the first circuit component 3 is crimped to the exposed part of the first resin layer 10 in the opening 2. . At this time, the in-plane conductor 5 of the core board 1 corresponds to the interlayer connection conductor 11b, and the terminal electrode 3a of the first circuit component 3 corresponds to the interlayer connection conductor 11a, and crimping is performed in such a manner. Since the uncured first resin layer 10 has adhesiveness, the core board 1 and the first circuit component 3 are temporarily fixed to the first resin layer 10 . At this time, since the conductive paste constituting the interlayer connection conductor 11 a is also not cured, the terminal electrode 3 of the first circuit component 3 and the interlayer connection conductor 11 a are not electrically connected.

图2的(c)为第三工序，在芯板1上层叠未固化的第二树脂层20。由于第二树脂层20未固化，因此，第二树脂层20进行流动，无间隙地填充到第二电路元器件6的周围，并且，还填充到开口部2的内壁与第一电路元器件3之间的间隙中。通过在进行层叠压接的同时进行加热，使第一树脂层10和第二树脂层20一起固化。其结果是，将芯板1置于中间，使第一树脂层10与第二树脂层20形成一体化。此时，由于层间连接导体11a、11b也同时固化，产生导电性，因此，层间连接导体11a与第一电路元器件3的端子电极3a进行电连接，并且，层间连接导体11b与芯板1的面内导体5进行电连接。(c) of FIG. 2 is a third step of laminating an uncured second resin layer 20 on the core board 1 . Since the second resin layer 20 is not cured, the second resin layer 20 flows and fills the periphery of the second circuit component 6 without gaps, and also fills the inner wall of the opening 2 and the first circuit component 3. in the gap between. The first resin layer 10 and the second resin layer 20 are cured together by heating while performing lamination pressure bonding. As a result, the core board 1 is placed in the middle, and the first resin layer 10 and the second resin layer 20 are integrated. At this time, since the interlayer connection conductors 11a and 11b are also cured at the same time to generate electrical conductivity, the interlayer connection conductor 11a is electrically connected to the terminal electrode 3a of the first circuit component 3, and the interlayer connection conductor 11b is connected to the core. The in-plane conductors 5 of the board 1 are electrically connected.

图2的(d)为第四工序，通过对固化的第一树脂层10的铜箔12进行图案形成，形成面内导体12a、12b，完成元器件内置模块A。铜箔12的图案形成可通过蚀刻等公知方法来形成。另外，面内导体12a、12b除了通过将铜箔12粘贴在未固化的第一树脂层10上、在第一树脂层10固化后进行蚀刻的方法来形成，还可通过镀覆法、导电糊料的印刷法等来形成。(d) of FIG. 2 is the fourth step, in which the in-plane conductors 12a and 12b are formed by patterning the copper foil 12 of the cured first resin layer 10, and the component built-in module A is completed. The patterning of the copper foil 12 can be formed by well-known methods, such as etching. In addition, the in-plane conductors 12a, 12b can be formed by bonding the copper foil 12 on the uncured first resin layer 10 and etching after the first resin layer 10 is cured, or by plating, conductive paste, etc. The printing method of the material, etc. to form.

虽然在图2所示的制造方法中，使第一树脂层10和第二树脂层20同时固化，但也可以在工序(b)结束的阶段，先使第一树脂层10固化。但是，在第一树脂层10和第二树脂层20是同种材料、且同时进行固化的情况下，由于两层树脂层的固化收缩成为相同的情况，因此，具有能抑制产生翘曲的优点。In the manufacturing method shown in FIG. 2, the first resin layer 10 and the second resin layer 20 are cured simultaneously, but the first resin layer 10 may be cured first at the end of step (b). However, when the first resin layer 10 and the second resin layer 20 are made of the same material and are cured at the same time, since the cure shrinkage of the two resin layers becomes the same, there is an advantage that warpage can be suppressed. .

—第二制造方法——Second manufacturing method—

图3表示所述元器件内置模块A的制造方法的其他示例。图3的(a)是第一工序，表示准备了芯板1和未固化的第一树脂层10的状态。虽然芯板1与图2相同，但第一树脂层10是没有形成层间连接导体的薄层的树脂片材。第一树脂层10也没有粘贴铜箔。FIG. 3 shows another example of the manufacturing method of the module A with built-in components. (a) of FIG. 3 is a 1st process, and has shown the state in which the core board 1 and the uncured 1st resin layer 10 were prepared. Although the core board 1 is the same as in FIG. 2 , the first resin layer 10 is a resin sheet in which no interlayer connection conductors are formed in a thin layer. Copper foil was not attached to the first resin layer 10 either.

图3的(b)是第二工序，将芯板1压接在第一树脂层10上，并且，将第一电路元器件3压接于开口部2内的第一树脂层10露出的部分。由于在第一树脂层10中尚未形成层间连接导体，因此，无需将芯板1及第一电路元器件3与第一树脂层10对准位置，粘接操作变简单。(b) of FIG. 3 is the second process, the core board 1 is crimped on the first resin layer 10, and the first circuit component 3 is crimped to the exposed part of the first resin layer 10 in the opening 2. . Since no interlayer connection conductors have been formed in the first resin layer 10, there is no need to align the core board 1 and the first circuit component 3 with the first resin layer 10, and the bonding operation is simplified.

图3的(c)为第三工序，在芯板1上层叠未固化的第二树脂层20。由于第二树脂层20未固化，因此，第二树脂层20进行流动，无间隙地填充到第二电路元器件6的周围，并且，还填充到开口部2的内壁与第一电路元器件3之间的间隙中。通过在进行层叠压接的同时进行加热，使第一树脂层10和第二树脂层20一起固化。(c) of FIG. 3 is a third step of laminating an uncured second resin layer 20 on the core board 1 . Since the second resin layer 20 is not cured, the second resin layer 20 flows and fills the periphery of the second circuit component 6 without gaps, and also fills the inner wall of the opening 2 and the first circuit component 3. in the gap between. The first resin layer 10 and the second resin layer 20 are cured together by heating while performing lamination pressure bonding.

图3的(d)是第四工序，在与芯板1的面内导体5及第一电路元器件3的端子电极3a相对应的第一树脂层10的位置，通过激光加工形成层间连接导体用孔11a1、11b1。通过形成层间连接导体用孔11a1、11b1，露出面内导体5及端子电极3a。(d) of FIG. 3 is the fourth step, forming an interlayer connection by laser processing at the position of the first resin layer 10 corresponding to the in-plane conductor 5 of the core board 1 and the terminal electrode 3a of the first circuit component 3 Conductor holes 11a 1 , 11b 1 . The in-plane conductor 5 and the terminal electrode 3a are exposed by forming the interlayer connection conductor holes 11a 1 and 11b 1 .

图3的(e)是第五工序，在层间连接导体用孔(过孔)11a1、11b1中填充导电糊料，使其固化，形成层间连接导体11a、11b，之后，在第一树脂层10的表面形成与层间连接导体11a、11b导通的面内导体12a、12b的图案。层间连接导体11a、11b并不限于填充并固化导电糊料，还可以通过镀覆法在层间连接导体用孔11a1、11b1的内表面形成导电膜，之后，在层间连接导体用孔11a1、11b1中埋设树脂。作为面内导体12a、12b的形成方法，可选择镀覆法、印刷导电糊料等任意方法。(e) of Fig. 3 is the fifth step, filling the conductive paste in the holes (via holes) 11a 1 and 11b 1 for interlayer connection conductors, and curing it to form the interlayer connection conductors 11a and 11b. On the surface of one resin layer 10, a pattern of in-plane conductors 12a, 12b electrically connected to the interlayer connection conductors 11a, 11b is formed. The interlayer connection conductors 11a, 11b are not limited to filling and curing the conductive paste, but a conductive film may be formed on the inner surfaces of the interlayer connection conductor holes 11a 1 , 11b 1 by a plating method, and thereafter, the interlayer connection conductor holes 11a 1 , 11b 1 may be formed with a conductive film. Resin is embedded in the holes 11a 1 and 11b 1 . As a method for forming the in-plane conductors 12a and 12b, any method such as a plating method and printing of a conductive paste can be selected.

对于图3所示的制造方法的情况，由于在第一树脂层10固化之后，形成层间连接导体用孔11a1、11b1，并通过导电糊料或镀覆形成层间连接导体11a、11b，因此，能将芯板1的面内导体5及第一电路元器件3的端子电极3a与层间连接导体11a、11b可靠地进行电连接。虽然在图3所示的制造方法中，使第一树脂层10和第二树脂层20同时固化，但也可以在层叠第二树脂层20之前，使第一树脂层10固化。在该情况下，也可以在层叠第二树脂层20之前，形成层间连接导体11a、11b。In the case of the manufacturing method shown in FIG. 3, after the first resin layer 10 is cured, holes 11a1 , 11b1 for interlayer connection conductors are formed, and interlayer connection conductors 11a, 11b are formed by conductive paste or plating. Therefore, the in-plane conductor 5 of the core board 1 and the terminal electrode 3a of the first circuit component 3 can be reliably electrically connected to the interlayer connection conductors 11a and 11b. In the manufacturing method shown in FIG. 3 , the first resin layer 10 and the second resin layer 20 are cured simultaneously, but the first resin layer 10 may be cured before laminating the second resin layer 20 . In this case, the interlayer connection conductors 11 a and 11 b may be formed before laminating the second resin layer 20 .

[实施方式2][Embodiment 2]

图4表示元器件内置模块的实施方式2。在该实施方式的元器件内置模块B中，在实施方式1的元器件内置模块A的第一树脂层10的下表面，进一步组合层叠了树脂层30。该树脂层30是与第一树脂层10同样的薄树脂层，在其下表面形成有通过多个层间连接导体31与第一树脂层10的面内导体12a、12b相连接的面内导体32。另外，当然也可以在树脂层30的下表面进一步层叠树脂层。FIG. 4 shows Embodiment 2 of the component built-in module. In the component built-in module B of this embodiment, the resin layer 30 is further combined and laminated|stacked on the lower surface of the 1st resin layer 10 of the component built-in module A of Embodiment 1. As shown in FIG. The resin layer 30 is a thin resin layer similar to the first resin layer 10, and in-plane conductors connected to the in-plane conductors 12a and 12b of the first resin layer 10 via a plurality of interlayer connecting conductors 31 are formed on the lower surface thereof. 32. In addition, of course, a resin layer may be further laminated on the lower surface of the resin layer 30 .

[实施方式3][Embodiment 3]

图5表示元器件内置模块的实施方式3。为了提高安装密度，该实施方式的元器件内置模块C通过在第一树脂层10的背面的面内导体12a、12b上安装第三电路元器件40，并且，在第一树脂层10的背面层叠第三树脂层50，从而将第三电路元器件40埋设在第三树脂层50中。第三电路元器件40可以是比第一电路元器件3要低的元器件。第三树脂层50可以采用与第一、第二树脂层10、20相同的材料。在第二树脂层20中形成有与芯板1的面内导体图案4相连接的多个层间连接导体21，在第二树脂层20的表面上形成有与层间连接导体21相连接的面内导体图案22a。FIG. 5 shows Embodiment 3 of the module with built-in components. In order to increase the mounting density, the module C with built-in components of this embodiment mounts the third circuit components 40 on the in-plane conductors 12a, 12b on the back surface of the first resin layer 10, and laminates them on the back surface of the first resin layer 10. The third resin layer 50 , so that the third circuit component 40 is buried in the third resin layer 50 . The third circuit component 40 may be a lower component than the first circuit component 3 . The third resin layer 50 can use the same material as the first and second resin layers 10 and 20 . A plurality of interlayer connection conductors 21 connected to the in-plane conductor pattern 4 of the core board 1 are formed in the second resin layer 20, and a plurality of interlayer connection conductors 21 connected to the interlayer connection conductors 21 are formed on the surface of the second resin layer 20. In-plane conductor pattern 22a.

图6是表示元器件内置模块C的制造工序的一个示例。首先，由于图6的(a)～(d)与图2的(a)～(d)基本相同，因此省略其重复说明。但是，在图6(c)的阶段，在第二树脂层20的表面配置铜箔22，在压接/固化时铜箔22固定于第二树脂层20的表面。此外，在图6的(d)中，在第二树脂层20固化后，铜箔22进行图案形成而成为面内导体图案22a，并且，对到达芯板1的上表面的面内导体4的层间连接导体用孔(过孔)进行激光加工，在该层间连接导体用孔中填充导电糊料并使其固化，从而形成层间连接导体21。此外，第二电路元器件6的一部分的形状与图2不同。FIG. 6 shows an example of the manufacturing process of the module C with built-in components. First, since (a) to (d) of FIG. 6 are basically the same as (a) to (d) of FIG. 2 , repeated description thereof will be omitted. However, at the stage of FIG. 6( c ), the copper foil 22 is disposed on the surface of the second resin layer 20 , and the copper foil 22 is fixed to the surface of the second resin layer 20 during crimping and curing. In addition, in FIG. 6( d ), after the second resin layer 20 is cured, the copper foil 22 is patterned to form an in-plane conductor pattern 22a, and the in-plane conductor 4 that reaches the upper surface of the core board 1 The interlayer connection conductor hole (via hole) is processed by laser, and the conductive paste is filled and cured in the interlayer connection conductor hole to form the interlayer connection conductor 21 . In addition, the shape of a part of the second circuit component 6 is different from FIG. 2 .

在图6的(e)中，将通过图6的(d)得到的模块翻转，在第一树脂层10的背面的面内导体12a、12b上安装第三电路元器件40。在图6的(f)中，通过将未固化的第三树脂层50热压接在第一树脂层10上，利用第三树脂层50覆盖第三电路元器件40的周围，并且，使第三树脂层50固化，从而完成元器件内置模块C。In FIG. 6( e ), the module obtained in FIG. 6( d ) is turned over, and the third circuit component 40 is mounted on the in-plane conductors 12 a and 12 b on the back surface of the first resin layer 10 . In (f) of FIG. 6, by thermocompression bonding the uncured third resin layer 50 on the first resin layer 10, the third resin layer 50 is used to cover the periphery of the third circuit component 40, and the third resin layer 50 is used to make the third circuit component 40. The three resin layers 50 are cured, thereby completing the module C with built-in components.

虽然在图6中，作为第一树脂层10，使用了预先形成层间连接导体11a、11b且在下表面的整个表面粘贴铜箔12的树脂片材，但也可以像图3所示的那样，使用没有层间连接导体及铜箔的树脂片材，并在其固化后形成层间连接导体。In FIG. 6, as the first resin layer 10, a resin sheet in which the interlayer connecting conductors 11a, 11b are formed in advance and the copper foil 12 is pasted on the entire lower surface is used, but as shown in FIG. 3, Use a resin sheet without interlayer connection conductors and copper foil, and form interlayer connection conductors after curing.

虽然在上述实施例中，作为第一电路元器件3，示出使用了比芯板1要高的元器件的示例，但也可以是与芯板1等高的元器件、或是比芯板1要低的元器件。此外，第一树脂层10和第二树脂层20的固化处理不一定需要同时进行。即，也可以在将芯板1和第一电路元器件3临时固定于第一树脂层10之后，使第一树脂层10固化，之后层叠第二树脂层20并使其固化。但是，同时进行第一树脂层10和第二树脂层20的固化，在能减小固化收缩所带来的模块翘曲这一点上是有利的。Although in the above-mentioned embodiment, as the first circuit component 3, an example using a component higher than the core board 1 is shown, it may also be a component that is as high as the core board 1, or a component higher than the core board. 1 to low components. In addition, the curing treatment of the first resin layer 10 and the second resin layer 20 does not necessarily need to be performed simultaneously. That is, after temporarily fixing the core board 1 and the first circuit component 3 to the first resin layer 10, the first resin layer 10 may be cured, and then the second resin layer 20 may be laminated and cured. However, curing the first resin layer 10 and the second resin layer 20 at the same time is advantageous in that the warping of the module due to curing shrinkage can be reduced.

标号说明Label description

A～C  元器件内置模块A～C Component built-in modules

1     芯板1 core board

2     开口部2 opening

3     第一电路元器件3 The first circuit components

3a    端子电极3a terminal electrode

4、5  面内导体4, 5 in-plane conductors

6     第二电路元器件6 Second circuit components

10    第一树脂层10 The first resin layer

11a、11b  电极(层间连接导体)11a, 11b Electrodes (interlayer connection conductors)

12a、12b  面内导体12a, 12b In-plane conductor

20    第二树脂层20 second resin layer

21    层间连接导体21 Interlayer connecting conductor

30    层叠树脂层30 laminated resin layers

40    第三电路元器件40 Third circuit components

50    第三树脂层50 third resin layer

Claims (12)

1. a manufacture method for parts installation module, is characterized in that, comprising:
Operation A, this operation A is stacked in the core layer with the peristome that runs through positive and negative direction on the first resin bed of its uncured state;
Process B, this process B makes the first circuit elements device be attached to the exposed portions serve of described first resin bed of its uncured state of exposing in described peristome;
Operation C, this operation C is layered in the second resin bed of its uncured state on described central layer, and fills the second resin bed in the inwall of described peristome and the gap between described the first circuit elements device;
Step D, this step D is solidified described the first resin bed; And
Operation E, this operation E solidifies described the second resin bed,
In described the first resin bed before described process B, form electrode, this electrode by the interlayer bonding conductor that runs through this first resin bed with hole be filled into this interlayer bonding conductor and form with the uncured conducting paste in hole,
In described process B, described the first circuit elements device is attached to described the first resin bed in the mode with described electrode contact,
In described step D, when making described the first resin bed curing, described conducting paste is solidified, described the first circuit elements device and described electrode are electrically connected to.
2. the manufacture method of parts installation module as claimed in claim 1, is characterized in that,
Implement described step D and operation E simultaneously.
3. the manufacture method of parts installation module as claimed in claim 1, is characterized in that,
Described the first circuit elements device is the components and parts higher than the thickness of described central layer.
4. the manufacture method of parts installation module as claimed in claim 1, is characterized in that,
Before being included in described operation C, will be arranged on the operation on described central layer than the low second circuit components and parts of described the first circuit elements device,
In described operation C, described second circuit components and parts are embedded in described the second resin bed.
5. the manufacture method of parts installation module as claimed in claim 1, is characterized in that,
Described the first resin bed and described the second resin bed are formed by identical material.
6. a manufacture method for parts installation module, is characterized in that, comprising:
Operation A, this operation A is stacked in the core layer with the peristome that runs through positive and negative direction on the first resin bed of its uncured state;
Process B, this process B makes the first circuit elements device be attached to the exposed portions serve of described first resin bed of its uncured state of exposing in described peristome;
Operation C, this operation C is layered in the second resin bed of its uncured state on described central layer, and fills the second resin bed in the inwall of described peristome and the gap between described the first circuit elements device;
Step D, this step D is solidified described the first resin bed; And
Operation E, this operation E solidifies described the second resin bed,
After described step D, in described the first resin bed, to arrive the mode of described the first circuit elements device, form interlayer bonding conductor use hole, and at this interlayer bonding conductor with forming interlayer bonding conductor in hole, the electrode being electrically connected to described the first circuit elements device by such formation.
7. the manufacture method of parts installation module as claimed in claim 6, is characterized in that,
Implement described step D and operation E simultaneously.
8. the manufacture method of parts installation module as claimed in claim 6, is characterized in that,
Described the first circuit elements device is the components and parts higher than the thickness of described central layer.
9. the manufacture method of parts installation module as claimed in claim 6, is characterized in that,
Before being included in described operation C, will be arranged on the operation on described central layer than the low second circuit components and parts of described the first circuit elements device,
In described operation C, described second circuit components and parts are embedded in described the second resin bed.
10. the manufacture method of parts installation module as claimed in claim 6, is characterized in that,
Described the first resin bed and described the second resin bed are formed by identical material.
11. 1 kinds of parts installation modules, is characterized in that, comprising:
The first resin bed;
Central layer, this core layer is stacked on described the first resin bed, and has the peristome that runs through positive and negative direction;
The first circuit elements device higher than the thickness of described central layer, this first circuit elements device is accommodated in the peristome of described central layer, and bottom surface is attached on described the first resin bed;
The second resin bed, this second resin bed is layered on described central layer, and is filled in the peristome and the gap between described the first circuit elements device of described central layer;
Than the low second circuit components and parts of described the first circuit elements device, these second circuit components and parts are arranged on described central layer, and are embedded in described the second resin bed; And
Electrode, this electrode is formed at described the first resin bed, and is electrically connected to described the first circuit elements device.
12. parts installation modules as claimed in claim 11, is characterized in that,
Described the first resin bed and described the second resin bed are formed by identical material.
CN200980131635.2A 2008-08-12 2009-06-09 Method for manufacturing module with built-in component, and module with built-in component Expired - Fee Related CN102119588B (en)

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CN103747616A (en) 2014-04-23
JP5093353B2 (en) 2012-12-12

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