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CN102105335A - 用于封装碰撞传感器的方法和设备 - Google Patents

用于封装碰撞传感器的方法和设备 Download PDF

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CN102105335A
CN102105335A CN2009801292659A CN200980129265A CN102105335A CN 102105335 A CN102105335 A CN 102105335A CN 2009801292659 A CN2009801292659 A CN 2009801292659A CN 200980129265 A CN200980129265 A CN 200980129265A CN 102105335 A CN102105335 A CN 102105335A
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circuit board
printed circuit
crash sensor
pcb
material layer
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CN102105335B (zh
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C·D·坎贝尔
小N·G·穆雷
D·帕克
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Future Industry Zf Automotive Technologies Guangzhou Co ltd
ZF Active Safety and Electronics US LLC
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TRW Automotive US LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
    • B60R21/013—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents including means for detecting collisions, impending collisions or roll-over
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Air Bags (AREA)
  • Connection Or Junction Boxes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

一种碰撞传感器组件，包括印刷电路板和安装在所述印刷电路板上的碰撞传感器。至少一个连接器引脚被安装到所述印刷电路板以允许与所述碰撞传感器的外部电通信。第一嵌件成型的软的内材料层部分覆盖所述印刷电路板，并覆盖所述碰撞传感器，而第二包覆成型的硬的外材料层覆盖并连结到所述第一软的内材料层，并且与所述印刷电路板刚性接触。

Description

用于封装碰撞传感器的方法和设备
相关专利申请
本申请要求2008年7月28日提交的美国临时专利申请序列No.61/084,124的优先权，其主题通过引用被完整结合在此。
技术领域
本发明涉及车辆碰撞传感器，更具体地涉及用于封装车辆碰撞传感器的方法和设备。
背景技术
本领域中已知有可启动的车辆乘客保护系统。这样的保护系统可以包括用于检测车辆碰撞状态的发生的一个或更多个车辆碰撞传感器。当检测到车辆碰撞状态时，该保护系统可以启动可充气装置，诸如气囊，以帮助保护车上的乘客。
某些类型的车辆碰撞传感器可以包括响应于车辆变形而闭合的机械装置，诸如开关。机械装置的闭合表明车辆碰撞状态的发生。另外的车辆碰撞传感器可以包括用于检测碰撞状态的电学装置，诸如加速度计。当经处理的电学装置输出超过阈值水平时，车辆碰撞状态得以确定。
用于检测对车辆的侧面撞击的车辆碰撞传感器必须具有特别快的响应时间，因为用于启动用于在侧面撞击期间保护乘客的可充气装置的时间段显著小于用于启动用于在正面撞击期间保护乘客的可充气装置的时间段。为了帮助改进用于感测侧面撞击的车辆碰撞传感器的响应时间，通常将车辆碰撞传感器放置在车辆的侧面，诸如在侧柱上或在车辆的门里。
碰撞传感器可能由于其安装位置而受制于严苛的环境条件。
发明内容
根据本发明的一个实施例，一种碰撞传感器组件包括印刷电路板和安装在所述印刷电路板上的碰撞传感器。至少一个连接器引脚被安装到所述印刷电路板以允许与所述碰撞传感器的外部电通信。第一嵌件成型的软的内材料层部分覆盖所述印刷电路板，并覆盖所述碰撞传感器，而第二包覆成型的硬的外材料层覆盖并连结到所述第一软的内材料层，并且与所述印刷电路板刚性接触。
根据本发明的另一个实施例，提供一种碰撞传感器组件，该碰撞传感器组件包括：印刷电路板；安装在所述印刷电路板上的碰撞传感器；和安装在所述印刷电路板上并连接到所述碰撞传感器以处理来自该碰撞传感器的信号的处理电路。至少一个连接器被安装到所述印刷电路板以允许与所述处理电路的外部电通信。第一嵌件成型的软的内材料层部分覆盖所述印刷电路板，并覆盖所述碰撞传感器和所述处理电路。第二包覆成型的硬的材料层覆盖并连结到所述第一内材料，并接触所述印刷电路板。
根据本发明的另一个实施例，提供一种用于组装碰撞传感器的方法，包括以下步骤：将碰撞传感器安装到印刷电路板；将至少一个连接器安装到所述印刷电路板，以允许与所述碰撞传感器的电通信；将软的弹性内材料层嵌件成型到电路板，以部分覆盖所述印刷电路板，并覆盖所述碰撞传感器；和将硬的外材料层包覆成型在第一内材料层和所述印刷电路板之上。
根据本发明的另一个实施例，提供一种用于组装碰撞传感器的方法，包括以下步骤：将碰撞传感器安装到印刷电路板；将处理电路安装到所述印刷电路板，并将所述处理电路连接到所述碰撞传感器以处理来自该碰撞传感器的信号；将至少一个连接器安装到所述印刷电路板，并将所述至少一个连接器连接到所述处理电路，以允许与所述处理电路的电通信；将软的弹性内材料层嵌件成型到电路板，以部分覆盖所述印刷电路板，并覆盖所述碰撞传感器和所述处理电路；和将硬的外材料层包覆成型在第一内材料层和所述印刷电路板之上。
附图说明
对于本发明所涉及的本领域技术人员，在参考附图阅读了下面的描述之后，本发明的前述和其它特征以及优点将变得清楚，在附图中：
图1是根据本发明的一个示例性实施例，其上安装有碰撞传感器和相关联的处理电路的印刷电路板(“PCB”)子组件的示意图；
图2是图1的PCB在其用第一软内层进行嵌件成型(insert molded)之后的示意图；
图3是用第二较硬外层对图1-2的PCB进行嵌件成型得到其最终设计形式的示意图；
图4是用第二较硬外层对图1-2的PCB进行嵌件成型得到另一种最终形状的侧面立体图。
具体实施方式
参考图1，示出了根据本发明的一个示例性实施例制造的碰撞传感器组件10。碰撞传感器组件10包括印刷电路板(“PCB”)12，其上可操作地安装有加速度计14形式的碰撞传感器和相关联的处理电路16。在本申请中，词语“印刷电路板”意指也包括基板、引线框、印刷线路板、支架(armature)、柔性电路、汇流条、以及金属线基板和/或提供电子部件之间的互连以及用于外部通信的端子连接的任何装置。连接器18提供到车辆总线的电连接，以便以任何已知的方式与车辆的其它可启动的约束控制电路通信。
碰撞传感器组件10可以是正面碰撞传感器、侧面碰撞传感器、翻滚传感器，或者以任何其它已知朝向放置，以实现所需结果。传感器组件10的安装位置也可以位于任何车辆位置。
为了在环境上保护传感器组件10，用软的橡胶/塑料材料对传感器进行包覆成型(overmolded)或嵌件成型，以便部分包围电路板和电子器件，并保护它们免受潮湿影响。这种材料还防止对电路板上的电子部件及其焊接连接的热膨胀剪力伤害。电路板的某些选择的部分保持暴露，以便与另一工艺步骤中模制的硬外壳进行硬接触。电子装置，诸如加速度计、电阻器、电容器和二极管，被软的弹性塑料完全包围。然后在第一较软层之上模制硬的外壳，以连结到内部软橡胶/塑料材料，从而为电路提供机械保护，并且由于在较硬外层和电路板12之间为直接接触，还将碰撞冲击脉冲传送到安装在电路板上的加速度计14。硬的外壳还提供到车辆体的安装接口。硬的外壳围绕电子部件形成连续无缝的模制结构，其改进从车辆体到加速度计14的碰撞冲击加速力传送。
参考图2-4，用软橡胶/塑料弹性聚合物(诸如TPE(热塑弹性体))材料30对电路板10进行嵌件成型，以覆盖示出的所有部件14、16。硬的外部塑料体40(见图4)(诸如PA66GF(聚酰胺6，聚酰胺66)PBT(聚对苯二甲酸丁二酯))通过注射包覆成型(injection overmolding)工艺被连结到软的内层30和电路板12。硬的外壳40提供到车辆体(未示出)的机械连接，并且提供车辆线束壳体50。两层材料(软的内层和硬的外层)之间的连结和粘结在选择材料时是重要因素。
外壳40、40’的最终形状可以是任何需要的形状。
根据本发明的以上描述，本领域技术人员将意识到各种改进、变化和修改。本领域技术人员的这些改进、变化和修改意图由所附的权利要求所覆盖。

Claims (6)

1.一种碰撞传感器组件，包括：
印刷电路板；
安装在所述印刷电路板上的碰撞传感器；
至少一个连接器引脚，其安装到所述印刷电路板以允许与所述碰撞传感器的外部电通信；
第一嵌件成型的软的内材料层，其部分覆盖所述印刷电路板，并覆盖所述碰撞传感器；和
第二包覆成型的硬的外材料层，其覆盖并连结到所述第一软的内材料层，并且与所述印刷电路板刚性接触。
2.如权利要求1所述的碰撞传感器，其中所述软的内材料层是热塑弹性体。
3.如权利要求1所述的碰撞传感器，其中所述硬的外材料层是聚对苯二甲酸丁二酯。
4.一种碰撞传感器组件，包括：
印刷电路板；
安装在所述印刷电路板上的碰撞传感器；
处理电路，其安装在所述印刷电路板上并连接到所述碰撞传感器以处理来自该碰撞传感器的信号；
至少一个连接器，其安装到所述印刷电路板以允许与所述处理电路的外部电通信；
第一嵌件成型的软的内材料层，其部分覆盖所述印刷电路板，并覆盖所述碰撞传感器和所述处理电路；和
第二包覆成型的硬的材料层，其覆盖并连结到所述第一内材料，并接触所述印刷电路板。
5.一种用于组装碰撞传感器的方法，包括以下步骤：
将碰撞传感器安装到印刷电路板；
将至少一个连接器安装到所述印刷电路板，以允许与所述碰撞传感器的电通信；
将软的弹性内材料层嵌件成型到电路板，以部分覆盖所述印刷电路板，并覆盖所述碰撞传感器；和
将硬的外材料层包覆成型在第一内材料层和所述印刷电路板之上。
6.一种用于组装碰撞传感器的方法，包括以下步骤：
将碰撞传感器安装到印刷电路板；
将处理电路安装到所述印刷电路板，并将所述处理电路连接到所述碰撞传感器以处理来自该碰撞传感器的信号；
将至少一个连接器安装到所述印刷电路板，并将所述至少一个连接器连接到所述处理电路，以允许与所述处理电路的电通信；
将软的弹性内材料层嵌件成型到电路板，以部分覆盖所述印刷电路板，并覆盖所述碰撞传感器和所述处理电路；和
将硬的外材料层包覆成型在第一内材料层和所述印刷电路板之上。
CN2009801292659A 2008-07-28 2009-07-27 用于封装碰撞传感器的方法和设备 Active CN102105335B (zh)

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US8412408P 2008-07-28 2008-07-28
US61/084,124 2008-07-28
PCT/US2009/051849 WO2010014550A2 (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors

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CN102105335A true CN102105335A (zh) 2011-06-22
CN102105335B CN102105335B (zh) 2013-07-24

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KR20110036836A (ko) 2011-04-11
US20110107835A1 (en) 2011-05-12
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WO2010014550A3 (en) 2010-03-25
WO2010014550A2 (en) 2010-02-04
BRPI0916519B1 (pt) 2019-07-16
US8966975B2 (en) 2015-03-03
JP5685187B2 (ja) 2015-03-18
JP2011529420A (ja) 2011-12-08
EP2310232A2 (en) 2011-04-20
KR101296426B1 (ko) 2013-08-13
CN102105335B (zh) 2013-07-24

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