CN101925262A - Steel mesh and PCB (Printed Circuit Board) - Google Patents
Steel mesh and PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN101925262A CN101925262A CN 201010242556 CN201010242556A CN101925262A CN 101925262 A CN101925262 A CN 101925262A CN 201010242556 CN201010242556 CN 201010242556 CN 201010242556 A CN201010242556 A CN 201010242556A CN 101925262 A CN101925262 A CN 101925262A
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- Prior art keywords
- steel mesh
- pcb
- circuit board
- printed circuit
- hole
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 42
- 239000010959 steel Substances 0.000 title claims abstract description 42
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 11
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 230000002411 adverse Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- 239000006071 cream Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a steel mesh which is provided with a plurality of holes, wherein at least one protrusion is arranged in one hole. The invention also discloses a PCB (Printed Circuit Board) which is provided with a plurality of bonding pads, wherein the bonding pads are provided with at least one notch, and the shape of each hole of the steel mesh is matched with the shape of each bonding pad. Limited by the protrusions in the steel mesh holes, the quantity of dipped solder paste is reduced to achieve the aim of reducing the consumption of the solder paste at the bottom of an element or a device, the internal flowing of the solder paste is lessened by the reduced consumption of the solder paste so that the surface tension of the element or the device is balanced to avoid adverse phenomena, such as tin wires and tombstones generated at the bottom of the element or the device, the rotating position offset of the element or the device during the reflow, and the like.
Description
Technical field
The present invention relates to steel mesh and printed circuit board (PCB), particularly a kind of steel mesh and printed circuit board (PCB) of saving material.
Background technology
SMT (Surface Mounted Technology, surface installation technique or surface mounting technology) is most popular a kind of technology and a technology in the present electronics assembling industry.In SMT technology, steel mesh is by pad big or small perforate in 1: 1, soldering paste also adopts with 1: 1 size in steel mesh hole usually and is printed on PCB (Printed Circuit Board, printed circuit board (PCB)) on, the assembling quality of SMT and PCB pad design have direct, crucial relation, if the PCB pad design is correct, when mounting a spot of crooked can be when Reflow Soldering, owing to the effect of fusion weld tin surfaces tension force obtains correcting (being called self-align or the self-correcting effect); On the contrary, if the PCB pad design is incorrect, even it is very accurate to mount the position, weld defects such as position of components skew, suspension bridge can appear on the contrary after the Reflow Soldering.
In Reflow Soldering, when soldering paste reaches melt temperature, under the capillary effect of balance, can produce self-aligning effect, surface tension makes reflow soldering process looser to the placement accuracy requirement, simultaneously also just because of " it is moving to reflux " reaches the characteristics of " self-aligning effect ", reflow soldering process has stricter requirement to pad design, components and parts standardization, if the solder surfaces tension imbalance of fusion, weld defects such as position of components skew, suspension bridge, bridge joint can appear after the welding, wasted more soldering paste, the cost of soldering paste is higher relatively.
Therefore, how can prevent from effectively to occur the position of components skew after SMT from welding and save soldering paste is the technical problem that needs to be resolved hurrily in the industry.
Summary of the invention
Main purpose of the present invention provides a kind of steel mesh and printed circuit board (PCB), is intended to reduce the solder paste material consumption, prevents from the position of components skew to occur and save soldering paste after the SMT welding.
The present invention proposes a kind of steel mesh, is provided with some holes on described steel mesh, wherein, is provided with at least one projection in described hole.
Preferably, described projection is set to one.
Preferably, described hole is " recessed ", " C ", " U " or " V " word shape after projection is set.
Preferably, described projection is " rectangle ", " square " or " isosceles trapezoid ".
Preferably, the projection shape that is provided with in each described hole is identical or inequality.
The present invention also proposes a kind of printed circuit board (PCB), and described printed circuit board (PCB) is provided with a plurality of pads, and wherein, described pad is provided with at least one breach.
Preferably, described breach is set to one.
Preferably, described pad is set to " recessed ", " C ", " U " or " V " word shape, or is set to " rectangle ", " square " or " isosceles trapezoid ".
Preferably, the shape of described pad is identical or inequality.
Adopt the present invention in the SMT paster, owing to be provided with projection in the hole of steel mesh, make perforated area reduce, pad design shape on the PCB is also corresponding with the perforate of steel mesh, because be subjected to the restriction of projection in the steel mesh hole, the tin cream consumption of use has reduced, but also reaches the technique effect of better paster, reduce the tin cream consumption of components and parts bottoms, saved tin cream; The minimizing of tin cream consumption can reduce the internal flow of soldering paste, makes components and parts surface tension balance, and bad phenomenon such as device position of rotation skew in the time of just can not producing components and parts bottom tin silk, gravestone, backflow reduces time of welding simultaneously.
Description of drawings
Fig. 1 a is the schematic diagram of an embodiment of steel mesh of the present invention;
Fig. 1 b is the schematic diagram of another embodiment of steel mesh of the present invention;
Fig. 2 a is the schematic diagram of an embodiment of printed circuit board (PCB) of the present invention;
Fig. 2 b is the schematic diagram of another embodiment of printed circuit board (PCB) of the present invention.
The realization of the object of the invention, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
With reference to Fig. 1 a, an embodiment of a kind of steel mesh of the present invention is proposed, on described steel mesh 10, be provided with some holes 101, in described hole 101, be provided with at least one projection 102, in the present embodiment, above-mentioned projection 102 is set to one, is " recessed " word shape after hole 101 is provided with projection 102.
In last embodiment, projection 102 shapes that are provided with in each described hole 101 can be identical, also can be inequality, promptly hole 101 shapes that on same steel mesh 10, are provided with can be identical also can be incomplete same, present embodiment mesopore 101 shapes are set to identical and are symmetricly set on the steel mesh, can be positioned at the inside middle position, according to the practical situations setting.
Use present embodiment, owing to be provided with projection 102 in the hole of steel mesh 10, make hole 101 reduce, owing to be subjected to the restriction of projection 102 in steel mesh 10 holes, the tin cream consumption that uses has reduced, and when Reflow Soldering, can reduce the internal flow of soldering paste melt temperature and minimizing solder paste amounts, reach surface tension and make reflow soldering process looser, be easier to realize increasingly automated and high-speed the placement accuracy requirement.Because " reflux moving " reaches the characteristics of " self-aligning effect ", reflow soldering process has stricter requirement to pad design, components and parts standardization, if the surface tension imbalance, can occur after the welding position of components skew, suspension bridge, bridge joint, etc. weld defect.Use the present invention to overcome described defective, also reach the purpose of optimizing paster device bottom tin cream consumption and reducing weld time.Having changed traditional soldering paste and steel mesh hole adopts size to be applied to PCB at 1: 1.
With reference to Fig. 1 b, another embodiment of a kind of steel mesh of the present invention is proposed, on described steel mesh 20, be provided with some holes 201, in described hole 201, be provided with at least one projection 202, in the present embodiment, above-mentioned projection 202 is set to one, is " C " word shape after the hole is provided with projection 202.
In the present embodiment, projection 202 shapes that are provided with in each described hole 201 can be identical, also can be inequality, promptly the hole shape that on same steel mesh 20, is provided with can be identical also can be incomplete same, according to the practical situations setting.
The technique effect that present embodiment reached is the same with the technique effect of last embodiment steel mesh, no longer repeats at this.
Above-mentioned projection 102,202 can also be set to be " rectangle ", " square " or " isosceles trapezoid " waits other geometry.Above-mentioned hole 101,201 can also be set to other shapes such as " U " or " V " word shape.The technique effect that reaches is the same with the technique effect of above two embodiment, no longer repeats at this.
With reference to Fig. 2 a, one embodiment of a kind of printed circuit board (PCB) of the present invention is proposed, described printed circuit board (PCB) (PCB) 30 is provided with a plurality of pads 301, described pad 301 is provided with at least one breach 302, in the present embodiment, above-mentioned breach 302 is set to one, make pad 301 be set to " recessed " word shape, and hole 101 shapes that steel mesh 10 embodiment of the size shape of pad 301 and above-mentioned Fig. 1 a are provided with are suitable, breach 302 is corresponding with projection 102 in steel mesh 10 holes 101, becomes the member that a cover is used.
In the present embodiment, each described pad 301 shape can be identical, also can be inequality, pad 301 shapes that promptly on same PCB30, are provided with can be identical also can be incomplete same, but hole 101 shapes of the steel mesh 10 that uses with its corresponding matching should be suitable, present embodiment pad 301 shapes are set to identical and are symmetricly set on the printed circuit board (PCB), can be positioned at the inside middle position, according to the practical situations setting.
PCB30 uses the pad 301 of the foregoing description, owing to be provided with projection 102 in the hole 101 of Fig. 1 a steel mesh 10 embodiment, make hole 101 reduce, owing to be subjected to the restriction of projection 102 in steel mesh 10 holes 101, the tin cream consumption that uses has reduced, thereby the soldering paste that pad 301 obtains is also just few, when Reflow Soldering, can reduce the internal flow of soldering paste melt temperature and minimizing solder paste amounts, reach surface tension and make reflow soldering process looser, be easier to realize increasingly automated and high-speed the placement accuracy requirement.Because the soldering paste of fusion has " it is moving to reflux " to reach the characteristics of " self-aligning effect ", reflow soldering process has stricter requirement to pad design, components and parts standardization, if the surface tension imbalance, can occur after the welding position of components skew, suspension bridge, bridge joint, etc. weld defect.Use the present invention to overcome above-mentioned defective, in mount technology, also reach the purpose of optimizing paster device bottom tin cream consumption and reducing weld time.Having changed traditional soldering paste and pad adopts size to be applied to PCB at 1: 1.
With reference to Fig. 2 b, another embodiment of a kind of printed circuit board (PCB) of the present invention is proposed, described printed circuit board (PCB) (PCB) 40 is provided with a plurality of pads 401, described pad 401 is provided with at least one breach 402, in the present embodiment, above-mentioned breach 402 is set to one, make pad 401 be set to " C " word shape, and hole 201 shapes that steel mesh 20 embodiment of the size shape of pad 401 and above-mentioned Fig. 1 b are provided with are suitable, breach 402 is corresponding with projection 202 in steel mesh 20 holes 201, becomes the member that a cover is used.
In the present embodiment, each described pad 401 shape can be identical, also can be inequality, pad 401 shapes that promptly on same PCB, are provided with can be identical also can be incomplete same, but hole 201 shapes of the steel mesh 20 that uses with its corresponding matching should be suitable, according to the practical situations setting.
The technique effect that present embodiment reached is the same with the technique effect of last embodiment printed circuit board (PCB), no longer repeats at this.
Above-mentioned pad 301,401 can also be set to be " U " or " V " word shape, or be set to " rectangle ", " square " or " isosceles trapezoid " waits other geometry.The technique effect that reaches is the same with the technique effect of above printed circuit board (PCB) two embodiment, no longer repeats at this.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (9)
1. a steel mesh is provided with some holes on described steel mesh, it is characterized in that, is provided with at least one projection in described hole.
2. steel mesh according to claim 1 is characterized in that, described projection is set to one.
3. steel mesh according to claim 1 and 2 is characterized in that, described hole is " recessed ", " C ", " U " or " V " word shape after projection is set.
4. steel mesh according to claim 1 and 2 is characterized in that, described projection is " rectangle ", " square " or " isosceles trapezoid ".
5. steel mesh according to claim 1 and 2 is characterized in that, the projection shape that is provided with in each described hole is identical or inequality.
6. printed circuit board (PCB), described printed circuit board (PCB) is provided with a plurality of pads, it is characterized in that, and described pad is provided with at least one breach.
7. printed circuit board (PCB) according to claim 6 is characterized in that, described breach is set to one.
8. according to claim 6 or 7 described printed circuit board (PCB)s, it is characterized in that described pad is set to " recessed ", " C ", " U " or " V " word shape, or be set to " rectangle ", " square " or " isosceles trapezoid ".
9. according to claim 6 or 7 described printed circuit board (PCB)s, it is characterized in that the shape of described pad is identical or inequality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010242556 CN101925262A (en) | 2010-08-02 | 2010-08-02 | Steel mesh and PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010242556 CN101925262A (en) | 2010-08-02 | 2010-08-02 | Steel mesh and PCB (Printed Circuit Board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101925262A true CN101925262A (en) | 2010-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010242556 Pending CN101925262A (en) | 2010-08-02 | 2010-08-02 | Steel mesh and PCB (Printed Circuit Board) |
Country Status (1)
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| CN (1) | CN101925262A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107552A (en) * | 2010-12-30 | 2011-06-29 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN102281706A (en) * | 2011-05-31 | 2011-12-14 | 昆山元崧电子科技有限公司 | Pore structure for tin-bead-resistant printed template |
| CN103298254A (en) * | 2012-02-24 | 2013-09-11 | 比亚迪股份有限公司 | Packaging of component arranged on printed circuit board and manufacturing method thereof |
| CN103415162A (en) * | 2013-08-16 | 2013-11-27 | 京信通信系统（中国）有限公司 | Method for forming holes in steel net |
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN104507270A (en) * | 2014-12-24 | 2015-04-08 | 宁波萨瑞通讯有限公司 | Memory compatible method |
| CN105208784A (en) * | 2015-10-16 | 2015-12-30 | 苏州市狮威电子有限公司 | Steel mesh structure for solder paste three-dimensional printing |
| CN107278050A (en) * | 2017-08-07 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of asymmetric pad steel mesh windowing methods of PCBA and system |
| CN110691464A (en) * | 2019-10-14 | 2020-01-14 | 业成科技（成都）有限公司 | Welding structure to avoid Mini LED displacement |
| CN111063669A (en) * | 2018-10-17 | 2020-04-24 | 矽品精密工业股份有限公司 | Electronic packaging piece and bearing structure |
| CN111615257A (en) * | 2020-06-30 | 2020-09-01 | 华勤通讯技术有限公司 | A PCB board and a welding method for a shielding cover on the PCB board |
| CN113395840A (en) * | 2021-06-03 | 2021-09-14 | 上海丸旭电子科技有限公司 | Method for improving welding reliability of surface mount type shunt |
Citations (4)
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| CN1283954A (en) * | 1999-08-09 | 2001-02-14 | 三星电子株式会社 | Printed circuit board and mask of screen printing such printed circuit bard |
| CN1611099A (en) * | 2001-09-26 | 2005-04-27 | 英特尔公司 | Tombstoning structures and methods of manufacture |
| CN101296559A (en) * | 2007-04-29 | 2008-10-29 | 佛山普立华科技有限公司 | Pad, circuit board with the pad, and electronic device |
| CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
-
2010
- 2010-08-02 CN CN 201010242556 patent/CN101925262A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1283954A (en) * | 1999-08-09 | 2001-02-14 | 三星电子株式会社 | Printed circuit board and mask of screen printing such printed circuit bard |
| CN1611099A (en) * | 2001-09-26 | 2005-04-27 | 英特尔公司 | Tombstoning structures and methods of manufacture |
| CN101296559A (en) * | 2007-04-29 | 2008-10-29 | 佛山普立华科技有限公司 | Pad, circuit board with the pad, and electronic device |
| CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107552B (en) * | 2010-12-30 | 2012-05-23 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN102107552A (en) * | 2010-12-30 | 2011-06-29 | 昶虹电子(苏州)有限公司 | Surface mount technology (SMT) printing steel mesh |
| CN102281706A (en) * | 2011-05-31 | 2011-12-14 | 昆山元崧电子科技有限公司 | Pore structure for tin-bead-resistant printed template |
| CN103298254B (en) * | 2012-02-24 | 2016-02-03 | 比亚迪股份有限公司 | The encapsulation and preparation method thereof of components and parts on a kind of printed substrate |
| CN103298254A (en) * | 2012-02-24 | 2013-09-11 | 比亚迪股份有限公司 | Packaging of component arranged on printed circuit board and manufacturing method thereof |
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN103415162B (en) * | 2013-08-16 | 2016-10-05 | 京信通信系统（中国）有限公司 | The method of steel mesh perforate |
| CN103415162A (en) * | 2013-08-16 | 2013-11-27 | 京信通信系统（中国）有限公司 | Method for forming holes in steel net |
| CN104507270A (en) * | 2014-12-24 | 2015-04-08 | 宁波萨瑞通讯有限公司 | Memory compatible method |
| CN105208784A (en) * | 2015-10-16 | 2015-12-30 | 苏州市狮威电子有限公司 | Steel mesh structure for solder paste three-dimensional printing |
| CN107278050A (en) * | 2017-08-07 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of asymmetric pad steel mesh windowing methods of PCBA and system |
| CN111063669A (en) * | 2018-10-17 | 2020-04-24 | 矽品精密工业股份有限公司 | Electronic packaging piece and bearing structure |
| CN110691464A (en) * | 2019-10-14 | 2020-01-14 | 业成科技（成都）有限公司 | Welding structure to avoid Mini LED displacement |
| CN111615257A (en) * | 2020-06-30 | 2020-09-01 | 华勤通讯技术有限公司 | A PCB board and a welding method for a shielding cover on the PCB board |
| CN113395840A (en) * | 2021-06-03 | 2021-09-14 | 上海丸旭电子科技有限公司 | Method for improving welding reliability of surface mount type shunt |
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Open date: 20101222 |