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CN101616556B - 电子装置的壳体及其制造方法 - Google Patents

电子装置的壳体及其制造方法 Download PDF

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CN101616556B
CN101616556B CN2008103024093A CN200810302409A CN101616556B CN 101616556 B CN101616556 B CN 101616556B CN 2008103024093 A CN2008103024093 A CN 2008103024093A CN 200810302409 A CN200810302409 A CN 200810302409A CN 101616556 B CN101616556 B CN 101616556B
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hypostracum
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CN101616556A (zh
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苏振文
黄刚
邓中丹
郭银杰
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ZHENGZHOU ZHONGCHUANG HUIDA ELECTRIC Co Ltd
Zhengzhou Power Supply Co of State Grid Henan Electric Power Co Ltd
State Grid Corp of China SGCC
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Shenzhen Futaihong Precision Industry Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0441—Injection moulding apparatus using movable moulds or mould halves involving a rotational movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24074—Strand or strand-portions
    • Y10T428/24091—Strand or strand-portions with additional layer[s]
    • Y10T428/24099—On each side of strands or strand-portions
    • Y10T428/24107—On each side of strands or strand-portions including mechanically interengaged strands, strand-portions or strand-like strips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249923—Including interlaminar mechanical fastener

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

本发明提供一种电子装置的壳体及其制造方法，所述壳体包括一内壳层、一外壳层及形成于内壳层与外壳层之间的嵌件，所述内壳层经第一次注塑成型形成，且该内壳层上形成有定位结构，所述嵌件定位于该定位结构上，所述外壳层经第二次注塑成型形成，所述嵌件于第二次注塑形成中经所述定位结构定位嵌于该壳体内。该制造过程包括：首先第一次注胶成型一内壳层，且于该内壳层上形成定位结构，然后将该嵌件固定于所述定位结构上，接着第二次注胶与所述内壳层成型一完整的壳体，且所述嵌件嵌于该成型的壳体内。该成型过程有效地解决了传统嵌件成型技术上嵌件尤其是小型嵌件定位精度不高的技术问题。

Description

电子装置的壳体及其制造方法
技术领域
本发明涉及一种电子装置的壳体及其制造方法，尤其涉及一种内部有嵌件的壳体及其制造方法。
背景技术
电子装置的壳体在制造过程中，为了增强壳体强度，常会在壳体内部嵌入嵌件，嵌件的嵌入一般通过将嵌件与塑胶一体成型的方法达成，业界亦叫嵌入成型(insert molding)。该种成型方法先通过将嵌件置入模具的型腔内，然后往该型腔内注入塑胶，使嵌件为塑胶所包裹，从而形成所需壳体。
然该成型过程常存在嵌入件在成型后位置精度不高的问题，尤其对于一些小型的嵌件，如金属丝等。由于该等嵌件在成型过程中受塑胶冲压后位置易产生变动，或者本身被冲压变形，使得嵌件难在壳体上保持精确的位置。
另外，对于一些具有嵌件的透明的壳体，该种壳体的嵌件还具装饰或标示壳体的作用，如该种嵌件可形成如商标或字符等图案形状嵌于壳体内。然由于嵌件在成型时的位置精度难于保证，使得该种装饰图案或标识亦难于达到理想的效果。
发明内容
鉴于以上所述，有必要提供一种在成型过程中嵌件的定位精度高的电子装置的壳体。
有必要提供一种在成型过程中使嵌件的定位精度高的电子装置的壳体的制造方法。
一种电子装置的壳体，其包括一内壳层、一外壳层及形成于内壳层与外壳层之间的嵌件，所述内壳层经第一次注塑成型形成，且该内壳层上形成有定位结构，所述嵌件定位于该定位结构上，所述外壳层经第二次注塑成型形成，所述嵌件于第二次注塑形成中经所述定位结构定位嵌于该壳体内。
一种电子装置的壳体的制造方法，其包括二次注塑成型步骤，首先第一次注塑成型一内壳层，且于该内壳层上形成定位结构，然后将该嵌件固定于所述定位结构上，接着第二次注塑与所述内壳层成型一完整的壳体，且所述定位结构与嵌件一体成型于壳体内。
与现有技术相比，本发明通过二次注塑成型步骤，第一次射出成型的内壳层上形成定位结构，该定位结构固定所述嵌件，第二次射出成型后将该定位结构及嵌件一体成型于壳体内。在整个成型过程中，由于嵌件通过定位结构固定，不会受注胶的冲压产生位置变动，从而确保了嵌件在壳体上的位置精度。且固定结构在成型后一体形成于壳体的内部，不会影响整个壳体结构。
附图说明
图1是本发明较佳实施例壳体整体示意图；
图2是本发明较佳实施例壳体分解示意图；
图3是本发明较佳实施例成型壳体的模具分解示意图；
图4是本发明较佳实施例嵌件在成型过程中置于内壳层上示意图。
具体实施方式
请参阅图1及图2，所示为本发明较佳实施例的一壳体10包括一内壳层12、一嵌件层14及一外壳层16。所述内壳层12大致为所述外壳层16所包裹，该内壳层12为一第一塑性材质注塑形成，该外壳层16为一第二塑性材质注塑形成，所述嵌件层14为若干金属丝142形成，其形成于该内壳层12与外壳层16之间。
该壳体10的成型过程包括二次注塑成型步骤，成型该壳体10的模具可利用业界常见的双射成型模具。如提供一模具20，请参阅图3，该模具20包括一母模22及与该母模22相配合的一公模24。该母模22的合模面上并排开设有一第一模穴222及一第二模穴224。所述公模24的合模面上并排设置有一第一模仁242及一第二模仁244。所述公模24可绕轴O-O旋转，使所述第一模仁242可分别与第一模穴222及第二模穴224配合，相应地该第二模仁244分别与第二模穴224及第一模穴222配合。
首先第一次注塑成型所述内壳层12，且于该内壳层12上形成若干定位结构122。本实施例中，该定位结构122为卡勾，其呈矩阵排布于内壳层12的表面上，用于将所述嵌件层14固定，该定位结构122可由在母模22的底部开设若干对应的卡槽(未标示)形成。将所述公模24与母模22合模，使第一模仁242与第一模穴222配合，相应地第二模仁244与第二模穴224亦配合。往所述第一模仁242与第一模穴222形成的型腔内注入一第一塑料以形成所述内壳层12。
然后将所述公模24与母模22分开，所述内壳层12贴附于公模24的第一模仁242上与母模22的第一模穴222分开，且内壳层12上形成所述定位结构122。
然后将所述若干金属丝142分别固定于所述定位结构122上，如图4所示。该金属丝142固定至定位结构122的过程可通过机械装置如机械手实现。
然后绕轴O-O旋转所述公模24，使所述第一模仁242与母模22的第二模穴224配合，相应地该第二模仁244与母模22的第一模穴222配合。则贴附于公模24的第一模仁242上且固设有金属丝142的内壳层12容置入该第二模穴224内。
接着往该第二模穴224内注入一第二塑料，该第二塑料与所述固设有金属丝142的内壳层12一体成型，形成完整的所述壳体10。
然后分开所述公模24与母模22，则可取出所述壳体10。
有必要进一步说明的是，在第二模穴224内注入第二塑料的同时，往第二模仁244与第一模穴222配合的第一模穴222内注入第一塑料以形成所述内壳层12，然后再分开所述公模24与母模22，往该内壳层12上固装所述金属丝142。如此，可形成循环，可不间断地在第二模穴224内形成所述壳体10。
本发明通过第一次注塑成型的内壳层且在内壳层上形成定位结构，通过该定位结构固定所述嵌件，然后第二次射出成型后将该定位结构及嵌件一体成型于壳体内。在整个成型过程中，嵌件固定，不会受注胶的冲压产生位置变动，从而确保了嵌件在壳体上的位置精度。且固定结构在成型后一体形成于壳体的内部，不会影响壳体的整体结构。
可以理解，该第一次注塑与第二次注塑可注塑为同一种塑料，且当该二次注塑均注塑为透明材质的塑胶时，此时的金属丝142，不但对所述壳体10有增强刚性的作用，还对壳体10有装饰的作用，甚至可将若干金属丝142设计成图案形状，以使该壳体10美观。若金属丝142精加工处理后具有三维效果，由于壳体10材质透明，则可得到三维效果的图案。
可以理解，当金属丝142离壳体10表面距离很小时，成型后由于壳体10的收缩特性，壳体10的表面将露出类似金属丝142图案的轮廓。

Claims (10)

1.一种电子装置的壳体，其包括一内壳层、一外壳层及形成于内壳层与外壳层之间的嵌件，其特征在于：所述内壳层经第一次注塑成型形成，且该内壳层上形成有定位结构，所述嵌件定位于该定位结构上，所述外壳层经第二次注塑成型形成，所述嵌件于第二次注塑形成中经所述定位结构定位嵌于该壳体内。
2.如权利要求1所述的电子装置的壳体，其特征在于：所述内壳层与外壳层均为透明材质，所述嵌件为若干金属丝形成。
3.如权利要求1所述的电子装置的壳体，其特征在于：所述定位结构为卡勾，其呈矩阵排布于内壳层的表面。
4.一种电子装置的壳体的制造方法，其包括二次注塑成型步骤，其特征在于：首先第一次注塑成型一内壳层，于该内壳层上形成定位结构，然后将该嵌件固定于所述定位结构上，接着第二次注塑形成一外壳层在所述内壳层上，且所述定位结构与嵌件一体成型于外壳层与内壳层之间。
5.如权利要求4所述的电子装置的壳体的制造方法，其特征在于：所述内壳层为第一塑性材质注塑形成，所述外壳层为第二塑性材质注塑形成。
6.如权利要求5所述的电子装置的壳体的制造方法，其特征在于：所述第一塑性材质与第二塑性材质均为透明材质，所述嵌件为若干金属丝形成。
7.如权利要求6所述的电子装置的壳体的制造方法，其特征在于：所述金属丝围成三维图形，以形成具有三维的图案的壳体。
8.如权利要求4所述的电子装置的壳体的制造方法，其特征在于：所述壳体的成型模具为一双射成型模具，该模具包括一公模及一母模，所述公模上形成有二模仁，所述母模上开设有配合所述二模仁的二模穴，且所述公模可相对所述母模旋转，以使公模上每一模仁能分别与母模的二模穴配合。
9.如权利要求4所述的电子装置的壳体的制造方法，其特征在于：所述定位结构为卡勾，其呈矩阵排布于内壳层的表面。
10.如权利要求4所述的电子装置的壳体的制造方法，其特征在于：所述嵌件嵌于壳体内且于壳体表面露出类似嵌件的图案。
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CN102202472A (zh) * 2010-03-23 2011-09-28 深圳富泰宏精密工业有限公司 电子装置外壳及其制造方法
CN102300422A (zh) * 2010-06-24 2011-12-28 深圳富泰宏精密工业有限公司 壳体及其制造方法
CN102371644A (zh) * 2010-08-05 2012-03-14 和硕联合科技股份有限公司 一种模内成型方法及由该方法生产的壳体
CN102762062A (zh) * 2011-04-28 2012-10-31 深圳富泰宏精密工业有限公司 前盖及应用该前盖的便携式电子装置
CN103974577B (zh) * 2013-07-19 2015-08-12 富准精密工业(深圳)有限公司 电子装置壳体及其制造方法
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