CN101587883B - Light-emitting diode chip packaging structure with substrate as lampshade and manufacturing method thereof - Google Patents

Abstract

The invention provides a light emitting diode chip packaging structure taking a substrate as a lampshade and a manufacturing method thereof, wherein the light emitting diode chip packaging structure comprises: a substrate unit and a light emitting unit. Wherein, the substrate unit is provided with a substrate body in the shape of a lampshade. The light-emitting unit is provided with a plurality of light-emitting elements which are electrically arranged on the inner surface of the substrate body. Therefore, part of light beams generated by the plurality of light-emitting elements are reflected out through the inner surface of the substrate body in the shape of the lampshade. The invention not only can omit the manufacture of the traditional lampshade, but also can increase the heat dissipation effect of the light-emitting element through the high heat conductivity of the substrate body (consisting of the metal layer and the bakelite layer).

Description

Light-emitting diode chip packaging structure with substrate as lampshade and manufacturing method thereof

technical field

The invention relates to a light-emitting diode chip packaging structure and a manufacturing method thereof, in particular to a light-emitting diode chip packaging structure with a substrate as a lampshade and a manufacturing method thereof.

Background technique

Please refer to FIG. 1 , which is a schematic side view of a prior art LED packaging structure disposed in a lampshade. It can be seen from the figure that the LED packaging structure in the prior art includes: a substrate body S and at least one light-emitting element L electrically disposed on the substrate body S, wherein the substrate body S has a heat conducting layer (heat conducting layer) S1, an insulating layer (insulative layer) S2 formed on the upper surface of the heat conducting layer S1, and a conductive layer (conductive layer) S3 formed on the upper surface of the insulating layer S2. Therefore, the light-emitting element L conducts electricity to a power source (not shown) through the conductive layer S3 , and the light-emitting element L sequentially passes through the insulating layer S2 and the heat-conducting layer S1 to dissipate heat.

In order to enable the partial light beam B generated by the light-emitting element L to achieve the effect of concentrating light, the light-emitting diode packaging structure in the prior art is arranged in the lampshade U in the shape of a lampshade through an adhesive layer A, so the light-emitting element L generates Part of the light beam B can pass through the inner surface U10 of the lampshade U to produce a light-focusing effect.

However, in the prior art, the method of arranging the LED packaging structure on the lampshade U is not only complicated in manufacturing process, but also because the heat generated by the light-emitting element L must pass through the substrate body S (through the insulating layer S2 and the The lampshade U can only be reached after the heat conducting layer S1) and the adhesive layer A, thus greatly reducing the heat dissipation speed and efficiency of the light emitting element L.

Therefore, it can be seen from the above that there are obviously inconveniences and defects in the LED packaging structure in the prior art, and therefore need to be improved.

Contents of the invention

Therefore, the inventor believes that the above-mentioned defects are improved, and based on years of relevant experience in this field, after careful observation and research, and in conjunction with the application of scientific and technological principles, the present invention is proposed with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a light emitting diode chip packaging structure with the substrate as a lampshade and a manufacturing method thereof. The invention directly bends the lampshade body of the LED chip packaging structure to become the lampshade of the light emitting element of the LED chip packaging structure. Therefore, the present invention can not only save the production of the traditional lampshade, but also increase the heat dissipation effect of the light-emitting element through the high thermal conductivity of the lampshade body (composed of the metal layer and the Bakelite layer).

In order to solve the above technical problems, according to one solution of the present invention, a light emitting diode chip packaging structure using a substrate as a lampshade is provided, which includes: a lampshade unit and a light emitting unit. Wherein, the lampshade unit has a lampshade body in the shape of a lampshade, and the inner surface of the lampshade body in the shape of a lampshade has a positive conductive trace and a negative conductive trace. The light-emitting unit has a plurality of light-emitting elements arranged on the inner surface of the lampshade body and respectively electrically connected between the positive conductive track and the negative conductive track, and each light-emitting element is a light-emitting diode chip. In this way, part of the light beams generated by the plurality of LED chips are reflected through the inner surface of the lampshade body in the shape of the lampshade.

In the LED chip packaging structure with the substrate as the lampshade, the lampshade body can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate, and the lampshade is U-shaped.

In the LED chip packaging structure with the substrate as the lampshade, the lampshade body may have a plane part and two extending parts extending upward from both ends of the plane part, and the lampshade body includes a metal layer and a metal layer formed on the metal layer. Bakelite layer on top.

In the LED chip package structure using the substrate as a lampshade, the positive conductive track and the negative conductive track are both formed on the inner surface of the planar portion.

In the LED chip packaging structure using the substrate as a lampshade, the positive conductive track and the negative conductive track are both formed on the inner surface of the planar part and the inner surfaces of the two extension parts.

In the LED chip packaging structure using the substrate as the lampshade, the lampshade body may have two recessed parts, and each recessed part is formed between the planar part and each extension part.

In the LED chip packaging structure with the substrate as the lampshade, each recessed portion can be a continuous groove.

In the LED chip packaging structure with the substrate as the lampshade, each recessed portion may be composed of a plurality of grooves separated from each other.

In the LED chip packaging structure with the substrate as the lampshade, the positive conductive track and the negative conductive track are both aluminum or silver lines.

In order to solve the above-mentioned technical problems, according to one solution of the present invention, a method for manufacturing a light-emitting diode chip packaging structure using a substrate as a lampshade is provided, which includes: first, providing a planar lampshade body, and the planar The inner surface of the lampshade body has a positive conductive track and a negative conductive track; then, a plurality of light-emitting elements are arranged on the inner surface of the lampshade body and electrically connected between the positive conductive track and the negative conductive track respectively, Each of the light-emitting elements is a light-emitting diode chip; then, the lampshade body is bent so that the shape of the lampshade body is bent from a planar shape to a lampshade shape, so that part of the light beams generated by the above-mentioned multiple light-emitting diode chips pass through the lampshade. The inner surface of the lampshade body in the shape of the lampshade is reflected.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the lampshade body can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate, and the lampshade is U-shaped.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the lampshade body in the shape of a lampshade may have a plane part and two extending parts extending upward from both ends of the plane part, and the lampshade body includes a metal layer and a bakelite layer formed on the metal layer.

In the manufacturing method of the light-emitting diode chip packaging structure using the substrate as a lampshade, the positive conductive trace and the negative conductive trace are both formed on the inner surface of the planar portion.

In the manufacturing method of the LED chip packaging structure using the substrate as a lampshade, the positive conductive track and the negative conductive track are both formed on the inner surface of the planar part and the inner surfaces of the two extension parts.

In the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade, the lampshade body may have two recessed parts, and each recessed part is formed between the planar part and each extension part.

The manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade may further include: bending the lampshade body along the two recesses.

In the above manufacturing method of the LED chip package structure using the substrate as the lampshade, each concave portion may be a continuous groove.

In the manufacturing method of the LED chip packaging structure using the substrate as the lampshade, each recessed portion may be composed of a plurality of grooves separated from each other.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the positive conductive track and the negative conductive track are both aluminum or silver lines.

In order to solve the above-mentioned technical problems, according to one solution of the present invention, a method for manufacturing a light-emitting diode chip packaging structure using a substrate as a lampshade is provided, which includes: first, providing a planar lampshade body, and the planar The inner surface of the lampshade body has a positive electrode conductive track and a negative electrode conductive track; then, bend the lampshade body so that the shape of the lampshade body is bent from the planar shape into a lampshade shape; then, a plurality of light-emitting elements are arranged on the The inner surface of the lampshade body is electrically connected between the positive conductive track and the negative conductive track respectively, wherein each light-emitting element is a light-emitting diode chip, so part of the light beams generated by the above-mentioned light-emitting diode chips pass through the Reflected from the inner surface of the lampshade body in the shape of the lampshade.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the lampshade body can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate, and the lampshade is U-shaped.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the lampshade body in the shape of a lampshade may have a plane part and two extending parts extending upward from both ends of the plane part, and the lampshade body includes a metal layer and a bakelite layer formed on the metal layer.

In the manufacturing method of the light-emitting diode chip packaging structure using the substrate as a lampshade, the positive conductive trace and the negative conductive trace are both formed on the inner surface of the planar portion.

In the manufacturing method of the LED chip packaging structure using the substrate as a lampshade, the positive conductive track and the negative conductive track are both formed on the inner surface of the planar part and the inner surfaces of the two extension parts.

In the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade, the lampshade body may have two recessed parts, and each recessed part is formed between the planar part and each extension part.

The manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade may further include: bending the lampshade body along the two recesses.

In the above manufacturing method of the LED chip package structure using the substrate as the lampshade, each concave portion may be a continuous groove.

In the manufacturing method of the LED chip packaging structure using the substrate as the lampshade, each recessed portion may be composed of a plurality of grooves separated from each other.

In the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade, the positive conductive track and the negative conductive track are both aluminum or silver lines.

Therefore, the present invention directly bends the lampshade body of the LED chip packaging structure to become the lampshade of the light emitting element of the LED chip packaging structure. Therefore, the present invention not only saves the manufacture of the traditional lampshade, but also increases the heat dissipation effect of the light-emitting element through the high thermal conductivity of the lampshade body (consisting of the metal layer and the bakelite layer).

In order to further understand the technology, means and effects adopted by the present invention to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the present invention, and believe that the purpose, characteristics and characteristics of the present invention can be obtained in depth and concretely. However, the drawings are only for reference and description, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic side view of a light emitting diode packaging structure arranged in a lampshade in the prior art;

2 is a flow chart of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

2A to 2C2 are schematic diagrams of the manufacturing process of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

3 is a flow chart of a second embodiment of the manufacturing method of the light emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

3A to 3C2 are schematic diagrams of the manufacturing process of the second embodiment of the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

4 is a flow chart of a third embodiment of the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

4A to 4C2 are schematic diagrams of the manufacturing process of the third embodiment of the manufacturing method of the light-emitting diode chip packaging structure using the substrate as the lampshade of the present invention;

5 is a schematic perspective view of a fourth embodiment of the LED chip packaging structure using the substrate as a lampshade according to the present invention; and

FIG. 6 is a schematic perspective view of a fifth embodiment of an LED chip packaging structure using a substrate as a lampshade according to the present invention.

Wherein, the reference signs are explained as follows:

[current technology]

S lampshade body S1 heat conduction layer

S2 insulating layer

S3 conductive layer

L Lighting element B Partial beam

A Adhesive layer

U lampshade U10 inner surface

[this invention]

(first embodiment)

1a lampshade body 100a inner surface

10a Positive Conductive Track

11a Negative Conductor Track

12a metal layer

13a bakelite layer

2a light-emitting element 20a positive terminal

21a negative terminal

La partial beam

1a′ lampshade body 10a′ plane part

11a' extension

(second embodiment)

1b Shade body 100b Inner surface

10b Positive Conductive Track

11b negative conductive track

12b metal layer

13b bakelite layer

2b Light-emitting element 20b Positive terminal

21b negative terminal

Lb partial beam

1b'shade body 10b'plane part

11b' extension

(third embodiment)

1c lampshade body 100c inner surface

10c positive conductive track

11c negative conductive track

12c metal layer

13c bakelite layer

14c, 14c' depression

2c Light-emitting element 20c Positive terminal

21c negative terminal

Lc partial beam

1c′ lampshade body 10c′ plane part

11c' extension

(fourth embodiment)

1d′ lampshade body

14d'recessed part 140d'groove

(fifth embodiment)

10e Positive conductive track

11e negative conductive track

10e' planar part

11e' extension

Detailed ways

Please refer to FIG. 2 and FIG. 2A to FIG. 2C2. FIG. 2 is a flow chart of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure with the substrate as the lampshade of the present invention; FIG. 2A to FIG. 2C2 are the flowcharts of the present invention A schematic diagram of the manufacturing process of the first embodiment of the manufacturing method of the light emitting diode chip package structure in which the substrate is a lampshade.

It can be seen from the above drawings that the first embodiment of the present invention provides a method for manufacturing a light emitting diode chip packaging structure using the substrate as a lampshade, which includes: first, please cooperate with FIG. 2 and FIG. 2A to provide a lampshade in a planar shape Main body 1a (S100). Wherein, the lampshade body 1a has a positive electrode conductive track 10a and a negative electrode conductive track 11a formed on the inner surface 100a of the lampshade body 1a, and the lampshade body 1a includes a metal layer 12a and a Bakelite layer 13a formed on the metal layer 12a . According to actual requirements, both the positive conductive track 10 a and the negative conductive track 11 a can be aluminum or silver circuits. In addition, the lampshade body 1a can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

Next, as shown in FIG. 2 and FIG. 2B, a plurality of light-emitting elements 2a are electrically mounted on the inner surface 100a of the lampshade body 1a by means of Surface Mounted Technology (S102). Wherein, each light-emitting element 2a has a positive terminal 20a and a negative terminal 21a electrically connected to the positive conductive track 10a and the negative conductive track 11a of the lampshade body 1a respectively.

Next, according to FIG. 2 , FIG. 2C1 and FIG. 2C2 , bend the lampshade body 1 a so that the shape of the lampshade body 1 a is bent from the planar shape into a lampshade shape ( S104 ). In other words, the planar lampshade body 1a is bent into a lampshade-shaped lampshade body 1a', so the partial light beams La generated by the plurality of light-emitting elements 2a pass through the inner surface 100a of the lampshade-shaped lampshade body 1a'. And reflect it out. Wherein, the lampshade is U-shaped, and the lampshade-shaped lampshade body 1a' has a plane part 10a' and two extending parts 11a' extending upward from both ends of the plane part 10a'. In addition, the positive conductive track 10a and the negative conductive track 11a are both formed on the inner surface of the planar portion 10a'.

Please refer to FIG. 3 and FIG. 3A to FIG. 3C2. FIG. 3 is a flow chart of the second embodiment of the manufacturing method of the LED chip packaging structure with the substrate as the lampshade of the present invention; FIG. 3A to FIG. 3C2 are the flowcharts of the present invention. A schematic diagram of the manufacturing process of the second embodiment of the manufacturing method of the light emitting diode chip package structure in which the substrate is a lampshade.

As can be seen from the above drawings, the second embodiment of the present invention provides a method for manufacturing a light-emitting diode chip packaging structure using a substrate as a lampshade, which includes: first, please provide a planar lampshade as shown in FIG. 3 and FIG. 3A Body 1b (S200). Wherein, the lampshade body 1b has a positive electrode conductive track 10b and a negative electrode conductive track 11b formed on the inner surface 100b of the lampshade body 1b, and the lampshade body 1b includes a metal layer 12b and a bakelite layer 13b formed on the metal layer 12b . According to actual needs, both the positive electrode conductive track 10b and the negative electrode conductive track 11b can be aluminum lines or silver lines. In addition, the lampshade body 1b can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

Next, as shown in FIG. 3 and FIG. 3B , bend the lampshade body 1b so that the shape of the lampshade body 1b is bent from the planar shape into a lampshade shape ( S202 ). In other words, the planar lampshade body 1b is bent into a lampshade-shaped lampshade body 1b'. Wherein, the lampshade is U-shaped, and the lampshade-shaped lampshade body 1b' has a plane part 10b' and two extending parts 11b' extending upward from both ends of the plane part 10b'. In addition, the positive conductive track 10b and the negative conductive track 11b are both formed on the inner surface of the planar portion 10b'.

Next, as shown in FIG. 3, FIG. 3C1 and FIG. 3C2, a plurality of light-emitting elements 2b are electrically mounted on the inner surface 100b of the lampshade body 1b by means of surface mount technology (S204). Part of the light beam Lb generated by each light emitting element 2b is reflected by the inner surface 100b of the lampshade body 1b' in the shape of the lampshade. Wherein, each light-emitting element 2b has a positive end 20b and a negative end 21b electrically connected to the positive conductive track 10b and the negative conductive track 11b of the lampshade body 1b' respectively.

Therefore, it can be seen from the above steps that the biggest difference between the second embodiment of the present invention and the first embodiment is that in the first embodiment, the above-mentioned plurality of light-emitting elements 2a are firstly electrically arranged on the planar surface. on the lampshade body 1a, and then bend the plane-shaped lampshade body 1a into a lampshade-shaped lampshade body 1a'; and in the second embodiment, first bend the plane-shaped lampshade body 1b into The lampshade body 1b' in the shape of a lampshade, and then the above-mentioned plurality of light-emitting elements 2b are electrically arranged on the lampshade body 1b' in the shape of a lampshade.

Therefore, the "light-emitting diode chip packaging structure using the substrate as a lampshade" provided by the first embodiment and the second embodiment of the present invention includes: a lampshade unit and a light emitting unit. Wherein, the lampshade unit has a lampshade body (1a', 1b') in the shape of a lampshade. The light emitting unit has a plurality of light emitting elements (2a, 2b) electrically arranged on the inner surface (100a, 100b) of the lampshade body (1a', 1b'). Thereby, part of the light beams generated by the plurality of light emitting elements (2a, 2b) are reflected by the inner surface (100a, 100b) of the lampshade body (1a', 1b') in the shape of a lampshade.

Please refer to FIG. 4 and FIG. 4A to FIG. 4C2. FIG. 4 is a flow chart of the third embodiment of the manufacturing method of the light emitting diode chip packaging structure with the substrate as the lampshade of the present invention; FIG. 4A to FIG. 4C2 are the flowcharts of the present invention. A schematic diagram of the manufacturing process of the third embodiment of the manufacturing method of the LED chip package structure in which the substrate is a lampshade.

As can be seen from the above drawings, the third embodiment of the present invention provides a method for manufacturing a light-emitting diode chip packaging structure using a substrate as a lampshade, which includes: first, please provide a planar lampshade as shown in FIG. 3 and FIG. 3A The main body 1c, and the lampshade main body 1c has two concave parts 14c (S300). Wherein, the lampshade body 1c has a positive electrode conductive track 10c and a negative electrode conductive track 11c formed on the inner surface 100c of the lampshade body 1c, and the lampshade body 1c includes a metal layer 12c and a bakelite layer 13c formed on the metal layer 12c . In addition, each concave portion 14c is a continuous groove.

Next, as shown in FIG. 4 and FIG. 4B , bend the lampshade body 1c along the above-mentioned two recesses 14c, so that the shape of the lampshade body 1c is bent from the planar shape into a lampshade shape (S302). In other words, the planar lampshade body 1c is bent into a lampshade-shaped lampshade body 1c', and the two concave portions 14c are bent into a bent concave portion 14c'. Wherein, the shape of the lampshade is U-shaped, and the lampshade body 1c' in the shape of the lampshade has a plane part 10c' and two extension parts 11c' extending upward from both ends of the plane part 10c', so each bend A folded concave portion 14c' is formed between the planar portion 10c' and each extension portion 11c'. In addition, the positive conductive track 10c and the negative conductive track 11c are both formed on the inner surface of the planar portion 10c'.

Next, as shown in Fig. 4, Fig. 4C1 and Fig. 4C2, a plurality of light-emitting elements 2c are electrically mounted on the inner surface 100c of the lampshade body 1c' by means of surface mount technology (S304). Part of the light beam Lc generated by the plurality of light emitting elements 2c is reflected by the inner surface 100c of the lampshade body 1c' in the shape of the lampshade. Wherein, each light-emitting element 2c has a positive end 20c and a negative end 21c electrically connected to the positive conductive track 10c and the negative conductive track 11c of the lampshade body 1c', respectively.

Therefore, it can be seen from the above steps that the biggest difference between the third embodiment of the present invention and the second embodiment is that in the second embodiment, two recesses 14c are formed on the lampshade body 1c first, so that In the above step S302, the step of "bending the lampshade body 1c along the above two recessed parts 14c" can be performed. Therefore, the ease and convenience of forming the lampshade-shaped lampshade body 1c' are increased through the arrangement of the above-mentioned two recessed parts 14c.

Please refer to FIG. 5 , which is a schematic perspective view of a fourth embodiment of the LED chip packaging structure using the substrate as a lampshade according to the present invention. It can be seen from the figure that the biggest difference between the fourth embodiment of the present invention and the second embodiment is that each bent concave portion 14d' is composed of a plurality of grooves 140d' separated from each other. Its advantage is also that: firstly form the two concave parts (not shown) before bending on the lampshade body 1d ' which is in the shape of the lampshade, so as to "bend along the above two concave parts (not shown) The lampshade body (not shown)" step. Therefore, the ease and convenience of forming the lampshade-shaped lampshade body 1d' is increased through the arrangement of the above two recessed parts (not shown in the figure).

Please refer to FIG. 6 , which is a schematic perspective view of a fifth embodiment of the light emitting diode chip packaging structure using the substrate as a lampshade according to the present invention. It can be seen from the figure that the biggest difference between the fifth embodiment of the present invention and the second embodiment is that the positive conductive track 10e and the negative conductive track 11e are both formed on the inner surface of the planar part 10e' and inside the two extension parts 11e' surface.

To sum up, the present invention directly bends the lampshade body of the LED chip packaging structure to become the lampshade of the light emitting element of the LED chip packaging structure. Therefore, the present invention can not only save the manufacture of the traditional lampshade, but also increase the heat dissipation effect of the light-emitting element through the high thermal conductivity of the lampshade body (composed of the metal layer and the bakelite layer).

However, it should be noted that the above description is only a detailed description and accompanying drawings of one of the best embodiments of the present invention, but the features of the present invention are not limited thereto, so the above description and accompanying drawings are not intended to limit the present invention. The scope of the present invention should be based on the scope of the claims, and all embodiments that meet the spirit of the scope of the claims of the present invention and its similar changes should be included in the scope of the present invention, any person skilled in the art in the field of the present invention, Easily conceivable changes or modifications all fall within the patent scope of the following application.

Claims (29)

1. one kind is the LED encapsulation construction of lampshade with the substrate, it is characterized in that, comprising:

The lampshade unit, it has the lampshade body that is the lampshade shape, and the inner surface of this lampshade body has positive conductive traces and negative pole conductive traces; And

Luminescence unit, its have a plurality of be arranged at the inner surface of this lampshade body and be electrically connected at this positive conductive traces respectively and this negative pole conductive traces between light-emitting component, and each light-emitting component is a light-emitting diode chip for backlight unit;

Whereby, the segment beam that described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.

2. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.

3. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.

4. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.

5. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.

6. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.

7. as claimed in claim 6 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.

8. as claimed in claim 6 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.

9. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.

10. one kind is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, may further comprise the steps:

Provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces;

A plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit; And

Bend this lampshade body, so that the profile of this lampshade body is bent into the lampshade shape from flat shape, the segment beam that therefore described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.

11. as claimed in claim 10 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.

12. as claimed in claim 10 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body that is the lampshade shape has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.

13. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.

14. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.

15. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.

16. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, further comprises: prolonging above-mentioned two depressed parts to bend this lampshade body.

17. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.

18. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.

19. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.

20. one kind is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, may further comprise the steps:

Provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces;

Bend this lampshade body, so that the shape of this lampshade body is bent into the lampshade shape from this flat shape; And

A plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit, and the segment beam that therefore described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.

21. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.

22. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body that is the lampshade shape has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.

23. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.

24. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.

25. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.

26. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, further comprises: prolonging above-mentioned two depressed parts to bend this lampshade body.

27. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.

28. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.

29. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.

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