CN101538715B - Flexible circuit board etching liquid concentration control device - Google Patents
Flexible circuit board etching liquid concentration control device Download PDFInfo
- Publication number
- CN101538715B CN101538715B CN2009100307979A CN200910030797A CN101538715B CN 101538715 B CN101538715 B CN 101538715B CN 2009100307979 A CN2009100307979 A CN 2009100307979A CN 200910030797 A CN200910030797 A CN 200910030797A CN 101538715 B CN101538715 B CN 101538715B
- Authority
- CN
- China
- Prior art keywords
- etch bath
- oxidant
- test box
- pipe
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title claims abstract description 68
- 239000007788 liquid Substances 0.000 title claims abstract description 33
- 239000007800 oxidant agent Substances 0.000 claims abstract description 61
- 230000001590 oxidative effect Effects 0.000 claims abstract description 58
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000012360 testing method Methods 0.000 claims abstract description 52
- 239000000523 sample Substances 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000012530 fluid Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 abstract description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical group Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005381 potential energy Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a flexible circuit board etching liquid concentration control device belonging to the technical field of etching liquid detection and control devices and comprising a testing box with a box cavity, an etching pool, a liquid inlet pipe and a liquid return pipe. The testing box is provided with a controller as well as an oxidant probe, a hydrochloric acid probe and a hydrometer which are respectively and electrically connected with the controller and extend into the testing box; the etching pool is provided with an oxidant adding pipe, a hydrochloric acid inlet pipe and a water inlet pipe; the oxidant adding pipe, the hydrochloric acid inlet pipe and the water inlet pipe are respectively provided with a control valve; the control valves are electrically connected with the controller; one end of the liquid inlet pipe is connected with the etching pool, the middle is provided with a conveying pump and a valve, and the other end extends into the testing box; and one end of the liquid return pipe is connected with the etching pool and the other end is connected with the testing box. The invention has the characteristic that the oxidant probe is inserted into the pipe cavity of the liquid inlet pipe. The invention has the advantage of ensuring the etching effect of the etching pool to FPC boards.
Description
Technical field
The invention belongs to etching solution Detection ﹠ Controling device technique field, be specifically related to a kind of flexible circuit board etching liquid concentration control device.
Background technology
In the course of processing of flexible circuit board (FPC) plate, in order to adopt the etching solution etching to use the formation circuit structure to FPC, and the oxidant in the etching solution is the many or few unfavorable factors that all can produce of composition of copper chloride, for example when oxidizer composition be after a little while content when low etching speed just slack-off even can't etching, can cause unnecessary waste at most and cross.Therefore the manufacturing enterprise of FPC plate is connect by the test box of pipeline with etch bath and etching liquid concentration control device, and forms the circulating reflux of etching solution between the two usually at the supporting etching liquid concentration control device in etch bath (also claiming work pool) position.Specifically: the etching solution in the etch bath is introduced aforesaid test box by pump, is returned by test box to cause in the etch bath again.In this process, measure corresponding value by the oxidant on the test box top that is installed in etching liquid concentration control device probe, hydrochloric acid probe and densimeter.
The oxidant probe is the oxidant sensor or claims transducer, measure the potential value (ORP value) of the oxidant in the etching solution by it, and give controller with signal feedback, give the control valve of the oxidant feed tube that is installed on the etch bath to signal by controller, with in good time unlatching or close the control valve of oxidant feed tube, add oxidant or stop to add oxidant to etch bath, make the oxidizer composition in the etch bath be controlled at content or the title concentration that the rational numerical scope is promptly stipulated.
The hydrochloric acid probe is the hydrochloric acid sensor, according to electromagnetic induction principle, when electric current passes through hydrochloric acid sensor coil, can produce flux (magnetic line of force), this flux can produce the certain proportion electric current according to the ion concentration of hydrochloric acid in the etching solution, again this current change quantity is quantized, and be converted to the signal of telecommunication and pass to controller, controller judges according to the signal of telecommunication whether the ion concentration of hydrochloric acid in the etching solution is unusual, give the control valve that is installed in the hydrochloric acid feed tube on the etch bath to send instruction, with in good time unlatching or close the control valve of hydrochloric acid feed tube, make the content of hydrochloric acid in the etch bath be controlled at reasonable range.
Densimeter is the densimeter sensor, its mechanism of action is to increase buoyancy according to etching solution proportion to increase, the reason that vice versa, when content of copper ion in the etching solution increases or reduces, the buoyancy of etching solution also can become big or reduce, the variation of buoyancy makes the certain ball float of weight rise or descend, the lifting meeting occurrence positions of ball float changes, when proportion reaches set point, when the sheet metal at ball float top contacts with metal sensor, inductor is converted to electrical signal transfer with its potential energy (potential energy → electric energy) variable quantity and gives controller, controller is judged the size of etching solution proportion according to the signal of telecommunication, give the control valve that is installed in the water inlet pipe on the etch bath to send signal (instruction),, that is to say by adding running water and control proportion in etch bath, to add entry (being generally running water) in good time.
But, there is following shortcoming in the structure of the flexible circuit board etching liquid concentration control device in the prior art: because the oxidant that is installed on the tester probes in the interior etching solution of test box, therefore the oxidant concentration in its etching solution that measures is essentially the concentration of the oxidant in the interior etching solution of test box, and be not oxidant concentration for follow-up etching solution when etch bath is incorporated into test box, because in test box, had the previous etching solution that comes from the etch bath, and the oxidant concentration in the previous etching solution that comes from the etch bath often with follow-up and the oxidant concentration from the etching solution that etch bath is introduced there are differences, therefore the value of measuring of oxidant probe has the phenomenon of lagging, the so-called phenomenon that lags is meant: oxidant probe can not directly measure follow-up introduces oxidant concentration in the etching solution of test box by etch bath, and can only or claim the different periods to enter into the concentration determination of the oxidant that mixed etching solution occurred of test box to different phase, thereby lack specific aim and accuracy inevitably, influence etch effect.
Summary of the invention
Task of the present invention is to provide a kind of oxidant probe that can make to measure the oxidant concentration that comes from the etching solution in the etch bath timely and accurately and use the flexible circuit board etching liquid concentration control device that ensures etch effect.
Task of the present invention is finished like this, a kind of flexible circuit board etching liquid concentration control device, it comprises the test box with case chamber, etch bath, feed tube and liquid back pipe, disposing oxidant that controller is connected with controller circuitry with each and that all extend in the test box on the test box pops one's head in, hydrochloric acid probe and densimeter, etch bath is provided with the oxidant charge pipe, hydrochloric acid feed pipe and water inlet pipe, the oxidant charge pipe, hydrochloric acid feed pipe and water inlet pipe respectively are equipped with a control valve, control valve and described controller are electrically connected, one end of feed tube is connected with etch bath, the middle part disposes delivery pump and valve, the other end is stretched in the test box, one end of liquid back pipe is connected with etch bath, the other end is connected with test box, and characteristics are: described oxidant probe is inserted in the tube chamber of described feed tube.
In a specific embodiment of the present invention, an end of described feed tube is connected with etch bath and communicates, and the other end stretches into and extend to the top in the case chamber of test box from the bottom of described test box.
In another specific embodiment of the present invention, every being provided with densimeter test bucket, the bottom of densimeter test bucket offers a guiding fluid hole in described test box, and this guiding fluid hole communicates with described case chamber.
Go back in the specific embodiment of the present invention, an end of described liquid back pipe is connected with the top of etch bath and communicates with etch bath, and the other end is connected with the bottom of test box and communicates with described case chamber.
In another specific embodiment of the present invention, the pipeline of described liquid back pipe is provided with valve.
In another specific embodiment of the present invention, described etch bath is provided with and is used for mixing mechanism to what etching solution stirred.
More of the present invention and in specific embodiment, the described mechanism of mixing comprises motor, reductor and stirring arm, motor and reductor connect and take the top that motor is installed in etch bath by reductor, and stirring arm is positioned at etch bath and connects with the reductor transmission.
Technical scheme provided by the present invention is owing to be inserted into the oxidant probe in the feed tube, therefore can in time and exactly measure the oxidant concentration that comes from the etching solution in the etch bath, the oxidant concentration that the oxidant probe is measured is the oxidant concentration of the etching solution in the etch bath, thereby can guarantee the etch effect of etch bath to the FPC plate.
Description of drawings
Fig. 1 is a specific embodiment structure chart of the present invention.
Embodiment
Please be referring to Fig. 1, the test box 1 of being furnished with controller 11, oxidant probe 12, hydrochloric acid probe 13 and densimeter 14 can be from the market acquisition, for example select for use name by the production and sales of the special Electronics Equipment Co., Ltd of Jiangsu Province, China Changzhou Gree to be called oxidant regeneration and add controller.Aforesaid oxidant probe 12, hydrochloric acid probe 13 and densimeter 14 are electrically connected by circuit and controller 11.Every being provided with densimeter test bucket 16, in the bucket chamber of densimeter 14 corresponding to densimeter test bucket 16, offer a guiding fluid hole 161 in the bottom of densimeter test bucket 16 in the case chamber 15 of test box 1, guiding fluid hole 161 communicates with case chamber 15.
One end of one feed tube 3 is that illustrated right-hand member communicates with the bottom side joint of etch bath 2 and with etch bath 2, the middle part of feed tube 3 disposes delivery pump 31 and valve 32, to be illustrated left end be incorporated into the case chamber 15 of test box 1 from the bottom of test box 1 other end of feed tube 3 and stretch upwards the top in case chamber 15, and aforesaid oxidant probe 12 probes into or claims to be inserted in the tube chamber of feed tube 3.As shown in the above description, the effect that pipeline section in the case chamber 15 of feed tube 3 test box that is insinuated into 1 has been filled the post of testing tube 33 in fact, because oxidant probe 12 is inserted in the testing tube 33, therefore the oxidant concentration in oxidant probe 12 etching solutions that measured is the oxidant concentration of the etching solution in the etch bath 2, so can reflect the situation of the etching solution in the etch bath 2 timely and accurately, and give controller 11 with signal feedback, so that send instruction by the control valve 5 of controller 11 on the pipeline that is installed in the oxidant feed pipe 21 on the etch bath 2, open 5 of this control valves and in etch bath 2, add oxidant, promptly add copper chloride.Be installed on the etch bath 2 and hydrochloric acid feed pipe 22 that respectively be furnished with control valve 5 and water inlet pipe 23 also are controlled by controller 11.Therefore its reason is no longer given unnecessary details as applicant's explanation to hydrochloric acid probe and densimeter in the background technology hurdle.
One end of one liquid back pipe 4 is that illustrated right-hand member is connected with the top of etch bath 2 and communicates with etch bath 2, the other end is that illustrated right-hand member is connected with test box 1 in the bottom of test box 1, and the bucket chamber with case chamber 15 and densimeter test bucket 16 communicates respectively, is provided with valve 41 on the pipeline of liquid back pipe 4.
Still ask for an interview Fig. 1, be provided with one in a side of etch bath 2 and mix mechanism 6 by what motor 61, reductor 62 and stirring arm 63 constituted, wherein, motor 61 and reductor 62 are matched and take the top that it is installed in etch bath 2 by reductor 62, stirring arm 63 be positioned at etch bath 2 and with reductor 62 connections.
The applicant sketches operation principle of the present invention, the etched FPC plate of needs is put in the etch bath 2 that fills the etching solution of preparing on request in advance (etch bath 2 is work pool as can be known), carrying out along with etching work, the oxidant concentration of the etching solution in the etch bath 2 (copper chloride) can change, in order to make oxidant, hydrochloric acid and water are in the required poised state of technology all the time, therefore in etching process, delivery pump 31 and valve 32 on the pipeline of timing or not timing ground unlatching feed tube 3, etching solution in the etch bath 2 is introduced until being drawn out to the case chamber 15 from testing tube 33 by feed tube 3, this moment is owing to oxidant probe 12 is inserted in the testing tube 33, therefore can in time and accurately measure the oxidant concentration in the etching solution that comes from the etch bath 2, promptly measure the potential value of the oxidant of etching solution by oxidant probe 12, give controller 11 with signal feedback, and then be located at control valve 5 on the pipeline of oxidant charge pipe 21 by controller 11 control, added oxidants or stop to add oxidant to etch bath 2 by oxidant charge pipe 21, making oxidant is that the content of copper chloride remains in suitable amount in etching solution.Simultaneously whether normal according to the ion concentration that electromagnetic induction principle obtains hydrochloric acid in the etching solution in the case chamber 15 by hydrochloric acid probe 13, and give controller 11 to signal, send instruction to the control valve 5 on the pipeline of hydrochloric acid feed pipe 22 by controller 11,5 of opening controlling valves add hydrochloric acid to etch bath, vice versa, uses the scope that the content of hydrochloric acid that makes in the etching solution is controlled at regulation.Again, meanwhile, increase the principle that buoyancy also increases by densimeter 14 according to the proportion of etching solution, when the content of copper ion in the etching solution increases or reduces, the ball float come-up of densimeter 14 or sink (decline), when proportion reaches set point, the sheet metal at ball float top contacts with metal sensor, by inductor its potential energy (potential energy → electric energy) variable quantity is converted to electrical signal transfer and gives controller 11, give the control valve 5 on the pipeline of water inlet pipe 23 to instruction by controller 11, in etch bath 2, to add running water or to stop to add running water in good time.
Claims (7)
1. flexible circuit board etching liquid concentration control device, it comprises the test box (1) with case chamber (15), etch bath (2), feed tube (3) and liquid back pipe (4), dispose that controller (11) is connected with controller (11) circuit with each on the test box (1) and all extend into oxidant probe (12) in the test box (1), hydrochloric acid probe (13) and densimeter (14), etch bath (2) is provided with oxidant charge pipe (21), hydrochloric acid feed pipe (22) and water inlet pipe (23), oxidant charge pipe (21), hydrochloric acid feed pipe (22) and water inlet pipe (23) respectively are equipped with a control valve (5), control valve (5) is electrically connected with described controller (11), one end of feed tube (3) is connected with etch bath (2), the middle part disposes delivery pump (31) and valve (32), the other end is stretched in the test box (1), one end of liquid back pipe (4) is connected with etch bath (2), the other end is connected with test box (1), it is characterized in that: described oxidant probe (12) is inserted in the tube chamber of described feed tube (3).
2. flexible circuit board etching liquid concentration control device according to claim 1, an end that it is characterized in that described feed tube (3) is connected with etch bath (2) and communicates, and the other end stretches into and extend to the top in the case chamber (15) of test box (1) from the bottom of described test box (1).
3. flexible circuit board etching liquid concentration control device according to claim 1, it is characterized in that in described test box (1) every being provided with densimeter test bucket (16), the bottom of densimeter test bucket (16) offers a guiding fluid hole (161), and this guiding fluid hole (161) communicates with described case chamber (15).
4. flexible circuit board etching liquid concentration control device according to claim 1, an end that it is characterized in that described liquid back pipe (4) is connected with the top of etch bath and communicates with etch bath (2), and the other end is connected with the bottom of test box (1) and communicates with described case chamber (15).
5. according to claim 1 or 4 described flexible circuit board etching liquid concentration control devices, it is characterized in that the pipeline of described liquid back pipe (4) is provided with valve (41).
6. flexible circuit board etching liquid concentration control device according to claim 1 is characterized in that described etch bath (2) is provided with and is used for mixing mechanism (6) to what etching solution stirred.
7. flexible circuit board etching liquid concentration control device according to claim 6, it is characterized in that the described mechanism (6) of mixing comprises motor (61), reductor (62) and stirring arm (63), motor (61) connects with reductor (62) and takes the top that motor (61) is installed in etch bath (2) by reductor (62), and stirring arm (63) is positioned at etch bath (2) and connects with reductor (62) transmission.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100307979A CN101538715B (en) | 2009-04-15 | 2009-04-15 | Flexible circuit board etching liquid concentration control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100307979A CN101538715B (en) | 2009-04-15 | 2009-04-15 | Flexible circuit board etching liquid concentration control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101538715A CN101538715A (en) | 2009-09-23 |
| CN101538715B true CN101538715B (en) | 2011-01-12 |
Family
ID=41122095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100307979A Expired - Fee Related CN101538715B (en) | 2009-04-15 | 2009-04-15 | Flexible circuit board etching liquid concentration control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101538715B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208782A (en) * | 2015-09-28 | 2015-12-30 | 惠州市特创电子科技有限公司 | Automatic circuit board etching equipment |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534621B (en) * | 2012-02-21 | 2013-11-13 | 上海正帆科技有限公司 | Method for treating acidic etching solution |
| CN104977947A (en) * | 2014-04-01 | 2015-10-14 | 宇宙电路板设备(深圳)有限公司 | Automatic adding system for printed circuit board production line etching liquid |
| CN104846374A (en) * | 2015-06-09 | 2015-08-19 | 成都虹华环保科技股份有限公司 | Automatic liquid adding etching tank |
| CN111926334A (en) * | 2020-09-08 | 2020-11-13 | 深圳市志凌伟业光电有限公司 | Regeneration system and regeneration method for acidic copper chloride etching solution |
| CN112595629A (en) * | 2020-12-29 | 2021-04-02 | 江西超洋科技有限公司 | Real-time liquid medicine analysis device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2329472Y (en) * | 1998-05-05 | 1999-07-21 | 赵庶忠 | Electric etching machine for metal |
| CN1402087A (en) * | 2001-08-16 | 2003-03-12 | 株式会社平间理化研究所 | Alkali processing liquor, method and device for preparing processing liquor, and method and device for supply thereof |
| CN1664994A (en) * | 2004-03-03 | 2005-09-07 | 鸿富锦精密工业（深圳）有限公司 | Etching system and pure water adding device thereof |
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching solution supply device, etching device and etching method |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
-
2009
- 2009-04-15 CN CN2009100307979A patent/CN101538715B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2329472Y (en) * | 1998-05-05 | 1999-07-21 | 赵庶忠 | Electric etching machine for metal |
| CN1402087A (en) * | 2001-08-16 | 2003-03-12 | 株式会社平间理化研究所 | Alkali processing liquor, method and device for preparing processing liquor, and method and device for supply thereof |
| CN1664994A (en) * | 2004-03-03 | 2005-09-07 | 鸿富锦精密工业（深圳）有限公司 | Etching system and pure water adding device thereof |
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching solution supply device, etching device and etching method |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208782A (en) * | 2015-09-28 | 2015-12-30 | 惠州市特创电子科技有限公司 | Automatic circuit board etching equipment |
| CN105208782B (en) * | 2015-09-28 | 2017-12-08 | 惠州市特创电子科技有限公司 | The automatic etching apparatus of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101538715A (en) | 2009-09-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101538715B (en) | Flexible circuit board etching liquid concentration control device | |
| CN201386136Y (en) | Concentration control device of flexible circuit board etching liquid | |
| CN103006073B (en) | Automatic water adding device with water level detection control and control method thereof | |
| CN104614486B (en) | Automatic apparatus for measuring chemical oxygen demand (cod) | |
| CN102879064B (en) | Variable speed feeding quantitative weighing system based on buoyant weighing and sensing principle | |
| CN202875042U (en) | Automatic water feeding device with water level detection control | |
| CN201242561Y (en) | Apparatus for detecting power supply current | |
| CN203307458U (en) | Copper foil electroplating testing device | |
| CN204844497U (en) | Intelligence slurrying system | |
| CN201497706U (en) | COD on-line automatic detector for drinking water | |
| CN218724528U (en) | Liquid level sensor | |
| CN200986668Y (en) | Simple lever type water level controller | |
| CN111551687A (en) | Underground water multi-inorganic parameter online detection system and method | |
| CN202421902U (en) | Water level controlling apparatus for nuclear power station king bolt center aperture ultrasonic detection | |
| CN101762088A (en) | Solar energy water heater capable of automatically replenishing water | |
| CN205171008U (en) | Plating bath liquid level control system | |
| CN220188362U (en) | Device for evaluating long-term release performance of slow-release solid tracer strip | |
| CN202814497U (en) | Oil level detection and alarm device for vacuum oil injection of transformer | |
| CN100389315C (en) | Digital Solution Concentration Measurement System | |
| CN201653472U (en) | Electromagnetic flowmeter | |
| CN203035510U (en) | Electronic flow controller | |
| CN216192740U (en) | High-efficient acid dip pickle | |
| CN206684588U (en) | A kind of vinegar pours leaching pit level control device | |
| CN214271061U (en) | Automatic acid liquor adding device | |
| CN201937980U (en) | Device for automatically adding liquid medicine into chemical copper jar |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20150415 |
|
| EXPY | Termination of patent right or utility model |