CN101124698A - Metallic materials for wiring and connecting appliances - Google Patents

Abstract

A metal material for wiring connection device for use in wiring connection between metal members, at least one thereof being of copper or a copper alloy material, which at least one of the metal members has a connection part surface of = 0.3 [mu]m average roughness (Ra) and = 2.0 [mu]m maximum roughness (Rt), the metal material for wiring connection device excelling in anti-glow characteristics.

Description

Metallic materials for wiring and connecting appliances

technical field

The present invention relates to a metal material for a wiring connector in which at least one metal member of the wiring connector is copper or a copper alloy material, and particularly relates to a metal material for a wiring connector capable of preventing the occurrence of glow and the increase of cuprous oxide.

Background technique

Wiring connectors are widely used in electrical connection parts such as electrical sockets and light switches. Metals are generally used for the above-mentioned connection parts, and the metals are electrically connected by contact. Conventionally, heat generation at the above-mentioned contact portion has been a problem. This is considered to be caused by the occurrence of minute discharge (glow) at the contact portion, which induces an increase in cuprous oxide, thereby increasing contact resistance and generating heat.

The alloy composition was reconsidered, and a copper alloy for wiring connectors that is less likely to cause glow and increase in cuprous oxide was proposed.

However, even if the alloy composition is investigated, heat generation due to the generation of glow and the increase of cuprous oxide cannot be prevented.

Contents of the invention

The inventors of the present invention have conducted detailed studies on the contact portion of the wiring connector and found that the roughness (roughness) of the surface of the material is related to the generation of glow. Based on this finding, they conducted further studies and completed the present invention.

The present invention provides the following solutions:

(1) A metal material for a wiring connection device, the metal material has excellent anti-glow characteristics, and in the wiring connection between metal members, at least one of the above-mentioned metal members is copper or a copper alloy material, wherein the metal The average roughness Ra of the connection part surface of at least one of the members is 0.3 μm or less, and the maximum roughness Rt is 2.0 μm or less; and

(2) The metal material for a wiring connection device according to claim 1, which is excellent in anti-glow characteristics, and wherein the ratio Rt/Ra of the average roughness Ra to the maximum roughness Rt is 10 or less.

The metal material for wiring connectors of the present invention can prevent the generation of glow and the increase of cuprous oxide by limiting the average roughness Ra and the maximum roughness Rt, and preferably further adjusting the ratio of the average roughness Ra to the maximum roughness Rt, thereby enabling Heat generation is suppressed, and it is suitable as a metal material for wiring connection equipment such as electrical outlets and lighting switches.

The above-mentioned and other characteristics and advantages of the present invention will become apparent from the following description when considered with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a measurement device for the anti-glow characteristic and the anti-copper oxide increase characteristic used in Examples.

Detailed ways

Preferred embodiments of the present invention will be described in detail. In addition, in the present invention, the definition of roughness follows JIS B 0601:2001. That is, in the present invention, the average roughness Ra refers to the arithmetic mean roughness of the above-mentioned JIS B 0601:2001. Similarly, in the present invention, the maximum roughness Rt refers to the roughness curve of the above-mentioned JIS B 0601:2001. Maximum section height.

In the present invention, at least one of the metal members among the wiring connections between the metal members is made of copper or a copper alloy material.

In the present invention, the average roughness Ra of at least one connecting portion (contact) surface of the above-mentioned metal member is 0.3 μm or less and the maximum roughness Rt is 2 μm or less, and any metal member preferably has an average roughness Ra of 0.3 μm or less and The maximum roughness Rt is 2 μm or less.

In the present invention, the metal members whose average roughness Ra is 0.3 μm or less and maximum roughness Rt is 2 μm or less include copper or copper alloy materials and metal materials other than copper or copper alloy materials (such as nickel alloy materials). )Case.

Since the above average roughness Ra is 0.3 μm or less and the maximum roughness Rt is 2 μm or less, the generation of glow can be significantly reduced.

Roughness is one of the indicators showing the unevenness of the material surface, and it is considered that the voltage applied to the front of the unevenness is concentrated to cause glow discharge.

In the present invention, when the average roughness Ra exceeds 0.3 μm, glow discharge is likely to occur. Preferably it is 0.2 μm or less.

In addition, when the maximum roughness Rt exceeds 2 μm, glow discharge is also likely to occur. It is preferably 1 μm or less.

In addition, the smaller the average roughness Ra and the maximum roughness Rt, the more preferable. The lower limit values of the average roughness Ra and the maximum roughness Rt are not particularly limited, but the average roughness Ra is usually preferably 0.01 μm or more, and the maximum roughness Rt is usually preferably 0.05 μm or more.

In the present invention, the ratio Rt/Ra of the maximum roughness Rt to the average roughness Ra is preferably 10 or less.

When the ratio Rt/Ra of the maximum roughness Rt to the average roughness Ra is 10 or less, the occurrence of glow can be further reduced. It is considered that if the Rt/Ra is too large, there will be localized portions with large irregularities, and glow discharge will easily occur at these portions.

In the present invention, Rt/Ra is preferably 5 or less. In addition, the smaller the above-mentioned Rt/Ra is, the more preferable it is. The lower limit of Rt/Ra is not particularly limited, but Rt/Ra is usually preferably 2 or more.

Since contact pressure and electrical conductivity are required for the contacts in the metal material for wiring connectors of the present invention, metals excellent in strength and electrical conductivity are generally used. Among them, stainless steel, nickel alloys, and copper alloys are preferable due to their excellent strength and electrical conductivity. More preferably, the tensile strength is 500 MPa or more, and the electrical conductivity is 30%IACS or more.

As above-mentioned more preferred example, can enumerate:

(1) A copper alloy containing 0.1 to 10% by mass of Sn, 0.001 to 0.5% by mass of P, and the remainder consisting of Cu and unavoidable impurities;

(2) A copper alloy containing 0.1 to 1.0% by mass of Cr, 0.05 to 5% by mass of at least one element of Sn or Zn, and the rest consisting of Cu and unavoidable impurities;

(3) Containing 1.0 to 5.0% by mass of Ni, 0.3 to 1.3% by mass of Si, 0.05 to 5.0% by mass of at least one element among Mg, Sn, and Zn in total, and the rest is composed of Cu and unavoidable Copper alloys consisting of impurities; or

(4) A copper alloy containing 0.5 to 3.0% by mass of Fe, 0.1 to 1.0% by mass of P, and the remainder consisting of Cu and unavoidable impurities.

The metal material for wiring connectors of the present invention can be manufactured by appropriately repeating casting, hot rolling, cold rolling, heat treatment, etc. by a usual manufacturing method. In addition, as a method of controlling the average roughness Ra and the maximum roughness Rt, it is carried out by washing the surface with acid, alkali, etc., or by changing the roll roughness in the cold rolling process.

Example

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

Commercially available plates made of copper alloys and non-ferrous materials with a plate thickness of 0.15 to 0.25 mm were obtained, and the tensile strength, hardness, and electrical conductivity were investigated. Tensile strength is measured based on JIS Z 2241 by cutting out JIS-5 test pieces from the rolling direction. Hardness is measured from the surface of the material with a load of 100g based on JIS Z 2244. The electrical conductivity is measured by cutting out a test piece with a width of 10 mm x a length of 150 mm from the parallel direction of rolling, and measuring it based on JIS H 3200 with a distance between terminals of 100 mm. The results are shown in Table 1 and Table 2. In addition, even with the same alloy composition, the strength, hardness, and electrical conductivity are different because of the difference in quenching and tempering treatment or manufacturing conditions.

Table 1

plate number % of main components Strength MPa Hardness Hv Conductivity %IACS 1 Cu-0.15Sn 443 150 88 2 Cu-3.9Sn-0.15P 422 144 19 3 Cu-3.9Sn-0.15P 655 217 17 4 Cu-5.8Sn-0.12P 688 227 14 5 Cu-7.9Sn-0.2P 721 237 13 6 Cu-21Zn 412 141 34 7 Cu-32Zn 482 163 28 8 Cu-32Zn 610 203 28 9 Cu-0.55Cr 582 194 74 10 Cu-0.29Cr-0.25Sn-0.5Zn 550 184 77 11 Cu-0.28Cr-0.8Sn-0.45Zn 528 177 55 12 Cu-0.28Cr-0.8Sn-0.45Zn 668 221 52 13 Cu-0.3Cr-2Sn 685 226 41 14 Cu-0.21Cr-0.11Zr-0.2Zn 522 175 twenty two 15 Cu-2.6Ni-0.55Si-0.1Mg 567 189 75 16 Cu-2.3Ni-0.5Si-0.1Mg-0.15Sn-0.5Zn 680 225 42 17 Cu-2.3Ni-0.5Si-0.1Mg-0.15Sn-0.5Zn 722 238 41 18 Cu-3.7Ni-0.9Si-0.1Mg-0.15Sn-0.5Zn 815 267 35 19 Cu-2.5Ni-0.55Si 712 235 41 20 Cu-2.5Ni-0.55Si-0.5Zn 734 241 48 201 Cu-0.25Cr-0.77Sn-0.3Zn 670 231 51 202 Cu-0.2SCr-0.77Sn-0.3Zn 693 241 51 203 Cu-0.3Cr-0.84Sn-0.4Zn 681 235 50 204 Cu-0.3Cr-0.84Sn-0.4Zn 702 250 50

Table 2

plate number % of main components Strength MPa Hardness Hv Conductivity %IACS twenty one Cu-0.1Fe-0.04P 422 144 90 twenty two Cu-1Fe-0.5Sn-0.5Zn 534 179 55 twenty three Cu-2.4Fe-0.2P 534 179 64 twenty four Cu-1Ni-0.05P-0.9Sn 523 175 38 25 Cu-0.8Mg-0.05P 511 172 61 26 Cu-3.8Ti 882 288 11 27 Cu-0.15Ag 515 173 96 28 Cu-0.15Zr 498 168 94 29 Cu-0.2Be-1.1Ni 783 257 37 30 Cu-0.2Fe-0.05P-0.96Sn-0.1Ni-0.03B 511 172 75 31 Cu-0.1Fe-0.1Ni-0.05P-0.11Ni-0.04B 533 179 34 32 Cu-3.1Ni-0.68Si-0.3Zn 588 196 54 33 Cu-2.1Sn-0.1Fe-0.03P 562 188 35 34 Cu-2.1Ni-0.53Si-1Zn-0.5Sn 641 212 38 35 Cu-25Zn-0.6Sn 882 288 twenty two 36 AI-0.4Si-0.4Fe-0.1Cu-0.33Mn-4.2Mg-0.1Cr 320 112 18 37 Fe-17Cr-7Ni 1823 582 4 38 Fe-18Cr-8Ni 1432 460 6 39 Fe-36Ni 634 210 3 40 Ni 622 206 18

Using various numbers of sandpaper (abrasive paper with SiC abrasive grains attached to the surface), the surface of the above-mentioned plate is ground in the same direction as the rolling direction (parallel to the rolling direction) to make a surface Materials with different roughness. That is, the board is fixed on a smooth platform, and eight grades of sandpaper with numbers increasing from #230 sandpaper to #4000 are used to grind 30 times, and then the surface is washed. It was judged that cuprous oxide in the surface layer was removed by the above polishing, and the evaluation described later was performed.

The measurement of surface roughness is based on JIS H 3406. The scanning of the stylus was performed 4 mm in a direction perpendicular to the rolling direction of the material or the direction of grinding with sandpaper, and the measurement was repeated three times to obtain an average value.

For these plates, the anti-glow property and the anti-cuprous oxide increase property were evaluated.

FIG. 1 shows a schematic view of an apparatus used in the measurement of the anti-glow characteristic and the anti-cuprous oxide increase characteristic.

The glow resistance property was evaluated as follows. That is, a copper wire 2 with a diameter of 2 mm is mounted on a holder 1 with a load applicator, and samples 3 of the examples of the present invention and comparative examples are placed on the sample holder 4 so as to be in contact with the copper wire 2, Using a sliding transformer (autotransformer, trade name, manufactured by Toshiba) 8 and a varistor 6, the current flowing between the copper wire 2 and the sample 3 was set to 4A. Next, the sample holder 4 was vibrated by the vibrator 5 , and the voltage waveform between the copper wire 2 and the sample 3 was observed by the oscilloscope 7 . When (microdischarge) occurs between the copper wire 2 and the sample 3, due to the waveform change of the oscilloscope 7, the number of vibrations (number of times) added until the waveform change occurred was used to evaluate the anti-glow characteristic. As an evaluation of the anti-glow characteristic, the case where the vibration added until the waveform change showing that the glow occurred was 1000 times or less was regarded as "failure", and the case of exceeding 1000 times and 2000 times or less was regarded as "acceptable", The case of exceeding 2000 times was regarded as "good".

Next, the cuprous oxide increase resistance characteristic was evaluated as follows. While confirming the generation of the aforementioned glow, the vibration of the vibrator 5 was stopped, and the sample 3 was left to stand for 60 minutes. Next, the sample 3 was taken out, the cuprous oxide formed on the surface of the sample 3 was collected, and its mass was measured. The cuprous oxide increase resistance was evaluated using this mass, that is, the increase amount (mg) of cuprous oxide. As an evaluation of cuprous oxide increase resistance, the case where the cuprous oxide generation amount (mg) was 200 mg or less was regarded as "good", the case of exceeding 200 mg and 250 mg or less was regarded as "good", and the case of exceeding 250 mg was regarded as "good". "bad".

The results are shown in Tables 3-7.

table 3

No. plate number Raμm Rtμm Rt/Ra Anti-glow characteristics × 1000 (times) Resistance to cuprous oxide increase (mg) Remark 1 1 0.12 0.82 6.83 200 153 this invention 2 1 0.21 1.71 8.14 65 83 3 2 0.15 1.23 8.04 128 133 4 2 0.17 1.39 8.11 46 76 5 3 0.12 1.05 8.75 212 155 6 3 0.22 1.77 8.01 73 95 7 4 0.19 1.52 7.97 221 157 8 4 0.23 1.84 8.18 61 80 9 5 0.16 1.31 8.09 29 70 10 5 0.16 1.35 8.29 131 120 11 6 0.22 1.69 7.79 172 146 12 6 0.16 1.34 8.17 87 96 13 7 0.20 1.65 8.32 330 181 14 7 0.17 1.30 7.73 77 80 15 8 0.14 1.11 7.93 34 76 16 8 0.18 1.44 7.84 54 82 17 9 0.05 0.48 8.93 97 122 18 9 0.18 1.39 7.60 80 87 19 10 0.07 0.51 7.49 419 180 20 10 0.27 1.88 7.97 29 48 twenty one 11 0.07 0.62 8.72 153 141 twenty two 11 0.25 2.00 8.02 43 65 twenty three 12 0.07 0.52 7.91 113 128 twenty four 12 0.30 1.92 8.02 125 99 25 13 0.07 0.60 8.01 51 94 26 13 0.22 1.56 7.20 180 127 27 14 0.05 0.43 7.84 127 133 28 14 0.24 1.84 7.83 238 139 29 15 0.09 0.65 7.45 308 171 30 15 0.16 1.29 8.07 25 43

Table 4

No. plate number Raμm Rtμm Rt/Ra Anti-glow characteristics × 1000 (times) Resistance to cuprous oxide increase (mg) Remark 31 16 0.02 0.14 7.03 343 80 this invention 32 16 0.12 0.97 8.39 90 127 33 17 0.06 0.52 8.01 263 165 34 17 0.13 1.09 8.56 40 62 35 18 0.01 0.06 4.95 125 155 36 18 0.20 1.67 8.24 215 93 37 19 0.04 0.24 6.54 38 81 38 19 0.25 1.92 7.83 54 127 39 20 0.02 0.22 9.12 242 87 40 20 0.27 1.89 7.05 32 53 41 twenty one 0.11 0.92 8.37 100 111 42 twenty one 0.21 1.65 7.88 82 88 43 twenty two 0.08 0.58 7.40 69 119 44 twenty two 0.16 1.20 7.50 32 62 45 twenty three 0.11 0.89 7.84 33 62 46 twenty three 0.14 1.21 8.33 37 68 47 twenty four 0.18 1.42 7.93 48 79 48 twenty four 0.16 1.38 8.46 41 72 49 25 0.20 1.57 7.95 213 89 50 25 0.14 1.16 8.15 42 73 51 26 0.12 0.99 8.03 116 117 52 26 0.21 1.70 8.10 27 54 53 27 0.13 1.06 8.40 131 135 54 27 0.21 1.69 7.90 127 79 55 28 0.06 0.48 7.77 196 152 56 28 0.22 1.76 8.16 94 87 57 29 0.01 0.05 9.33 263 149 58 29 0.28 1.87 6.75 248 156 59 30 0.05 0.47 9.32 379 181 60 30 0.26 1.99 7.55 154 120 601 201 0.11 1.25 11.36 221 155 602 202 0.14 1.38 9.86 123 131 603 203 0.13 1.05 8.08 112 120 604 204 0.18 1.18 6.56 104 115

table 5

No. plate number Raμm Rtμm Rt/Ra Anti-glow characteristics × 1000 (times) Resistance to cuprous oxide increase (mg) Remark 61 31 0.05 0.46 9.69 162 137 this invention 62 31 0.24 1.89 7.86 196 131 63 32 0.03 0.25 7.44 188 161 64 32 0.18 1.38 7.78 185 140 65 33 0.08 0.61 7.94 352 181 66 33 0.22 1.92 8.86 108 105 67 34 0.15 1.31 8.62 190 143 68 34 0.19 1.81 9.44 102 110 69 35 0.11 0.91 8.37 92 119 70 35 0.20 1.36 6.92 34 55 71 36 0.18 1.49 8.08 68 106 72 36 0.28 1.85 3.83 398 162 73 37 0.12 0.88 7.45 30 70 74 37 0.17 1.89 4.04 175 126 75 38 0.09 0.64 6.94 42 85 76 38 0.21 1.87 4.43 64 75 77 39 0.17 1.35 7.94 41 84 78 39 0.25 1.64 6.67 218 136 79 40 0.20 1.56 7.97 175 147 80 40 0.28 1.92 6.77 68 93 81 3 0.23 1.93 8.36 212 155 82 7 0.23 1.88 8.25 114 101 83 14 0.29 1.85 6.28 114 113 84 18 0.23 1.97 8.41 123 136

Table 6

No. plate number Raμm Rtμm Rt/Ra Anti-glow characteristics × 1000 (times) Resistance to cuprous oxide increase (mg) Remark 85 1 0.35 2.84 8.11 9.3 394 comparative example 86 2 0.41 3.24 7.91 2.0 354 87 4 0.35 2.54 7.31 0.7 322 88 5 0.47 3.76 7.96 2.3 320 89 6 0.41 4.03 9.80 0.7 288 90 8 0.54 4.25 7.91 5.9 374 91 9 0.40 4.35 11.01 2.3 361 92 10 0.59 4.71 1.02 2.1 367 93 11 0.26 4.00 15.28 5.1 386 94 12 0.58 4.70 8.11 3.2 348 95 13 0.56 4.48 8.06 1.5 316 96 15 0.34 2.52 7.39 5.4 350 97 16 0.32 2.70 8.46 3.0 395 98 17 0.57 4.52 7.87 0.7 328 99 19 0.33 2.94 8.99 0.7 302 100 20 0.48 3.88 8.04 4.5 385

Table 7

No. plate number Raμm Rtμm Rt/Ra Anti-glow characteristics × 1000 (times) Resistance to cuprous oxide increase (mg) Remark 101 twenty one 0.39 3.20 8.22 3.3 327 comparative example 102 twenty two 0.21 3.35 15.75 1.2 332 103 twenty three 0.22 3.36 15.23 1.0 311 104 twenty four 0.44 2.54 5.72 3.4 328 105 25 0.23 3.45 15.05 8.2 366 106 26 0.13 2.41 18.28 2.0 305 107 27 0.49 3.86 7.93 6.1 375 108 28 0.23 2.90 12.55 6.1 376 109 29 0.26 2.89 11.08 5.8 377 110 30 0.45 3.62 8.00 0.9 422 111 31 0.36 3.11 8.53 1.8 330 112 32 0.41 3.28 8.02 3.8 404 113 33 0.28 3.81 13.73 5.9 407 114 34 0.45 3.57 7.90 9.5 428 115 35 0.49 3.96 8.04 8.7 410 116 36 0.29 3.92 13.60 3.8 365 117 37 0.27 3.57 13.02 1.1 320 118 38 0.33 2.70 8.18 9.0 425 119 39 0.64 5.16 8.04 0.7 378 120 40 0.70 5.60 8.01 1.2 340

From Tables 3 to 7, it can be seen that Nos. 85 to 120 of Comparative Examples had a large amount of increase in cuprous oxide due to large Ra or Ra and Rt, or had poor anti-glow characteristics and a large amount of increase in cuprous oxide.

On the contrary, it can be seen that the sheet materials of the present invention shown in Nos. 1 to 84 and 601 to 604 are excellent in the anti-glow characteristic, and the amount of increase of cuprous oxide is also small, and they are excellent sheet materials.

Industrial Applicability

The metal material for the wiring connection device of the present invention can prevent the generation of glow and the increase of cuprous oxide by limiting the average roughness Ra and the maximum roughness Rt, preferably further adjusting the ratio of the average roughness Ra and the maximum roughness Rt, thereby Heat generation can be suppressed, and it is suitable as a metal material used in wiring and connecting appliances such as electrical sockets and lighting switches.

Although the present invention has been described on the basis of this embodiment, as long as we have no special designation, we do not intend to limit our invention in any detail of the description, and should not violate the spirit and spirit of the invention shown in the appended claims. Broader interpretation based on scope.

Claims (7)

1. wiring connector metal material, the excellent of anti-aura of this metal material, and during the wiring between hardware connects, at least one above-mentioned hardware is copper or Cu alloy material, wherein, the average roughness Ra at least one connecting portion surface of described hardware is that 0.3 μ m is following, maximal roughness Rt is below the 2.0 μ m.

2. the described wiring connector metal material of claim 1, the excellent of anti-aura of this metal material, wherein, the ratio Rt/Ra of average roughness Ra and maximal roughness Rt is below 10.

3. claim 1 or 2 described wiring connector metal materials, wherein, hot strength is more than the 500MPa, conductivity is more than the 30%IACS.

4. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Sn be that 0.1～10 quality %, P are the copper alloy that 0.001～0.5 quality %, remainder are made up of Cu and unavoidable impurities.

5. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Cr be that at least a element among 0.1～1.0 quality %, Sn or the Zn is the copper alloy that 0.05～5 quality %, remainder are made up of Cu and unavoidable impurities.

6. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Ni be that 1.0～5.0 quality %, Si are that at least a element among 0.3～1.3 quality %, Mg, Sn, the Zn is counted the copper alloy that 0.05～5.0 quality %, remainder are made up of Cu and unavoidable impurities with total amount.

7. claim 1 or 2 described wiring connector metal materials, wherein, above-mentioned metal material is that to contain Fe be that 0.5～3.0 quality %, P are the copper alloy that 0.1～1.0 quality %, remainder are made up of Cu and unavoidable impurities.