CN100568557C - Semiconductor high-power light-emitting module with heat insulation effect - Google Patents

Abstract

The invention provides a semiconductor high-power light-emitting module, which includes a radiator, a heat-conducting element and a diode light-emitting element. The radiator has a heat insulator coupled to a first side of the radiator. The radiator has a second side opposite to the first side. The insulator has a third side opposite to the first side. The ambient temperature of the third side is higher than the ambient temperature of the second side. The heat conduction element has a flat end and a contact portion. The contact portion is in close contact with the radiator. The diode light emitting element is arranged on the flat end of the heat conducting element. The semiconductor light-emitting module of the present invention is applied in the headlight of the vehicle, and has the characteristics of power saving and long life, and the radiator can even be integrated with the shell of the vehicle, which is both beautiful and practical.

Description

Semiconductor high-power light-emitting module with heat insulation effect

technical field

The invention relates to a semiconductor light-emitting module (Semiconductor light-emitting module), in particular to a semiconductor high-power light-emitting module with high heat dissipation efficiency.

Background technique

Because light-emitting diodes (Light-emitting diodes, LEDs) have many advantages such as power saving, shock resistance, fast response, and suitability for mass production. Therefore, at present, the lighting equipment using light-emitting diodes as light sources continues to be researched and developed. However, high-power light-emitting diodes also generate high heat, so the heat dissipation problem has become the mainstream in this field. A general heat dissipation method is to place a radiator (which may include several fins) in a relatively low temperature environment to dissipate heat. However, in many practical applications, the heat sink is placed in the relatively high temperature environment, resulting in a high junction temperature of the LED, which greatly affects the luminous efficiency and life of the LED.

For example, in the traditional automotive headlight market, halogen lamps are the mainstream, but their disadvantages are insufficient brightness and short lifespan. To address this shortcoming, solutions are currently available on the market with high-density gas discharge (High Intensity Discharge, HID) lamps. However, because the principle of light emission is to ignite the arc between two electrodes according to the principle of arc discharge, a stable and continuous high-voltage power supply is required. In terms of safety, it should be avoided to place the driver in a high-voltage power supply environment. If directly replace the headlight with the high-power light-emitting diode device on the market at present, then its cooling device will be placed in the car body at least a part, and this will make it bear the high heat of devices such as engine and be unfavorable for heat dissipation.

Therefore, it is necessary to provide a semiconductor high-power light-emitting module that can efficiently dissipate heat in an environment with temperature difference to solve the above problems.

Contents of the invention

A scope of the present invention is to provide a semiconductor light emitting module.

According to a preferred embodiment, the semiconductor light-emitting module of the present invention includes a heat-dissipating member, a strip-shaped heat-conducting device, a carrier and a diode light-emitting element (Diode light- emitting device). The radiating body has an insulator (Isolator member) closely attached to a first side of the radiating body, the radiating body has a second side opposite to the first side, and the insulator has a second side opposite to the first side A third side of the first side, the cooling body has a groove on the first side; the ambient temperature of the third side is higher than the ambient temperature of the second side. The heat conduction element has a flat end and a contact portion, and the contact portion is arranged between the radiator and the heat insulator and is closely attached to the groove of the radiator. The stage is sleeved on the heat conduction element, so that a plane of the stage is flush with the flat end. The aspect ratio of the heat conduction element is greater than 2. A bottom of the diode light-emitting element is closely attached to the flat end of the heat-conducting element, and the diode light-emitting element can convert electric energy into light. The heat conduction element can be a heat pipe or other devices with high heat conduction efficiency. The diode light-emitting element includes at least one light-emitting diode die (Light-emitting diode die) or at least one laser diode die (Laser diode die). The contact portion of each heat conduction element is fixed on the heat dissipation portion by a pressing plate. The heat generated during the operation of the diode light-emitting element can be conducted to the radiator through the heat conduction element, and then dissipated from the radiator.

According to the preferred embodiment, the semiconductor light-emitting module of the present invention can be applied to a car headlight, and the radiator can be connected to the car body (such as the frame behind the bumper or integrated on the car shell). In addition, because the position of the headlight of the car is quite close to the high heat device such as the engine, the semiconductor light emitting module includes the heat insulator to isolate the heat generated by the high heat device such as the engine from affecting the ambient temperature of the radiator. Furthermore, an Isolator sleeve is further used to cover the heat conduction element between the diode light-emitting element and the contact part to further reduce the influence of the high temperature environment generated by high heat devices such as engines on the high-speed heat conduction of the heat conduction element. To enhance heat dissipation efficiency, a plurality of fins (Fin) are formed on the second side of the heat sink. In addition, the semiconductor light emitting module further includes a control circuit (Control circuit) electrically connected to the diode light emitting element for controlling the diode light emitting element to emit the light.

Therefore, the semiconductor light-emitting module of the present invention utilizes a heat insulator to isolate the influence of the high-temperature environment on the cooling efficiency of the heat sink of the semiconductor light-emitting module, so that the heat sink can efficiently dissipate heat in a lower temperature environment. Applied in automobile headlights, the radiator of the semiconductor light-emitting module of the present invention can be designed integrally with the automobile shell, which is both beautiful and practical. And through the radiator, the heat generated during the operation of the diode light-emitting element is dissipated to a place with a lower ambient temperature outside the vehicle body, so that it is realized to install a high-power semiconductor light-emitting module in the headlight of the car.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Description of drawings

Fig. 1A is a schematic diagram of a semiconductor light emitting module X according to a first preferred embodiment of the present invention;

Fig. 1B is a schematic diagram of a semiconductor light emitting module X' of another preferred embodiment of the present invention;

Fig. 1C is a schematic diagram of a semiconductor light emitting module X" of another preferred embodiment of the present invention;

Fig. 1D is a schematic diagram of a semiconductor light emitting module X"' of another preferred embodiment of the present invention;

FIG. 1E is a schematic diagram of a semiconductor light emitting module according to another preferred embodiment of the present invention;

2A is a perspective view of a semiconductor light-emitting module suitable for a headlight of a car according to a second preferred embodiment of the present invention;

Fig. 2B is a partial sectional view of the lamp holder of the headlight;

2C is a schematic cross-sectional view of a light emitting diode packaging structure;

2D is a schematic cross-sectional view of another LED packaging structure;

Fig. 2E is a schematic diagram of another flat end of the heat conducting element of the second preferred embodiment;

3 is a perspective view of a semiconductor light-emitting module used in a headlight of a car according to a third preferred embodiment of the present invention;

4 is a perspective view of a semiconductor light-emitting module used in a headlight of a car according to a fourth preferred embodiment of the present invention;

FIG. 5 is another form of the fins of the radiator in the fourth preferred embodiment.

Description of main component symbols:

1, 1', 1", 1"': semiconductor light emitting module

3, 6, 8: Headlights 4: Encapsulation structure

11, 11’, 11”: radiator 12: heat conduction element

13: Diode light-emitting element 14, 14’, 14”: heat insulator

15: Insulation sleeve 16: Carrier

21: radiator 22: heat conduction element

23: Diode light-emitting element 24: Heat insulator

25: Stage 26: Bracket

27: Press plate 28: Control circuit

31: lamp holder 41, 41': substrate

42: Lower base 43, 43': Semiconductor light-emitting grains

44: Encapsulation material 45: Thermal gel

46: External electrode 47: Exposed electrode

51, 71: radiator 112: first side

114, 114': second side 116: third side

118: fins 122: flat end

124: Contact part 212: Fin

222, 222': flat end 232: substrate

224: Contact part 262: Hole

272: Surface 411: Top surface

412: bottom surface 421: first surface

422: Second surface 431: Grain bottom

712, 714: fins 4111: first depression

4121: Second depression _TA , T _B : Ambient temperature

A: Angle F: Fluid

Detailed ways

Please refer to FIG. 1A . FIG. 1A is a schematic diagram illustrating a semiconductor light emitting module 1 according to a first preferred embodiment of the present invention. The lower figure in Fig. 1A is a cross-sectional view of the upper figure along line X-X. The semiconductor light emitting module 1 includes a heat sink 11 , a heat conduction element 12 , a diode light emitting element 13 , a heat insulating sleeve 15 and a carrier 16 . The radiator 11 has a thermal insulator 14 coupled to a first side 112 of the radiator, the radiator 11 has a second side 114 opposite to the first side 112, and the thermal insulator has a second side 114 opposite to the first side 112. A third side 116 of the first side 112 has an ambient temperature higher than that of the second side 114 . The heat conduction element 12 has a flat end 122 and a contact portion 124 . The contact portion 124 is disposed between the radiator 11 and the heat insulator 14 and is closely attached to the radiator 11 . The aspect ratio of the heat conducting element 12 is greater than 2. The stage 16 has a hole through which the heat conduction element 12 passes, the heat conduction element 12 passes through the hole and the flat end 122 is substantially flush with a surface of the stage 16 . A bottom of the diode light-emitting element 13 is closely attached to the flat end 122 of the heat-conducting element 12 and the platform 16 . The diode light-emitting elements 13 can convert an electric energy into a light. The heat conduction element 12 can be a heat pipe or other devices with high heat conduction efficiency. The diode light emitting element 13 includes at least one LED die or at least one laser diode die.

According to the first preferred embodiment, the contact portion 124 of the heat conduction element 12 is completely sunk and directly fixed on the radiator 11 by the heat insulator 14 . Moreover, the thermal insulation cover 15 wraps the heat conduction element 12 between the diode light emitting element 13 and the contact portion 124 to isolate the influence of the high temperature environment on the heat conduction efficiency of the heat conduction element 12 . The heat insulator 14 can isolate the influence of the high temperature environment on the heat dissipation efficiency of the heat sink 11 . As shown in the lower figure of FIG. 1A , this configuration enables the semiconductor light emitting module 1 to be used in situations where the ambient temperature _TA of the heat insulator 14 is higher than the ambient temperature _TB of the radiator 11 . In addition, according to another preferred embodiment, as shown in FIG. 1B, compared with the first preferred embodiment, a heat dissipation fin is formed on the second side 114' of the heat sink 11' of a semiconductor light emitting module 1' Sheet 118 to improve heat dissipation efficiency.

In addition, according to another preferred embodiment, as shown in FIG. 1C, compared with the first preferred embodiment, the bonding method of the contact portion 124 of a semiconductor light emitting module 1" can only partially sink into a radiator 11" and directly fixed on the radiator 11" with an insulator 14'. In addition, according to another preferred embodiment, as shown in Figure 1D, compared with the first preferred embodiment, a semiconductor An insulator 14 ″ of the light emitting module 1 ″ can form a space with a gap with the heat sink 11 ″ to accommodate the contact portion 124 . The contact part 124 can still be fixed by the heat insulator 14" or fixed with a pressure plate (not shown in Fig. 1D). Finally, according to another preferred embodiment, as shown in Fig. 1E , a semiconductor light-emitting module includes three diode light-emitting elements 13', which are simultaneously arranged between a heat insulator 14"' and a heat sink. Compared with the first preferred embodiment, the diode light-emitting elements 13' can be packaged together or separately, and the packaging structure will be described in detail later.

It should be noted that the space is not necessary to be sealed, and the efficiency of the heat conduction element 12 conducting to the radiator 11, 11', 11" through the contact part 124 should be increased as much as possible, for example, the contact part 124 should be crushed Or fill the gap between the contact portion 124 and the heat sink 11 , 11 ′, 11 ″ with high thermal conductivity material to increase the contact area.

Please refer to FIG. 2A and FIG. 2B . FIG. 2A shows a perspective view of a semiconductor light emitting module suitable for a headlight 3 of a car according to a second preferred embodiment of the present invention. FIG. 2B shows a partial cross-sectional view of a lamp holder 31 of the headlight 3 . According to the second preferred embodiment, the structure of the semiconductor light emitting module constitutes a right headlight of an automobile. It should be noted that the present invention is not limited to be applicable to the right headlight.

The semiconductor light-emitting module of the present invention includes a radiator 21 , three heat-conducting elements 22 , three diode light-emitting elements 23 , an insulator 24 , a carrier 25 and a supporter 26 . Each heat conduction element 22 has a flat end 222 and a contact portion 224 , and the contact portion 224 is in close contact with the radiator 21 . The stage 25 has a hole through which the heat conduction element 22 passes, the heat conduction element 22 passes through the hole and the flat end 222 is substantially flush with a surface of the stage 25 . The diode light-emitting elements 23 are respectively disposed on the flat ends 222 of the heat-conducting elements 22 , and each diode light-emitting element 23 can convert an electric energy into a light. Each heat conduction element 22 can be a heat pipe or other devices with high heat conduction efficiency. Each diode light-emitting element 23 includes at least one LED die or at least one laser diode die.

According to the second preferred embodiment, the contact portion 224 of each heat conducting element 22 is fixed to the radiator 21 by a pressing plate 27 . The heat generated during the operation of the diode light emitting elements 23 can be conducted to the radiator 21 through the heat conducting elements 22 , and then dissipated by the radiator 21 . In addition, because the position of the automobile headlight is quite close to high-heat devices such as the engine, the heat insulator 24 is arranged between the high-heat devices such as the engine and the radiator 21 to insulate the high ambient temperature generated by the high-heat devices such as the engine (usually greater than 80°C) on the heat dissipation efficiency of the radiator 21. Therefore, the heat insulator 24 can also be directly used as the pressing plate 27, and simultaneously has the functions of heat insulation and fixing.

In addition, the contact portion 224 of the heat conduction element 22 can also be fixed in other ways, such as pasting the contact portion 224 on the radiator 21 with a material like glue, or even welding. Moreover, in order to increase the heat conduction efficiency from the contact portion 224 to the radiator 21, the contact portion 224 can be squeezed to form a larger contact area, or the contact portion 224 and the contact portion 224 can be filled with a material with high thermal conductivity. The gap near the heat sink 21 contacts to increase the cross-sectional area of heat conduction. In another specific embodiment, several grooves can be formed on a heat sink to respectively accommodate several heat conduction elements, or one groove can be formed to accommodate each heat conduction element. The shape of each groove can match the shape of each heat conduction element, or apply deformation to each heat conduction element to match the shape of these grooves. At this time, a heat insulator can directly cover the grooves, so as to have the functions of blocking high temperature and fixing at the same time.

It should be noted that, according to the second preferred embodiment, in order to reduce the impact of the high temperature environment produced by high heat devices such as engines on the heat dissipation efficiency of the heat sink 21, the heat insulator 24 can also be replaced or additionally provided with a heat insulating material The material coats the heat dissipation body 21 and the contact portions 224 of the heat conduction elements 22 . Moreover, a heat insulating sleeve (not shown in the figure) can be further used to cover the heat conduction element 22 between the diode light-emitting element 23 and the contact portion 224, or to cover the heat conduction element 22 exposed outside the heat insulator 24 to further reduce the engine etc. The impact of the high temperature environment generated by the high heat device on the heat transfer efficiency of the heat conduction element 12 . The heat-insulating sleeve can cover several heat-conducting elements 22 at one time or cover each heat-conducting element 22 with several heat-insulating sleeves. The heat insulating sleeve is not limited to the form of a sleeve, and may be wound in the form of an adhesive tape or directly coated with a layer of heat insulating material to achieve heat insulation or reduce heat conduction. In addition, in order to enhance the heat dissipation efficiency, a plurality of fins 212 are formed on the heat dissipation body 21 to increase the heat dissipation area. It is worth mentioning that, in each of the preferred specific embodiments, the area of the heat sink covered by the heat insulators should be as large as possible, so as to effectively insulate the high temperature environment produced by high heat devices such as engines to dissipate heat to the heat sink. Efficiency impact.

According to the second preferred embodiment, the platform 25 has three through holes for the heat conduction elements to pass through, so that the diode light emitting elements 23 can be disposed on the flat ends 222 of the heat conduction elements 22 . The substrate 232 of each diode light emitting element 23 is disposed on the stage 25 . A surface 272 of the substrate 232 forms or bears electrodes connected to a control circuit 28 . The wires connected to the electrodes are electrically connected to a control circuit 28 through a hole 262 of the bracket. The control circuit 28 is electrically connected to the vehicle wiring via a connector. The bracket 26 connects the heat conducting elements 22 with the lamp holder 31 . The bracket 26 can be integrally formed with the heat conducting platform 25 . According to the second preferred embodiment, the bracket 26 is fixed on the lamp holder 31 by screws. However, the bracket 26 can also be fixed on the lamp holder 31 by adhesive or hook design, or alternatively fixed on other parts of the headlight 3 .

In addition, the diode light-emitting elements 23 can be packaged together using the substrate 232 . Please refer to FIG. 2C . FIG. 2C is a schematic cross-sectional view of an LED packaging structure 4 . The packaging structure 4 includes a substrate 41 , a lower base 42 , at least one semiconductor light-emitting die 43 , and a packaging material 44 . The substrate 41 defines a top surface 411 on which a plurality of external electrodes (electrically coupled) 46 are disposed. The lower base 42 defines a first surface 421 , and the at least one semiconductor light-emitting die 43 is fixed on the first surface 421 of the lower base 42 through an internal electrode (bond pad) at its bottom (Bottom) 431 . The top surface 411 of the substrate 41 forms a first recess 4111, the substrate 41 further defines a bottom surface 412, the bottom surface 412 of the substrate 41 forms a second recess 4121, and the second recess 4121 and The first concave portion 4111 is connected, and the lower base 42 is embedded in the second concave portion 4121, the lower base 42 further defines a second surface 422, and the first surface 421 of the lower base 42 is exposed to the first The interior of the recessed portion 4111. The bottom 431 of the at least one semiconductor light emitting die 43 is fixed on the portion of the first surface 421 of the lower base 42 exposed inside the first recess 4111 . The packaging material 44 is used to fill the first recess 4111 to cover the at least one semiconductor light emitting die 43 . The at least one semiconductor light emitting die 43 has an internal electrode, and is connected to the external electrode 46 on the top surface 411 through a wire. The connection between the internal electrode and the external electrode 46 of the at least one semiconductor light-emitting crystal grain 43 is arranged in series, but the connection of each electrode can also be connected in parallel, and the present invention can still be achieved. the goal of.

In addition, a thermally conductive glue 45 can be placed between the first surface 421 of the lower base 42 and the bottom of the first recess 4111 to combine the first surface 421 of the lower base 42 with the first recess 4111 The bottom of the base is used to connect the substrate 41 and the lower base 42 . The substrate 41 can be made of one of metal, ceramic, flexible printed circuit board and rigid printed circuit board. The lower base 42 can be made of semiconductor. It is worth mentioning that the packaging of the diode light-emitting element 23 is not limited to the above, and several semiconductor light-emitting chips 43' can also be directly placed on the substrate 41' without using the first recess 4111 and the second The design of the second concave portion 4121 is shown in FIG. 2D , in which there are two exposed electrodes 47 on the substrate 41 ′ for connecting external circuits.

It should be noted that each heat conduction element 22 is not limited to carry only one diode light emitting element 23 , but also can carry several diode light emitting elements 23 . But in this case, the flat end 222' of the heat conducting element 22 is different from the aforementioned flat end 222, and one end of the heat conducting element 22 is squeezed to form the larger flat end 222' (the schematic diagram is shown in FIG. 2E Show). The choice of these two flat end shapes depends on the actual product design, and the number and installation space of the diode light-emitting elements will be very important considerations. In this case, the geometric dimensions of the stage 25 and the substrate 232 also need to be modified accordingly.

Please refer to FIG. 3 , which shows a perspective view of a semiconductor light emitting module applied to a headlight 6 of an automobile according to a third preferred embodiment of the present invention. Compared with the second preferred embodiment, the radiator 51 of the semiconductor light emitting module is mainly connected with the car shell near the hood of the automobile, which is different from the heat dissipation of the semiconductor light emitting module 2 of the second preferred embodiment. Body 21, which is located at the rear of the automobile bumper, can be connected with the vehicle body behind the bumper. In addition, please refer to FIG. 4 , which shows a perspective view of a semiconductor light emitting module applied to a headlight 8 of a car according to a fourth preferred embodiment of the present invention. Compared with the second and third preferred embodiments, the radiator 71 of the semiconductor light-emitting module is mainly engaged with the front side shell of the automobile.

It is worth mentioning that, taking the fourth preferred embodiment as an example, in addition to forming fins 712 on the outside of the heat sink 71 to increase heat dissipation efficiency, the outer structure of the heat sink 71 can also be changed to increase heat dissipation efficiency, for example Increase the surface roughness or other surface forms to increase the heat dissipation area, or form an additional layer of fins 714 parallel to the heat sink 71 outwards and design the angle A between the two layers (the schematic diagram is as shown in Figure 5, and it is drawn Show the top view of the fourth preferred embodiment), in addition to increasing the heat dissipation area, the velocity and density of the fluid F flowing through the layers can also be increased to achieve the purpose of increasing heat dissipation efficiency. In addition, according to the third preferred embodiment, although no fins are formed on the outer side of the radiator 51 , it is not impossible to form fins. What kind of fins it forms or any structure that helps to dissipate heat or what kind of surface treatment it implements should match the overall design of the car.

Therefore, according to the preferred embodiments, the semiconductor light-emitting module of the present invention utilizes a heat insulator to isolate the influence of the high-temperature environment of the vehicle body on the heat dissipation efficiency of the heat sink of the semiconductor light-emitting module, so that the heat dissipation body can be placed at a lower temperature outside the vehicle body. Efficient heat dissipation at ambient temperature. That is to say, the radiator of the semiconductor light-emitting module can operate normally in an environment with temperature difference. The scope of application of the semiconductor light-emitting module of the present invention is not limited to the automotive headlights mentioned in the above-mentioned preferred embodiments. As long as there is a temperature difference in the operating environment and there is a need for heat dissipation, the semiconductor light-emitting module of the present invention can be applied. . The geometric dimensions of the radiator need to be designed in accordance with the actual operating environment.

Applied in the headlights of automobiles, the radiator of the semiconductor light-emitting module of the present invention can be designed integrally with the automobile shell, which is both beautiful and practical. And through the radiator, the heat generated during the operation of each LED light-emitting element is dissipated, so as to reduce the junction temperature of the LED element, and realize the high-power LED in the automobile headlight device. At the same time, although a part of the heat sink is placed in a high-temperature environment, the influence of the high-temperature environment on the heat dissipation efficiency of the heat sink is isolated by the heat insulator so that the heat dissipation body still has good heat dissipation efficiency. In addition, because the light emitting diodes have different light emitting colors, the semiconductor light emitting module can simultaneously have indication or other lighting functions, such as integrating fog lamps and general lighting functions into the same semiconductor light emitting module.

Through the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention can be described more clearly, rather than limiting the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the appended claims of the present invention.

Claims (9)

1. a semiconductor light emitting module (Semiconductor light-emitting module) comprises:

One radiator (Heat-dissipating member) has a heat guard (Isolator member) and fits tightly on one first side of this radiator, this radiator has one second side with respect to this first side, this heat guard has one the 3rd side with respect to this first side, and this radiator has a groove on this first side;

One heat pipe, this heat pipe have a smooth end (Flat end) and a contact site (Contactportion), and this contact site is arranged between this radiator and this heat guard and is fitted on this groove of this radiator;

One microscope carrier is socketed on this heat pipe, makes a plane of this microscope carrier flush with this smooth end; And

One bottom of one led lighting element (Diode light-emitting device) is fitted on the smooth end of this heat pipe and is arranged on this plane.

2. semiconductor light emitting module as claimed in claim 1, wherein the length-width ratio of this heat pipe is greater than 2.

3. semiconductor light emitting module as claimed in claim 1 further comprises a jacket (Isolatorsleeve) and coats heat pipe between this led lighting element and this contact site.

4. semiconductor light emitting module as claimed in claim 1, wherein a plurality of fins (Fin) are formed on second side of this radiator.

5. semiconductor light emitting module as claimed in claim 1 further comprises a control circuit (Control circuit) and is electrically connected to this led lighting element, launches a light in order to control this led lighting element.

6. semiconductor light emitting module as claimed in claim 1, wherein this led lighting element comprises at least one LED crystal particle (Light-emitting diode die) or at least one laser diode crystal grain (Laser diode die).

7. semiconductor light emitting module as claimed in claim 1, wherein this led lighting element comprises:

One substrate (substrate), a fixed top surface of this ceiling substrate and a basal surface, form one first depressed part on this top surface of this substrate, form one second depressed part on this basal surface of this substrate, and this second depressed part is connected with this first depressed part, is provided with a plurality of outer electrodes (Outerelectrode) on this top surface;

One lower bottom base (Sub-mount) engages with this second depressed part, limit a first surface and a second surface on this lower bottom base, this lower bottom base is embedded in this second depressed part, so that the part of this first surface of this lower bottom base is exposed to the inside of this first depressed part;

At least one semiconductor light emitting crystal grain (Semiconductor light-emitting die), wherein each semiconductor light emitting crystal grain comprises a bottom and an internal electrode (Inter electrode), and this first surface that this at least one semiconductor light emitting crystal grain is fixed in this lower bottom base by this bottom is exposed to the part of this first depressed part inside; And

One package material (Package material), this package material are used to fill in this first depressed part, to cover this at least one semiconductor light emitting crystal grain.

8. semiconductor light emitting module as claimed in claim 7, wherein this substrate (Substrate) is to be made of wherein a kind of institute of metal, pottery, flexible printed wiring board and rigid printed circuit board.

9. semiconductor light emitting module as claimed in claim 7, wherein this lower bottom base is made up of semiconductor (semiconductor).

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