CN100533700C - Apparatus and method for mounting electronic component - Google Patents
Apparatus and method for mounting electronic component Download PDFInfo
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- CN100533700C CN100533700C CNB2006800066178A CN200680006617A CN100533700C CN 100533700 C CN100533700 C CN 100533700C CN B2006800066178 A CNB2006800066178 A CN B2006800066178A CN 200680006617 A CN200680006617 A CN 200680006617A CN 100533700 C CN100533700 C CN 100533700C
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- carrier tape
- tape
- winding
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- mounting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
- B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
- B65H23/032—Controlling transverse register of web
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/41—Winding, unwinding
- B65H2301/412—Roll
- B65H2301/4127—Roll with interleaf layer, e.g. liner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1942—Web supporting regularly spaced non-adhesive articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Winding Of Webs (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
Description
技术领域 technical field
本发明涉及将电子部件安装在从载带供给卷轴抽出的载带上、将该载带与间隔带一起卷绕到载带卷绕卷轴上的电子部件的安装装置及安装方法。The present invention relates to an electronic component mounting device and mounting method for mounting an electronic component on a carrier tape unwound from a carrier tape supply reel, and winding the carrier tape together with a spacer tape onto a carrier tape winding reel.
背景技术 Background technique
例如,在TAB(Tape Automatic Bonding,卷带自动结合)或COF(ChipOn Film,将芯片封装在柔性电路板上)等中,将半导体芯片等的电子部件安装在形成于薄膜状的载带上的端子部上。For example, in TAB (Tape Automatic Bonding, tape automatic bonding) or COF (ChipOn Film, packaging chips on flexible circuit boards), etc., electronic components such as semiconductor chips are mounted on a carrier tape formed in a film shape. on the terminal section.
图6表示用来将电子部件安装在上述载带上的以往的安装装置。该安装装置具有卷绕有载带1的载带供给卷轴2。在载带1上,如图7所示,形成有具有设备孔3a以及将一端突出设置在该设备孔3a中的引线3b的端子部3。因此,该载带1与保护端子部3的导线3b的间隔带4a重叠而卷绕在上述载带供给卷轴2上。FIG. 6 shows a conventional mounting device for mounting electronic components on the carrier tape. This mounting device has a carrier
从上述载带供给卷轴2抽出的载带1卡合在载带导引辊5a上而被导引到输送轨道6上,从该输送轨道6被卷绕到载带卷绕卷轴7上。在输送轨道6的中途部设有安装部8。The carrier tape 1 unwound from the carrier
上述载带1被从上述载带供给卷轴2抽出,以使其在载带导引辊5a和输送轨道6的一端之间不会发生松弛。该载带1的松弛量由第1下部传感器11a和第1上部传感器11b检测并控制。即,如果第1下部传感器11a检测到松弛的载带1,则停止上述载带供给卷轴2的载带1的抽出。如果载带1的松弛消失、不能由第1上部传感器11b检测到载带,则通过上述载带供给卷轴2抽出载带1。由此,将载带1的松弛量控制在规定的范围内。The carrier tape 1 is drawn out from the carrier
在上述安装部8中,在载带1上如图8所示那样安装半导体芯片等的电子部件12。安装部8具有在X、Y方向上被驱动的安装台13、和在X、Y及Z方向上被驱动的安装工具14。In the
被从上述载带供给卷轴2与载带1一起抽出的间隔带4a受一对间隔带导引辊15a、15b导引,卷绕在间隔带卷绕卷轴16上。The
如果将上述电子部件12供给到上述安装台13上,则该安装台13被定位在载带1的端子部3的下方。接着,将上述安装工具14向下降方向驱动。由此,将上述端子部3的导线3b弯折,连接到上述电子部件12的凸起12a上。When the
安装了电子部件12的载带1由与上述输送轨道6对置地设置的未图示的链轮等传送机构按规定的间距间歇地传送。安装了电子部件12并被传送机构传送的载带1,与从间隔带供给卷轴18供给的上述间隔带4b重叠而卷绕到上述载带卷绕卷轴7上。由此,安装在载带1上的电子部件12被上述间隔带4b保护。The carrier tape 1 on which the
载带1被载带导引辊5b导引而被卷绕到上述载带卷绕卷轴7上。间隔带4b被下部间隔带导引辊15c和上部间隔带导引辊15d导引而被卷绕在上述载带卷绕卷轴7上。The carrier tape 1 is guided by the carrier
载带1安装电子部件12之后,被未图示的传送机构按规定长度间歇地传送。在卷绕侧,被间歇传送的载带1的松弛量由第2下部传感器17a和第2上部传感器17b检测。After the
如果松弛量变为规定以上、由第2下部传感器17a检测到该情况,则通过该检测信号驱动载带卷绕卷轴7,开始载带1和间隔带4b的卷绕。如果开始卷绕而松弛量减少,由第2上部传感器17b检测不到载带1,则停止载带1的卷绕。If the amount of slack becomes more than a predetermined amount and is detected by the second
上述载带1和间隔带4b通过分别被上述载带导引辊5b和上述间隔带导引辊15d导引,被决定相对于上述载带卷绕卷轴7的卷绕位置,即被决定与在将各带1、4b卷绕到载带卷绕卷轴7上时作为卷绕的外周面的载带卷绕卷轴7的卷绕芯7a的外周面、或者与已经卷绕在该卷绕芯7a上的带1、4b的外周面接触的周向的位置。The above-mentioned carrier tape 1 and
在载带卷绕卷轴7上已经卷绕有载带1和间隔带4b时的上述卷绕位置,在载带1的情况下是与已经卷绕的间隔带4b接触的位置,在间隔带4b的情况下是与已经卷绕的载带1接触的位置。The above-mentioned winding position when the carrier tape 1 and the
在专利文献1中表示上述结构的安装装置。Patent Document 1 shows a mounting device having the above-mentioned structure.
专利文献1:(专利)特开平6—244246号公报。Patent Document 1: (Patent) Japanese Patent Application Laid-Open No. 6-244246.
以往的安装装置如图6所示,将上述载带导引辊5b和上部间隔带导引辊15d定位而设置,以使载带1和间隔带4b被卷绕到载带卷绕卷轴7上时的卷绕位置Z相同。即,载带导引辊5b和上部间隔带导引辊15d接近于载带卷绕卷轴7的径向下方而配置,由此使卷绕位置Z相同。As shown in FIG. 6 , the conventional installation device positions the carrier
最近,由于使用非常薄的载带1,所以该载带1在卷绕时有在宽度方向上振动的情况。如果载带1一边在宽度方向上振动一边被卷绕在载带卷绕卷轴7上,则该卷绕有时会在载带卷绕卷轴7的宽度方向上错位。Recently, since a very thin carrier tape 1 is used, the carrier tape 1 may vibrate in the width direction during winding. When the carrier tape 1 is wound around the carrier
如果载带1和间隔带4b相对于上述载带卷绕卷轴7的卷绕位置Z相同,则卷绕在载带卷绕卷轴7上的载带1的宽度方向的振动收敛之前,即在载带1在宽度方向上位置有偏差的状态下,该载带1被间隔带4b推压保持并卷绕到载带卷绕卷轴7的外周面上。If the winding positions Z of the carrier tape 1 and the
因此,载带1在其宽度方向上有偏差的状态下被卷绕到载带卷绕卷轴7上,所以其偏差量逐渐变大,最终会超过容许范围。Therefore, since the carrier tape 1 is wound up on the carrier
发明内容 Contents of the invention
本发明提供一种安装装置及安装方法,该安装装置及安装方法即使载带在宽度方向上振动,也通过在其振动收敛后将间隔带与载带一起卷绕,能够将上述载带不发生错位地卷绕到载带卷绕卷轴上的。The present invention provides a mounting device and a mounting method that can prevent the carrier tape from occurring by winding the spacer tape together with the carrier tape after the vibration has converged even if the carrier tape vibrates in the width direction. Wound onto the carrier tape take-up reel with offset.
即,本发明的电子部件的安装装置,用于将电子部件安装到载带上,其特征在于,具备:That is, the electronic component mounting device of the present invention is used for mounting electronic components on a carrier tape, and is characterized in that it has:
载带供给卷轴,重叠卷绕有上述载带和间隔带;a carrier tape supply reel on which the above-mentioned carrier tape and spacer tape are overlapped;
间隔带卷绕卷轴,将与上述载带一起从该载带供给卷轴抽出的上述间隔带进行卷绕;a spacer tape winding reel for winding the above-mentioned spacer tape drawn out from the carrier tape supply reel together with the above-mentioned carrier tape;
安装部,将上述电子部件安装到从上述载带供给卷轴抽出的上述载带上;a mounting unit for mounting the electronic component on the carrier tape drawn from the carrier tape supply reel;
载带卷绕卷轴,将在该安装部安装了电子部件的载带进行卷绕;The carrier tape winding reel is used to wind the carrier tape on which the electronic components are mounted on the mounting portion;
间隔带供给卷轴,供给在由该载带卷绕卷轴卷绕安装有上述电子部件的载带时与该载带重叠卷绕的间隔带;a spacer tape supply reel for supplying a spacer tape wound overlappingly with the carrier tape when the carrier tape on which the electronic components are mounted is wound by the carrier tape winding reel;
间隔带导引辊,导引卷绕到上述载带卷绕卷轴上的间隔带;Spacer belt guide rollers for guiding the spacer belt wound onto the above-mentioned carrier tape winding reel;
定位机构,通过变更上述间隔带导引辊的位置,将卷绕到上述载带卷绕卷轴上并推压保持上述载带的上述间隔带的卷绕开始的位置设定在比上述载带的卷绕开始的位置靠卷绕方向的下游侧。The positioning mechanism sets the starting position of winding of the spacer tape wound on the carrier tape winding reel and pressing and holding the carrier tape at a position that is lower than that of the carrier tape by changing the position of the spacer tape guide roller. The winding start position is on the downstream side in the winding direction.
此外,本发明提供一种电子部件的安装方法,用于将电子部件安装到载带上,其特征在于,具备:In addition, the present invention provides an electronic component mounting method for mounting the electronic component on a carrier tape, characterized in that it has:
将卷绕在载带供给卷轴上的载带抽出的工序;The process of pulling out the carrier tape wound on the carrier tape supply reel;
将上述电子部件安装到从上述载带供给卷轴抽出的载带上的工序;A step of mounting the above-mentioned electronic component on a carrier tape drawn from the above-mentioned carrier tape supply reel;
将间隔带重叠在安装有电子部件的载带上并卷绕到载带卷绕卷轴上的工序;The process of superimposing a spacer tape on a carrier tape mounted with electronic components and winding it onto a carrier tape take-up reel;
变更间隔带导引辊的位置,以将卷绕到上述载带卷绕卷轴上的上述载带的卷绕开始的位置设定在比上述载带的卷绕开始的位置靠卷绕方向的下游侧的工序。Changing the position of the spacer tape guide roller so that the winding start position of the carrier tape wound on the carrier tape winding reel is set downstream in the winding direction from the winding start position of the carrier tape side process.
附图说明 Description of drawings
图1是表示本发明的第1实施方式的表示安装装置的概略结构的正视图。FIG. 1 is a front view showing a schematic configuration of a mounting device according to a first embodiment of the present invention.
图2是表示用来说明载带和间隔带相对于载带卷绕卷轴的卷绕位置的载带卷绕卷轴的图。FIG. 2 is a diagram showing a carrier tape winding reel for explaining the winding positions of a carrier tape and a spacer tape with respect to the carrier tape winding reel.
图3是表示上部间隔带导引辊的安装构造的部分剖开的侧视图。Fig. 3 is a partially cutaway side view showing the mounting structure of the upper spacer belt guide roller.
图4是表示本发明的第2实施方式的安装上部间隔带导引辊的安装部件的正视图。4 is a front view showing a mounting member for mounting an upper spacer belt guide roller according to a second embodiment of the present invention.
图5是表示本发明的第3实施方式的表示上部间隔带导引辊的安装孔像的侧视图。5 is a side view showing an image of an attachment hole of an upper spacer belt guide roller according to a third embodiment of the present invention.
图6是表示以往的安装装置的概略结构的正视图。Fig. 6 is a front view showing a schematic configuration of a conventional mounting device.
图7是放大表示载带的一部分的俯视图。Fig. 7 is an enlarged plan view showing a part of the carrier tape.
图8是用来说明安装部的安装的图。Fig. 8 is a diagram for explaining the attachment of the attachment portion.
具体实施方式 Detailed ways
以下,参照图1至图3说明本发明的第1实施方式。另外,对于与图6所示的以往的结构相同的部分标注相同的标号并省略说明。Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 3 . In addition, the same code|symbol is attached|subjected to the same part as the conventional structure shown in FIG. 6, and description is abbreviate|omitted.
如图1所示,本发明的安装装置具有设定卷绕在载带卷绕卷轴7上的间隔带4b的卷绕位置的上部间隔带导引辊15d。该上部间隔带导引辊15d比导引卷绕在载带卷绕卷轴7上的载带1的载带导引辊5b靠上方而配置,设置为可通过作为定位机构的安装部件21进行上下方向的定位调节。As shown in FIG. 1 , the mounting device of the present invention has an upper spacer
上述安装部件21是带板状,使长度方向沿着上下方向配设在载带卷绕卷轴7的侧方。如图3所示,在安装部件21上沿上下方向以规定间隔穿设有多个安装孔22。并且,在规定位置的安装孔22中,中间夹着垫片23a通过螺钉23安装固定有上述上部间隔带导引辊15d。The mounting
通过将上述上部间隔带导引辊15d安装在上述安装部件21上、配置在比上述载带导引辊5b靠上方,如图2所示,能够将间隔带4b在作为卷绕的外周面的载带卷绕卷轴7的卷绕芯7a上的卷绕位置X设定在比上述载带1的卷绕位置Y靠卷绕方向下游侧。By installing the above-mentioned upper spacer
这样,将间隔带4b的卷绕位置X向比载带1的卷绕位置Y靠卷绕方向下游侧错位。因此,如果旋转驱动载带卷绕卷轴7而开始卷绕,则在载带1接触卷绕外周面后载带卷绕卷轴7旋转了规定角度的时刻,将间隔带4b在卷绕外周面上与载带1重叠而卷绕。即,将间隔带4b比载带1延迟规定时间来卷绕在载带卷绕卷轴7上。In this way, the winding position X of the
因此,即使载带1一边在宽度方向上振动一边被卷绕到载带卷绕卷轴7上,也在载带1的振动收敛后、间隔带4b推压保持并卷绕载带1。结果,即使在卷绕时载带1振动,也能够防止通过间隔带4b将载带1在位置偏差的状态下推压保持并卷绕。Therefore, even if the carrier tape 1 is wound up on the carrier
卷绕在上述载带卷绕卷轴7上时的载带1的振动量根据载带1的厚度、宽度尺寸、材质(特别是柔性)或者重量等品种的差异而不同。The amount of vibration of the carrier tape 1 when wound on the carrier
如果载带1的振动量根据品种的差异而不同,则从载带1开始被卷绕到载带卷绕卷轴7上到其振动收敛所需的上述载带卷绕卷轴7的旋转角度不同。If the amount of vibration of the carrier tape 1 differs depending on the type, the rotation angle of the carrier
因而,在载带1的品种变更的情况下,变更上述上部间隔带导引辊15d在上述安装部件21上的安装位置。由此,能够在比载带1的卷绕位置Y靠卷绕方向的下游侧,变更上述间隔带4b推压保持卷绕在载带卷绕卷轴7上的载带1的位置、即间隔带4b在载带卷绕卷轴7上的卷绕位置X。Therefore, when the type of carrier tape 1 is changed, the mounting position of the above-mentioned upper spacer
例如,在载带1的品种例如变更为柔软的品种、卷绕时的振动量变大的情况下,将间隔带4b的卷绕位置变更为比图2所示的最初的卷绕位置X靠下游侧的位置X1。For example, when the type of the carrier tape 1 is changed to a soft type and the amount of vibration during winding becomes large, the winding position of the
由此,间隔带4b能够在卷绕在载带卷绕卷轴7上的载带1的振动收敛的时刻推压保持该载带1。As a result, the
在载带1变更为例如刚性较高的品种而振动量变小的情况下,将间隔带4b的卷绕位置变更为比最初的卷绕位置X靠上游侧的位置X2。When the carrier tape 1 is changed to, for example, a rigid type and the amount of vibration is reduced, the winding position of the
由此,间隔带4b能够在卷绕在载带卷绕卷轴7上的载带1的振动收敛的时刻推压保持该载带1。As a result, the
在载带1的振动较小时,也考虑不使间隔带4b的卷绕位置为X2、而为比X2靠下游侧的X1。在此情况下,载带1不是在其卷绕位置Y处振动收敛的时刻被间隔带4b推压保持,而是在从X2到X1被卷绕后被间隔带4b推压保持。When the vibration of the carrier tape 1 is small, it is conceivable not to set the winding position of the
因此,从载带1被卷绕到载带卷绕卷轴7上到被间隔带4b推压保持的旋转角度变大,所以有可能在此期间载带1在卷绕卷轴7的卷绕芯7a的外周面错位。因而,优选为载带1在振动收敛的时刻被间隔带4b推压保持。Therefore, since the rotation angle from when the carrier tape 1 is wound on the carrier
即,将上部间隔带导引辊15d在上述安装部件21上的安装位置设定为,使得即使因载带1的品种而振动的大小不同,也在其振动收敛的时刻由间隔带4b推压保持该载带1。That is, the mounting position of the upper spacer
由此,即使振动的大小因上述载带1的品种而不同,也能够可靠地防止在卷绕时载带1错位。Thereby, even if the magnitude of the vibration differs depending on the type of the above-mentioned carrier tape 1, it is possible to reliably prevent the carrier tape 1 from being misaligned during winding.
图4是表示作为定位机构的安装部件21的变形例的第2实施方式,在该实施方式中,在安装部件21上,代替第1实施方式所示的多个安装孔22而形成长孔25,能够沿着该长孔25变更上部间隔带导引辊15d的安装位置。FIG. 4 is a second embodiment showing a modified example of the mounting
根据这样的结构,能够无级地设定上部间隔带导引辊15d的安装位置。According to such a structure, the attachment position of the upper spacer
图5是表示定位机构的又另一变形例的第3实施方式,在该实施方式中,上部间隔带导引辊15d设在可动部件26上。该可动部件26设置为可沿着线性导引部27移动。在上述可动部件26上螺合有螺纹轴,该螺纹轴28被马达29旋转驱动。FIG. 5 is a third embodiment showing still another modified example of the positioning mechanism. In this embodiment, the upper spacer
因而,如果通过马达29旋转驱动螺纹轴28,则能够使可动部件26沿着线性导引部27移动,所以能够设定设在该可动部件26上的上部间隔带导引辊15d的位置。即,能够设定间隔带4b的卷绕位置。Therefore, if the threaded
另外,在图5所示的第3实施方式中,驱动可动部件26的机构也可以使用压力缸或线性马达等其他的驱动机构来代替螺纹轴。In addition, in the third embodiment shown in FIG. 5 , the mechanism for driving the
工业实用性Industrial Applicability
根据本发明,由于使卷绕在载带卷绕卷轴上的间隔带的卷绕位置比载带的卷绕位置靠卷绕方向的下游侧,所以载带在被卷绕到载带卷绕卷轴上后延迟地卷绕间隔带。因此,在载带的振动收敛后卷绕间隔带,所以能够不发生位置偏差地卷绕载带。According to the present invention, since the winding position of the spacer tape wound on the carrier tape winding reel is positioned on the downstream side in the winding direction than the winding position of the carrier tape, the carrier tape is wound up on the carrier tape winding reel. Wind the spacer tape with a delay. Therefore, since the spacer tape is wound after the vibration of the carrier tape has converged, the carrier tape can be wound without positional deviation.
进而,能够设定间隔带的卷绕位置。因此,即使振动的大小因载带的质量而不同,也能够将载带无错位地可靠地卷绕。Furthermore, it is possible to set the winding position of the spacer tape. Therefore, even if the magnitude of the vibration differs depending on the mass of the carrier tape, the carrier tape can be reliably wound without misalignment.
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005091976 | 2005-03-28 | ||
| JP091976/2005 | 2005-03-28 |
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| Publication Number | Publication Date |
|---|---|
| CN101133485A CN101133485A (en) | 2008-02-27 |
| CN100533700C true CN100533700C (en) | 2009-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006800066178A Expired - Fee Related CN100533700C (en) | 2005-03-28 | 2006-02-15 | Apparatus and method for mounting electronic component |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4700686B2 (en) |
| KR (1) | KR101095882B1 (en) |
| CN (1) | CN100533700C (en) |
| TW (1) | TWI385737B (en) |
| WO (1) | WO2006103839A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5059693B2 (en) * | 2008-06-06 | 2012-10-24 | Juki株式会社 | Parts supply device |
| US20150076273A1 (en) * | 2012-05-31 | 2015-03-19 | Hewlett-Packard Development Company, L.P. | Spooling process films |
| US10555449B2 (en) * | 2012-08-31 | 2020-02-04 | Young Soo Hwang | Apparatus for automatically supplying carrier tape comprising device for automatically exposing parts |
| JP6239362B2 (en) * | 2013-12-05 | 2017-11-29 | Juki株式会社 | Electronic component feeder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339244A (en) * | 1999-03-26 | 2002-03-06 | 松下电工株式会社 | Method and system for processing metal-cold laminate for printed-circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01187161A (en) * | 1988-01-19 | 1989-07-26 | Toshiba Corp | Constant amount transport apparatus for carrier tape |
| JPH06244246A (en) * | 1993-02-13 | 1994-09-02 | Shibuya Kogyo Co Ltd | Bonding device |
| JP3223780B2 (en) * | 1996-01-19 | 2001-10-29 | 松下電器産業株式会社 | Chip mounting equipment |
| JP2001127086A (en) * | 1999-10-26 | 2001-05-11 | Hitachi Cable Ltd | Method for manufacturing semiconductor device |
-
2006
- 2006-02-15 WO PCT/JP2006/302656 patent/WO2006103839A1/en not_active Ceased
- 2006-02-15 CN CNB2006800066178A patent/CN100533700C/en not_active Expired - Fee Related
- 2006-02-15 KR KR1020077019827A patent/KR101095882B1/en not_active Expired - Fee Related
- 2006-02-15 JP JP2007510334A patent/JP4700686B2/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339244A (en) * | 1999-03-26 | 2002-03-06 | 松下电工株式会社 | Method and system for processing metal-cold laminate for printed-circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101095882B1 (en) | 2011-12-21 |
| CN101133485A (en) | 2008-02-27 |
| JP4700686B2 (en) | 2011-06-15 |
| TW200711011A (en) | 2007-03-16 |
| JPWO2006103839A1 (en) | 2008-09-04 |
| WO2006103839A1 (en) | 2006-10-05 |
| TWI385737B (en) | 2013-02-11 |
| KR20070100824A (en) | 2007-10-11 |
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