CN100499977C - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- CN100499977C CN100499977C CNB2006100332727A CN200610033272A CN100499977C CN 100499977 C CN100499977 C CN 100499977C CN B2006100332727 A CNB2006100332727 A CN B2006100332727A CN 200610033272 A CN200610033272 A CN 200610033272A CN 100499977 C CN100499977 C CN 100499977C
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating fin
- plate
- heat abstractor
- infrabasal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000005494 condensation Effects 0.000 claims abstract description 17
- 238000009833 condensation Methods 0.000 claims abstract description 17
- 239000006096 absorbing agent Substances 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种散热装置，包括一吸热板，一导热体置于吸热板上，该导热体包括一与吸热板接触的下基板，一与下基板平行且相隔设置的上基板，一传热板连接下基板与上基板，该上基板朝向下基板垂直设有若干第一散热鳍片，若干第二散热鳍片垂直设于上基板顶部，还包括至少一热管，该热管包括一夹置于导热体上基板顶部与第二散热鳍片之间的冷凝段，该冷凝段垂直于所述第一、第二散热鳍片。
A heat dissipation device comprising a heat absorbing plate, a heat conducting body placed on the heat absorbing plate, the heat conducting body comprising a lower substrate in contact with the heat absorbing plate, an upper substrate parallel to and spaced apart from the lower substrate, a heat transfer The board is connected to the lower base plate and the upper base plate, and the upper base plate is vertically provided with a plurality of first heat dissipation fins facing the lower base plate, and a plurality of second heat dissipation fins are vertically arranged on the top of the upper base plate, and also includes at least one heat pipe, and the heat pipe includes a The condensation section between the top of the substrate on the heat conductor and the second heat dissipation fin is perpendicular to the first and second heat dissipation fins.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.
[background technology]
Produce big calorimetric during electronic component (as central processing unit) operation, and itself and system temperature are raise, cause its runnability to descend then.For guaranteeing that electronic component normally moves, radiator is installed on electronic component usually, discharge the heat that it produces.
The fan that a kind of traditional radiator comprises a base plate that contacts with electronic component, is located at the some fin on the base plate and is installed on the fin top.After the heat that electronic component operation produces is absorbed by base plate, be dispersed in the surrounding environment with cooling electronic components by fin, the fan operation produces air-flow and blows to fin scattering and disappearing with accelerated heat again.For promoting heat dispersion, increase the surface area of radiator by increasing heat sink sizes usually.Yet, thereby the size that increases fin will can make the increase of radiator volume take system's more space resource on the one hand, be subject to processing the restriction of technology on the other hand.
In addition, in the traditional heat-dissipating device because its distance from top electronic component is far away, the heat that electronic component produces through base plate can not be fast by the bottom biography of radiator to the top, cause radiator top utilance low, influence the integral heat sink performance of radiator.
[summary of the invention]
In view of this, be necessary to provide a kind of heat abstractor that can fast heat be reached its top by the radiator bottom.
A kind of heat abstractor, comprise an absorber plate, one heat carrier places on the absorber plate, this heat carrier comprises an infrabasal plate that contacts with absorber plate, one and the upper substrate of being separated by being provided with parallel with infrabasal plate, one heat transfer plate connects infrabasal plate and upper substrate, this upper substrate vertically is provided with some first radiating fins towards infrabasal plate, some second radiating fins are vertical at the upper substrate top, described heat abstractor also comprises at least one heat pipe, this heat pipe comprises that one is folded in the condensation segment between the heat carrier upper substrate top and second radiating fin, and this condensation segment is perpendicular to described first, second radiating fin.
Compared with prior art, the heat carrier of this heat abstractor is provided with the heat transfer plate that connects upper substrate and infrabasal plate, make heat be passed to the heat carrier top fast, this heat carrier top is respectively arranged with down and first and second radiating fin that is provided with up, heat is distributed to first and second radiating fin thereby the heat that is passed to the heat carrier top is passed fast, the overall heat dispersion of heat abstractor is promoted.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
[description of drawings]
Fig. 1 is the stereogram of radiator preferred embodiment of the present invention.
Fig. 2 is the front view of Fig. 1.
Fig. 3 is the three-dimensional exploded view of Fig. 1.
[embodiment]
See also Fig. 1 and Fig. 2, disclose the preferred embodiment of heat abstractor of the present invention.It comprises that a radiator 10 and is installed on the fan 20 of radiator 10 1 sides to this heat abstractor in order to central processing unit heat-generating electronic elements such as (figure do not show) is dispelled the heat.This radiator 10 comprises an absorber plate that contacts with electronic component 12, one places heat carrier 30 on the absorber plate 12, some first parallel radiating fins 36 are extended by heat carrier 30, some second radiating fins 38 place heat carrier 30 tops, and three U-shaped heat pipes 40 connect absorber plate 12, heat carrier 30 and second radiating fin 38.
See also Fig. 3, these absorber plate 12 rectangular tabulars, have a bottom surface that contacts with electronic component 120 and an end face 122, this end face 122 is formed with three grooves 124,12 4 jiaos of levels of this absorber plate are outward extended with four ears 126, can pass radiator 10 is fixed on the circuit board (figure does not show) for the screw element 50 that is arranged with spring 60.
This heat carrier 30 is " worker " font, it comprises an infrabasal plate 32 that contacts with absorber plate 12, one is parallel with infrabasal plate 32 and separate the upper substrate 34 that is provided with, the one vertical heat transfer plate 33 that connects infrabasal plate 32 and upper substrate 34, above-mentioned first radiating fin 36 goes out towards infrabasal plate 32 vertical extent from the lower surface of upper substrate 34, forms some first gas channels therebetween.The upper substrate 34 of this heat carrier 30, infrabasal plate 32, heat transfer plate 33 and first radiating fin 36 of being located at upper substrate 34 are one-body molded by the aluminium extruded processing mode, the free end of this first radiating fin 36 has a spacing apart from infrabasal plate 32, and the free end of this first radiating fin 36 is positioned on the infrabasal plate 32, this upper substrate 34 is long than infrabasal plate 32 along the length perpendicular to first radiating fin, 36 directions, the end face of this upper substrate 34 is formed with a pair of groove 342, and the groove 124 at corresponding absorber plate 12 tops 122, the bottom surface of this infrabasal plate 32 is formed with three grooves (figure does not show).Wherein thereby the heat transfer plate 33 vertical infrabasal plates 32 that connect make above-mentioned first radiating fin 36 be respectively in this heat transfer plate 33 both sides with upper substrate 34 middle parts.Second radiating fin 38 is vertically integrated in the end face of heat carrier 30 upper substrates 34, and this second radiating fin 38 is parallel to first radiating fin 36, forms some second gas channels therebetween.On these second radiating fin, 38 bottom surface correspondences
The groove 342 of substrate 34 end faces is formed with the top that a pair of groove 382, one through holes 380 are formed at second radiating fin, 38 grooves 342.
This heat pipe 40 comprises a pair of first heat pipe 42 and one second heat pipe 44, and this first and second heat pipe 42,44 comprises an evaporation section 420,440 respectively, one is parallel to the condensation segment 422,442 and a linkage section 423 of evaporation section 420,440,443 connect evaporation section 420,440 and condensation segment 422,442.This condensation segment 422,442 is perpendicular to described first, second radiating fin 36,38.Wherein, in the groove 124 that the evaporation section 420,440 of first and second heat pipe 42,44 is contained in absorber plate 12 and the common passage that forms of the groove of heat carrier 30 infrabasal plates 32, thereby make absorber plate 12 and heat carrier 30 bottom surface hot links; The condensation segment 422 of first heat pipe 42 is contained in the groove 382 common passages that form of the groove 342 of heat carrier 30 upper substrates 34 and second radiating fin 38; The condensation segment 442 of second heat pipe 44 passes the through hole 380 of second radiating fin 38.
This fan 20 is installed on radiator 10 1 sides, the axis direction of this fan 20 and first and second radiating fin 36, the 38 gas channel direction unanimities that form, make the air-flow of its generation blow to first and second radiating fin 36, in 38 the gas channel to promote the radiating efficiency of first and second radiating fin 36,38.
When this heat abstractor was applied to heat-generating electronic elements, the bottom surface 120 contact electronic components of absorber plate 12 absorbed heat; The evaporation section 420,440 of the heat transferred that absorber plate 12 absorbs first and second heat pipe 42,44 on it; Evaporation section 420, the 440 a part of heat transferred that absorb are to the infrabasal plate 32 of the heat carrier 30 that is in contact with it, heat on the infrabasal plate 32 is passed on the upper substrate 34 of heat carrier 30 rapidly by the heat transfer plate 33 that links to each other with infrabasal plate 32 then, be passed on first and second radiating fin 36,38 by upper substrate 34 again and heat is distributed; Another part heat that the evaporation section 420 of first heat pipe 42 absorbs directly reaches the bottom surface of heat carrier 30 end faces and second radiating fin 38 by its linkage section 423 and condensation segment 422, the heat of heat carrier 30 end faces is passed to first radiating fin 36 rapidly, so heat outwards distributes by first and second radiating fin 36,38; Another part heat that the evaporation section 440 of second heat pipe 44 absorbs directly reaches second radiating fin 38 by its linkage section 443 and condensation segment 442 and outwards distributes.
Heat abstractor of the present invention adopts the aluminium extruded type heat carrier 30 that is " worker " shape and combines with heat pipe 40, the heat that heat-generating electronic elements is produced is passed to the top of radiator 10 rapidly, the transmission of accelerated heat, thereby quicker more effective and more timely heat is taken away, improve the heat dispersion of entire heat dissipation device.
Claims (12)
1. heat abstractor, comprise an absorber plate, one heat carrier places on the absorber plate, this heat carrier comprises an infrabasal plate that contacts with absorber plate, one and the upper substrate of being separated by being provided with parallel with infrabasal plate, one heat transfer plate connects infrabasal plate and upper substrate, this upper substrate vertically is provided with some first radiating fins towards infrabasal plate, some second radiating fins are vertical at the upper substrate top, it is characterized in that: also comprise at least one heat pipe, this heat pipe comprises that one is folded in the condensation segment between the heat carrier upper substrate top and second radiating fin, and this condensation segment is perpendicular to described first, second radiating fin.
2. heat abstractor as claimed in claim 1 is characterized in that: form gas channel respectively between described first radiating fin and between second radiating fin.
3. heat abstractor as claimed in claim 1 is characterized in that: the free end of described first radiating fin is positioned on the described infrabasal plate.
4. heat abstractor as claimed in claim 1 is characterized in that: described upper substrate is along long perpendicular to the more described infrabasal plate of the length of the first radiating fin direction.
5. as each described heat abstractor in the claim 1 to 4, it is characterized in that: the parallel both sides that are distributed in the heat carrier heat transfer plate of described first radiating fin.
6. heat abstractor as claimed in claim 5 is characterized in that: described heat transfer plate connects the middle part of upper substrate and infrabasal plate, makes heat carrier be " worker " font.
7. heat abstractor as claimed in claim 3 is characterized in that: between described first radiating fin free end and the infrabasal plate spacing is arranged.
8. heat abstractor as claimed in claim 1 is characterized in that: described first radiating fin is parallel to second radiating fin.
9. heat abstractor as claimed in claim 1 is characterized in that: the described upper and lower substrate and first radiating fin are one-body molded by the aluminium extruded processing mode.
10. heat abstractor as claimed in claim 1, it is characterized in that: described heat pipe comprises that one is folded in the linkage section of evaporation section and between evaporation section and described condensation segment between the infrabasal plate of absorber plate and heat carrier, and this evaporation section and condensation segment are parallel to each other.
11. heat abstractor as claimed in claim 10, it is characterized in that: also comprise another heat pipe, this another heat pipe comprises that one is folded in the evaporation section between the infrabasal plate of absorber plate and heat carrier, one runs through the linkage section of condensation segment and between evaporation section and condensation segment of second radiating fin, and this evaporation section and condensation segment are parallel to each other.
12. heat abstractor as claimed in claim 2 is characterized in that: described heat abstractor comprises that further one places the fan of first and second radiating fin one side, and the axis direction of this fan is consistent with the gas channel direction that first and second radiating fin forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100332727A CN100499977C (en) | 2006-01-18 | 2006-01-18 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100332727A CN100499977C (en) | 2006-01-18 | 2006-01-18 | Heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101005751A CN101005751A (en) | 2007-07-25 |
| CN100499977C true CN100499977C (en) | 2009-06-10 |
Family
ID=38704535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100332727A Expired - Fee Related CN100499977C (en) | 2006-01-18 | 2006-01-18 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100499977C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101749980B (en) * | 2008-12-22 | 2012-12-26 | 富准精密工业(深圳)有限公司 | Radiating fin, radiator and electronic device |
| CN102819302A (en) * | 2011-06-09 | 2012-12-12 | 富准精密工业(深圳)有限公司 | Radiator |
| CN106052433A (en) * | 2016-05-11 | 2016-10-26 | 北京文本至远科技有限公司 | Novel condensing system for cooling copper pipes |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN108008797A (en) * | 2018-01-04 | 2018-05-08 | 钦州学院 | Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface |
| CN109253416A (en) * | 2018-10-12 | 2019-01-22 | 深圳益明光电技术有限公司 | A kind of efficient easy cleaning LED bay light |
| CN110778976A (en) * | 2019-12-12 | 2020-02-11 | 惠州市弗朗特光电科技有限公司 | Front lighting car lamp |
| CN116683264B (en) * | 2023-06-06 | 2024-01-23 | 深圳市格镭激光科技有限公司 | Solid laser convenient to cool down |
| CN117267689B (en) * | 2023-09-28 | 2024-04-12 | 惠州市拉图影视器材有限公司 | Spotlight with high-efficient heat radiation structure |
| CN119451065B (en) * | 2025-01-13 | 2025-05-02 | 深圳精智达技术股份有限公司 | Heat radiation structure and imaging device |
-
2006
- 2006-01-18 CN CNB2006100332727A patent/CN100499977C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101005751A (en) | 2007-07-25 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090610 Termination date: 20150118 |
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| EXPY | Termination of patent right or utility model |