CN100488335C - Multi-step printed circuit board of probe card - Google Patents

Abstract

A multi-stage printed circuit board of a probe card, comprising: a clamping body, in which the circuit wiring with preset pattern is formed, and its periphery can be clamped by a testing machine; the body is connected to the lower part of the clamping body which is not clamped, so that a step-shaped fall is formed between the clamping body and the periphery of the body, and the conducting line is electrically conducted with the circuit wiring.

Description

Multi-stage printed circuit board for probe cards

technical field

The present invention is related to a probe card, and more specifically refers to a multi-level printed circuit board of a probe card.

Background technique

General integrated circuits must first pass the circuit test by the probe card before packaging, through which defective products can be screened out and the yield rate of the final product can be improved.

However, the structure of a general vertical probe card roughly includes a printed circuit board (PCB), a transfer substrate (Substrate) and a vertical probe head (Probe Head), wherein the transfer substrate is based on one of the One side is connected to the circuit board and is electrically connected with the circuit board, and the vertical probe base is connected to the other side of the adapter substrate, through the vertical probe base built in the vertical probe base The probes can be electrically connected with the circuit board through the adapter substrate. However, since the circuit board needs to be clamped by the test machine, the entire probe card can be stabilized, but because the size of the test machine that can be clamped is limited, the thickness of the circuit board must meet the limit that can be clamped Inside. Moreover, since the transfer substrate is laminated by build-up to increase its thickness, the thickness of the dielectric raw material for each build-up is limited to 30-60 μm, and in order to cope with the transfer The base plate must be able to be drilled by a laser, etc., so the thickness of the interposer base plate is generally limited to 0.8-1.1 mm. In this way, when the thickness of the circuit board and the interposer substrate are limited and the probes of the probe base cannot be too long, it often happens that the test machine cannot be moved to the lowest starting point. The probes of the probe base are in contact with the integrated circuit to be tested, so that the probe card cannot perform the testing operation at all.

Therefore, in order to solve the above-mentioned shortcomings, some operators have used solder balls to join the two circuit boards or interposer substrates for high-temperature reflow soldering, so that the two circuit boards or interposer substrates can be electrically connected by solder balls. ; However, although the overall thickness of the probe card can be increased by using this method, it also has some defects: first, the two circuit boards or the transfer substrate are electrically connected by solder balls, which will make the electrical connection Second, after the solder balls are reflowed, it is easy to cause gaps between the two circuit boards or the transfer substrate due to the different sizes of the solder balls due to the technical and process conditions. The levelness is not good; thirdly, after using solder balls for reflow soldering, the bonding force of the solder balls is easy to be different due to the operating conditions of the materials, and because the thickness of the transfer substrate is thin, it is easy to be damaged or cause damage due to impact. The situation that the solder ball falls off occurs; Fourth, the reflow of the solder ball will lead to an increase in the process and cost at the same time.

Contents of the invention

In view of this, the main purpose of the present invention is to provide a multi-level printed circuit board of a probe card, which can increase the overall thickness of the probe card under the condition of meeting the test specifications of the existing test machine, so as to solve the test problem. The problem of insufficient depth.

Another object of the present invention is to provide a multi-level printed circuit board of a probe card, which can avoid excessive reflection and lack of oxidation caused by the transmission line of electrical signals being exposed to the external environment.

The reason is that, in order to achieve the above-mentioned purpose, a multi-stage printed circuit board of a probe card of the present invention includes: a clamping body with a predetermined pattern of circuit wiring formed inside, and its periphery can be clamped by a test machine holding; a proliferating body, which is formed with a predetermined pattern of conductive lines inside, and the proliferating body is connected below the part of the clamping body that is not clamped, so that the clamping body and the periphery of the proliferating body form a shape There is a stepped drop, and the conducting line is electrically connected to the circuit wiring.

In order to have a further understanding and recognition of the characteristics and purposes of the present invention, the following preferred embodiments are listed below, and are described in conjunction with the drawings:

Description of drawings

Fig. 1 is the three-dimensional exploded view of the first preferred embodiment of the present invention;

Fig. 2 is the three-dimensional assembly diagram of the preferred embodiment shown in Fig. 1;

Fig. 3 is the assembled sectional view of preferred embodiment shown in Fig. 1;

Fig. 4 is the combined sectional view of the second preferred embodiment of the present invention;

Fig. 5 is a three-dimensional assembled view of the third preferred embodiment of the present invention.

Detailed ways

Please refer to FIG. 1 to FIG. 3 , which is a multi-step printed circuit board 100 of a probe card provided by the first preferred embodiment of the present invention, which mainly includes a clamping body 10 and a growth body 20, wherein:

The clamping body 10 is a printed circuit board (Printed Circuit Board, PCB) with a predetermined outline, which can define a first end surface 11 and a second end surface 12 opposite to the first end surface 11, The clamping body 10 can be made of materials such as FR-4, FR-5 or Polyimide (PI), BT, etc., which are laminated under high pressure and high temperature. Stated and electrically connected circuit wiring 13 is shown in FIG. 3 , and at the center positions of the first end surface 11 and the second end surface 12, connection terminals 14 are respectively formed in a predetermined range and electrically connected to the circuit wiring; The thickness of the clamping body 10 is within the size range that can be clamped by the test machine (about 3.2 mm to 7.0 mm), and its width is within 6 o'clock to 17 o'clock, so that the periphery of the clamping body 10 It can be clamped by the test machine.

The growth body 20 is a printed circuit board (Printed Circuit Board, PCB) with a predetermined profile, and its profile is smaller than the clamping body 10, and the growth body 20 can define a top surface 21 and a The top surface 21 is opposite to the bottom surface 22. The accretion body 20 can be made of materials such as FR-4, FR-5 or Polyimide (PI), BT, etc., which are laminated under high pressure and high temperature. During the process, a conducting line 23 (see FIG. 3 ) in a predetermined shape and electrically connected is formed, and a predetermined range is formed at the middle position of the top surface 21 and the bottom surface 22, which is connected to the conducting line. The connecting terminal 24 of the wiring 23 is electrically connected; the thickness of the growth body 20 is about 0.5mm-6.0mm, and its width is about 16mm.

Therefore, the above is the main components of the multi-stage printed circuit board 100 of the probe card provided by the present invention, and then its assembly type, usage method and characteristics are introduced as follows:

First of all, since the type and position of the junction point 23 formed on the top surface 21 of the growth body 20 are the same as the shape and position of the connection point 13 formed on the second end surface 12 of the clamping body 10, the growth point can be The joint end point 23 on the top surface 21 of the living body 20 is pressed with the connection end point 13 of the second end surface of the clamping body 10 (the press fit can utilize the film (PP) of the PCB process to carry out high temperature and high pressure combination), so that the clamping The main body 10 and the growth body 20 are integrated, and the circuit wiring 13 and the conductive line 23 inside the body 10 and the growth body 20 are sandwiched and electrically connected to each other. At this time, a step-like drop is naturally formed between the second end surface 12 of the clamping body 10 and the periphery of the growth body 20 because the width of the growth body 20 is smaller than the width of the clamping body 10. The periphery of the clamping body 10 within the drop range can be used for clamping by a test machine 50; in addition, an adapter substrate 30 (Substrate) (since the adapter substrate is an existing component and has a general predetermined specification) shape and space conversion function, so I won’t go into details here) one end surface is pressed and connected with the bottom surface 22 of the growth body 20, so that the adapter substrate 30 can be electrically connected with the growth body 20 and the clamping body 10. Sexual conduction, and finally a probe seat 40 (Probe Head) with a number of predetermined vertical probes 41 built in is connected to the other end surface of the adapter substrate, so that one end of the probe 41 is connected to the The adapter substrate 30 is electrically connected, and the other end is exposed for contact with the object to be tested, which is not shown in the figure, and can be used for contacting an integrated circuit; finally, connect the connection terminal 14 on the first end surface 11 of the clamping body 10 with the test The machine is electrically connected so that the electrical signal of the object under test measured by the probe 41 can be transmitted to the testing machine for interpretation.

Through this, the growth body 20 in the present invention can increase the overall thickness without affecting the limited thickness dimension of the clamping body 10 to be clamped. In other words, the distance between the probe 41 and the clamping body 10 clamped on the testing machine 50 can be lengthened, so that the problem of insufficient testing depth of the testing machine can be solved.

Moreover, since the growth body 20 and the clamping body 10 are connected by high temperature and high pressure pressing, and this procedure is an existing process of printed circuit board (PCB), no additional procedures and costs are required. Moreover, since the circuit wiring 13 and the conductive line 23 that are electrically connected between the clamping body 10 and the growth body 20 are all formed inside without any exposed welding, there will be no signal reflection or loss. The situation when the quality is poor. In addition, since the accretion body 20 and the clamping body 10 are pressed together, the precisely polished steel plate is used for positioning, so the flatness of the finished product after pressing is better. Secondly, since the growth body 20 and the clamping body 10 are pressed together by high temperature and high pressure, the bonding strength between the two is better than that of reflow welding;

Please refer to FIG. 4 again, which is the second preferred embodiment of the present invention, which is different from the above-mentioned embodiments in that the design of the transfer substrate 30 (Substrate) is directly omitted, and the original design is placed on the transfer substrate 30 (Substrate). The circuit is directly designed in an accretion body 20, which can save the purchase cost.

Please refer to FIG. 5 , which is a multi-step printed circuit board 200 of a probe card provided by the third preferred embodiment of the present invention, which includes a clamping body 60 and a growth body 70 the same as the previous embodiment. The main differences are:

The clamping body 60 and the growth body 70 are integrally made. That is to say, the thickness of the clamping body 60 when it is made is larger than the thickness that can be clamped by the test machine in general, but then the lower part of the clamping body 10 that is to be clamped is removed by using the removal method There are many, and any method that can partially remove the printed circuit board can be removed. In this way, the central lower part of the clamping body 60 is not reserved for the clamping position of the test machine, and a protruding growth body 70 is formed naturally, and The same purpose as the previous embodiment can be achieved.

Claims (16)

1. A multi-stage printed circuit board of a probe card, characterized in that it comprises: A clamping body, with a predetermined pattern of circuit wiring formed inside, and its periphery is clamped by a test machine; A growth body, with a predetermined pattern of conductive lines formed inside, the growth body is connected below the part of the clamping body that is not clamped, so that a stepped shape is formed between the clamping body and the periphery of the growth body drop, and the conducting line is electrically connected to the circuit wiring. 2. According to the multi-stage printed circuit board of the probe card according to claim 1, it is characterized in that, the clamping body can be made of one of FR-4, FR-5 or Polyimide BT under high pressure and high temperature. Laminated and laminated. 3. According to the multi-stage printed circuit board of the probe card according to claim 1, it is characterized in that, the growth body can be increased by high pressure and high temperature by one of the materials of FR-4, FR-5 or Polyimide BT. Laminated. 4. According to the multi-step printed circuit board of the probe card according to claim 1, wherein the clamping body can define a first end surface and a second end surface opposite to the first end surface, And at the position where the first end surface and the second end surface are not clamped, respectively form connection terminals in a predetermined range and electrically connected with the circuit wiring, the connection terminals on the first end surface are used for connecting with the test The machine is electrically connected, and the connection terminal on the second end surface is used to electrically communicate with the conductive line of the growth body. 5 . The multi-stage printed circuit board of the probe card according to claim 1 , wherein the thickness of the clamping body is within 3.2 mm˜7.0 mm. 6 . The multi-stage printed circuit board of the probe card according to claim 1 , wherein the width of the clamping body is within 6 o'clock to 17 o'clock. 7 . The multi-level printed circuit board of the probe card according to claim 1 , wherein an outline of the growth body is smaller than an outline of the clamping body. 8 . 8. According to the multi-level printed circuit board of the probe card according to claim 1, it is characterized in that, the growth body can define a top surface and a bottom surface opposite to the top surface, the top surface and the bottom surface Joint terminals are respectively formed in a predetermined range and electrically communicated with the conductive line, the joint terminals on the top surface are used to electrically communicate with the circuit wiring of the clamping body, and the joint terminals on the bottom surface are used for It is electrically connected with an interposer substrate. 9 . The multi-stage printed circuit board of the probe card according to claim 1 , wherein the thickness of the growth body is within 0.5 mm˜6.0 mm. 10 . The multi-level printed circuit board of the probe card according to claim 1 , wherein the width of the growth body is within 16 inches. 11 . 11 . The multi-stage printed circuit board of the probe card according to claim 1 , wherein the clamping body and the growth body are connected by a high temperature and high pressure film. 11 . 12 . The multi-stage printed circuit board for the probe card according to claim 1 , wherein when the growth body is connected to the clamping body, it is positioned by a precisely polished steel plate. 13 . 13. According to the multi-step printed circuit board of the probe card according to claim 1, it is characterized in that, the clamping body and the growth body are made integrally; the predetermined lower part of the clamping body is removed After the thickness is removed, the unremoved part of the same side is naturally formed into the hyperplasia. 14. A probe card, characterized in that it comprises: A multi-step printed circuit board, the multi-step printed circuit board has a clamping body and a growth body; a predetermined pattern of circuit wiring is formed inside the clamping body, and its periphery is clamped by a testing machine; the The accretion body has a conductive circuit of a predetermined pattern formed inside, the proliferative body is connected to the bottom of the part where the clamping body is not clamped, and the conductive circuit is electrically connected to the circuit wiring, so that A step-like drop is formed between the clamping body and the periphery of the growth body; An adapter substrate, one end surface of which is connected to the other end surface of the growth body, so that the adapter substrate can conduct electrical conduction with the growth body and the clamping body; A probe base, a predetermined number of vertical probes are built in the probe base, and one end surface of the vertical probe is connected to the other end surface of the transfer substrate, so that the vertical probe and The growth body is electrically connected, and the other end surface of the vertical probe is exposed for contacting with an object to be measured. 15. According to the multi-stage printed circuit board of the probe card according to claim 14, it is characterized in that, the clamping body is electrically connected with the test machine, so that the electrical signal of the object under test measured by the probe It can be transmitted to the test machine for interpretation. 16. A clamping method for a probe card, characterized in that: First provide a probe card, the probe card has a multi-level printed circuit board, the multi-level printed circuit board has a holding body and a growth body; the inside of the holding body is formed with a predetermined pattern of circuit wiring ; The growth body is formed with a predetermined pattern of conductive lines inside, and one end of the growth body is connected below the part of the clamping body that is not clamped, and the conductive line is electrically connected to the circuit wiring , so that a step-like drop is formed between the clamping body and the periphery of the growth body; a probe base, a predetermined number of vertical probes are built in the probe base, so that the vertical probe One end surface of the vertical probe is connected to the other end surface of the growth body, so that the vertical probe is electrically connected to the growth body, and the other end surface of the vertical probe is exposed for contact with an object to be measured; placing the probe card on a test machine so that the periphery of the clamping body can be clamped by the test machine; Then, the circuit wiring of the clamping body is electrically connected with the test machine, so that the electrical signal of the object under test measured by the probe can be transmitted to the test machine for interpretation.

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