CN100383960C - heat pipe - Google Patents
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- CN100383960C CN100383960C CNB2004100273645A CN200410027364A CN100383960C CN 100383960 C CN100383960 C CN 100383960C CN B2004100273645 A CNB2004100273645 A CN B2004100273645A CN 200410027364 A CN200410027364 A CN 200410027364A CN 100383960 C CN100383960 C CN 100383960C
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- seat
- heat pipe
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetic Pumps, Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Reciprocating Pumps (AREA)
Abstract
一种热导管,包括一装有工作液体的管体,该管体一端为吸热端,另一端为放热端;其中该管体一末端内设有一容积可变的泵体,该管体外靠近上述管体的末端设有电磁开关,该泵体包括一磁性膜片,该电磁开关产生磁场,该磁场驱动磁性膜片运动,使泵体内的容积产生变化。本发明热导管通过泵体内容腔容积的变化驱动工作液体运动,故本发明能够在较低温度下工作,且可增加工作液体流动动力,从而具有较好的散热效果。
A heat pipe, comprising a tube body filled with a working liquid, one end of the tube body is a heat-absorbing end, and the other end is a heat-radiating end; wherein a pump body with a variable volume is arranged inside one end of the tube body, and the outside of the tube body is An electromagnetic switch is provided near the end of the above-mentioned tube body. The pump body includes a magnetic diaphragm. The electromagnetic switch generates a magnetic field. The magnetic field drives the magnetic diaphragm to move to change the volume in the pump body. The heat pipe of the present invention drives the movement of the working liquid through the change of the volume of the inner chamber of the pump body, so the present invention can work at a lower temperature, and can increase the flow power of the working liquid, thereby having a better heat dissipation effect.
Description
【技术领域】 【Technical field】
本发明是关于一种热导管,尤其是指一种应用于电子元件散热的热导管。The invention relates to a heat pipe, in particular to a heat pipe used for heat dissipation of electronic components.
【背景技术】 【Background technique】
随着电子信息业不断发展,电子元件运行频率和速度也在不断提升。高频高速将使电子元件产生的热量越来越多,温度也越来越高,如何将电子元件的热量散发出去,以保证其正常运作,一直是业界在研究的问题。传统的散热方式是单纯依靠金属材质的散热器传导热量,由于金属的热传导系数有限,导致散热器在单位时间、单位体积下的热传导量也有限。传统的纯金属散热器散热方式已不能满足高发热量电子元件的散热需求。With the continuous development of the electronic information industry, the operating frequency and speed of electronic components are also increasing. High frequency and high speed will make electronic components generate more and more heat, and the temperature will become higher and higher. How to dissipate the heat of electronic components to ensure their normal operation has always been a research problem in the industry. The traditional way of heat dissipation is to rely solely on metal heat sinks to conduct heat. Due to the limited thermal conductivity of metals, the amount of heat conduction per unit time and unit volume of the heat sink is also limited. The traditional heat dissipation method of pure metal heat sink can no longer meet the heat dissipation requirements of high calorific electronic components.
目前业内技术人士常用热管为电子元件散热,热管利用液体在汽液两态间转变时温度保持不变,同时吸收或放出大量热的原理将电子元件产生的热量散失掉。图1所示为习知热管结构示意图,热管120包括一密封低压管形壳体121,该壳体121内设有毛细结构122并充有适量的工作液体123。热管120一端为蒸发段130,另一端为冷凝段132,根据工作需要在两段中间可布置绝热段131。当热管120蒸发段130受热时毛细结构122中的工作液体123蒸发汽化,蒸汽在微小压差下流向冷凝段132放出热量后凝结成液体,液体在毛细结构122毛细力作用下回流到蒸发段130,从而使热量由热管120蒸发段130迅速传至冷凝段132。热管120利用工作液体123的汽、液两相变化可以将大量的热量通过其较小的截面积远距离的传输,且热阻较小,具有优良的等温性能和较高的导热性能,与铜、银、铝等金属相比,单位重量的热管120可以传递几个数量级的热量。这种热管也有其不足之处,热管通过工作液体的相变化传递热量,故热管有一定的起始工作温度,一般热管的起始工作温度约在30~40度左右,在热管未达到一定温度时,其内的工作液体不会产生相变化传递热量,从而在热管的蒸发端造成热量的累积影响对发热元件进行散热,为提高热管对发热元件的散热效果需降低热管的起始温度即降低工作液体的沸点,在工作液体一定的条件下可通过提高热管内的真空度以降低工作液体的沸点,但提高热管内的真空度对热管的材料、热管的漏率及其结构强度等具有较高要求,而且生产的成本高,因而并不实用。而且热管依靠其毛细结构的毛细力为工作液体提供流动的动力,随着发热元件产生的热量不断激增,毛细结构已不能提供足够大的毛细力驱动工作液体流动,导致热管各种传热极限的产生,从而影响热管的导热性能。故如何降低热管的起始工作温度即如何使热管可在较低温度下工作及如何提高工作液体的流动动力是进一步提升热管性能的急需解决的问题。At present, technicians in the industry often use heat pipes to dissipate heat from electronic components. Heat pipes use the principle that the temperature of liquid remains unchanged when it changes between vapor and liquid, and absorb or release a large amount of heat at the same time to dissipate the heat generated by electronic components. FIG. 1 is a schematic diagram of the structure of a conventional heat pipe. The
【发明内容】 【Content of invention】
本发明的目的在于提供一种能够在较低温度下工作,且可增加工作液体流动动力的热导管。The object of the present invention is to provide a heat pipe that can work at a lower temperature and can increase the flow power of the working fluid.
本发明的目的是通过以下技术方案实现的:本发明的热导管包括一装有工作液体的管体,该管体一端为吸热端,另一端为放热端;其中该管体一末端内设有一容积可变的泵体,该管体外靠近上述管体的末端设有电磁开关,该泵体包括一磁性膜片,该电磁开关产生磁场,该磁场驱动磁性膜片运动,使泵体内的容积产生变化。The object of the present invention is achieved through the following technical solutions: the heat pipe of the present invention includes a tube body filled with working liquid, one end of the tube body is a heat-absorbing end, and the other end is a heat-dissipating end; A pump body with variable volume is provided, and an electromagnetic switch is arranged outside the tube body near the end of the tube body. The pump body includes a magnetic diaphragm. The electromagnetic switch generates a magnetic field, and the magnetic field drives the magnetic diaphragm to move, so that volume changes.
与习知技术相比,本发明热导管包括一泵体,通过泵体容积的变化驱动工作液体运动,故本发明热导管在吸热端未达到工作液体沸点时就可工作,避免热量在吸热端累积从而提升对被冷却元件的散热效果;同时,本发明热导管利用泵体容积的变化驱动工作液体,可提供较大的动力使工作液体循环运动,从而可极大的提高热导管的散热效果。Compared with the conventional technology, the heat pipe of the present invention includes a pump body, which drives the movement of the working liquid through the change of the volume of the pump body, so the heat pipe of the present invention can work when the heat-absorbing end does not reach the boiling point of the working liquid, so as to avoid heat loss in the heat-absorbing end. The hot end accumulates to improve the heat dissipation effect on the cooled element; at the same time, the heat pipe of the present invention uses the change of the volume of the pump body to drive the working fluid, which can provide greater power to circulate the working liquid, thereby greatly improving the performance of the heat pipe. heat radiation.
下面参照附图结合实施例对本发明作进一步的描述。The present invention will be further described below with reference to the accompanying drawings and embodiments.
【附图说明】 【Description of drawings】
图1是习知热管结构示意图。FIG. 1 is a schematic diagram of a conventional heat pipe structure.
图2是本发明热导管第一实施例的工作状态示意图。Fig. 2 is a schematic view of the working state of the first embodiment of the heat pipe of the present invention.
图3是图2中热导管下一刻的工作状态示意图。FIG. 3 is a schematic diagram of the working state of the heat pipe in FIG. 2 at the next moment.
图4是本发明热导管第二实施例的结构示意图。Fig. 4 is a schematic structural diagram of the second embodiment of the heat pipe of the present invention.
【具体实施方式】 【Detailed ways】
请一起参考图2至图3,本发明热导管10包括一电磁开关100及一管体200,该管体200包括一与被冷却电子元件15接触的吸热端280及位于管体200一端且与吸热端280相对的放热端270,上述电磁开关100位于管体200外靠近吸热端280一侧。其中,该管体200包括一壳体220、填充于壳体220内的工作液体222及位于管体200一端且固定于壳体220上临近吸热端280一端的一泵体230。该泵体230包括一座体240及一磁性膜片246,该泵体230通过其座体240固定于壳体220上,该磁性膜片246可由镍化铁等磁性材料制成,通过其上的AB、CD外缘部分固定于座体240上。该座体240包括一底座241、一顶座242及设于两者之间的若干膜片244。上述磁性膜片246、顶座242及膜片244形成一容积可变的容腔248,且在底座241、顶座242上分别设有通口250、252、253及258、259、260等,这些膜片244分别与底座241及顶座242上相对应的通口250、252、253及258、259、260形成单向阀254、256及264,从而构成工作液体222的流动通道。Please refer to FIG. 2 to FIG. 3 together. The
本发明的热导管10在使用过程中,通过电磁开关100的开与关产生方向相反的磁场以驱动磁性膜片246来回运动,使容腔248的容积在膨胀、压缩两个状态间转换,从而使工作液体222被吸入或排出容腔248,其具体过程如图2及图3。图2所示为容腔248吸入工作液体222状态:电磁开关100产生磁场使磁性膜片246向电磁开关100所在方向运动,从而导致容腔248体积增大,使容腔248内的压强低于管体200内其它部分的压强,在压差作用下使单向阀254及256打开,单向阀264关闭,从而在单向阀254及256处形成使容腔248与管体200内其它部分连通的两条通路,吸热端280内的工作液体222沿这两条通路被吸入到容腔248内,放热端270内被冷却的工作液体222流向吸热端280从而降低吸热端280的温度,当容腔248内的压强与管体200内其它部分的压强达到平衡时,单向阀254及256关闭,完成吸液过程,容腔248将把其内的工作液体222排出。图3所示为容腔248将其内的工作液体222排出状态:电磁开关100关闭产生一同上述磁场方向相反的磁场,驱动磁性膜片246向放热端270运动,容腔248容积压缩变小,使容腔248内的压强高于管体200内其它部分的压强,在压差作用下使单向阀264打开,单向阀254及256关闭,从而在单向阀264处形成使容腔248与管体200内其它部分连通的一条通路,容腔248内的较热的工作液体222沿这条通路被排出容腔248流向放热端270,使较热的工作液体222在放热端270放出热量冷却,当容腔248内的压强与管体200内其它部分的压强达到平衡时,单向阀264关闭,完成排液过程,容腔248将吸入工作液体222重复图2所示工作过程,如此不断循环,从而使工作液体222在管体200放热端270与吸热端280之间往复运动。图中所示挡板243、245及262具有保护作用:在容腔248吸入或排出工作液体222的过程中,可避免由于工作液体222流速过高,冲击膜片244造成单向阀254等的损坏。During the use of the
图4是本发明热导管第二实施例,该热导管10A与第一实施例的不同之处在于泵体的结构。该热导管10A的泵体230A包括座体240A及一磁性膜片246,该座体240A包括一底座241A、一顶座242A及设于两者之间的若干膜片244A与固定在底座241A另侧的膜片244B。底座241上相应设有若干通道与其对应的膜片244A或244B分别构成单向阀254A、256A、264A。如上述的工作过程,控制电磁开关100的开与关即可驱动工作液体在管体放热端与吸热端之间往复运动。由于本实施例中未设有挡板243、245及262等保护结构,故本实施例的热导管10A适于在工作液体222流速较低的情况下使用。Fig. 4 is the second embodiment of the heat pipe of the present invention, the
上述为本发明热导管的两个具体实施例,但本发明热导管并不仅限于此,上述两个实施例中包括两个液体流入的单向阀与一个液体流出的单向阀,根据需要可改变控制液体流入、流出的单向阀的数量以及通过改变膜片与座体的结合方式,可得到相同的单向阀结构,且磁性膜片246可直接固定于膜片上;容腔吸入或排出液体的力的大小与容腔容积变化率有关,可依据热导管横截面尺寸对其进行调整以获得需要的液体流速,从而控制热导管的冷却效果;此外,该泵体还可以设在管体放热端一侧。The above are two specific embodiments of the heat pipe of the present invention, but the heat pipe of the present invention is not limited thereto. The above two embodiments include two one-way valves for liquid inflow and one one-way valve for liquid outflow. The same check valve structure can be obtained by changing the number of one-way valves that control the inflow and outflow of the liquid and by changing the combination of the diaphragm and the seat, and the
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100273645A CN100383960C (en) | 2004-05-18 | 2004-05-18 | heat pipe |
| US11/014,427 US20050257916A1 (en) | 2004-05-18 | 2004-12-17 | Heat conductive pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100273645A CN100383960C (en) | 2004-05-18 | 2004-05-18 | heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1700455A CN1700455A (en) | 2005-11-23 |
| CN100383960C true CN100383960C (en) | 2008-04-23 |
Family
ID=35374073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100273645A Expired - Fee Related CN100383960C (en) | 2004-05-18 | 2004-05-18 | heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20050257916A1 (en) |
| CN (1) | CN100383960C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103427556A (en) * | 2013-09-02 | 2013-12-04 | 南京磁谷科技有限公司 | High-power high-speed electric machine and high-power high-speed draught fan |
| CN104538372B (en) * | 2014-12-29 | 2018-05-22 | 华进半导体封装先导技术研发中心有限公司 | Heat-radiation type package structure and preparation method thereof, heat radiating type package substrate |
| CN107462095A (en) * | 2017-08-31 | 2017-12-12 | 南昌大学 | A kind of thermal siphon of variable heat conduction |
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|---|---|---|---|---|
| US5005639A (en) * | 1988-03-24 | 1991-04-09 | The United States Of America As Represented By The Secretary Of The Air Force | Ferrofluid piston pump for use with heat pipes or the like |
| US6029742A (en) * | 1994-01-26 | 2000-02-29 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
| CN1371125A (en) * | 2001-02-21 | 2002-09-25 | 台达电子工业股份有限公司 | Heat sinks using magnetized heat transfer fluids |
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| US4120172A (en) * | 1977-05-05 | 1978-10-17 | The United States Of America As Represented By The United States Department Of Energy | Heat transport system |
| US4463798A (en) * | 1981-01-07 | 1984-08-07 | The Boeing Company | Electrostatically pumped heat pipe and method |
| US4590993A (en) * | 1984-10-23 | 1986-05-27 | University Of Florida | Heat transfer device for the transport of large conduction flux without net mass transfer |
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| US5238056A (en) * | 1990-03-30 | 1993-08-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat exchanger with oscillating flow |
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| DE19720482C5 (en) * | 1997-05-16 | 2006-01-26 | INSTITUT FüR MIKROTECHNIK MAINZ GMBH | Micro diaphragm pump |
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| JP2002188876A (en) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | Liquid cooling system and personal computer using the same |
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2004
- 2004-05-18 CN CNB2004100273645A patent/CN100383960C/en not_active Expired - Fee Related
- 2004-12-17 US US11/014,427 patent/US20050257916A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005639A (en) * | 1988-03-24 | 1991-04-09 | The United States Of America As Represented By The Secretary Of The Air Force | Ferrofluid piston pump for use with heat pipes or the like |
| US6029742A (en) * | 1994-01-26 | 2000-02-29 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
| CN1371125A (en) * | 2001-02-21 | 2002-09-25 | 台达电子工业股份有限公司 | Heat sinks using magnetized heat transfer fluids |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050257916A1 (en) | 2005-11-24 |
| CN1700455A (en) | 2005-11-23 |
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