CN100355056C - Method for detecting silicon chip state in chip case and repositioning its circle center - Google Patents
Method for detecting silicon chip state in chip case and repositioning its circle center Download PDFInfo
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- CN100355056C CN100355056C CNB2005101355469A CN200510135546A CN100355056C CN 100355056 C CN100355056 C CN 100355056C CN B2005101355469 A CNB2005101355469 A CN B2005101355469A CN 200510135546 A CN200510135546 A CN 200510135546A CN 100355056 C CN100355056 C CN 100355056C
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Abstract
本发明涉及一种片盒中硅片状态检测及其圆心重定位方法，属于IC制造技术领域。该状态检测为：设置大、中、小光强阈值分别为IO1、I1、I2，检测第一个传感器对的接收光强为IS1，若IS1＝IO1，则槽中无硅片，当IO1＞IS1＞I1为槽中只有一个硅片，I1≥IS1＞I2为槽中硅片重叠，若IS1≤I2则为硅片倾斜；该硅片圆心重定位的方法为：设定圆心对中的硅片边缘和第一个传感器对光路相切时，第二个传感器对接收光强为IO2，在该时刻检测第二个传感器对接收光强为IS2，比较IS2与IO2，根据两者的差值计算出移动距离d，然后通过传输机械手移动来补偿该硅片的圆心偏差。本发明的方法使用简便，硬件成本低廉。
The invention relates to a method for detecting the state of a silicon chip in a chip box and relocating the center of a circle, belonging to the technical field of IC manufacturing. The state detection is as follows: set the large, medium, and small light intensity thresholds as I O1 , I 1 , and I 2 respectively, and detect the received light intensity of the first sensor pair as I S1 . If I S1 =I O1 , there is no Silicon wafer, when I O1 > I S1 > I 1 means there is only one silicon wafer in the slot, I 1 ≥ I S1 > I 2 means that the silicon wafers in the slot overlap, and if I S1 ≤ I 2 means that the silicon wafer is tilted; the silicon wafer The method of relocating the center of the circle is as follows: when the edge of the silicon wafer in the center of the circle is set to be tangent to the light path of the first sensor pair, the light intensity received by the second sensor pair is I O2 , and the light received by the second sensor pair is detected at this moment. The strength is I S2 , compare I S2 and I O2 , calculate the moving distance d according to the difference between the two, and then compensate the center deviation of the silicon wafer by moving the transmission manipulator. The method of the invention is easy to use and has low hardware cost.
Description
Technical field
The invention belongs to IC manufacturing technology field, particularly the method for silicon chip state detection and reorientation.
Background technology
Silicon chip detects and reorientation is that IC such as mask aligner makes the important component part of equipping advance system.Silicon chip detect need before transmission manipulator is got sheet, detect in the respective grooves silicon chip have or not with and the position whether normal, find status errors such as silicon chip is overlapping, silicon chip inclination, make the transmission hand correctly get sheet.The function that the reorientation of the silicon chip center of circle realizes mainly contains two: 1. make silicon chip accurately send into film magazine, proofread and correct the silicon chip circle center error that produces in the lower film loop joint; 2. the silicon chip that film magazine is taken out carries out center of circle coarse localization, and a circle center error when dwindling slice to the prealignment platform reduces the detection cost and the prealignment time of prealignment platform.
Silicon chip detects and center of circle reorientation is two important steps in the film trasport flow process, in the former implementation method, all be to consider this two problems respectively, as adopting point-source of light formula transmission sensors to detect the placement state of silicon chip in film magazine in the US patent 5906469, and adopt transmission sensors to survey the method also application to some extent at present that the limit principle is carried out location, the silicon chip center of circle, adopt 2 transmission sensors to be used for location, the center of circle as US patent 5258823, US patent 5194743 adopts 3 transmission sensors to be used for location, the center of circle.Relative silicon chip prealignment, the reorientation precision is relatively low, adopts transducer to realize that respectively not only number of sensors is many silicon chip detection and reorientation, the debugging maintenance difficult, and take up room.
Summary of the invention
The objective of the invention is for overcoming the weak point of prior art, silicon chip state detection and center of circle method for relocating thereof in a kind of film magazine are proposed, adopt transmission-type optical pickocff group to realize that simultaneously the silicon chip in the silicon chip transmission system detects and two technological processes of reorientation, can use less transducer, and be simple and easy to usefulness, cost is lower.
Silicon chip state detects and center of circle method for relocating in a kind of film magazine that the present invention proposes, and it is characterized in that: comprise adopt two groups of transmission-type optical measuring elements to be implemented in simultaneously that silicon chip state in the film magazine detects and transmission course in silicon chip reorientation two parts; The serve as reasons light-emitting component that sends the strip light belt and to receive the transducer that the receiving element of light-emitting component institute isolychn forms right of said transmission-type optical measuring element; First transducer is to being arranged on the light transmission part of level before and after the film magazine, and light belt and the film magazine axis of symmetry have an angle; Second transducer to light path and first transducer to vertical;
Described silicon chip state detection method is: the large, medium and small light intensity threshold value of setting first sensor is respectively I
01, I
1, I
2, when detected silicon chip groove was in first transducer same level, the right receiving light power of first transducer was I
S1, if first transducer is to receiving light power I
S1=I
01, then judge in the current groove and do not have silicon chip; Work as I
01＞I
S1＞I
1, then judge and have only a silicon chip in the tested groove; I
1〉=I
S1＞I
2, judge that then silicon chip is overlapping in the groove; If I
S1≤ I
2, judge that then silicon chip tilts in the groove;
The method of described silicon chip center of circle reorientation is: set the silicon chip edge of center of circle centering ideal position and first transducer to light path when tangent, second transducer is I to receiving light power
02, as detecting constantly, detecting second right receiving light power of transducer constantly at this was I when the light field that silicon chip edge and first transducer is right was tangent
S2, compare I
S2With I
02Obtain both differences, according to both difference calculate silicon chip second transducer to light field in the displacement d of relative ideal position, then by transmission manipulator move corresponding apart from d in order to compensating the circle center error of this silicon chip, thereby realize silicon chip center of circle reorientation.
Characteristics of the present invention and effect:
Less sensor configuration: the present invention is directed to silicon box design reorientation, for realizing above-described function, in the situation that does not influence system's beat, if design reorientation with following sheet position according to last slice position, adopt the transmissive optical transducer, then need four transducers to be used for reorientation at least in addition.
Be simple and easy to usefulness, cost is lower: realize that simultaneously silicon chip detects and the function of reorientation, can also adopt equipment such as laser range finder, but, adopt this equipment not only to cost an arm and a leg because silicon chip is thinner, and debug difficulties.Than, because these two kinds of accuracy of detection requirements are not very high, so it is easy to maintenance to adopt method of the present invention not only to debug, and cost is relatively low.
Description of drawings:
Fig. 1 realizes that for adopting two groups of transmission sensors silicon chip detects and the schematic diagram of reorientation,
Wherein (a) is front view, (b) is vertical view;
Fig. 2 is a center of circle method for relocating schematic diagram;
Fig. 3 is the control flow chart when silicon box is got sheet;
Fig. 4 is the control flow chart when the silicon box film releasing.
Embodiment
It is as follows that silicon chip detection of the present invention and method for relocating reach description of drawings in conjunction with the embodiments:
Silicon chip state detects and center of circle method for relocating in a kind of film magazine that the present invention proposes, comprise adopt two groups of transmission-type optical measuring elements to be implemented in simultaneously that silicon chip state in the film magazine detects and transmission course in silicon chip reorientation two parts;
The serve as reasons light-emitting component that sends the strip light belt and to receive the transducer that the receiving element of light-emitting component institute isolychn forms right of said transmission-type optical measuring element; First transducer is to being arranged on the light transmission part of level before and after the film magazine, and light belt and the film magazine axis of symmetry have an angle; Second transducer to light path and first transducer to vertical;
Wherein the silicon chip state detection method is: (this method detect determine to be in the groove of first transducer to same level in do not have silicon chip, a slice silicon chip arranged, silicon chip is overlapping and silicon chip tilts four kinds of different conditions, when being in this strip light field when object, the light intensity decreasing that receiving element receives, and the shading area difference of different conditions silicon chip is judged the state of silicon chip in film magazine by first sensor to the different light intensity that receives) the large, medium and small light intensity threshold value of establishing first sensor is respectively I
01(preferably select highlight flux or near highlight flux), I
1, I
2, when detected silicon chip groove was in first transducer same level, the right receiving light power of first transducer was I
S1, if first transducer is to receiving light power I
S1=I
01, there is not silicon chip in the then current groove, work as I
01＞I
S1＞I
1For having only a silicon chip, I in the groove
1〉=I
S1＞I
2For silicon chip in the groove overlapping, if I
S1≤ I
2Then silicon chip tilts in the groove;
Wherein the method for silicon chip center of circle reorientation is: set the silicon chip edge of center of circle centering and first transducer to light path when tangent, second transducer is I to the light intensity that receives
02(this light intensity preferably is set to about 1/2nd of the right total light transmission amount of second transducer, so that to silicon chip adjusting range maximum), as detecting constantly, be I when the light field that silicon chip edge and first transducer is right is tangent in this light intensity that detects second transducer constantly
S2Compare I
S2With I
02Obtain both differences, calculate the displacement d of silicon chip relative ideal position in second transducer 2 light field according to both difference, move by transmission manipulator then and compensate the circle center error (its circle center error can solve by corresponding geometrical relationship) of this silicon chip accordingly, thereby realize silicon chip center of circle reorientation apart from d.
The embodiment that the inventive method is used for advance system is the advance system at 8 inches silicon chips.Comprise 3 lifting platforms in this system, film magazine, lower magazine and useless film magazine are gone up in carrying respectively, and the transmission handbag contains four degrees of freedom, are respectively Y, Z, X and 180 degree rotations, and transmission hand X-axis comprises vacuum absorption device.
Fig. 1 is provided with two groups of position views that transmission sensors is right for the inventive method embodiment, transducer between dotted portion represent light field.Wherein Fig. 1 (a) is a front view, and the normal laying state of silicon chip 4 expression promptly has a slice silicon chip in the groove, and silicon chip 5 expressions have two overlappingly to be placed on a state in the groove, silicon chip 6 expression inclination laying states, and silicon chip 5,6 all is an abnormal condition; Transducer is to 1 front and back that are arranged on film magazine, and transducer is to 2 ends that are arranged on film magazine, and transducer is vertical mutually to 1,2.Fig. 1 (b) is a vertical view, can see more clearly that transducer is to 1,2 with the relation of the ideal position 7 of fetching and delivering silicon chip, transducer is to 1 light transmission part that is horizontally disposed with before and after the film magazine, guarantee that sensor optical path is not blocked by silicon box 3, and transmitting element that transducer is right and receiving element are separately positioned on the diagonal angle edge of the light transmission part before and after the film magazine, so that the light belt and the film magazine axis of symmetry keep trying one's best big angle (as long as there is an angle just can detect silicon chip inclination laying state, angle is big more, it is good more to detect effect), before transducer is vertically set on film magazine 3 left ends to 2, promptly when transducer to 1 with silicon chip edge when tangent, silicon chip is about half of total light intensity in the shading of transducer in to 2, for convenience of calculation, the radial direction that can make the ideal position silicon chip by transducer to 2 light field.The right fixed-site of two sensors is motionless.
The transmission sensors that present embodiment adopts is to adopting the FU-12 of KEYENCE company, its optical fiber row group is a linear array zone, and the width of light belt is 10mm, and the minimum detection object is 0.3m, transducer to reprocessing with luminous flux from the 0-4096 mark, transducer is set to 1 highlight flux I in this enforcement
01Be 2000, transducer be set 2 highlight fluxs are set to 4096, and to select desirable silicon chip shading amount be I
02Be 2048 place's sensor installations to 2 (promptly when transducer to 1 with silicon chip edge the position when tangent, at this moment silicon chip is about half of total light intensity in the shading of transducer in to 2, and the radial direction of silicon chip by transducer to 2 light field), preprocessor can convert the shading amount to the correspondent voltage signal, wherein maximum shading amount 4096 corresponding 5V, minimum shading amount 0 corresponding 1V.By the A/D conversion,, just can obtain the displacement of silicon chip in light field by the input voltage difference by simple demarcation with this voltage signal input controller.
Specifically being applied in of present embodiment method got the sheet process and sent the sheet process to be respectively described below:
Need when getting sheet simultaneously silicon chip state in the box to be detected and the reorientation of the silicon chip center of circle, silicon chip is in getting the sheet transmission course, the motion of controller drives lifting platform, make silicon box and transducer 1 produce relative motion, simultaneously the cycle of controller about with 0.5ms read in sensing data, can in time detect the points of tangency of silicon chip edge and transducer 1 light field like this.
Detect for silicon chip, transducer is set 1 light intensity threshold value I
01=2000 (being highlight flux), I
1=1400, I
2=1000, establishing real-time detection light intensity is I
S1, luminous flux is constant in corresponding groove position, i.e. I
S1, there is not silicon chip in this groove, at=2000 o'clock as 2000＞I
S1＞1400 can think to have only a silicon chip, 1400 〉=I in the tested groove
S1Thinking for＞1000 has the silicon chip overlapping phenomenon in the groove, if I
S1Can think the silicon chip heeling condition for≤1000.
For center of circle reorientation, when getting sheet, transmission manipulator carries silicon chip and moves outside film magazine, and when silicon chip had just gone out the light field of transducer 1, transducer 2 write down the shading area of silicon chips at this moment.If broken circle is that silicon chip takes out film magazine and transducer 1 ideal position when tangent among Fig. 2.Because silicon chip may move horizontally in groove, the silicon chip physical location is in solid line circle 8 correspondence positions (situation 1) and will influences the prealignment effect when getting sheet, needs to adjust home position.Because the silicon chip radius is known, offset d can obtain according to different shading areas (when promptly relatively the right light field of silicon chip edge and first transducer is tangent, the light intensity I of detected second transducer
S2=with desirable silicon chip shading amount I
02Calculate the displacement d of silicon chip relative ideal position in transducer 2 light fields according to both difference), angle theta determined by the relative position of two transducers, like this length on another limit in the triangle, be the distance in two centers of circle also, can set up solution of equation by the cosine law and get.
In actual applications, its method such as Fig. 3 when getting sheet may further comprise the steps:
1) judges whether that groove position, place all detected, if the lifting platform that then rises is changed film magazine to initial position; Otherwise continue next step;
2) slot pitch of lifting platform decline;
3) read sensor carries out state-detection to 1 data, is the overlapping or inclination of silicon chip as if testing result, then reports to the police, and takes corresponding means corrigendum; If no silicon chip then changes step 2); If silicon chip is arranged, then continue next step;
4) the transmission hand is got sheet and is outwards carried;
5) judge whether silicon chip edge is tangent to 1 light field with transducer, if not, then change step 4) transmission hand and continue outwards to carry; If then continue next step;
6) find the solution the silicon chip circle center error;
7) the transmission hand is outwards being revised deviation in the film trasport process;
8) this sheet is got the sheet end, changes step 2).
Only need be when sending sheet to the reorientation of the silicon chip center of circle, for the situation among Fig. 21, to film magazine send sheet process method for relocating and to get the sheet method similar, promptly transmitting hand carries silicon chip and moves to film magazine, when the light field of silicon chip edge and transducer 1 is tangent, the value of record transducer 2 this moment is tried to achieve the distance that the silicon chip center of circle need be adjusted.The situation (situation 2) of sending sheet Fig. 2 mid point scribed circle 9 also may occur to film magazine, if this moment, Y direction circle center error was excessive, then the silicon chip circumference will not run into film magazine with transducer 1 light field is tangent as yet, so when sending sheet, if the shading amount of the shading amount of silicon chip in transducer 2 during greater than ideal position, should move along Y-axis by first control transmission hand, carry out reorientation calculating thereby make silicon chip enter transducer 1 light field as early as possible.This method requires the Y direction motion as quickly as possible of transmission hand and the motion of slower directions X, assurance is sent and is not bumped film magazine in the sheet process, but consider that the course of processing times such as silicon wafer exposure are longer, following sheet process time is abundant, the method for relocating that uses allows silicon chip to be parked in the sensing station measurement data at present, so this method can not have influence on system's film trasport beat.
The process of sending sheet may further comprise the steps as shown in Figure 4:
1) judges whether all loads of all groove positions, if lifting platform to the initial position that then rises is changed film magazine; Otherwise continue next step;
2) the transmission hand send sheet;
3) judge whether that silicon edge and transducer are tangent to 1 light field, if, then find the solution the silicon chip circle center error, overgauge is retouched in transmission and film magazine is gone in film releasing, leaves film magazine then, moves a groove position on the lifting platform, goes to step 1); Otherwise continue next step;
4) judge transducer to 2 shading whether greater than desirable silicon chip shading, if not, then change step 2); Otherwise continue next step;
5) the transmission hand moves along directions X, changes step 3).
Reorientation and silicon chip are detected the method for using transducer to realize respectively in the present advance system, the quantity of the transducer that the present invention not only uses is few, cost is low, and algorithm is simple, and debugging difficulty is low.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101355469A CN100355056C (en) | 2005-12-30 | 2005-12-30 | Method for detecting silicon chip state in chip case and repositioning its circle center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101355469A CN100355056C (en) | 2005-12-30 | 2005-12-30 | Method for detecting silicon chip state in chip case and repositioning its circle center |
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| Publication Number | Publication Date |
|---|---|
| CN1801471A CN1801471A (en) | 2006-07-12 |
| CN100355056C true CN100355056C (en) | 2007-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101355469A Expired - Fee Related CN100355056C (en) | 2005-12-30 | 2005-12-30 | Method for detecting silicon chip state in chip case and repositioning its circle center |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194727B (en) * | 2010-03-11 | 2013-09-04 | 中芯国际集成电路制造(上海)有限公司 | Improved robot telescopic arm |
| CN103985656B (en) * | 2014-05-30 | 2017-07-25 | 上海集成电路研发中心有限公司 | The identifying device and method of silicon chip positive and negative |
| CN107131825B (en) * | 2017-03-24 | 2019-08-09 | 北京工业大学 | A detection device and method for distinguishing and recording the position of a silicon wafer |
| CN110379735B (en) * | 2019-06-28 | 2021-10-26 | 福建省福联集成电路有限公司 | Wafer oblique insertion detection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| US5258823A (en) * | 1990-06-28 | 1993-11-02 | Canon Kabushiki Kaisha | Alignment system |
| US5906469A (en) * | 1995-11-22 | 1999-05-25 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for detecting and conveying substrates in cassette |
| CN1692487A (en) * | 2003-01-06 | 2005-11-02 | 东京毅力科创株式会社 | Substrate inspection method and device for semiconductor processing, and substrate transfer system |
-
2005
- 2005-12-30 CN CNB2005101355469A patent/CN100355056C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| US5258823A (en) * | 1990-06-28 | 1993-11-02 | Canon Kabushiki Kaisha | Alignment system |
| US5906469A (en) * | 1995-11-22 | 1999-05-25 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for detecting and conveying substrates in cassette |
| CN1692487A (en) * | 2003-01-06 | 2005-11-02 | 东京毅力科创株式会社 | Substrate inspection method and device for semiconductor processing, and substrate transfer system |
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