CN109884502A - Chip detecting method and device, system, control equipment and storage medium - Google Patents
Chip detecting method and device, system, control equipment and storage medium Download PDFInfo
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- CN109884502A CN109884502A CN201910169534.XA CN201910169534A CN109884502A CN 109884502 A CN109884502 A CN 109884502A CN 201910169534 A CN201910169534 A CN 201910169534A CN 109884502 A CN109884502 A CN 109884502A
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Abstract
本申请实施例公开了一种芯片测试方法及装置、系统、控制设备及存储介质，该方法包括：确定与芯片对应的电路板；其中，所述电路板上设置有键合焊盘；所述芯片为未进行封装的裸片；将芯片上的测试点连接在对应的所述键合焊盘上；通过测试设备对所述键合焊盘上的信号进行测试。
The embodiment of the present application discloses a chip testing method and device, system, control device and storage medium. The method includes: determining a circuit board corresponding to the chip; wherein, the circuit board is provided with a bonding pad; the The chip is an unpackaged bare chip; the test points on the chip are connected to the corresponding bonding pads; the signals on the bonding pads are tested by testing equipment.
Description
Technical field
The invention relates to semiconductor processing technology, relates to, but are not limited to a kind of chip detecting method and device, is
System, control equipment and storage medium.
Background technique
It during semiconductor chip product manufacturing, needs to test chip, the signal stream inside detection chip
It is logical, carry out the performance of analysis chip.In the related technology, the mode for generalling use acupuncture treatment test, using the needle card of probe device or micro-
Test signal is transmitted to signal point then using long conducting wire connection needle card or probe by the test point of type probe contact chip
Desorption device, to analyze and to judge.This test mode needs accurate probe device, due to the acupuncture treatment point very little of chip,
The alignment function having an acupuncture treatment using microscope is needed, difficulty of test is larger, and needle card or miniature probe are easy to damage core
Piece.
Summary of the invention
In view of this, the embodiment of the present application be solve the problems, such as it is existing in the prior art at least one and a kind of chip is provided
Test method and device, system, control equipment and storage medium.
The technical solution of the embodiment of the present application is achieved in that
The embodiment of the present application provides a kind of chip detecting method, this method comprises:
Determine circuit board corresponding with chip to be tested；Wherein, bonding welding pad is provided on the circuit board；The core
Piece is the bare die not being packaged；
Test point on chip is connected on the corresponding bonding welding pad；
The signal on the bonding welding pad is tested by test equipment.
The embodiment of the present application also provides a kind of chip test system, which includes: circuit board and test equipment；
The circuit board, it is corresponding with chip to be tested, bonding welding pad is provided on the circuit board；Wherein, the core
Piece is the bare die not being packaged；
The bonding welding pad, for the test point on the chip to be connect with the circuit board；
The test equipment, for testing the signal on the bonding welding pad.
The embodiment of the present application also provides a kind of apparatus for testing chip, which includes:
Determination unit is configured to determine circuit board corresponding with chip to be tested；Wherein, it is provided on the circuit board
Bonding welding pad；The chip is the bare die not being packaged；
Connection unit is configured to for the test point on chip being connected on the corresponding bonding welding pad；
Test cell is configured to test the signal on the bonding welding pad by test equipment.
The embodiment of the present application also provides a kind of chip testing control equipment, including operating member, memory and processor, institute
It states memory and is stored with the computer program that can be run on a processor, when the processor executes described program, described in control
Operating member realizes the step in said chip test method.
The embodiment of the present application also provides a kind of computer readable storage medium, is stored thereon with computer program, the calculating
The step in said chip test method is realized when machine program is executed by processor.
In the embodiment of the present application, by the way that the test point in chip to be drawn out on circuit board, it is direct to reuse test equipment
Signal on circuit board is tested, to realize the test to chip.In this way, avoiding using high cost and using difficulty
Great probe device, and damage of the probe to chip is avoided, effectively improve testing efficiency.
Detailed description of the invention
Fig. 1 is the schematic illustration tested using probe device chip；
Fig. 2 is the implementation process schematic diagram of the embodiment of the present application chip detecting method；
Fig. 3 A is the composed structure schematic diagram of the embodiment of the present application chip test system；
Fig. 3 B is the composed structure schematic diagram of the embodiment of the present application circuit board；
Fig. 4 A is the schematic illustration that the embodiment of the present application makes circuit board；
Fig. 4 B is in the embodiment of the present application by the fixed schematic illustration on circuit boards of chip to be tested；
Fig. 4 C is the schematic illustration for carrying out routing connection in the embodiment of the present application to chip and circuit board；
Fig. 4 D is the schematic illustration for installing protection cap in the embodiment of the present application additional to circuit board；
Fig. 5 is the composed structure schematic diagram of the embodiment of the present application apparatus for testing chip；
Fig. 6 is a kind of hardware entities schematic diagram of the embodiment of the present application chip testing devices.
Specific embodiment
During carrying out functional verification to chip, need using test probe in the bare die not being packaged, i.e. core
On piece acupuncture treatment, for example, acupuncture treatment or finished chip on the semi-finished product chip such as wafer (wafer) or die (crystal grain).In chip
On, be provided with test pad (acupuncture treatment point), after test probe touches test pad, can by the circuit of chip interior with it is external
Test circuit be connected, and signal path is formed, thus by additional test signal come the circuit performance inside detection chip.
Test probe includes needle card and miniature probe etc., and needle card is one group of probe with constant spacing arrangement, can the company of contact simultaneously
Meet multiple test pad.Miniature probe can neatly be directly connected to the circuit of chip interior, to carry out the acquisition of internal signal
And test.
However, chip internal circuits are very small, even if being provided with test pad, it is also desirable in probing (probe) equipment
Microscopie unit under precisely aligned, test probe could accurately be connect with circuit to be measured, as shown in Figure 1,
Chip 12 to be tested is aligned and had an acupuncture treatment using the probing equipment with microscopie unit 11, then passes through long conducting wire
13, which are connected to test equipment, is tested.It is more time-consuming during testing probe and test pad contraposition, and be easy to make
At the damage of chip.The method of this test is easy to be affected by the ambient, and cannot bear to shake or hit, right
The shockproof requirements of probing equipment are higher.
In addition, impedance is larger, therefore can only test SDR since test signal is needed by test probe and long conducting wire
(Single Data Rate, single data rate) mode only carries out reading and writing data, intelligent reading in single cycle in rising edge clock
It writes once, rate is slower.
For above situation, the embodiment of the present application provides a kind of chip detecting method, and it is a kind of convenient for survey that this method, which uses,
Chip is tested in COB (Chips on Board, the chip on board) encapsulation of examination.This packing forms will be tested
Signal drawn from chip, on the circuit board connected by way of routing, then directly connected with tester table by circuit board
It connects, is tested, thus instead of the use of probing board.
The technical solution of the application is further elaborated on reference to the accompanying drawings and examples.
The embodiment of the present application provides a kind of chip detecting method, as shown in Fig. 2, this method comprises:
Step S101, determination circuit board corresponding with chip to be tested；Wherein, bonding weldering is provided on the circuit board
Disk；The chip can be semi-finished product chip, the bare die not being packaged for example,；In other embodiments, the chip can
Think the finished chip that can be tested.
There is test point to be tested, for receiving detection signal and providing detected signal on chip to be tested.
It needs exist for determining circuit board corresponding with the chip, signal to be tested will be needed to be drawn out on circuit board on chip.
Step S102, the test point on chip is connected on the corresponding bonding welding pad；
It is provided with bonding welding pad on circuit board, by way of routing, the test point on chip can be connected to bonding
On pad.In this way, the signal of test point can be drawn out on circuit board on chip.
Step S103, the signal on the bonding welding pad is tested by test equipment.
Test equipment does not need to have an acupuncture treatment to chip, but directly calibrating terminal is connected with circuit board, feeler switch
The signal being brought out on pad is closed, to realize the test to chip.
The embodiment of the present application provides another chip detecting method, this method comprises:
Step S201, determination circuit board corresponding with chip to be tested；Wherein, bonding weldering is provided on the circuit board
Disk；The chip is the bare die not being packaged；
Step S202, attachment device and circuit are set on the circuit board；The circuit is used for the attachment device
It is connect with the bonding welding pad；
Step S203, the test point on chip is connected on the corresponding bonding welding pad；
Step S204, the test equipment is connected in the attachment device, to the signal in the attachment device into
Row test.
Above-mentioned steps S202 provides a kind of scheme that attachment device and circuit are arranged on circuit boards, and being convenient for will be on chip
Test signal extract.Above-mentioned steps S204 provides the implementation of step S103 a kind of, and connection can be set on circuit board
Device, for being connected with test equipment.The interface to match can be arranged in the attachment device according to test equipment.Circuit board
On also need that circuit is arranged, be used to for attachment device connect with bonding welding pad, due to the test point company on bonding welding pad and chip
It is connected together, therefore, the test point on chip is drawn out to attachment device by circuit, test device can be directly to connection
Corresponding signal is tested on device.
The embodiment of the present application provides another chip detecting method, this method comprises:
Step S301, according to the mark of the chip, the quantity of the test point is determined；
Step S302, according to the quantity of the test point, determining has the circuit board of corresponding bonding welding pad；Wherein, institute
Stating chip is the bare die not being packaged；
Step S303, attachment device and circuit are set on the circuit board；The circuit is used for the attachment device
It is connect with the bonding welding pad；
Step S304, the test point on chip is connected on the corresponding bonding welding pad；
Step S305, the test equipment is connected in the attachment device, to the signal in the attachment device into
Row test.
Above-mentioned steps S301 to step S302 provides a kind of implementation of step S201, by chip come determine survey
The quantity of pilot, and then determine the circuit board with corresponding bonding welding pad.Here, the mark of chip can be the model of product
Deng, the quantity of test point can be determined by the mark, can also determine position, corresponding signal type of test point etc. other
Information.According to these information of test point, position and the quantity of corresponding bonding welding pad can be determined.This process i.e. true
The process of the fixed circuit board with bonding welding pad corresponding with chip.Pass through this process, so that it may by institute on chip to be tested
The test point needed guides to corresponding bonding welding pad on circuit board, then guides to attachment device by circuit again, consequently facilitating surveying
Examination equipment is tested on circuit boards.
The embodiment of the present application provides another chip detecting method, this method comprises:
Step S401, determination circuit board corresponding with chip to be tested；Wherein, bonding weldering is provided on the circuit board
Disk；The chip is the bare die not being packaged；
Step S402, attachment device and circuit are set on the circuit board；The circuit is used for the attachment device
It is connect with the bonding welding pad；Wherein, the attachment device includes external pad；
Step S403, the test point on chip is connected on the corresponding bonding welding pad；
Step S404, the calibrating terminal of the test equipment is welded on the external pad, to the external pad
On signal tested.
Here, attachment device includes the external pad of setting on circuit boards, for the calibrating terminal phase with test equipment
Connection.Calibrating terminal can be directly welded on external pad, in this way, the test point from test equipment to chip forms completely
Access, stabilization be hardly damaged, be suitble to that validation test is repeated.Without the operation such as contraposition of having an acupuncture treatment.
In other embodiments, the attachment device includes connecting interface；
It is described that the test equipment is connected in the attachment device, the signal in the attachment device is surveyed
Examination, comprising:
The calibrating terminal of the test equipment is plugged in the connecting interface, to the signal in the connecting interface into
Row test.
Another form of attachment device, i.e. connecting interface are provided here.The connecting interface can be with the survey of test equipment
Examination terminal is plugged in together, and can neatly be connected or disconnected, convenient for test.
The embodiment of the present application provides a kind of chip detecting method, this method comprises:
Step S501, determination circuit board corresponding with chip to be tested；Wherein, bonding weldering is provided on the circuit board
Disk；The chip is the bare die not being packaged；
Step S502, the chip is fixed on the circuit board,
Step S503, the test point on chip is connected on the corresponding bonding welding pad；
Step S504, the protection cap of installation covering on the chip on the circuit board；
Step S505, the signal on the bonding welding pad is tested by test equipment.
Above-mentioned steps S504 provides the mode of the setting protection cap of the chip on a kind of pair of circuit board, passes through the guarantor of protection cap
Shield, prevents the damage or pollution of chip, improves the accuracy of test, and be conducive to Reusability and the test of chip.
The embodiment of the present application provides another chip detecting method, this method comprises:
Step S601, determination circuit board corresponding with chip to be tested；Wherein, bonding weldering is provided on the circuit board
Disk；The chip is the bare die not being packaged；
Step S602, the chip is fixed on the circuit board,
Step S603, the test point on chip is connected on the corresponding bonding welding pad；
Step S604, the protection cap of installation covering on the chip on the circuit board；
Step S605, the signal on the bonding welding pad is tested by test equipment.
Step S606, when needing to carry out the chip acupuncture treatment test, the protection cap is disassembled；
Step S607, the test point of the chip is contacted using probe, carries out the acupuncture treatment test.
Above-mentioned steps S606 and step S607 provides a kind of mode of flexible Application of the test method, when the electricity of production
Road plate is unable to reach testing requirement, when having newly-increased test point, or needs to carry out the contrast test with probe test mode
When, still the test point on probe contact chip can be used by the way of probe test.Detachable protective can be installed
Lid, when needing to carry out probe test, protection cap is disassembled and is tested again；When only to needing corresponding point on circuit board
It when position is tested, then does not need to dismantle lower protection cap, directly circuit board is attached and is tested using test equipment.
The embodiment of the present application also provides a kind of chip test system, and as shown in Figure 3A, which includes: circuit board 201
With test equipment 202；
The circuit board 201, it is corresponding with chip 10 to be tested, wherein the chip is the bare die not being packaged；Such as
Shown in Fig. 3 B, bonding welding pad 301 is provided on the circuit board；
The bonding welding pad 301, for the test point on the chip to be connect with the circuit board；
The test equipment 202, for testing the signal on the bonding welding pad 301.
Here, chip 10 may be mounted on circuit board, the test point on chip 10 and the bonding welding pad on circuit board 201
301 are attached, so that it may which the signal on chip 10 is guided on circuit board 201.It can be to circuit board using test equipment 202
201 are directly tested, and so as to avoid the use of probe device, improve the stability of test.
It in other embodiments, further include attachment device 302 and circuit 303 on the circuit board 201；
The circuit 303, for the attachment device 302 to be connect with the bonding welding pad 301；
The attachment device 302, for being connect with the test equipment 202.
Here attachment device 302 can be designed according to the signaling interface of test equipment 202, can be set to pad or
Connecting interface etc..Test equipment connection is directly tested on circuit boards.
In other embodiments, on the circuit board further include fixed area 304 for fixing the chip；
It further include the protection cap 305 being movably arranged in the fixed area on the circuit board；The protection cap covering
The chip 10.
It further include mounting hole 307 on circuit board 201 in Fig. 3 B, for circuit board 201 to be fixed on test equipment or carrying
On platform.
Test equipment 202 in the system is built with circuit board 201 by the attachment device 302 being arranged on circuit board 201
Vertical connection, test equipment can provide to circuit board 201 or obtain signal by attachment device 302.And circuit board 201 is logical
The silk thread 306 that is bonded crossed between bonding welding pad 301 and chip 10 to be tested establishes connection, the signal on bonding welding pad 301
It is connected by circuit 303 with attachment device 302.It is formd as a result, by test equipment to circuit board again to chip to be tested
Complete signal access.Without using probe device when test, which can be done directly test, improve testing efficiency,
The stability of test process is improved, and easy to operate, convenient for testing repeatedly.
The embodiment of the present application provides a kind of chip detecting method, this method comprises:
Step S1, circuit substrate, i.e. circuit board as shown in Figure 4 A, are made, and makes circuit on substrate；
Bonding welding pad 401 needed for being provided with routing on circuit substrate, the test for being connected with external test equipment
Pad 402 and required circuit connection 403 etc..And a block space is reserved for carrying chip to be tested.
Step S2, as shown in Figure 4 B, chip 404 to be tested is pasted on circuit substrate with glue；
Step S3, as shown in Figure 4 C, routing, by the test point on chip 404 and the bonding welding pad 401 on circuit substrate
It is attached by being bonded silk thread 405；
Step S4, transparent plastic protection cover 406 as shown in Figure 4 D, is added on chip, which can open,
When needing to be added interim test point, still acupuncture treatment test can be carried out using probing board.
Step S5, circuit board is connected using test equipment, chip is tested.
By the scheme in the embodiment of the present application, probing board can be replaced by way of COB is encapsulated, not
The expense that expensive probing board is saved on the basis of influence test result, saves the expense of test probe；And it can be with
Simplify test process, without precisely contraposition, save the testing time, avoids the parasitic capacitance of external test probe and long conducting wire to survey
The interference of trial signal.Additionally it is possible to eliminate damage of the test probe to chip, the test service life is improved；And this form tool
There are better Ability of Resisting Disturbance and measuring stability, it is low to the shockproof class requirement of test equipment, it can be effectively reduced and tested
The interference of external environment in journey promotes tested performance.
Based on embodiment above-mentioned, the embodiment of the present application provides a kind of apparatus for testing chip, and the device is for controlling chip
Each operating member in test equipment executes operating procedure, which includes that included each unit and each unit are wrapped
Each module included can be realized by the processor in computer equipment；Certainly it can also be realized by specific logic circuit；
In the process of implementation, processor can be central processing unit (CPU), microprocessor (MPU), digital signal processor (DSP)
Or field programmable gate array (FPGA) etc..
Fig. 5 is the composed structure schematic diagram of the embodiment of the present application apparatus for testing chip, as shown in figure 5, described device 500 is wrapped
Include determination unit 501, connection unit 502 and test cell 503, in which:
Determination unit 501 is configured to determine circuit board corresponding with chip to be tested；Wherein, it is set on the circuit board
It is equipped with bonding welding pad；The chip is the bare die not being packaged；
Connection unit 502 is configured to for the test point on chip being connected on the corresponding bonding welding pad；
Test cell 503 is configured to test the signal on the bonding welding pad by test equipment.
In other embodiments, device further include: attachment device and circuit are set on the circuit board；The circuit
For the attachment device to be connect with the bonding welding pad；
The test cell is additionally configured to for the test equipment being connected in the attachment device, fills to the connection
The signal set is tested.
In other embodiments, the determination unit, comprising:
First determining module is configured to the mark according to the chip, determines the quantity of the test point；
Second determining module is configured to the quantity according to the test point, and determining has the circuit of corresponding bonding welding pad
Plate.
In other embodiments, the attachment device includes external pad；
The test cell is additionally configured to for the calibrating terminal of the test equipment being welded on the external pad, right
Signal on the external pad is tested.
In other embodiments, the attachment device includes connecting interface；
The test cell is additionally configured to for the calibrating terminal of the test equipment being plugged in the connecting interface, right
Signal in the connecting interface is tested.
In other embodiments, the device further include:
Fixed cell is configured to for the chip being fixed on the circuit board；
Installation unit is configured to the protection cap that the installation on the circuit board covers the chip.
In other embodiments, the protection cap is detachable；The device further include:
Removable unit is configured to disassemble the protection cap when needing to carry out the chip acupuncture treatment test；
Probe test cell is configured so that probe contacts the test point of the chip, carries out the acupuncture treatment test.
The description of apparatus above embodiment, be with the description of above method embodiment it is similar, have same embodiment of the method
Similar beneficial effect.For undisclosed technical detail in the application Installation practice, the application embodiment of the method is please referred to
Description and understand.
It should be noted that in the embodiment of the present application, if realizing that above-mentioned chip is surveyed in the form of software function module
Method for testing, and when sold or used as an independent product, it also can store in a computer readable storage medium.Base
In such understanding, substantially the part that contributes to existing technology can be in other words for the technical solution of the embodiment of the present application
The form of software product embodies, which is stored in a storage medium, including some instructions to
So that a chip testing devices execute all or part of each embodiment the method for the application.And storage medium above-mentioned
Include: that USB flash disk, mobile hard disk, read-only memory (Read Only Memory, ROM), magnetic or disk etc. are various can store
The medium of program code.It is combined in this way, the embodiment of the present application is not limited to any specific hardware and software.
Accordingly, the embodiment of the present application provides a kind of chip testing control equipment, including operating member, memory and processing
Device, the memory is stored with the computer program that can be run on a processor, when the processor executes described program, control
Operating member realizes the step in the chip detecting method provided in above-described embodiment.
Accordingly, the embodiment of the present application provides a kind of computer readable storage medium, is stored thereon with computer program, should
Step in the chip detecting method provided in above-described embodiment is provided when computer program is executed by processor.
It need to be noted that: the description of medium stored above and apparatus embodiments, with retouching for above method embodiment
It is similar for stating, and has with embodiment of the method similar beneficial effect.For in the application storage medium and apparatus embodiments not
The technical detail of disclosure please refers to the description of the application embodiment of the method and understands.
It should be noted that Fig. 6 is a kind of hardware entities schematic diagram that the embodiment of the present application chip testing controls equipment, such as
Shown in Fig. 6, the hardware entities which controls equipment 600 include: processor 601, communication interface 602,603 and of memory
Operating member 604, wherein
The overall operation of the usually control chip testing control equipment 600 of processor 601.
Communication interface 602 can make chip testing devices pass through network and other terminals or server communication.
Memory 603 is configured to store the instruction and application that can be performed by processor 601, can also cache device to be processed
601 and chip testing control equipment 600 in each module it is to be processed or processed data (for example, image data, audio number
According to, voice communication data and video communication data), flash memory (FLASH) or random access storage device (Random can be passed through
Access Memory, RAM) it realizes；
Operating member 604 is executed actual in test method in above-described embodiment by the control of above-mentioned processor 601
Operational motion is realized between test equipment, circuit board and the chip to be tested in above-described embodiment chip test system
Selection determination of connecting moves, control action and circuit board etc..
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment
A particular feature, structure, or characteristic includes at least one embodiment of the application.Therefore, occur everywhere in the whole instruction
" in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot
Structure or characteristic can combine in any suitable manner in one or more embodiments.It should be understood that in the various implementations of the application
In example, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, the execution sequence Ying Yiqi function of each process
It can be determined with internal logic, the implementation process without coping with the embodiment of the present application constitutes any restriction.Above-mentioned the embodiment of the present application
Serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
In several embodiments provided herein, it should be understood that disclosed device and method can pass through it
Its mode is realized.Apparatus embodiments described above are merely indicative, for example, the division of the unit, only
A kind of logical function partition, there may be another division manner in actual implementation, such as: multiple units or components can combine, or
It is desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed each composition portion
Mutual coupling or direct-coupling or communication connection is divided to can be through some interfaces, the INDIRECT COUPLING of equipment or unit
Or communication connection, it can be electrical, mechanical or other forms.
Above-mentioned unit as illustrated by the separation member, which can be or may not be, to be physically separated, aobvious as unit
The component shown can be or may not be physical unit；Both it can be located in one place, and may be distributed over multiple network lists
In member；Some or all of units can be selected to achieve the purpose of the solution of this embodiment according to the actual needs.
In addition, each functional unit in each embodiment of the application can be fully integrated in one processing unit, it can also
To be each unit individually as a unit, can also be integrated in one unit with two or more units；It is above-mentioned
Integrated unit both can take the form of hardware realization, can also realize in the form of hardware adds SFU software functional unit.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above method embodiment can pass through
The relevant hardware of program instruction is completed, and program above-mentioned can store in computer-readable storage medium, which exists
When execution, step including the steps of the foregoing method embodiments is executed；And storage medium above-mentioned includes: movable storage device, read-only deposits
The various media that can store program code such as reservoir (Read Only Memory, ROM), magnetic or disk.
If alternatively, the above-mentioned integrated unit of the application is realized in the form of software function module and as independent product
When selling or using, it also can store in a computer readable storage medium.Based on this understanding, the application is implemented
Substantially the part that contributes to existing technology can be embodied in the form of software products the technical solution of example in other words,
The computer software product is stored in a storage medium, including some instructions are used so that a chip testing devices execute
The all or part of each embodiment the method for the application.And storage medium above-mentioned includes: movable storage device, ROM, magnetic
The various media that can store program code such as dish or CD.
The above, only presently filed embodiment, but the protection scope of the application is not limited thereto, it is any to be familiar with
Those skilled in the art within the technical scope of the present application, can easily think of the change or the replacement, and should all cover
Within the protection scope of the application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (12)
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| CN110376506A (en) * | 2019-07-17 | 2019-10-25 | 上海华虹宏力半导体制造有限公司 | A kind of test method of fragment chip |
| CN113341297A (en) * | 2021-05-26 | 2021-09-03 | 长江存储科技有限责任公司 | Grab point test system and method |
| CN113921514A (en) * | 2021-09-28 | 2022-01-11 | 芯盟科技有限公司 | A test wafer, chip forming method and chip testing method |
| CN119535162A (en) * | 2024-11-20 | 2025-02-28 | 中国电子科技集团公司第十一研究所 | Batch automatic testing method and system for chip flip chip interconnection connectivity |
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| CN113341297A (en) * | 2021-05-26 | 2021-09-03 | 长江存储科技有限责任公司 | Grab point test system and method |
| CN113921514A (en) * | 2021-09-28 | 2022-01-11 | 芯盟科技有限公司 | A test wafer, chip forming method and chip testing method |
| CN119535162A (en) * | 2024-11-20 | 2025-02-28 | 中国电子科技集团公司第十一研究所 | Batch automatic testing method and system for chip flip chip interconnection connectivity |
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