CN109810559B - High-dispersity matte solder resist ink - Google Patents
High-dispersity matte solder resist ink Download PDFInfo
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- CN109810559B CN109810559B CN201910151381.6A CN201910151381A CN109810559B CN 109810559 B CN109810559 B CN 109810559B CN 201910151381 A CN201910151381 A CN 201910151381A CN 109810559 B CN109810559 B CN 109810559B
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- surfactant
- resist ink
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 55
- 239000004094 surface-active agent Substances 0.000 claims abstract description 41
- 230000008033 biological extinction Effects 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 13
- -1 acrylate compound Chemical class 0.000 claims abstract description 12
- 239000000412 dendrimer Substances 0.000 claims abstract description 10
- 229920000736 dendritic polymer Polymers 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- 239000000654 additive Substances 0.000 claims abstract description 9
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 8
- 239000000049 pigment Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims description 20
- 239000003921 oil Substances 0.000 claims description 16
- 238000009835 boiling Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 4
- 150000004056 anthraquinones Chemical class 0.000 claims description 4
- 239000002518 antifoaming agent Substances 0.000 claims description 4
- 229920000962 poly(amidoamine) Polymers 0.000 claims description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 244000028419 Styrax benzoin Species 0.000 claims description 3
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 3
- 229960002130 benzoin Drugs 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 235000019382 gum benzoic Nutrition 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 240000007839 Kleinhovia hospita Species 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract 1
- 238000010019 resist printing Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 42
- 239000011248 coating agent Substances 0.000 description 33
- 238000000576 coating method Methods 0.000 description 33
- 238000012360 testing method Methods 0.000 description 21
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 12
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 3
- INRQKLGGIVSJRR-UHFFFAOYSA-N 5-hydroxypentyl prop-2-enoate Chemical compound OCCCCCOC(=O)C=C INRQKLGGIVSJRR-UHFFFAOYSA-N 0.000 description 3
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 3
- 239000001384 succinic acid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- YRVPDHIFJSYCHO-UHFFFAOYSA-N (2-ethyl-1-hydroxyhexyl) prop-2-enoate Chemical compound CCCCC(CC)C(O)OC(=O)C=C YRVPDHIFJSYCHO-UHFFFAOYSA-N 0.000 description 2
- IQEWHTMQTSAPLG-UHFFFAOYSA-N 10-hydroxydecyl prop-2-enoate Chemical compound OCCCCCCCCCCOC(=O)C=C IQEWHTMQTSAPLG-UHFFFAOYSA-N 0.000 description 2
- QEGIOGSAGXFTLO-UHFFFAOYSA-N 11-hydroxyundecyl prop-2-enoate Chemical compound OCCCCCCCCCCCOC(=O)C=C QEGIOGSAGXFTLO-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 2
- AGEGRZSWVOJDMY-UHFFFAOYSA-N 7-hydroxyheptyl prop-2-enoate Chemical compound OCCCCCCCOC(=O)C=C AGEGRZSWVOJDMY-UHFFFAOYSA-N 0.000 description 2
- JSCDRVVVGGYHSN-UHFFFAOYSA-N 8-hydroxyoctyl prop-2-enoate Chemical compound OCCCCCCCCOC(=O)C=C JSCDRVVVGGYHSN-UHFFFAOYSA-N 0.000 description 2
- ZWNGBXQHXLKZLV-UHFFFAOYSA-N 9-hydroxynonyl prop-2-enoate Chemical compound OCCCCCCCCCOC(=O)C=C ZWNGBXQHXLKZLV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- MPWLRUHDXQRDFI-BBKCMACZSA-N Ins-1-P-Cer(t20:0/26:0) Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(=O)N[C@H]([C@H](O)C(O)CCCCCCCCCCCCCCCC)COP(O)(=O)O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](O)[C@H]1O MPWLRUHDXQRDFI-BBKCMACZSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- NKYRAXWYDRHWOG-UHFFFAOYSA-N 12-hydroxydodecyl prop-2-enoate Chemical compound OCCCCCCCCCCCCOC(=O)C=C NKYRAXWYDRHWOG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical group CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- ZCEYMOIPAHPDOR-UHFFFAOYSA-N 7-(diethylamino)-4-methylchromen-2-one Chemical compound CC1=CC(=O)OC2=CC(N(CC)CC)=CC=C21.CC1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 ZCEYMOIPAHPDOR-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OFSAUHSCHWRZKM-UHFFFAOYSA-N Padimate A Chemical compound CC(C)CCOC(=O)C1=CC=C(N(C)C)C=C1 OFSAUHSCHWRZKM-UHFFFAOYSA-N 0.000 description 1
- WYWZRNAHINYAEF-UHFFFAOYSA-N Padimate O Chemical compound CCCCC(CC)COC(=O)C1=CC=C(N(C)C)C=C1 WYWZRNAHINYAEF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- HXTBYXIZCDULQI-UHFFFAOYSA-N bis[4-(methylamino)phenyl]methanone Chemical compound C1=CC(NC)=CC=C1C(=O)C1=CC=C(NC)C=C1 HXTBYXIZCDULQI-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 150000004775 coumarins Chemical class 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007965 rubber solvent Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000007614 solvation Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention belongs to the technical field of printing ink, and relates to high-dispersity matte solder resist printing ink, which comprises the following components in parts by weight: 30 parts by mass of an acrylate compound with a carboxyl group, 0.5-20 parts by mass of an inorganic extinction filler, 0.5-20 parts by mass of an organic extinction filler, 0.1-20 parts by mass of a surfactant, 5-30 parts by mass of an epoxy resin, 1-5 parts by mass of a photoinitiator, 1-5 parts by mass of a pigment, 0.1-5 parts by mass of an additive and 5-20 parts by mass of an organic solvent, wherein the surfactant is any one of an AB type block polymer surfactant, a Gemini type surfactant, a Bola type surfactant and a Dendrimer type surfactant. The solder resist ink disclosed by the invention can maintain the photosensitive characteristics and various resistances of the solder resist ink, and has good extinction efficiency and good dispersibility.
Description
Technical Field
The invention relates to the technical field of ink, in particular to high-dispersity matte solder resist ink.
Background
The solder resist ink is mainly used in the production process of printed circuit boards, and forms a solder resist patterned coating by covering circuits and copper surfaces, thereby preventing the problems of bridge short circuit and the like during subsequent welding, preventing the circuits from being corroded by moisture, acid-base environment and electrolyte, and providing a long-time insulating environment for the circuit boards. According to the glossiness of the solder resist ink formed on the surface of the printed circuit board, the printed circuit board can be divided into bright, semi-matte, matte and other types. In recent years, with the continuous improvement of requirements on product appearance, line confidentiality and the like, matte solder resist ink (particularly, the glossiness of a coating measured by a 60-degree light incident angle is below 20) gets more and more attention, the surface of the formed coating is in a fog shape, the visual effect is soft, the inner part is converged, the eyes are not hurt, the design is fashionable, elegant and textured, and particularly, the dark matte ink coating has a strong confidentiality function on internal elements and lines.
In order to achieve the matte effect, a common method is to add an inorganic filler or an organic filler having a matting effect, but the method has many disadvantages, which are simply listed as follows:
1) in order to achieve a good extinction effect, the addition amount of the extinction filler is large, which is equivalent to the dilution of the proportion of other resin components, and the photo-thermal curing reaction rate of the solder resist ink is reduced to a certain extent; meanwhile, the extinction filler and other components in the solder resist ink are poor in intersolubility and dispersibility, so that the solder resist ink has the quality problems of sedimentation and the like in transportation and use;
2) the matte solder resist coating has the advantages that the surface of the matte solder resist coating is easy to have the problem of unevenness, the diffuse reflection effect on light is strong, the photo-hardening degree of the solder resist ink is influenced, and the problems of insufficient photosensitive property, various insufficient resistances of the coating and the like can be caused.
Disclosure of Invention
The invention mainly aims to provide the high-dispersity matte solder resist ink which can ensure good extinction efficiency and good dispersity.
The invention realizes the purpose through the following technical scheme: a high-dispersity matte solder resist ink comprises the following components in percentage by weight: 30 parts by mass of an acrylate compound with a carboxyl group, 0.5-20 parts by mass of an inorganic extinction filler, 0.5-20 parts by mass of an organic extinction filler, 0.1-20 parts by mass of a surfactant, 5-30 parts by mass of an epoxy resin, 1-5 parts by mass of a photoinitiator, 1-5 parts by mass of a pigment, 0.1-5 parts by mass of an additive and 5-20 parts by mass of an organic solvent, wherein the surfactant is any one of an AB type block polymer surfactant, a Gemini type surfactant, a Bola type surfactant and a Dendrimer type surfactant.
Specifically, the surfactant is a 1:1 mass ratio mixture of an AB type block polymer surfactant and a Dendrimer type surfactant, the AB type block polymer surfactant is PBA-b-PDMAEA, and the Dendrimer type surfactant is PAMAM.
Specifically, the organic solvent is a mixture of a plurality of organic solvents having different boiling ranges.
Further, the organic solvent is a mixture of No. 6 extraction solvent oil, No. 120 solvent oil and No. 200 solvent oil.
Specifically, the photoinitiator comprises at least one of benzoin and derivatives thereof, acetophenone and derivatives thereof, anthraquinone and derivatives thereof, thioxanthone and derivatives thereof, ketal and derivatives thereof, benzophenone and derivatives thereof, and tertiary amine and derivatives thereof.
Specifically, the additive comprises at least one of a leveling agent, a defoaming agent and a film-forming aid.
By adopting the technical scheme, the technical scheme of the invention has the beneficial effects that:
the solder resist ink disclosed by the invention can maintain the photosensitive characteristics and various resistances of the solder resist ink, and has good extinction efficiency and good dispersibility.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
In a dust-free laboratory, the raw materials were uniformly stirred according to the ratio in table 1 to prepare the photo-thermal dual-curing solder resist inks of examples 1 to 4 and comparative examples 1 to 6.
Table 1:
wherein the acrylate compound with carboxyl used in the embodiment refers to carboxyl polyethylene glycol acrylate, the epoxy resin is bisphenol A, and the inorganic extinction filler is silica delustering powder OK 500; the organic extinction filler is polyamide wax micro powder NEW-0401C; the surfactant is 1 of AB type block polymer surfactant PBA-b-PDMAEA and Dendrimer type surfactant PAMAM: 1 mass ratio of the mixture; the organic solvent is a mixture of solvent oil No. 6, solvent oil No. 120 and solvent oil No. 200 in the mass ratio of 1/3; the photoinitiator is IRG 907; the pigment is carbon black; the additive is TEGO-A116 flatting agent; the organic solvent is butyl carbitol.
Carrying out SOFT ETCHING pretreatment on a flexible circuit copper clad laminate FCCL (the PI thickness is 12-25 mu m and the copper thickness is 18 mu m), then carrying out screen printing solder resist ink on the surface of the FCCL by using a 100-mesh screen, and heating for 30min at 80 ℃ by using a hot air circulation type drying furnace to form a solder resist ink coating with the film thickness of 20 mu m (the error is +/-2 mu m). If the pre-baking is required to be performed for 5-20 min at 110 ℃ corresponding to the roll-to-roll process, the solder resist ink coating can be formed relatively quickly.
(1) Finger touch dryness test
An EXM-1201 exposure machine using ORC CORPORATION with a duty ratio of 200-500 mJ/cm2And a negative pattern mask to irradiate the solder resist ink coating. The ink coating was examined for indentation and ease of removal of a negative pattern mask (e.g., film) to evaluate the finger-touch dryness.
The evaluation criteria for finger-touch dryness were as follows:
o: the ink coating is completely free of indentation, and the mask can be easily taken down;
x: the ink coating has significant indentations and the mask is difficult to remove or stick to.
(2) Developability test
The base material was immersed in a 1% sodium carbonate aqueous solution at a temperature of 30 ℃ for development for 60 seconds with a spray pressure of 1kg/cm2The surface of the flexible printed wiring board was visually inspected to evaluate the developability.
The evaluation criteria for developability were as follows:
o: the developing can be realized, and the solder mask ink coating state is good;
x: the exposed portions are dissolved in a developing solution, or the unexposed portions are not dissolved in a developing solution, resulting in failure to form a good solder resist pattern.
(3) Light sensing characteristics
After screen printing of a solder resist ink coating with a film thickness of 20 μm, at a rate of 500mJ/cm2The exposure and the STOUFFER exposure ruler (21Steps) irradiate the solder resist ink coating, the surface of the sample plate is observed after development for 60s, and the sensitivity segment number is obtained through the segment number of the complete residual solder resist coating. Here, according to the current market and the requirement of customers for solder resist ink products, the number of photosensitive segments is more than 8, which is qualified.
(4) Adhesion test
And (3) baking the flexible circuit board subjected to the process in a baking oven at 150 ℃ for 1 hour to prepare a test sample plate, testing the adhesive force of the sample plate by adopting a coating and drawing method, cutting the solder resist ink coating to the surface of the base material by using a cutting tool to form grid-shaped scratches, tearing the solder resist ink coating after being adhered by using a 3M adhesive tape, checking the peeling condition of the coating, and grading the adhesion condition of the coating.
The adhesion evaluation criteria were as follows:
o: the adhesive force is high, and no peeling phenomenon occurs;
x: poor adhesion, peeling or peeling of the coating occurs.
(5) Flexibility test
Bending at 180 degrees for 50 times, and winding and bending the steel plate for 1 mm in diameter;
and b.360-degree dead fold once.
The flexibility evaluation criteria are as follows:
o: the flexibility is high, and the appearance has no obvious crease after various bending experiments, and no cracking or peeling phenomenon exists;
x: poor flexibility, crease marks on the appearance after various bending experiments, and cracking or peeling phenomena.
(6) Gloss measurement
The surface gloss of the sample plate solder resist ink coating surface was measured at 3X 3 points spaced 1cm apart at an incident angle of 60 degrees using a micro-TRI-gloss instrument from BYK Gardner, and the gloss range was recorded to 1. Here, according to the current market and the demand of customers for the matte solder resist ink product, the glossiness value representing the matte degree is qualified below 15, and the smaller the value, the higher the matte degree.
(7) Insulation reliability test
And applying DC 100V bias voltage to the IPC-B comb-shaped electrode on the sample plate, and placing the IPC-B comb-shaped electrode in a constant-temperature constant-humidity tank with the temperature of 90% R.H. for one week under the condition of temperature cycle of 25-65 ℃. The samples were then treated at room temperature under DC500V for one minute, and resistance measurements and light microscopy were performed using a multimeter.
O: the insulation property is hardly decreased, and no surface change is observed;
x: the insulation property is obviously reduced, and the copper ions are transferred.
(8) Solder thermal shock resistance test
And spraying rosin soldering flux on the test sample, then placing the test sample in molten solder at 270 ℃ for soaking for 30 seconds, taking out the test sample, cleaning the test sample by using trichloroethane, air-drying the test sample, and carrying out visual detection.
The evaluation criteria for the solder thermal shock resistance were as follows:
o: the solder heat shock resistance process has no change, no color change, no falling off and no bump;
x: the solder heat shock resistance process is changed, such as discoloration, falling, bulging and the like.
(9) Nickel and gold resistance test
After 0.03 μ M Au plating of Ni 5 μ M, the coating was adhered with 3M tape and then peeled off, and the adhesion of the coating was rated.
The evaluation standard of the nickel and gold resistance is as follows:
o: no peeling phenomenon occurs;
x: peeling or peeling of the coating occurs.
(10) Acid resistance test
The test panels were immersed in a 10% volume fraction aqueous H2SO4 solution for half an hour at room temperature, removed and rinsed with deionized water, air dried, and visually inspected.
The acid resistance evaluation criteria are as follows:
o: the color of the product is not changed, and the product does not fall off or bulge;
x: changes occur, such as discoloration, peeling, bulging, etc.
(11) Alkali resistance test
And soaking the test sample in 10% NaOH aqueous solution for half an hour at room temperature, taking out, washing with deionized water, air-drying, and visually detecting.
The alkali resistance evaluation criteria are as follows:
o: the color of the product is not changed, and the product does not fall off or bulge;
x: changes occur, such as discoloration, peeling, bulging, etc.
(12) Solvent resistance test
The test panels were immersed in PMA (propylene glycol methyl ether acetate) solution for half an hour at room temperature, taken out, washed with deionized water, air dried, and visually inspected.
The evaluation criteria for solvent resistance were as follows:
o: the color of the product is not changed, and the product does not fall off or bulge;
x: changes occur, such as discoloration, peeling, bulging, etc.
The results are as follows:
table 2: performance evaluation results of solder resist ink and coating
As can be seen from the test results shown in table 2,
1. the inorganic extinction filler and the organic extinction filler can effectively reduce the surface gloss of the solder resist ink coating, but the addition amount is large, which is equivalent to diluting the proportion of other resin components, and the mutual solubility and the dispersibility with other resin components are not good, so that the photo-thermal curing reaction rate of the solder resist ink is reduced to a certain extent. Meanwhile, the matte solder-resisting coating is easy to have the problem of unevenness on the surface, has strong light diffuse reflection effect, influences the light hardening degree of the solder-resisting ink, and can cause the problems that the number of sensitivity sections in comparative examples 1-4 is reduced, and the soldering tin thermal shock resistance and the nickel and gold resistance are insufficient.
However, if a proper amount of surfactant is added, experiments show that especially 50% of the novel surfactant-AB type block polymer surfactant PBA-b-PDMAEA and the Dendrimer type surfactant PAMAM, which are mentioned in the invention, are added, the surface activity and the surface wettability of the inorganic and organic extinction filler can be effectively enhanced, the chemical stability and the viscosity stability are enhanced, the uniform dispersion of the inorganic and organic extinction filler in the solder resist ink is achieved, the surface smoothness of the solder resist ink coating is enhanced, the excessive light diffuse reflection caused by uneven surface of the solder resist ink coating is reduced, and the sensitivity and various resistances are effectively improved on the premise of ensuring the qualified matte degree.
2. If only one component of the inorganic extinction filler or the organic extinction filler is added, the problems of uneven dispersion, sedimentation, unstable chemistry or unstable viscosity and the like are easy to occur, the effective matte degree can not be achieved, and the inorganic extinction filler and the organic extinction filler are used together to achieve a good extinction effect, as shown in comparative examples 5-6.
3. The combination of solvents with different boiling points is the most effective blending method of the solvent for the matte solder resist ink after experimental trials, and the unevenness of the surface of the solder resist ink coating can be enhanced and the matte effect of the surface can be better promoted by using organic solvents with low, medium and high boiling points and volatilizing the solvents at different temperature sections.
In conclusion, the solder resist ink disclosed by the invention can maintain the photosensitive characteristics and various resistances of the solder resist ink, and has good extinction efficiency and good dispersibility.
In addition to the ingredients used in the examples, the acrylate compound having a carboxyl group may be selected from any one or a combination of at least any two of the following compounds including, but not limited to: omega-carboxy-polycaprolactone-acrylate, the phthalate of hydroxymethyl acrylate, the phthalate of hydroxyethyl acrylate, the phthalate of hydroxypropyl acrylate, the phthalate of hydroxybutyl acrylate, the phthalate of hydroxypentyl acrylate, the phthalate of hydroxyhexyl acrylate, the phthalate of hydroxyheptyl acrylate, the phthalate of hydroxyoctyl acrylate, the phthalate of hydroxynonyl acrylate, the phthalate of hydroxy-2-ethylhexyl acrylate, the phthalate of hydroxydecyl acrylate, the phthalate of hydroxyundecyl acrylate, the succinate of hydroxymethyl acrylate, the succinate of hydroxyethyl acrylate, the succinate of hydroxypropyl acrylate, succinic acid monoester of hydroxybutyl acrylate, succinic acid monoester of hydroxypentyl acrylate, succinic acid monoester of hydroxyhexyl acrylate, itaconic acid, crotonic acid, maleic acid, fumaric acid, isocrotonic acid and anhydrides thereof, hexahydrophthalic acid monoester of hydroxymethyl acrylate, hexahydrophthalic acid monoester of hydroxyethyl acrylate, hexahydrophthalic acid monoester of hydroxypropyl (meth) acrylate, hexahydrophthalic acid monoester of hydroxybutyl acrylate, hexahydrophthalic acid monoester of hydroxypentyl acrylate, hexahydrophthalic acid monoester of hydroxyhexyl acrylate, hexahydrophthalic acid monoester of hydroxyheptyl acrylate, hexahydrophthalic acid monoester of hydroxyoctyl acrylate, hexahydrophthalic acid monoester of hydroxynonyl acrylate, hexahydrophthalic acid monoester of hydroxy-2-ethylhexyl acrylate, hydroxydecyl acrylate, hydroxyundecyl acrylate, hydroxydodecyl acrylate, and the like.
The inorganic matting filler can be selected from silicon dioxide, talcum powder, barium sulfate, aluminum stearate, calcium stearate and the like.
The organic matting filler can be selected from cellulose acetate, low molecular weight polyethylene, polypropylene and other olefins, hydrogenated castor oil, polyamide wax micropowder, etc.
The surfactant is used for enhancing the dispersibility and intersolubility of the extinction filler and can be selected from AB type block polymer surfactants, Gemini type surfactants, Bola type surfactants and Dendrimer type surfactants.
The A block and the B block of the AB type block macromolecule are respectively similar to a hydrophilic head group and a hydrophobic tail chain, specifically, the A block is a pigment-philic anchor group, and the B block is a solvent-philic solvation tail chain. The A block is generally a functional group such as acid, amine, alcohol, phenol, etc., and is adsorbed on the surface of the particle by ionic bond, covalent bond, coordinate bond, hydrogen bond, van der Waals' force, etc., and the adsorption can be more compact and durable because of the plurality of adsorption sites. The B block is generally a polyether, polyester, polyolefin, polyacrylate, or the like, suitable for polar and non-polar solvents, respectively. BYK, CIBA, RHODIA and Shenzhen Shenchuan companies develop the products at present;
the Gemini type surfactant, also called dimer type surfactant, is a dimer oligomeric surfactant, and greatly improves the surface activity and wettability through a chemical bond connection method.
Bola-type surfactants, compounds in which two polar head groups are linked together by one or more hydrophobic chains, are known for their shape resembling Bola, a weapon of the southern american clay. The hydrophobic groups at both ends of the molecule act as associations, corresponding to the 2 terminal groups of the Bola type surfactant. The hydrophilic chains correspond to the linking chains of Bola-type surfactants and provide chemical and viscosity stability.
The Dendrimer type surfactant is a structure which is similar to a dendritic macromolecule in shape, starts from a central core molecule and is gradually diffused and spread by a branched monomer, and has the advantage of pigment dispersion stability under low viscosity. Because by modifying the terminal group thereof, a plurality of pigment affinity groups can be generated, enhancing the interaction with the pigment. In addition, because of the consistent molecular structure and the shape similar to an ellipsoid, a lower viscosity is easier to obtain in a dispersion system.
The epoxy resin can be selected from brominated epoxy resin, novolac epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, glycidylamine epoxy resin, hydantoin epoxy resin, alicyclic epoxy resin, trihydroxyphenyl methane epoxy resin, bixylenol epoxy resin, biphenol epoxy resin or their mixture; bisphenol S type epoxy resin, bisphenol A novolac type epoxy resin, tetrahydroxyphenyl ethane type epoxy resin, heterocyclic epoxy resin, phthalic acid diglycidyl ester resin, tetraglycidyl xylenol ethane resin, naphthyl group-containing epoxy resin, and alicyclic epoxy resins such as an epoxy resin having a dicyclopentadiene skeleton, a glycidyl methacrylate copolymer epoxy resin, a copolymer epoxy resin of cyclohexylmaleimide and glycidyl methacrylate, a CTBN-modified epoxy resin, vinylcyclohexene diepoxide, (3 ', 4 ' -epoxycyclohexylmethyl) -3, 4-epoxycyclohexane carboxylate, and (3 ', 4 ' -epoxy-6 ' -methylcyclohexylmethyl) -3, 4-epoxy-6-methylcyclohexane carboxylate.
The photoinitiator comprises at least one of benzoin and derivatives thereof, acetophenone and derivatives thereof, anthraquinone and derivatives thereof, thioxanthone and derivatives thereof, ketal and derivatives thereof, benzophenone and derivatives thereof, and tertiary amine and derivatives thereof. As the benzoin derivative, for example, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and the like; as the acetophenone derivatives, for example, 2-dimethoxy-2-phenylacetophenone, 2-diethoxy-2-phenylacetophenone, 1-dichloroacetophenone and the like; as the anthraquinone derivatives, for example, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, etc.; examples of the thioxanthone derivative include 2, 4-dimethylthioxanthone, 2, 4-diethylthioxanthone, 2-chlorothioxanthone, 2, 4-diisopropylthioxanthone, and the like; as the ketal derivative, for example, acetophenone dimethyl ketal, benzil dimethyl ketal, or the like; as the benzophenone derivative, for example, 4-benzoyl diphenyl sulfide, 4-benzoyl-4 ' -methyl diphenyl sulfide, 4-benzoyl-4 ' -ethyl diphenyl sulfide, 4-benzoyl-4 ' -propyl diphenyl sulfide and the like; examples of the tertiary amine compound include ethanolamine compounds and compounds having a dialkylaminobenzene structure, for example, dialkylamino group-containing coumarin compounds such as 4,4 '-dimethylaminobenzophenone, 4, 4' -diethylaminobenzophenone, and 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one- (7- (diethylamino) -4-methylcoumarin), ethyl 4-dimethylaminobenzoate, ethyl 2-dimethylaminobenzoate, ethyl (n-butoxy) 4-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, and 2-ethylhexyl 4-dimethylaminobenzoate.
The pigment may also be selected from phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium dioxide, naphthalene black, and the like.
At least one of an acrylic leveling agent, a fluorine leveling agent and a polymer leveling agent can be selected as the leveling agent in the additive. The additive can also be a defoaming agent and a film-forming additive. At least one selected from the group consisting of organosiloxanes and polyethers can be selected as the defoaming agent. The film forming assistant is at least one of propylene glycol butyl ether, propylene glycol methyl ether acetate and alcohol ester twelve.
Organic solvents having different boiling points include, but are not limited to, any one of the following compounds or a combination of at least any two of the following compounds: low boiling point solvent oil, such as No. 6 extraction solvent oil, with a boiling range of 60-90 ℃; medium boiling point solvent oil, such as rubber solvent oil, such as No. 120 solvent oil, the boiling range is 80-120 ℃; the boiling range of the high boiling point solvent oil, such as 200# solvent oil, is 140-200 ℃.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (5)
1. A high-dispersity matte solder resist ink is characterized by comprising the following components in percentage by weight: 30 parts by mass of an acrylate compound with carboxyl, 0.5-20 parts by mass of an inorganic extinction filler, 0.5-20 parts by mass of an organic extinction filler, 0.1-20 parts by mass of a surfactant, 5-30 parts by mass of an epoxy resin, 1-5 parts by mass of a photoinitiator, 1-5 parts by mass of a pigment, 0.1-5 parts by mass of an additive and 5-20 parts by mass of an organic solvent, wherein the surfactant is a 1:1 mass ratio mixture of an AB type block polymer surfactant and a Dendrimer type surfactant; the inorganic matting filler is silicon dioxide matting powder; the organic extinction filler is polyamide wax micropowder; the acrylate compound with carboxyl is carboxyl polyethylene glycol acrylate; the AB type block polymer surfactant is PBA-b-PDMAEA, and the Dendrimer type surfactant is PAMAM.
2. The high dispersibility matte solder resist ink according to claim 1, characterized in that: the organic solvent is a mixture of a plurality of organic solvents with different boiling ranges.
3. The high dispersibility matte solder resist ink according to claim 2, characterized in that: the organic solvent is a mixture of No. 6 extraction solvent oil, No. 120 solvent oil and No. 200 solvent oil.
4. The high dispersibility matte solder resist ink according to claim 1, characterized in that: the photoinitiator comprises at least one of benzoin and derivatives thereof, acetophenone and derivatives thereof, anthraquinone and derivatives thereof, thioxanthone and derivatives thereof, ketal and derivatives thereof, benzophenone and derivatives thereof, and tertiary amine and derivatives thereof.
5. The high dispersibility matte solder resist ink according to claim 1, characterized in that: the additive comprises at least one of a leveling agent, a defoaming agent and a film-forming assistant.
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| CN112852215A (en) * | 2021-01-12 | 2021-05-28 | 惠州市艾比森光电有限公司 | Printing ink for PCB (printed circuit board) of LED display screen, preparation method of LED display module using printing ink and LED display screen |
| CN113652133A (en) * | 2021-07-14 | 2021-11-16 | 湖北敏捷志成标识科技有限公司 | Amphiphilic printing coating and preparation method and application thereof |
| CN114058212A (en) * | 2021-11-18 | 2022-02-18 | 惠州市艾比森光电有限公司 | Black matte ink, PCB and preparation method thereof |
| CN114395287A (en) * | 2021-12-30 | 2022-04-26 | 广州斯达利电子原料有限公司 | Solder resist ink, solder resist layer and Mini-LED printed circuit board |
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