CN109819362A - Sound acquisition circuit and bluetooth headset - Google Patents

Abstract

The invention belongs to the field of intelligent listening and wearing equipment, and in particular relates to a sound collection circuit and a bluetooth earphone. The circuit includes: a Bluetooth processing module, connected to a sound collection module, and also adapted to be connected to a mobile terminal, receiving a first control signal sent by the mobile terminal, and outputting to the sound collection module according to the first control signal a first voltage; a sound collection module collects a sound signal according to the first voltage, and sends the sound signal to the Bluetooth processing module; the Bluetooth processing module is further configured to receive the sound signal and pass the sound signal through the audio The playback device converts the sound to the user. The above-mentioned sound collection circuit and the bluetooth earphone control the sound collection module through the bluetooth processing module, so that when the user wears the well-sealed earphone, the outside sound can be clearly heard, and the personal safety of the user is guaranteed.

Description

Sound acquisition circuit and bluetooth headset

technical field

The invention belongs to the technical field of intelligent listening and wearing equipment, and more particularly, relates to a sound collection circuit and a bluetooth earphone.

Background technique

With the development of society, the quality of life that people pursue is also improving. As a consumer product in life, earphones are loved by the people. Whether it is free time at home or on the way to travel, wearing a favorite earphone and listening to wonderful music can give people a relaxed and happy mood.

At present, the earmuffs of the earphones on the market are getting better and better, enabling users to hear beautiful music without noise from the earphones, or to make voice calls clearly. But when we listen to music with headphones and walk on the road, if there is a car passing by or someone talking, we may not be able to hear it, and there are safety issues, especially for headphones that can isolate external sounds, the airtightness is good, and it is not easy to hear. Safety.

SUMMARY OF THE INVENTION

In view of this, embodiments of the present invention provide a sound collection circuit and a Bluetooth headset to solve the problem in the prior art that a user cannot hear external sounds when wearing a well-sealed headset, making the user unsafe.

A first aspect of the embodiments of the present invention provides a sound collection circuit, including: a Bluetooth processing module and a sound collection module;

The bluetooth processing module is connected to the sound collection module, and is also adapted to be connected to a mobile terminal, to receive the first control signal sent by the mobile terminal, and to output the first control signal to the sound collection module according to the first control signal. a voltage;

The sound collection module collects a sound signal according to the first voltage, and sends the sound signal to the Bluetooth processing module;

The bluetooth processing module is further configured to receive the sound signal, and convert the sound signal into sound through an audio playback device.

Optionally, the Bluetooth processing module includes a CSR8670 chip;

Both the first control pin and the second control pin of the CSR8670 chip are connected to the sound acquisition module.

Optionally, the first control pin includes: a MIC_R_EN pin and a MIC_RP pin;

The second control pins include: a MIC_L_EN pin and a MIC_LP pin.

Optionally, the Bluetooth processing module further includes: a signal receiving unit for receiving the first control signal;

The signal receiving unit is connected to the BT_RF pin of the CSR8670 chip.

Optionally, the Bluetooth processing module further includes: a storage unit for storing software programs in the Bluetooth processing module;

The storage unit includes SST26WF080B chip;

The VDD pin of the SST26WF080B chip is connected to the VDD pin of the CSR8670 chip; the CE pin of the SST26WF080B chip is connected to the PIO23 pin of the CSR8670 chip; the SO pin of the SST26WF080B chip is connected to the CSR8670 The PIO26 pin of the chip is connected; the WP pin of the SST26WF080B chip is connected to the PIO27 pin of the CSR8670 chip; the HOLD pin of the SST26WF080B chip is connected to the PIO28 pin of the CSR8670 chip; The SCK pin is connected to the PIO21 pin of the CSR8670 chip; the SI pin of the SST26WF080B chip is connected to the PIO25 of the CSR8670 chip; the VSS pin of the SST26WF080B chip is grounded.

Optionally, the sound collection module includes: a first sound collection unit and a second sound collection unit;

The signal input end of the first sound collection unit is connected with the first control pin; the signal input end of the second sound collection unit is connected with the second control pin.

Optionally, the first sound collection unit includes: a first SPW2430HR5H-B chip; the second sound collection unit includes: a second SPW2430HR5H-B chip;

The first VDD pin of the first SPW2430HR5H-B chip is connected to the MIC_R_EN pin, the first OUT pin of the first SPW2430HR5H-B chip is connected to the MIC_RP pin, and the first SPW2430HR5H- The first GND pins of chip B are all grounded;

The second VDD pin of the second SPW2430HR5H-B chip is connected to the MIC_L_EN pin, the second OUT pin of the second SPW2430HR5H-B chip is connected to the MIC_LP pin, and the second SPW2430HR5H- The second GND pins of the B chips are all grounded.

Optionally, the first sound collection unit further includes: a first ESD electrostatic tube and a second ESD electrostatic tube;

One end of the first ESD (Electro-Static discharge, electrostatic discharge) electrostatic tube is connected to the first VDD pin, and the other end of the first ESD electrostatic tube is grounded; one end of the second ESD electrostatic tube is connected to the first VDD pin. The first OUT pin is connected, and the other end of the second ESD electrostatic tube is grounded;

The second sound collection unit further includes: a third ESD electrostatic tube and a fourth ESD electrostatic tube;

One end of the third ESD electrostatic tube is connected to the second VDD pin, and the other end of the third ESD electrostatic tube is grounded; one end of the fourth ESD electrostatic tube is connected to the second OUT pin, The other end of the fourth ESD electrostatic tube is grounded.

Optionally, the sound collection circuit further includes: a button module, connected to the Bluetooth processing module, and also adapted to be connected to an external power supply, for controlling the connection between the Bluetooth processing module and the mobile terminal according to user input;

The button module includes: a first control element and a fifth ESD electrostatic tube;

The first end of the first control element is connected to the external power supply, and the second end of the first control element is connected to the VREGEN pin of the CSR8670 chip;

One end of the fifth ESD electrostatic tube is connected to the first end of the first control element, and the other end of the fifth ESD electrostatic tube is grounded.

A second aspect of the embodiments of the present invention provides a Bluetooth headset, including a microphone and an audio playback device, and further including any one provided in the first aspect of the foregoing embodiments connected to the microphone and the audio playback device. The described sound acquisition circuit;

The microphone is connected to a sound collection module of the sound collection circuit; the sound collection module collects external sound signals through the microphone.

The beneficial effect of the sound collection circuit and the Bluetooth headset in the embodiment of the present invention compared with the prior art is that: in this embodiment, the Bluetooth processing module receives the first control signal sent by the mobile terminal, and according to the first control signal The signal outputs a first voltage to the sound collection module; the sound collection module collects the sound signal according to the first voltage, and sends the sound signal to the Bluetooth processing module; the Bluetooth processing module receives the sound signal, and sends the sound signal to the Bluetooth processing module. The sound signal is converted into sound through the audio playback device and transmitted to the user, so that the user can clearly hear the external sound when wearing the earphone with good sealing, so as to ensure the personal safety of the user.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present invention. In some embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a sound collection circuit provided by an embodiment of the present invention;

2 is a schematic diagram of a circuit structure of a Bluetooth processing module provided by an embodiment of the present invention;

3 is a schematic diagram of a circuit structure of a first sound collection unit provided by an embodiment of the present invention;

4 is a schematic diagram of a circuit structure of a second sound collection unit provided by an embodiment of the present invention;

FIG. 5 is a schematic flowchart of an implementation of the sound collection circuit for collecting sound signals according to an embodiment of the present invention.

Detailed ways

In the following description, for the purpose of illustration rather than limitation, specific details such as specific system structures and technologies are set forth in order to provide a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

In order to illustrate the technical solutions of the present invention, the following specific embodiments are used for description.

Example 1

Referring to FIG. 1 , a sound collection circuit provided by an embodiment of the present invention includes a Bluetooth processing module 100 and a sound collection module 200 .

The Bluetooth processing module 100 is connected to the sound collection module 200, and is also suitable to be connected to a mobile terminal. The Bluetooth processing module 100 receives the first control signal sent by the mobile terminal, and outputs a first voltage to the sound collection module 200 according to the first control signal.

The sound collection module 200 collects the sound signal signal according to the first voltage, and sends the sound signal to the Bluetooth processing module 100 .

The Bluetooth processing module 100 is further configured to receive the sound signal, convert the sound signal into sound, and transmit it to the user.

The above sound collection circuit receives the first control signal sent by the mobile terminal through the Bluetooth processing module 100, and outputs a first voltage to the sound collection module 200 according to the first control signal, and the sound collection module 200 according to the first voltage Collect the sound signal, and send the collected sound signal to the bluetooth processing module 100, and the bluetooth processing module 100 converts the sound signal into sound through the audio playback device and transmits it to the user, so that when the user wears a well-sealed earphone, the sound can be clearly To hear the outside world, to ensure the personal safety of users.

Referring to FIG. 2 , in one embodiment, the Bluetooth processing module 100 includes a CSR8670 chip.

Wherein, the first control pin and the second control pin of the CSR8670 chip are both connected to the sound acquisition module 200 .

The first control pins include: MIC_R_EN pins and MIC_RP pins; and the second control pins include: MIC_L_EN pins and MIC_LP pins.

Optionally, the Bluetooth processing module 100 further includes a signal receiving unit. The signal receiving unit is used to receive the connection signal sent by the mobile terminal to the Bluetooth processing module 100, and may also be used to receive the control signal sent by the mobile terminal to the Bluetooth processing module 100, and the like.

In addition, the signal receiving unit can be connected to the BT_RF pin of the CSR8670 chip.

Optionally, the Bluetooth processing module 100 further includes a storage unit. The storage unit is used to store the software program of the Bluetooth processing module 100; the software program is used to convert the sound signal into sound, and can also be used to convert the sound signal into sound and transmit it to the user, and can also realize a call function, etc. Wait. The storage unit may also be used to store voice signals or sound signals of the Bluetooth processing module 100 . The sound signal may be a sound signal of music being listened to by the user or playing a video.

The storage unit may include a SST26WF080B chip.

The VDD pin of the SST26WF080B chip is connected to the VDD pin of the CSR8670 chip, the CE pin of the SST26WF080B chip is connected to the PIO23 pin of the CSR8670 chip, and the SO pin of the SST26WF080B chip is connected to the CSR8670 The PIO26 pin of the chip is connected, the WP pin of the SST26WF080B chip is connected to the PIO27 pin of the CSR8670 chip, the HOLD pin of the SST26WF080B chip is connected to the PIO28 pin of the CSR8670 chip, and the SST26WF080B chip's PIO28 pin is connected. The SCK pin is connected to the PIO21 pin of the CSR8670 chip, the SI pin of the SST26WF080B chip is connected to the PIO25 of the CSR8670 chip, and the VSS pin of the SST26WF080B chip is grounded.

Optionally, the Bluetooth processing module 100 may further include a software burning unit. The software burning unit is used to burn a software program to the Bluetooth processing module 100; the software program can be used to convert the sound signal into sound, and can also be used to convert the sound signal into sound and transmit it to the user, or Realize the call function and so on.

The software burning unit can be respectively connected with the SD_OUT pin, SD_IN pin, WS pin, SCK pin and SPI_PCM# pin of the CSR8670 chip.

Optionally, the Bluetooth processing module 100 may further include an LED (Light Emitting Diode, light-emitting diode) reminder unit. Exemplarily, when the Bluetooth processing module 100 is connected to the mobile terminal, the LED light of the LED reminding unit reminds the user that the connection is successful or is in a connected state. Wherein, the reminding state of the LED light included in the LED reminding unit may be brightening, or may be flashing and emitting light. This embodiment does not limit the alerting state of the LED lights of the LED alerting unit, nor does it limit the number of the LED lights.

The LED reminder unit can be connected to the LED_0 pin, the LED_1 pin and the LED_2 pin of the CSR8670 chip, respectively.

Optionally, the Bluetooth processing module 100 may further include a voice calling unit. The voice call unit is used to implement a voice call function between a user and a mobile terminal through the voice call unit. The voice calling unit is also adapted to be connected with a microphone.

The power input end of the voice communication unit is connected with the PIO6 pin of the CSR8670 chip, the clock input end of the voice communication unit is connected with the PIO14 pin of the CSR8670 chip, and the data input end of the voice communication unit is connected to the PIO14 pin of the CSR8670 chip. The PIO5 pin of the CSR8670 chip is connected. One end of the microphone is connected to the clock input end and the data input end of the voice communication unit respectively, and the other end of the microphone is connected to the power input end of the voice communication unit.

Optionally, the Bluetooth processing module 100 may further include a power supply unit. The power supply unit is mainly used to provide power to the storage unit, the software burning unit, the LED reminder unit and the voice calling unit, etc., and can provide different voltages according to the different voltages required by each unit.

The power supply unit can be connected to the VDD pin of the CSR8670 chip.

Referring to FIG. 3 and FIG. 4 , in one embodiment, the sound collection module 200 includes: a first sound collection unit 201 and a second sound collection unit 202 . The first sound collection unit 201 is used to collect the sound of the right earphone, and the second sound collection unit 202 is used to collect the sound of the left earphone.

The signal input end of the first sound collection unit 201 is connected to the first control pin of the CSR8670 chip; the signal input end of the second sound collection unit 202 is connected to the second control pin of the CSR8670 chip.

Optionally, the first sound collection unit 201 includes: a first SPW2430HR5H-B chip; the second sound collection unit 202 includes: a second SPW2430HR5H-B chip.

The first VDD pin of the first SPW2430HR5H-B chip is connected to the MIC_R_EN pin of the CSR8670 chip, the first OUT pin of the first SPW2430HR5H-B chip is connected to the MIC_RP pin of the CSR8670 chip, The first GND pins of the first SPW2430HR5H-B chip are all grounded.

The second VDD pin of the second SPW2430HR5H-B chip is connected to the MIC_L_EN pin of the CSR8670 chip, the second OUT pin of the second SPW2430HR5H-B chip is connected to the MIC_LP pin of the CSR8670 chip, The second GND pins of the second SPW2430HR5H-B chip are all grounded.

Optionally, the first sound collection unit 201 further includes: a first ESD electrostatic tube D0 and a second ESD electrostatic tube D1. The first ESD electrostatic tube D0 is used to eliminate the static electricity of the voltage across the first VDD pin and the MIC_R_EN pin of the CSR8670 chip; the second ESD electrostatic tube D1 is used to eliminate the first OUT pin. The static electricity between the two ends of the pin and the voltage across the MIC_RP pin of the CSR8670 chip.

One end of the first ESD electrostatic tube D0 is connected to the first VDD pin, and the other end of the first ESD electrostatic tube D0 is grounded. One end of the second ESD electrostatic tube D1 is connected to the first OUT pin, and the other end of the second ESD electrostatic tube D1 is grounded.

Optionally, the first sound collection unit 201 may further include a first capacitor C1. The first capacitor C1 is used to filter the voltage output from the MIC_R_EN pin of the CSR8670 chip to the first VDD pin.

The anode of the first capacitor C1 is connected to the first VDD pin, and the cathode of the first capacitor C1 is grounded.

Optionally, the second sound collection unit 202 further includes: a third ESD electrostatic tube D3 and a fourth ESD electrostatic tube D5. The third ESD electrostatic tube D3 is mainly used to eliminate the static electricity of the voltage across the second VDD pin and the MIC_L_EN pin of the CSR8670 chip; the fourth ESD electrostatic tube D5 is mainly used to eliminate the second ESD electrostatic tube D5. The static electricity between the OUT pin and the voltage across the MIC_LP pin of the CSR8670 chip.

One end of the third ESD electrostatic tube D3 is connected to the second VDD pin, and the other end of the third ESD electrostatic tube D3 is grounded. One end of the fourth ESD electrostatic tube D5 is connected to the second OUT pin, and the other end of the fourth ESD electrostatic tube D5 is grounded.

Optionally, the second sound collection unit 202 may further include a second capacitor C2. The second capacitor C2 is used for filtering the voltage output from the MIC_L_EN pin of the CSR8670 chip to the second VDD pin.

The anode of the second capacitor C2 is connected to the second VDD pin, and the cathode of the second capacitor C2 is grounded.

Further, referring to FIG. 2 , in one embodiment, the sound collection circuit further includes a button module 300 . The button module 300 is connected to the Bluetooth processing module 100, and is also suitable for being connected to an external power supply. The button module 300 is used to control the Bluetooth processing module 100 to connect with the mobile terminal according to user input.

Optionally, the key module 300 may include: a first control element and a fifth ESD electrostatic tube D6.

The first end of the first control element is connected to the external power supply, and the second end of the first control element is connected to the VREGEN pin of the CSR8670 chip. The first control element is mainly used to control the Bluetooth processing module 100 to connect with the mobile terminal when the user inputs the first control element. Optionally, the first control element can also be used as a power-on button for the Bluetooth processing module 100. When the first control element is entered, the Bluetooth processing module 100 enters a working state. The first control element can also be used for the connection button of the voice communication unit of the Bluetooth processing module 100. After the Bluetooth processing module 100 is connected to the mobile terminal, the mobile terminal receives a call, and the user enters the first key. Control element, the phone of the mobile terminal is connected. Preferably, the first control element is a key switch.

One end of the fifth ESD electrostatic tube D6 is connected to the first end of the first control element, and the other end of the fifth ESD electrostatic tube D6 is grounded.

Optionally, the button module 300 may further include a first resistor R13. The first resistor R13 is used to protect the circuit in which the first control element is connected to an external power source. One end of the first resistor R13 is connected to the first end of the first control element, and the other end is connected to the external power supply. The first control element is connected to an external power source through the first resistor R13.

Optionally, the key module 300 may further include: a second control element and a third control element. The second control element and the third control element are mainly used to control the volume of the sound output by the Bluetooth processing module 100 according to user input, and the volume of the sound may be the sound of multimedia in the mobile terminal connected to the Bluetooth processing module 100. Volume, such as music and video, etc., can also be the volume of voice calls. Preferably, the second control element and the third control element are key switches.

The first end of the second control element is connected to the PIO2 pin of the CSR8670 chip, and the second end of the second control element is connected to the first power pin.

The first end of the third control element is connected to the PIO1 pin of the CSR8670 chip, and the second end of the third control element is connected to the second end of the second control element.

Optionally, the key module 300 may further include a sixth ESD electrostatic tube D2 and a seventh ESD electrostatic tube D4. The sixth ESD electrostatic tube D2 is used to eliminate the static electricity of the voltage of the second control element; the seventh ESD electrostatic tube D4 is used to eliminate the static electricity of the voltage of the third control element.

One end of the sixth ESD electrostatic tube is connected to the first end of the second control element, and the other end of the sixth ESD electrostatic tube D2 is grounded. One end of the seventh ESD electrostatic tube D4 is connected to the first end of the third control element, and the other end of the seventh ESD electrostatic tube D4 is grounded.

Optionally, the button module 300 may further include a second resistor R4 and a third resistor R6. The second resistor R4 is used to divide the voltage output by the Bluetooth processing module 100 to the second control element; the third resistor R6 is used to divide the voltage output by the Bluetooth processing module 100 to the third control element. The voltage is divided into voltage.

One end of the second resistor R4 is connected to the first end of the second control element, and the other end of the second resistor R4 is connected to the PIO2 pin of the CSR8670 chip. The second control element is connected to the PIO2 pin of the CSR8670 chip through the second resistor R4.

One end of the third resistor R6 is connected to the first end of the third control element, and the other end of the third resistor R6 is connected to the PIO1 pin of the CSR8670 chip. The third control element is connected to the PIO1 pin of the CSR8670 chip through the third resistor R6.

Referring to FIG. 5, the specific process of collecting external sounds will be described in conjunction with the above-mentioned sound collecting circuit, and the details are as follows:

S501: The Bluetooth processing module 100 receives a first control signal sent by the mobile terminal, and outputs a first voltage to the sound collection module 200 according to the first control signal.

Specifically, the mobile terminal may be equipped with a software APP (Application) that controls the Bluetooth processing module 100. After the Bluetooth processing module 100 is connected to the mobile terminal, the user can enter the function of collecting external sounds in the software APP by typing Press the button, and the software APP sends the first control signal to the Bluetooth processing module 100 through the mobile terminal.

After receiving the first control signal, the Bluetooth processing module 100 outputs the first voltage to the first sound collection unit 201 and the second sound collection module 202 of the sound collection module 200, that is, to the first sound on the right side. The collection unit 201 outputs the first voltage, that is, outputs the first voltage to the second sound collection unit 202 on the left.

Specifically, after receiving the first control signal, the Bluetooth processing module 100 controls the MIC_R_EN pin and the MIC_L_EN pin of the CSR8670 chip to be at a high level, and the MIC_R_EN pin sends a signal to the first sound The first VDD pin of the first SPW2430HR5H-B chip of the acquisition unit 201 outputs the first voltage, that is, the MIC_R_EN pin supplies power to the first SPW2430HR5H-B chip, so that the first SPW2430HR5H-B chip enters the working state , so that the first sound collection unit 201 starts to collect external sounds; the MIC_L_EN pin outputs the first voltage to the second VDD pin of the second SPW2430HR5H-B chip of the second sound collection unit 202, that is, The MIC_L_EN pin supplies power to the second SPW2430HR5H-B chip, so that the second SPW2430HR5H-B chip enters a working state, so that the second sound collection unit 202 starts to collect external sounds.

Optionally, before the Bluetooth processing module receives the first control signal sent by the mobile terminal, the method further includes:

Control the Bluetooth processing module 100 to connect with the mobile terminal through the key module 300 according to user input.

Specifically, the mobile terminal may be equipped with a software APP that controls the Bluetooth processing module 100. When the user opens the software APP and enters a Bluetooth connection button in the software APP, the software APP sends a message to the mobile terminal through the mobile terminal. The bluetooth processing module 100 sends a connection signal, and the user controls the bluetooth processing module 100 to receive the connection signal through the first control element of the key-in key module 300, and the bluetooth processing module 100 is connected to the mobile terminal.

Optionally, the mobile terminal may include a bluetooth function. After the user turns on the bluetooth function of the mobile terminal, the mobile terminal sends a connection signal to the bluetooth processing module 100 , and the user then presses the first key of the key module 300 . The control element controls the Bluetooth processing module 100 to receive the connection signal, and the Bluetooth processing module 100 is connected to the mobile terminal.

The mobile terminal may include a tablet computer, a palmtop computer, a computer notebook or a mobile phone and other terminals.

S502 , the sound collection module 200 collects a sound signal according to the first voltage, and sends the sound signal to the Bluetooth processing module 100 .

Specifically, the MIC_R_EN pin of the Bluetooth processing module 100 outputs the first voltage to the first VDD pin of the first SPW2430HR5H-B chip of the first sound collection unit 201, so that the first sound collection unit 201 enters the working state, and the first SPW2430HR5H-B chip starts to collect sound signals; the MIC_L_EN pin outputs the first sound signal to the second VDD pin of the second SPW2430HR5H-B chip of the second sound collecting unit 202 voltage, so that the second sound acquisition unit 202 enters the working state, even if the second SPW2430HR5H-B chip starts to collect sound signals.

Optionally, the user can open the software APP when the mobile terminal is in multimedia playback, such as video playback and music playback, and use the software APP to control the Bluetooth processing module 100 to output the first voltage to the sound acquisition module 200, The sound collection module 200 collects external sound signals. The user can also use the software APP to control the Bluetooth processing module 100 to output the first voltage to the sound collection module 200 when the mobile terminal is making a voice call, and the sound collection module 200 collects external sound signals. This embodiment does not limit the working state of the mobile terminal, that is, as long as the user opens the software APP and enters the function button of collecting external sounds in the software APP, the software APP will control the Bluetooth processing through the mobile terminal The module 100 outputs the first voltage to the sound collection module 200, and the sound collection module 200 collects external sound signals.

Further, the sound collection module 200 sends the collected sound signal to the MIC_RP pin of the CSR8670 chip of the Bluetooth processing module 100 through the first OUT pin of the first SPW2430HR5H-B chip, and the second SPW2430HR5H- The second OUT pin of the B chip sends the sound signal to the MIC_LP pin of the CSR8670 chip of the Bluetooth processing module 100 .

S503, the Bluetooth processing module 100 receives the sound signal, converts the sound signal into sound through an audio playback device, and transmits it to the user.

Specifically, the MIC_RP pin and the MIC_LP pin of the CSR8670 chip receive the sound signal sent by the sound collection module 200, and the CSR8670 chip converts the sound signal into sound through an audio playback device and transmits it to The user transmits the sound converted by the audio signal to the left and right ears of the user. Preferably, the audio playback device is a speaker.

Optionally, the user can control the volume of the sound delivered to the user by the Bluetooth processing module 100 by typing the second control element and the third control element of the key module 300 .

Optionally, when the user needs to collect outside sounds, during the process of collecting outside sound signals through the sound collection module 200, the volume of the sound played in the mobile terminal or the volume of the voice being called may remain unchanged or may be reduced. It can also be paused. When the volume of the sound played in the mobile terminal or the volume of the voice in the call remains unchanged, the volume of the external sound transmitted by the Bluetooth processing module 100 to the user is higher than the volume of the sound played in the mobile terminal or the voice in the call. The voice volume is large, that is, the user can clearly hear the external sound while listening to music or a voice call.

Optionally, after receiving the sound signal, the Bluetooth processing module 100 converts the sound signal into sound through the audio playback device and transmits it to the user, further comprising:

The user presses the button of the software APP in the mobile terminal to close and collect external sounds, and the Bluetooth processing module 100 stops outputting the first voltage to the sound collection module 200 .

Specifically, when there is no need to collect external sound signals, after the user presses the button to close the software APP to collect external sound, the software APP sends a shutdown signal to the Bluetooth processing module 100 through the mobile terminal, and the MIC_R_EN of the CSR8670 chip The pin and the MIC_L_EN pin are at low level, the Bluetooth processing module 100 stops outputting the first voltage to the sound collecting module 200, and the sound module 200 stops working, that is, stops collecting external sounds.

In this embodiment, the Bluetooth processing module 100 receives the first control signal sent by the mobile terminal, the MIC_R_EN pin and the MIC_L_EN pin of the CSR8670 chip are at a high level, and the Bluetooth processing module 100 sends a signal to the sound acquisition module 200 outputting a first voltage; the sound collection module 200 collects a sound signal according to the first voltage, and sends the sound signal to the bluetooth processing module 100; the bluetooth processing module 100 receives the sound signal, and passes the sound signal through the audio playback device It is converted into sound and transmitted to the user, so that when the user wears a well-sealed earphone, the external sound can be clearly heard, and the personal safety of the user is guaranteed.

Embodiment 2

This embodiment provides an earphone, including a microphone and an audio playback device, further comprising any sound collection circuit described in Embodiment 1 connected to the microphone and the audio playback device, and having the above sound collection circuit have beneficial effects.

Wherein, the microphone is connected to a sound collection module of the sound collection circuit, and the sound collection module collects external sound signals through the microphone. The audio playback device is arranged inside the earmuff of the earphone.

Exemplarily, when the user wears the earphones to listen to music, the earmuffs can completely isolate external noises and not be disturbed by the outside world due to the good sealing performance of the earmuffs. When the user needs to hear the external sound, the user can open the software APP that can control the headset through the mobile terminal, click the control button of the software APP or open the control button of the software APP by voice, and control the sound collection The Bluetooth processing module of the circuit outputs a first voltage to the sound collection module, and the sound collection module collects external sound signals. The sound collection module sends the collected sound signal to the bluetooth processing module; the bluetooth processing module receives the sound signal, converts the sound signal into sound through the audio playback device and transmits it to the user, so that the user wears a good seal. The outside sound can be clearly heard even with the headset.

Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. Module completion, that is, dividing the internal structure of the device into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment may be integrated in one processing unit, or each unit may exist physically alone, or two or more units may be integrated in one unit, and the above-mentioned integrated units may adopt hardware. It can also be realized in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing from each other, and are not used to limit the protection scope of the present application. For the specific working processes of the units and modules in the above-mentioned system, reference may be made to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

In the foregoing embodiments, the description of each embodiment has its own emphasis. For parts that are not described or described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of the present invention.

In the embodiments provided by the present invention, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the device embodiments described above are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be Incorporation may either be integrated into another system, or some features may be omitted, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it is still possible to implement the foregoing implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the within the protection scope of the present invention.

Claims (10)

1. a kind of sound collection circuit characterized by comprising bluetooth processing module and sound acquisition module；

The bluetooth processing module is connect with the sound acquisition module, is further adapted for connecting with mobile terminal, receives the movement The first control signal that terminal is sent, and it is electric to sound acquisition module output first according to the first control signal Pressure；

The voice signal is sent to the indigo plant according to the first voltage collected sound signal by the sound acquisition module Tooth processing module；

The bluetooth processing module is also used to receive the voice signal, and the voice signal is turned by audio playing apparatus It is changed to sound.

2. sound collection circuit as described in claim 1, which is characterized in that the bluetooth processing module includes CSR8670 core Piece；

First control pin of the CSR8670 chip and the second control pin are connect with the sound acquisition module.

3. sound collection circuit as claimed in claim 2, which is characterized in that the first control pin includes: MIC_R_EN Pin and MIC_RP pin；

The second control pin includes: MIC_L_EN pin and MIC_LP pin.

4. sound collection circuit as claimed in claim 2, which is characterized in that the bluetooth processing module further include: for connecing Receive the signal receiving unit of the first control signal；

The signal receiving unit is connect with the BT_RF pin of the CSR8670 chip.

5. sound collection circuit as claimed in claim 2, which is characterized in that the bluetooth processing module further include: storage institute State the storage unit of the software program in bluetooth processing module；

The storage unit includes SST26WF080B chip；

The VDD pin of the SST26WF080B chip is connect with the VDD pin of the CSR8670 chip；It is described The CE pin of SST26WF080B chip is connect with the PIO23 pin of the CSR8670 chip；The SST26WF080B chip SO pin is connect with the PIO26 pin of the CSR8670 chip；The WP pin of the SST26WF080B chip with it is described The PIO27 pin of CSR8670 chip connects；The HOLD pin of the SST26WF080B chip and the CSR8670 chip The connection of PIO28 pin；The SCK pin of the SST26WF080B chip is connect with the PIO21 pin of the CSR8670 chip；Institute The SI pin for stating SST26WF080B chip is connect with the PIO25 of the CSR8670 chip；The SST26WF080B chip VSS pin ground connection.

6. the sound collection circuit as described in right wants 2, which is characterized in that the sound acquisition module includes: that the first sound is adopted Collect unit and second sound acquisition unit；

The signal input part of first sound collection unit is connect with the first control pin；The second sound acquisition is single The signal input part of member is connect with the second control pin.

7. sound collection circuit as claimed in claim 6, which is characterized in that first sound collection unit includes: first SPW2430HR5H-B chip；The second sound acquisition unit includes: the 2nd SPW2430HR5H-B chip；

First VDD pin of the first SPW2430HR5H-B chip is connect with the MIC_R_EN pin, and described first First OUT pin of SPW2430HR5H-B chip is connect with the MIC_RP pin, the first SPW2430HR5H-B chip The first GND pin be grounded；

2nd VDD pin of the 2nd SPW2430HR5H-B chip is connect with the MIC_L_EN pin, and described second 2nd OUT pin of SPW2430HR5H-B chip is connect with the MIC_LP pin, the 2nd SPW2430HR5H-B chip The second GND pin be grounded.

8. sound collection circuit as claimed in claim 7, which is characterized in that first sound collection unit further include: the One ESD phasmajector and the 2nd ESD phasmajector；

One end of the first ESD phasmajector is connect with the first VDD pin, another termination of the first ESD phasmajector Ground；One end of the 2nd ESD phasmajector is connect with the first OUT pin, another termination of the 2nd ESD phasmajector Ground；

The second sound acquisition unit further include: the 3rd ESD phasmajector and the 4th ESD phasmajector；

One end of the 3rd ESD phasmajector is connect with the 2nd VDD pin, another termination of the 3rd ESD phasmajector Ground；One end of the 4th ESD phasmajector is connect with the 2nd OUT pin, another termination of the 4th ESD phasmajector Ground.

9. sound collection circuit as claimed in claim 2, which is characterized in that the sound collection circuit further include: key mould Block is connect with the bluetooth processing module, is further adapted for connecting with external power supply, at the bluetooth according to user's input control Reason module is connect with the mobile terminal；

The key module includes: the first control element and the 5th ESD phasmajector；

The first end of first control element is connect with the external power supply, the second end of first control element with it is described The VREGEN pin of CSR8670 chip connects；

One end of the 5th ESD phasmajector is connect with the first end of first control element, the 5th ESD phasmajector Other end ground connection.

10. a kind of earphone, including microphone and audio playing apparatus, which is characterized in that further include and the microphone and described The sound collection circuit as claimed in any one of claims 1-9 wherein of audio playing apparatus connection；

The microphone is connect with the sound acquisition module of the sound collection circuit；The sound acquisition module passes through the wheat Gram elegance collection external sound signal.