CN109337292A - A kind of 355nmSLA 3D printing light-cured resin applied to waist brace - Google Patents
A kind of 355nmSLA 3D printing light-cured resin applied to waist brace Download PDFInfo
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- CN109337292A CN109337292A CN201811196666.3A CN201811196666A CN109337292A CN 109337292 A CN109337292 A CN 109337292A CN 201811196666 A CN201811196666 A CN 201811196666A CN 109337292 A CN109337292 A CN 109337292A
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- 355nmsla
- cured resin
- printing light
- resin applied
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- 239000011347 resin Substances 0.000 title claims abstract description 27
- 229920005989 resin Polymers 0.000 title claims abstract description 27
- 238000010146 3D printing Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 239000004593 Epoxy Substances 0.000 claims abstract description 6
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 5
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000000945 filler Substances 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims abstract description 5
- 239000000049 pigment Substances 0.000 claims abstract description 5
- 150000003254 radicals Chemical class 0.000 claims abstract description 5
- 150000001768 cations Chemical class 0.000 claims abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 6
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- SIMFZBAGLIDEPJ-UHFFFAOYSA-N C1(=CC=CC=C1)CC(C)=O.C(C)OOOCC Chemical compound C1(=CC=CC=C1)CC(C)=O.C(C)OOOCC SIMFZBAGLIDEPJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003599 detergent Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- OCFITNCBUXARHB-UHFFFAOYSA-N triphenyl(phenylsulfanyl)-$l^{4}-sulfane Chemical group C=1C=CC=CC=1S(C=1C=CC=CC=1)(C=1C=CC=CC=1)SC1=CC=CC=C1 OCFITNCBUXARHB-UHFFFAOYSA-N 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 3
- QFFVPLLCYGOFPU-UHFFFAOYSA-N barium chromate Chemical compound [Ba+2].[O-][Cr]([O-])(=O)=O QFFVPLLCYGOFPU-UHFFFAOYSA-N 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- RDLGTRBJUAWSAF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-2-one Chemical compound CC(=O)CC1C=CC=CC1(C)O RDLGTRBJUAWSAF-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- -1 iodine hexafluoro-antimonic acids Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000012827 research and development Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 241001085205 Prenanthella exigua Species 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- QCCDLTOVEPVEJK-UHFFFAOYSA-N phenylacetone Chemical compound CC(=O)CC1=CC=CC=C1 QCCDLTOVEPVEJK-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Abstract
The present invention provides a kind of 355nm SLA 3D printing photosensitive resin materials, including mass fraction are as follows: 20-30 parts of raw material monomer, 10-50 parts of acrylic resin raw material, 20-50 parts of epoxy source material, 0.2-2 parts of free radical photo-initiation, 0.2-2 parts of cation light initiator, 1-10 parts of filler, 0.05-0.1 parts of defoaming agent, 0.3-1 parts of levelling agent, 0.05-3 parts of pigment, the 355nm SLA 3D printing photosensitive resin material, the resin has moderate strength, medium elongation at break, have the advantages that warp resistance and ratio of briquetting are high, it is able to satisfy the manufacturing demand of medical arm brace product.The 355nm SLA 3D printing can be used cooperatively with photosensitive resin material with the 355nm SLA 3D printer of mainstream, have splendid versatility, and research and development and production process can be put by being not required to individually to buy printer, reduce research and development and the production cost of enterprise.
Description
Technical field
The present invention relates to 3D printing new material technology field, specially a kind of 355nmSLA 3D applied to waist brace
Light-cured resin is used in printing.
Background technique
SLA 3D printing technique, also known as Introduction To Stereolithography, principle are computer control laser beams to light
Quick resin is that the surface of raw material carries out point by point scanning, and the resin flake layer in scanned region generates photopolymerization reaction and solidifies, shape
At a thin layer of part.Workbench moves down the distance of a thickness, so as to the resin surface layer being cured apply again one layer it is new
Liquid resin carries out next layer of scanning machining, repeatedly, until the manufacture of entire original shape finishes.Rapid shaping technique is comprehensive
The research achievement of the science and technology such as laser, computer aided design and manufacture, photochemistry, new material, is not required to any machinery
Process equipment can quickly and accurately manufacture the object of complicated shape.Wherein laser technology is the core of rapid shaping technique, is swashed
The development push of the light technology development of fast shaping technology.
The research that China has started SL rapid shaping in the early 1990s achieves considerable by the development in nearly more than ten year
Progress, the contour check and correction SL principle of Xi'an Communications University, technique, application technology etc. conduct in-depth research, mature commodity
Change the RS series laser rapidform machine that product has Shanghai connection safe.The owning amount in domestic rapidform machine market at home has been more than
Import equipment, and its cost performance and after-sale service are better than import equipment.
Existing SLA (Stere-Lithography Apparatus, a stereolithography apparatus) based resin composition is deposited
Be fully cured post-shrinkage ratio it is excessive (generally more than 5%, maximum be more than 8%) with the inadequate problem of intensity, shrank conference and led
The component undergoes deformation that rear 3D printing is fully cured is caused, intensity not enough makes 3D printing component not be able to satisfy wanting for industrial use
It asks.
Summary of the invention
Technical problem solved by the invention is a kind of 355nmSLA 3D printing photocuring applied to waist brace
Resin, to solve the problems in above-mentioned background technique.
Technical problem solved by the invention is realized using following technical scheme: a kind of applied to waist brace
355nmSLA 3D printing light-cured resin, including mass fraction are as follows: 20-30 parts of raw material monomer, acrylic resin raw material 10-
50 parts, 20-50 parts of epoxy source material, 0.2-2 parts of free radical photo-initiation, 0.2-2 parts of cation light initiator, filler 1-10
Part, 0.05-0.1 parts of defoaming agent, 0.3-1 parts of levelling agent, 0.05-3 parts of pigment.
Further, the raw material monomer is lauryl acid (LA), hydroxy-ethyl acrylate (HEA), tripropylene glycol
The one or more kinds of mixtures of diacrylate (TPGDA), trimethylolpropane trimethacrylate (TMPTA).
Further, the acrylic resin raw material is urethane acrylate, polyester acrylate, polyoxyalkylene acrylate
One of ester or a variety of mixtures.
Further, one of the epoxy source material bisphenol A epoxide resin, aliphatic epoxy resin.
Further, the free radical photo-initiation 2- hydroxy-2-methyl-phenylacetone, hydroxy-cyciohexyl ketone,
2- hydroxy-2-methyl-is to one of ethoxy ether phenylacetone.
Further, the cationic initiator is Phenylsulfanylphenyl diphenyl sulphur father-in-law salt, bis- (4- detergent alkylates)
One of iodine hexafluoro antimonate.
Further, the filler is one of silica, silicon nitride, carbon fiber, zirconium oxide.
Further, the defoaming agent is polysiloxane-polyether copolymer.
Further, the levelling agent is modified polyorganosiloxane.
Further, the pigment is one of titanium dioxide, carbon black, phthalocyanine green, permanent yellow.
It is compared to open technology, benefit of the invention is: the 355nm SLA 3D printing photosensitive resin in the present invention
Material, the resin have moderate strength, and medium elongation at break has the advantages that warp resistance and ratio of briquetting are high, is able to satisfy
The manufacturing demand of medical waist stabilizing brace product, 355nm SLA 3D printing photosensitive resin material can be with mainstream
355nm SLA 3D printer be used cooperatively, there is splendid versatility, research and development can be put by being not required to individually to buy printer
And production process, reduce research and development and the production cost of enterprise.
Specific embodiment
In order to make, technological means of the invention, creation characteristic, workflow, application method reach purpose and effect is easy to bright
White understanding, below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Embodiment 1.
20 parts of lauryl sour (LA), 10 parts of urethane acrylate, bisphenol A epoxide resin 20 are taken by mass fraction
Part, 2- hydroxy-2-methyl -0.2 part of phenylacetone, 0.2 part of Phenylsulfanylphenyl diphenyl sulphur father-in-law salt, silica 1 part, poly- silicon oxygen
0.05 part of alkane-copolyether, 0.3 part of modified polyorganosiloxane, 0.05 part of permanent yellow；
The step of preparation, is: first the liquid component in technical formula component is uniformly mixed in de-airing mixer,
Then be added component in solid component stir evenly in a reactor, then on grinder grind, in the strainer of 400 mesh into
Row filtering, is finally packed.
Embodiment 2
25 parts of hydroxy-ethyl acrylate (HEA), 30 parts of polyester acrylate, aliphatic epoxy resin 35 are taken by mass fraction
Part, 1 part of hydroxy-cyciohexyl ketone, bis- 1 part of (4- detergent alkylate) iodine hexafluoro antimonates, 5 parts of silicon nitride, polysiloxanes-are poly-
0.08 part of ether copolymer, 0.6 part of modified polyorganosiloxane, 2 parts of titanium dioxide；
The step of preparation, is: first the liquid component in technical formula component is uniformly mixed in de-airing mixer,
Then be added component in solid component stir evenly in a reactor, then on grinder grind, in the strainer of 400 mesh into
Row filtering, is finally packed.
Embodiment 3
28 parts of tripropylene glycol diacrylate (TPGDA), 40 parts of polyether acrylate, bisphenol-A epoxy are taken by mass fraction
45 parts of resin, 2- hydroxy-2-methyl-to 1.5 parts of ethoxy ether phenylacetone, 1.5 parts of Phenylsulfanylphenyl diphenyl sulphur father-in-law salt,
8 parts of carbon fiber, 0.09 part of polysiloxane-polyether copolymer, 0.8 part of modified polyorganosiloxane, 2.5 parts of phthalocyanine green；
The step of preparation, is: first the liquid component in technical formula component is uniformly mixed in de-airing mixer,
Then be added component in solid component stir evenly in a reactor, then on grinder grind, in the strainer of 400 mesh into
Row filtering, is finally packed.
Embodiment 4
30 parts of trimethylolpropane trimethacrylate (TMPTA), 50 parts of polyether acrylate, aliphatic are taken by mass fraction
50 parts of epoxy resin, 2- hydroxy-2-methyl-is to 2 parts of ethoxy ether phenylacetone, bis- (4- detergent alkylate) iodine hexafluoro antimony
2 parts of hydrochlorate, 10 parts of zirconium oxide, 0.1 part of polysiloxane-polyether copolymer, 1 part of modified polyorganosiloxane, 3 parts of carbon black；
The step of preparation, is: first the liquid component in technical formula component is uniformly mixed in de-airing mixer,
Then be added component in solid component stir evenly in a reactor, then on grinder grind, in the strainer of 400 mesh into
Row filtering, is finally packed.
The above shows and describes the basic principle, main features and advantages of the invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.Claimed range of the invention by appended claims and
Its equivalent thereof.
Claims (10)
1. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace, it is characterised in that: its mass fraction
Are as follows: 20-30 parts of raw material monomer, 10-50 parts of acrylic resin raw material, 20-50 parts of epoxy source material, free radical photo-initiation
0.2-2 parts, 0.2-2 parts of cation light initiator, 1-10 parts of filler, 0.05-0.1 parts of defoaming agent, 0.3-1 parts of levelling agent, pigment
0.05-3 parts.
2. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
Be: the raw material monomer is lauryl acid (LA), hydroxy-ethyl acrylate (HEA), tripropylene glycol diacrylate
(TPGDA), the one or more kinds of mixtures of trimethylolpropane trimethacrylate (TMPTA).
3. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
Be: the acrylic resin raw material be one of urethane acrylate, polyester acrylate, polyether acrylate or
A variety of mixtures.
4. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
It is: one of the epoxy source material bisphenol A epoxide resin, aliphatic epoxy resin.
5. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
It is: the free radical photo-initiation 2- hydroxy-2-methyl-phenylacetone, hydroxy-cyciohexyl ketone, 2- hydroxyl -2- first
Base-is to one of ethoxy ether phenylacetone.
6. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
Be: the cationic initiator is Phenylsulfanylphenyl diphenyl sulphur father-in-law salt, bis- (4- detergent alkylate) iodine hexafluoro-antimonic acids
One of salt.
7. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
It is:, the filler is one of silica, silicon nitride, carbon fiber, zirconium oxide.
8. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
It is:, the defoaming agent is polysiloxane-polyether copolymer.
9. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, feature
Be: the levelling agent is modified polyorganosiloxane.
10. a kind of 355nmSLA 3D printing light-cured resin applied to waist brace as described in claim 1, special
Sign is: the pigment is one of titanium dioxide, carbon black, phthalocyanine green, permanent yellow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811196666.3A CN109337292A (en) | 2018-10-15 | 2018-10-15 | A kind of 355nmSLA 3D printing light-cured resin applied to waist brace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811196666.3A CN109337292A (en) | 2018-10-15 | 2018-10-15 | A kind of 355nmSLA 3D printing light-cured resin applied to waist brace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109337292A true CN109337292A (en) | 2019-02-15 |
Family
ID=65310210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811196666.3A Pending CN109337292A (en) | 2018-10-15 | 2018-10-15 | A kind of 355nmSLA 3D printing light-cured resin applied to waist brace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109337292A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118638391A (en) * | 2024-06-24 | 2024-09-13 | 杭州乐一新材料科技有限公司 | A biocompatible light-curing 3D printing material and its preparation and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040087687A1 (en) * | 2002-10-30 | 2004-05-06 | Vantico A&T Us Inc. | Photocurable compositions with phosphite viscosity stabilizers |
| CN104250422A (en) * | 2013-06-26 | 2014-12-31 | 合肥杰事杰新材料股份有限公司 | Photosensitive resin used in 3D printing, and its preparation method |
| CN108410162A (en) * | 2018-04-13 | 2018-08-17 | 广州市有得油墨科技有限公司 | Photocuring 3D printing material and its preparation method and application |
-
2018
- 2018-10-15 CN CN201811196666.3A patent/CN109337292A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040087687A1 (en) * | 2002-10-30 | 2004-05-06 | Vantico A&T Us Inc. | Photocurable compositions with phosphite viscosity stabilizers |
| CN104250422A (en) * | 2013-06-26 | 2014-12-31 | 合肥杰事杰新材料股份有限公司 | Photosensitive resin used in 3D printing, and its preparation method |
| CN108410162A (en) * | 2018-04-13 | 2018-08-17 | 广州市有得油墨科技有限公司 | Photocuring 3D printing material and its preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118638391A (en) * | 2024-06-24 | 2024-09-13 | 杭州乐一新材料科技有限公司 | A biocompatible light-curing 3D printing material and its preparation and application |
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