CN109288187A - A semiconductor heating and cooling helmet - Google Patents
A semiconductor heating and cooling helmet Download PDFInfo
- Publication number
- CN109288187A CN109288187A CN201811304139.XA CN201811304139A CN109288187A CN 109288187 A CN109288187 A CN 109288187A CN 201811304139 A CN201811304139 A CN 201811304139A CN 109288187 A CN109288187 A CN 109288187A
- Authority
- CN
- China
- Prior art keywords
- helmet
- cold
- fan
- inner cavity
- ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B3/00—Helmets; Helmet covers ; Other protective head coverings
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B3/00—Helmets; Helmet covers ; Other protective head coverings
- A42B3/04—Parts, details or accessories of helmets
Landscapes
- Helmets And Other Head Coverings (AREA)
Abstract
本发明涉及一种头盔，特别涉及一种半导体冷暖头盔，解决了头盔的使用问题，包括盔本体，所述的盔本体内设有内腔，所述的内腔内设有调温组件，所述的调温组件包括电池、散热器、风扇和冷热芯片，所述的冷热芯片、散热器和风扇依次设置，所述的冷热芯片设于内腔靠盔本体内壁一侧，所述的风扇设于内腔靠盔本体外壁一侧，所述的电池、风扇和冷热芯片之间电联接，还包括控制板，所述的控制板和调温组件之间电联接，所述的导冷板和冷热芯片之间通过接触热传导，结构简单，佩戴不影响正常使用，通过冷暖芯片进行降温，以及通过进风和出风来进行空气疏导和流通，配合散热和排风结构大大提高使用效益，具有实用性和经济性。
The invention relates to a helmet, in particular to a semiconductor heating and cooling helmet, which solves the problem of using the helmet, and comprises a helmet body. The temperature regulating assembly includes a battery, a radiator, a fan, and a cooling and heating chip. The cooling and heating chip, the radiator and the fan are arranged in sequence. The fan is located in the inner cavity on the side of the outer wall of the helmet body, the battery, the fan and the cooling and heating chip are electrically connected, and a control board is also included. The contact heat conduction between the cold-conducting plate and the hot-cold chip has a simple structure and does not affect normal use when worn. Use benefits, practicality and economy.
Description
Technical field
The present invention relates to a kind of helmet, in particular to a kind of semiconductor cold-warm helmet.
Background technique
Helmet thermal diffusivity, air permeability in the market is poor, has inconvenience when use more, and the helmet in the market is more radix saposhnikoviae
The helmet of type, closed type or protection type does not have and solves product sweat bring damp and hot sense when the helmet is integrally worn, is opening immediately
The helmet, human body are also easy to perspire on head when wearing, influence using comfort.
Summary of the invention
Aiming at the shortcomings of the prior art, the present invention provides a kind of semiconductor cold-warm helmet.
To achieve the goals above, the technical solution used in the present invention is: a kind of semiconductor cold-warm helmet, including helmet sheet
Body, the helmet ontology is interior to be equipped with inner cavity, and described is interior intracavitary equipped with temperature adjustment component, and the temperature adjustment component includes battery, dissipates
Hot device, fan and cold and hot chip, cold and hot chip, radiator and the fan are set gradually, and the cold and hot chip is set to interior
Chamber leans on helmet inner body wall side, and the fan is set to inner cavity and leans on helmet body outer wall side, the battery, fan and Cool Hot Core
It is electrically connected between piece；
Further include control panel, is electrically connected between the control panel and temperature adjustment component；
The inner cavity is equipped with temperature-control coating by helmet inner body wall side, and the temperature-control coating includes at least insulating layer and leads
Cold plate, the conduction cooling plate are set between insulating layer and inner cavity cavity wall, pass through contact between the conduction cooling plate and cold and hot chip
Heat transfer.
The helmet bodies top is equipped with air inlet, and the helmet ontology front end is equipped with front air outlet, the helmet ontology
Rear end is equipped with rear air outlet, and the air inlet, front air outlet and rear air outlet are connected with inner cavity.
The helmet inner body wall is equipped with catch net.
The helmet ontology is equipped with safety belt and safety buckle, and the safety belt is set to helmet ontology two sides, the peace
Full band is connected by safety buckle snapping.
Beneficial effects of the present invention: a kind of semiconductor cold-warm helmet structure provided by the present invention is simple, and wearing does not influence
Normal use is cooled down by changes in temperature chip, and is dredged and circulated to carry out air by air inlet and the outlet, cooperation heat dissipation
Utilization benefit is greatly improved with air discharge structure, there is practicability and economy.
Detailed description of the invention
Fig. 1 is side structure schematic view of the invention；
Fig. 2 is positive structure diagram of the invention.
Specific embodiment
As Figure 1-Figure 2, a kind of semiconductor cold-warm helmet, including helmet ontology 1, the helmet ontology 1 is interior to be equipped with inner cavity
2, it is equipped with temperature adjustment component in the inner cavity 2, the temperature adjustment component includes battery 3, radiator 4, fan 5 and cold and hot chip 6,
Cold and hot chip 6, radiator 4 and the fan 5 is set gradually, and the cold and hot chip 6 is set to inner cavity 2 and leans on 1 inner wall of helmet ontology
Side, the fan 5 are set to inner cavity 2 and lean on 1 outer wall side of helmet ontology, electric between the battery 3, fan 5 and cold and hot chip 6
Connection.Cold and hot chip 6 is mature technical products, i.e. semiconductor chip, is heated when freezing, by battery 3 power into
Row driving.Battery 3 may be provided at the left and right sides of the helmet when being arranged, carry out the dispersion of weight, and 3 groups of more batteries is facilitated to set
It sets, improves and use the time.Radiator 4 is mature technological means, and the strong material of a variety of thermal conductivity can be used and be made, and heat dissipation
The also settable radiating fin in the surface of device 4 improves heat dissipation effect by increasing surface area.Cold and hot chip 6 freezes one end by person of modern times
Body head, but be not directly to contact.Heat caused by heating one end is shifted by radiator 4, while passing through fan 5
With air dissipation into outside air.
Further include control panel 7, is electrically connected between the control panel 7 and temperature adjustment component.Control panel 7 can integrate for common
Wiring board controls each element by control panel 7 and is acted, and for mature technological means, does not make excessively to illustrate and limit herein.
The inner cavity 2 is equipped with temperature-control coating by 1 inner wall side of helmet ontology, and the temperature-control coating includes at least insulating layer 8
With conduction cooling plate 9, the conduction cooling plate 9 is set between 2 cavity wall of insulating layer 8 and inner cavity, the conduction cooling plate 9 and cold and hot chip 6 it
Between pass through contact heat conductien.Temperature-control coating is used to uniform heat, is also equivalent to is uniformly distributed cooling capacity here, improves refrigeration area
And avoid local temperature too low.Conduction cooling plate 9 can be made by sheet metal or by the preferable material of heating conduction.Insulating layer 8
For preventing the mutual ablation of cooling capacity and heat, is separated, prevent heat from offsetting refrigeration effect.
Air inlet 10 is equipped at the top of the helmet ontology 1,1 front end of helmet ontology is equipped with front air outlet 11, described
1 rear end of helmet ontology is equipped with rear air outlet 12, and the air inlet 10, front air outlet 11 and rear air outlet 12 are connected with inner cavity 2
It is logical.Double air outlets are set, air flow property is increased, are also able to maintain internal drying.
1 inner wall of helmet ontology is equipped with catch net 13, is protected by catch net 13 to human body head, can also be prevented
Only human body head is to the direct contact at low temperature.
The helmet ontology 1 is equipped with safety belt 14 and safety buckle 15, and the safety belt 14 is set to 1 two sides of helmet ontology,
The safety belt 14 is connected by 15 snapping of safety buckle.Safety belt 14 and safety buckle 15 are mature technical products, pass through peace
Full band 14 and safety buckle 15 prevent the helmet from falling.
Beneficial effects of the present invention: a kind of semiconductor cold-warm helmet structure provided by the present invention is simple, and wearing does not influence
Normal use is cooled down by changes in temperature chip, and is dredged and circulated to carry out air by air inlet and the outlet, cooperation heat dissipation
Utilization benefit is greatly improved with air discharge structure, there is practicability and economy.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention, together
When the basic principles, main features and advantages of the present invention have been shown and described above, the technical staff of the industry answers
The understanding.
Claims (4)
1. a kind of semiconductor cold-warm helmet, including helmet ontology, which is characterized in that inner cavity is equipped in the helmet ontology, it is described
Interior intracavitary equipped with temperature adjustment component, the temperature adjustment component includes battery, radiator, fan and cold and hot chip, the Cool Hot Core
Piece, radiator and fan are set gradually, and the cold and hot chip is set to inner cavity and leans on helmet inner body wall side, and the fan is set to
Helmet body outer wall side is leaned in inner cavity, electrically connects between the battery, fan and cold and hot chip；
Further include control panel, is electrically connected between the control panel and temperature adjustment component；
The inner cavity is equipped with temperature-control coating by helmet inner body wall side, and the temperature-control coating includes at least insulating layer and conduction cooling
Plate, the conduction cooling plate are set between insulating layer and inner cavity cavity wall, pass through contact heat between the conduction cooling plate and cold and hot chip
Conduction.
2. a kind of semiconductor cold-warm helmet as described in claim 1, which is characterized in that the helmet bodies top is equipped with air inlet
Mouthful, the helmet ontology front end is equipped with front air outlet, and the helmet ontology rear end is equipped with rear air outlet, the air inlet, preceding
Air outlet and rear air outlet are connected with inner cavity.
3. a kind of semiconductor cold-warm helmet as claimed in claim 1 or 2, which is characterized in that set in the helmet inner body wall
There is catch net.
4. a kind of semiconductor cold-warm helmet as claimed in claim 3, which is characterized in that the helmet ontology is equipped with safety belt
And safety buckle, the safety belt are set to helmet ontology two sides, the safety belt is connected by safety buckle snapping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811304139.XA CN109288187A (en) | 2018-11-03 | 2018-11-03 | A semiconductor heating and cooling helmet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811304139.XA CN109288187A (en) | 2018-11-03 | 2018-11-03 | A semiconductor heating and cooling helmet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109288187A true CN109288187A (en) | 2019-02-01 |
Family
ID=65145765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811304139.XA Pending CN109288187A (en) | 2018-11-03 | 2018-11-03 | A semiconductor heating and cooling helmet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109288187A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110464073A (en) * | 2019-08-28 | 2019-11-19 | 浙江洋光科技有限公司 | A kind of semiconductor and aluminium net weave air-conditioning cap |
| CN111685440A (en) * | 2020-07-24 | 2020-09-22 | 汤嘉豪 | Multifunctional helmet |
| WO2020221249A1 (en) * | 2019-04-28 | 2020-11-05 | 深圳光启超材料技术有限公司 | Heat dissipation apparatus and helmet |
| CN112021720A (en) * | 2020-09-29 | 2020-12-04 | 蔡明辉 | Temperature control helmet |
| CN112137224A (en) * | 2020-09-25 | 2020-12-29 | 王华栋 | Cold and hot safety helmet |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2028460A1 (en) * | 1989-10-24 | 1991-04-25 | Christian Zahn | Military safety helmet |
| KR19990007562U (en) * | 1997-07-24 | 1999-02-25 | 구자윤 | Safety helmet with cooling function |
| CN2674897Y (en) * | 2003-12-29 | 2005-02-02 | 中国电子科技集团公司第十八研究所 | Safe semiconductor heating and cooling helmet |
| CN204306111U (en) * | 2014-12-10 | 2015-05-06 | 芜湖欧凯罗博特机器人有限公司 | A kind of protective helmet with temp regulating function |
| CN205358385U (en) * | 2016-01-20 | 2016-07-06 | 浙江续航新能源科技有限公司 | Intelligence air conditioner safety helmet |
| WO2017120627A1 (en) * | 2016-01-06 | 2017-07-13 | Truong Thanh Le | Helmet having the thermoelectric cooling system |
| CN107224024A (en) * | 2017-05-26 | 2017-10-03 | 西安科技大学 | A kind of semiconductor intelligent cooling helmet |
| CN209391133U (en) * | 2018-11-03 | 2019-09-17 | 浙江聚珖科技股份有限公司 | A kind of semiconductor cold-warm helmet |
-
2018
- 2018-11-03 CN CN201811304139.XA patent/CN109288187A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2028460A1 (en) * | 1989-10-24 | 1991-04-25 | Christian Zahn | Military safety helmet |
| KR19990007562U (en) * | 1997-07-24 | 1999-02-25 | 구자윤 | Safety helmet with cooling function |
| CN2674897Y (en) * | 2003-12-29 | 2005-02-02 | 中国电子科技集团公司第十八研究所 | Safe semiconductor heating and cooling helmet |
| CN204306111U (en) * | 2014-12-10 | 2015-05-06 | 芜湖欧凯罗博特机器人有限公司 | A kind of protective helmet with temp regulating function |
| WO2017120627A1 (en) * | 2016-01-06 | 2017-07-13 | Truong Thanh Le | Helmet having the thermoelectric cooling system |
| CN205358385U (en) * | 2016-01-20 | 2016-07-06 | 浙江续航新能源科技有限公司 | Intelligence air conditioner safety helmet |
| CN107224024A (en) * | 2017-05-26 | 2017-10-03 | 西安科技大学 | A kind of semiconductor intelligent cooling helmet |
| CN209391133U (en) * | 2018-11-03 | 2019-09-17 | 浙江聚珖科技股份有限公司 | A kind of semiconductor cold-warm helmet |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020221249A1 (en) * | 2019-04-28 | 2020-11-05 | 深圳光启超材料技术有限公司 | Heat dissipation apparatus and helmet |
| CN110464073A (en) * | 2019-08-28 | 2019-11-19 | 浙江洋光科技有限公司 | A kind of semiconductor and aluminium net weave air-conditioning cap |
| CN111685440A (en) * | 2020-07-24 | 2020-09-22 | 汤嘉豪 | Multifunctional helmet |
| CN112137224A (en) * | 2020-09-25 | 2020-12-29 | 王华栋 | Cold and hot safety helmet |
| CN112021720A (en) * | 2020-09-29 | 2020-12-04 | 蔡明辉 | Temperature control helmet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190201 |