CN109286735B - Assembly structure of camera module and assembly method for reducing camera module size - Google Patents
Assembly structure of camera module and assembly method for reducing camera module size Download PDFInfo
- Publication number
- CN109286735B CN109286735B CN201710599130.5A CN201710599130A CN109286735B CN 109286735 B CN109286735 B CN 109286735B CN 201710599130 A CN201710599130 A CN 201710599130A CN 109286735 B CN109286735 B CN 109286735B
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- China
- Prior art keywords
- camera module
- notch
- lens barrel
- assembly structure
- image sensor
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- 238000000034 method Methods 0.000 title abstract description 17
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
本发明涉及一种摄像头模组的装配结构、减小摄像头模组尺寸的装配方法，摄像头模组包括：镜筒框架、图像传感器芯片、印刷电路板，所述镜筒框架的至少一边开缺口，去除部分镜筒框架侧壁，达到减小摄像头模组尺寸的目的。
The present invention relates to an assembly structure of a camera module and an assembly method for reducing the size of the camera module. The camera module comprises: a lens barrel frame, an image sensor chip, and a printed circuit board. At least one side of the lens barrel frame is notched, and part of the side wall of the lens barrel frame is removed to achieve the purpose of reducing the size of the camera module.
Description
Technical Field
The invention relates to the technical field of image sensor chip packaging, in particular to an assembly structure of a camera module and an assembly method for reducing the size of the camera module.
Background
The image sensor is a sensor capable of sensing optical image information and converting the optical image information into a usable output signal, and the image sensor chip is easy to be polluted by external environment in the working process, so that the image sensor chip is required to be packaged, and the image sensor chip is in a sealed environment, so that the influence of the external environment on the image sensor chip is avoided.
At present, the packaging of the image sensor chip mainly adopts the following method: the image sensor chip is fixed on a circuit board, metal wires are respectively bonded on the chip and the circuit board through a wire-bonding (wire-bonding) technology, then the chip is packaged by using a housing, and the lens component is assembled in the housing. In the existing assembly process, the step of packaging the shell needs to keep a certain safety distance outside the metal wires so that the shell cannot interfere with the metal wires to cause defects when being adhered to the circuit board, and the process directly influences the size of the whole camera module, for example, the size of the camera module is generally 8.5mm multiplied by 8.5mm before the conventional 13M and 16M cameras. Due to the rapid development of the full-screen of the mobile phone and the improvement of the requirements of people on the appearance, the camera module is developing to miniaturization, and the size of the camera module required by the full-screen mobile phone is lower than 8mm, so that the traditional assembly process can not meet the market requirements.
Disclosure of Invention
The invention aims to provide an assembly structure of a camera module and an assembly method for reducing the size of the camera module, which improve the existing assembly method and reduce the packaging size of the camera module.
In order to solve the above technical problems, the present invention provides an assembly method for reducing a size of a camera module, the camera module includes: the camera comprises a lens barrel frame, an image sensor chip and a printed circuit board, wherein at least one edge of the lens barrel frame is provided with a notch, and the side wall of part of the lens barrel frame is removed, so that the purpose of reducing the size of a camera module is achieved.
Optionally, after the lens barrel frame is glued with the printed circuit board, glue is added again in the notch area, so that the supporting strength of the camera module is increased, and meanwhile, the interference influence of external light on the camera module is reduced.
Optionally, the bottom edge of the side wall moves inwards to a position between the metal wire and the photosensitive area of the image sensor chip, so that glue overflow is reduced and interference of stray light is reduced.
Optionally, a bending structure is arranged in the vicinity of at least one corner of one side of the notch, so that the mechanical strength is improved.
Optionally, a structure easy to glue is arranged on one side of the notch.
Optionally, the structure of easy point gum is: and a slope structure is arranged along the direction of the outer side surface and the inner side surface.
Optionally, an observation structure is arranged near the metal wire, so that the bonding state of the metal wire and the printed circuit board can be easily observed.
Another aspect of the present invention also provides an assembly structure of a camera module, the camera module including: the camera comprises a lens cone frame, an image sensor chip and a printed circuit board, wherein at least one side of the lens cone frame is provided with a notch, part of the side wall of the lens cone frame is removed, and the size of a camera module is reduced.
Compared with the prior art, the assembly structure of the camera module and the assembly method for reducing the size of the camera module have the following beneficial effects:
In the present invention, the camera module includes: the camera module comprises a lens cone frame, an image sensor chip and a printed circuit board, wherein at least one side of the lens cone frame is provided with a notch, and part of the side wall of the lens cone frame is removed, so that the width of the camera module in the direction of the lens cone frame provided with the notch is reduced, and the purpose of reducing the size of the camera module is achieved; in addition, the notch area is convenient for glue supplementing again, the supporting strength of the module is improved, the side wall of the lens frame is laterally moved between the metal wire and the photosensitive area of the image sensor chip from the outer side of the gold wire area in the prior art, glue overflow is reduced, interference of stray light is reduced, and optical performance is improved.
Drawings
FIG. 1 is a schematic diagram of an assembly structure of a camera module according to an embodiment of the invention;
FIG. 2 is a partial schematic view of the area A in FIG. 1;
FIG. 3 is a schematic view of a notch according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a notch according to an embodiment of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than those herein described, and those skilled in the art will readily appreciate that the present invention may be similarly embodied without departing from the spirit or essential characteristics thereof, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, which are only examples for convenience of illustration, and should not be construed as limiting the scope of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, the following describes in detail the assembly structure of the camera module and the assembly method for reducing the size of the camera module with reference to fig. 1 to 4.
Referring to fig. 1, in the assembly method for reducing the size of a camera module according to the present invention, the camera module includes: the image Sensor comprises a lens barrel frame (Base) 100, an image Sensor chip (CMOS Sensor) 200 and a printed circuit board (FPC) 400, wherein the lens barrel frame 100 is positioned at the upper part of the image Sensor chip 200, the image Sensor chip 200 is provided with a suspended metal wire 210, the metal wire 210 in the embodiment is a gold wire, one end of the metal wire 210 is bonded to a bonding PAD (PAD) of the image Sensor chip 200, and the other end of the metal wire is suspended in the image Sensor chip 200 and connected to the printed circuit board 400, so that the electric connection between the image Sensor chip 200 and the printed circuit board 400 is realized.
At least one edge of the lens barrel frame 100 is provided with a notch 300, and a part of the side wall 310 of the lens barrel frame 100 is removed, so that the width of the camera module in the direction of the lens barrel frame 100 provided with the notch 300 is reduced, and the sizes of the printed circuit board 400 and the lens barrel frame 100 are reduced, thereby achieving the purpose of reducing the size of the camera module and saving the cost. Specifically, referring to fig. 2, fig. 2 is a schematic partial view of the area a in fig. 1, which is a top view of the lens barrel frame 100, wherein a notch 300 is formed at the bottom of the lens barrel frame 100, and the bottom edge of the sidewall 310 is moved inward from the outer side of the metal wire area to between the metal wire 210 and the photosensitive area of the image sensor chip 200 in the prior art, the sidewall 310 is adhered to the image sensor chip 200 to provide a supporting force for the image sensor chip 200, and the image sensor chip 200 is suspended above the printed circuit board 400, so that the photosensitive area is prevented from being polluted by the outside, glue overflow is reduced, interference of stray light is reduced, and optical performance of the image sensor chip 200 is improved.
Referring to fig. 3 and 4, a bending structure 320 is disposed in a vicinity of at least one corner of one side of the notch 300, and the bending structure 320 includes two parts with a certain included angle, so as to improve mechanical strength of the camera module.
Further, after the lens barrel frame 100 is glued to the printed circuit board 400, the glue is applied again to the area of the notch 300, so that the adhesive strength between the image sensor chip 200 and the lens barrel frame 100 is increased, the supporting strength of the camera module is increased, and meanwhile, the interference influence of external light on the camera module is reduced. In addition, a structure that is easy to glue is provided on one side of the notch 300, and in this embodiment, the structure that is easy to glue is: the structure of the slope 330 is arranged along the direction of the inner side surface of the outer side surface of the lens barrel frame 100, an inclination angle is formed between the slope structure 330 and the light sensitive surface of the image sensor chip 200, the space of the notch 300 is increased, and glue is easy to repair.
With continued reference to fig. 1, an observation structure 500 is disposed near the metal wire 210, the observation structure 500 is located above the metal wire 210, an infrared cut filter (not shown on the way) is disposed on the sidewall 310 of the lens barrel frame 100, and the infrared cut filter covers the observation structure 500, so that the metal wire 210 of the image sensor chip 200 and the printed circuit board 400 can be seen through the observation structure 500, and the bonding state of the metal wire 210 and the printed circuit board 400 can be easily observed.
Referring to fig. 1, another aspect of the present invention further provides an assembling structure of a camera module, where the camera module includes: the camera module comprises a lens barrel frame 100, an image sensor chip 200 and a printed circuit board 300, wherein at least one side of the lens barrel frame 100 is provided with a notch 300, the side wall of part of the lens barrel frame 100 is removed, and the size of the camera module is reduced. The notch 300 in the present invention reduces the size of the printed circuit board 400 and the lens barrel frame 100, thereby reducing the size of the camera module and reducing the cost.
In summary, in the assembly structure of the camera module and the assembly method for reducing the size of the camera module provided by the invention, the camera module comprises: the camera comprises a lens barrel frame, an image sensor chip and a printed circuit board, wherein at least one edge of the lens barrel frame is provided with a notch, and the side wall of part of the lens barrel frame is removed, so that the purpose of reducing the size of a camera module is achieved.
Although the present invention has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present invention by using the methods and technical matters disclosed above without departing from the spirit and scope of the present invention, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present invention are within the scope of the technical matters of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710599130.5A CN109286735B (en) | 2017-07-21 | 2017-07-21 | Assembly structure of camera module and assembly method for reducing camera module size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710599130.5A CN109286735B (en) | 2017-07-21 | 2017-07-21 | Assembly structure of camera module and assembly method for reducing camera module size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109286735A CN109286735A (en) | 2019-01-29 |
| CN109286735B true CN109286735B (en) | 2024-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710599130.5A Active CN109286735B (en) | 2017-07-21 | 2017-07-21 | Assembly structure of camera module and assembly method for reducing camera module size |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111614881A (en) * | 2020-06-19 | 2020-09-01 | 湖南金康光电有限公司 | Photography modules and mobile terminals |
| CN111726945B (en) * | 2020-06-19 | 2021-11-02 | 湖南金康光电有限公司 | Packaging method of camera module |
| CN112954157A (en) * | 2021-01-28 | 2021-06-11 | 湖北三赢兴光电科技股份有限公司 | Camera module and terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098399A (en) * | 2015-07-16 | 2015-11-25 | 格科微电子（上海）有限公司 | Electric connection method for camera module |
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Fast welding method for camera module |
| CN207835584U (en) * | 2017-07-21 | 2018-09-07 | 格科微电子（上海）有限公司 | The assembling structure of camera module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980773B2 (en) * | 2006-11-30 | 2011-07-19 | Hitachi Maxell, Ltd. | Camera module and imaging apparatus |
| KR20150048470A (en) * | 2013-10-28 | 2015-05-07 | 삼성전기주식회사 | Fθ lens module for laser processing |
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2017
- 2017-07-21 CN CN201710599130.5A patent/CN109286735B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Fast welding method for camera module |
| CN105098399A (en) * | 2015-07-16 | 2015-11-25 | 格科微电子（上海）有限公司 | Electric connection method for camera module |
| CN207835584U (en) * | 2017-07-21 | 2018-09-07 | 格科微电子（上海）有限公司 | The assembling structure of camera module |
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| Publication number | Publication date |
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| CN109286735A (en) | 2019-01-29 |
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