CN109194781A

CN109194781A - Bracket, in-out box and mobile device

Info

Publication number: CN109194781A
Application number: CN201810962831.5A
Authority: CN
Inventors: 韦怡
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-08-22
Filing date: 2018-08-22
Publication date: 2019-01-11
Anticipated expiration: 2038-08-22
Also published as: WO2020038059A1; CN109194781B

Abstract

The present application discloses a stand, an input and output assembly and a mobile device. The bracket includes a first surface and a second surface opposite to each other, the second surface is provided with a plurality of accommodating cavities, the first surface is provided with a plurality of through holes corresponding to the plurality of accommodating cavities, and the bracket adopts a non-magnetic material integral structure. In the bracket, the input-output assembly, and the mobile device according to the embodiments of the present application, the bracket is formed with a plurality of accommodating cavities, which can be used to install each input-output module in the input-output assembly, thereby improving the strength of the entire input-output assembly and increasing the strength of each input-output assembly. The stability of the cooperation between functional components, the bracket adopts non-magnetic material, which can effectively avoid the magnetic interference between the bracket and the optical anti-shake component in the input and output modules, such as the imaging module.

Description

Bracket, in-out box and mobile device

Technical field

This application involves technical field of electronic device more particularly to a kind of brackets, in-out box and mobile device.

Background technique

The CCD camera assembly of mobile phone can be configured with multiple functional module groups, and multiple functional units generally require to work in coordination It could work normally, such as CCD camera assembly may include imaging modules and TOF component, in order to guarantee between multiple functional module groups Relative position is fixed to mostly use fixing piece to fix to more preferably cooperate, and with the development of mobile phone, imaging modules mostly band There is an optical anti-vibration component, and fixing piece may interfere the magnetic elements such as motor in optical anti-vibration component, and then influence Anti- shudder performance.

Summary of the invention

The application provides a kind of bracket, in-out box and mobile device.

The bracket of the application embodiment, including opposite the first face and the second face, second face offers multiple receipts Cavity, first face offer multiple through-holes corresponding with multiple accommodating chambers, and the bracket is integrally tied using non-magnetic material Structure.

The in-out box of the application embodiment includes the bracket and input and output mould group of above embodiment, described Input and output mould group includes imaging modules and flight time mould group, and the imaging modules and the flight time Mo Zu are fixed respectively It is mounted in multiple accommodating chambers and by the corresponding through-hole and is showed out from described first.

The mobile device of the application embodiment, the in-out box including shell and above embodiment are described defeated Enter output precision installation on the housing.

Bracket, in-out box and the mobile device of the application embodiment, bracket are formed with multiple accommodating chambers, can use It is installed therein in by each input and output mould group in in-out box, so that the intensity of entire in-out box is improved, Increase the stability cooperated between each functional unit, bracket uses non-magnetic material, it is possible to prevente effectively from bracket and input and output The magnetic disturbance between optical anti-vibration component in mould group in such as imaging modules.

The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.

Detailed description of the invention

The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, in which:

Fig. 1 is the schematic perspective view of the in-out box of embodiment of the present invention.

Fig. 2 and Fig. 3 is the perspective exploded view of the in-out box of embodiment of the present invention.

Fig. 4 is the floor map of the bracket in the in-out box of embodiment of the present invention.

Fig. 5 is the schematic perspective view of the bracket in the in-out box of embodiment of the present invention.

Fig. 6 is the schematic perspective view of the flight time mould group in the in-out box of embodiment of the present invention.

Fig. 7 is schematic cross-section of the flight time mould group shown in fig. 6 along VII-VII line.

Fig. 8 and Fig. 9 is the schematic perspective view of the electronic equipment of embodiment of the present invention.

Main element symbol description:

In-out box 100, bracket 10, side wall 11, the first face 111, the second face 112, accommodating chamber 113, imaging receiving Chamber 1130, the first accommodating chamber 1131, the second accommodating chamber 1132, third accommodating chamber 1133, first sub- the 1134, second son of accommodating chamber are received Cavity 1135, through-hole 114, first through hole 1141, the second through-hole 1142, third through-hole 1143, first the 1144, second son of sub-through hole Through-hole 1145, limiting slot 115, imaging limiting slot 1150, the first limiting slot 1151, the second limiting slot 1152, third limiting slot 1153 mounting grooves 116, stop collar 12, occlusion part 13, dispensing hole 131, flange 14, input and output mould group 20, imaging modules 21, master Camera 211, first is imaged ontology 2111, the first imaging electronics board 2112, secondary camera 212, second and ontology 2121, the is imaged Two imaging electronics boards 2122, flight time mould group 22, imaging ontology 201, imaging electronics board 202, optical transmitting set 221, light-receiving Device 222, optical element 2222, first substrate component 223, first substrate 2231, flexible circuit board 2232, is reinforced shell 2221 Plate 2233, cushion block 224, accommodating cavity 2241, perforation 225, connector 226, electronic component 227, optical anti-vibration mould group 23, electronics member Device 30, mobile device 200, shell 40, main body 41, movable part 42, display screen 50.

Specific embodiment

Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.

With the development of mobile phone, CCD camera assembly function is also more and more abundant, includes not only single imaging modules, may be used also , to realize available depth information except imaging function, to be enriched into configured with multiple functional module groups, such as TOF component etc. As function.

Multiple functional units generally require to work in coordination and could work normally, such as imaging modules and TOF component need to protect The one of card optical axis shows guarantee using effect, and mobile phone is in use, may be subjected to and collides so as to cause component mis, And the relative position of each component is changed can not preferable cooperating.

In order to guarantee that the relative position between multiple functional module groups is fixed to more preferably cooperate, fixing piece is mostly used Functional module group is fixed.And the promotion of development and user demand with mobile phone camera, imaging modules have optical anti-vibration group more Part, and in order to guarantee the degree of stability of the intensity of fixing piece functional unit in other words, fixing piece may be made of materials such as iron, And iron may interfere the magnetic elements such as motor in optical anti-vibration component as magnetic material, such as light may be sucked The motor in stabilization component is learned, so that motor driving imaging sensor is not in place and anti-shudder performance is caused to decline.

It please refers to Fig.1 to Fig.3, the in-out box 100 of embodiment of the present invention includes bracket 10 and input and output mould Group 20.Bracket 10 is integral structure made of non-magnetic material, and bracket 10 includes the first face 111 and the second face 112 opposite to each other, the Two faces 112 offer multiple accommodating chambers 113, and the first face 111 offers multiple through-holes 114 corresponding with multiple accommodating chambers 113.It is defeated Entering to export mould group 20 includes imaging modules 21 and flight time mould group 22, and imaging modules 21 and flight time mould group 22 are fixed respectively It is mounted in multiple accommodating chambers 113 and is exposed by corresponding through-hole 114 from the first face 111.

Wherein, bracket 10 can be integrally formed structure, be also possible to the one knot fitted together after seperated molding Structure.Exposing refers to see input and output mould group 20 from the first face 111, for example, input and output mould group 20 can pass through the 111 through-hole 114 exposes from the first face 111 on one side, and input and output mould group 20 can also not pass through through-hole 114, but pass through through-hole 114 it can be seen that input and output mould group 20.

Bracket 10 in the in-out box 100 of embodiment of the present invention is the integral structure of non-magnetic material, is treated as When being mounted in accommodating chamber 113 as mould group 21 and flight time mould group 22, imaging modules 21 and flight time mould group 22 it is opposite Position is not susceptible to change, to enable multiple input and output mould groups 20 preferably cooperating.Specifically, multiple accommodating chambers 113 position will not change, as long as input and output mould group 20 is fixed in accommodating chamber 113, input and output mould group 20 it Between relative position will not change, to improve the intensity of entire in-out box 100, increase each functional unit it Between the stability that cooperates, bracket 10 uses non-magnetic material, it is possible to prevente effectively from bracket 10 and input and output mould group 20 for example The magnetic disturbance between optical anti-vibration component in imaging modules 21.

Preferably, the bracket 10 of present embodiment is made of aluminum titanium alloy material, weight be can control within 1g, example Such as in some example, the total weight of bracket 10 is 0.77 gram.It is to be appreciated that in actual operation, optical anti-vibration component Motor generallys use VCM motor, its working principle is that being powered in fixed magnetic field to generate driving force to drive imaging modules 21 imaging sensor is mobile to carry out jitter compensation.Aluminum titanium alloy is non-magnetic material, can effectively avoid bracket 10 and imaging The magnetic disturbance between the motor in optical anti-vibration component in mould group 21, specifically, bracket 10 may be with the magnetic in VCM motor Property part is attracting.Meanwhile aluminum titanium alloy has die casting high yield rate as a kind of metal material, casting is fine and close, product intensity is high, Without fracture, flexibility is strong the features such as.

Further, the surface of bracket 10 is thick using sandblasting and point Nickel Plating Treatment technique, the nickel layer that electro-nickel process is formed Degree is 3 microns -8 microns, and the resistance of bracket entirety is less than 1 ohm.Sandblasting processing can by the scale on 10 surface of bracket etc. all Dirt is completely cured, so that surface reaches the roughness of needs, greatly improves the attachment force of bracket 10 and plating material.Branch can be improved in nickel plating The wearability of frame 10, anticorrosive property simultaneously being capable of antirusts.Preferably, bracket also needs to test by smog and remanent magnetism detection, tool Body, salt spray test is 8 hours, and remanent magnetism is less than 0.8 Gauss.In this way, can guarantee the physical property of bracket by the test And electrical property is preferable.

Fig. 1 and Fig. 4 is please referred to, the in-out box 100 of embodiment of the present invention includes bracket 10, input and output mould group 20 and electronic component 30.

Bracket 10 is structure as a whole and including side wall 11, stop collar 12, occlusion part 13 and flange 14.

Side wall 11 includes opposite the first face 111 and the second face 112.Second face 112 offers multiple spaced receipts Cavity 113.First face 111 offers multiple through-holes 114 of connection corresponding with multiple accommodating chambers 113.The quantity of accommodating chamber 113 can Think two, three, four or any number of, the quantity of through-hole 114 is identical as the quantity of accommodating chamber 113 and one-to-one correspondence is set It sets.Incorporated by reference to Fig. 3, multiple accommodating chambers 113 include the imaging accommodating chamber 1130 for installing imaging modules 21, present embodiment It includes the second accommodating chamber 1132 and third accommodating chamber 1133 that accommodating chamber 1130, which is imaged,.

The quantity of the accommodating chamber 113 of present embodiment is three, and three accommodating chambers 113 include successively spaced first Accommodating chamber 1131, the second accommodating chamber 1132 and third accommodating chamber 1133, wherein the first accommodating chamber 1131 includes first to be connected Sub- accommodating chamber 1134 and the second sub- accommodating chamber 1135.Through-hole 114 includes and the first accommodating chamber 1131, the second accommodating chamber 1132 and The corresponding first through hole 1141 of three accommodating chamber 1133, the second through-hole 1142 and third through-hole 1143, wherein first through hole 114 include that first sub-through hole 1144 corresponding with the first sub- accommodating chamber 1134 and the second sub- accommodating chamber 1135 and the second son are logical Hole 1145.The center of first sub-through hole 1144, the center of the second sub-through hole 1145, the center of the second through-hole 1142 and third through-hole 1143 center is located on same straight line L.

Incorporated by reference to Fig. 2 and Fig. 5, the second face 112 is also provided with multiple limiting slots 115 and mounting groove 116.Multiple limiting slots 115 run through side wall 11, and the connection corresponding with multiple accommodating chambers 113 of multiple limiting slots 115.The quantity and receipts of limiting slot 115 The quantity of cavity 113 is consistent and is located at the same side of straight line L, and multiple limiting slots 115 are limited including the first limiting slot 1151, second Slot 1152 and third limiting slot 1153, the first limiting slot 1151 are connected to the first accommodating chamber 1131, the second limiting slot 1152 and The connection of two accommodating chambers 1132, third limiting slot 1153 are connected to third accommodating chamber 1133.Multiple limiting slots 115 include for installing The imaging limiting slot 1150 of imaging electronics board 202, the imaging limiting slot 1150 of present embodiment include 1152 He of the second limiting slot Third limiting slot 1153.Mounting groove 116 is located at the side far from the second limiting slot 1152 of the second accommodating chamber 1132 and with second Limiting slot 1152 is opposite.Mounting groove 115 is connected to through side wall 11 and with the second accommodating chamber 1132.

The opening size of through-hole 114 is less than the opening size of corresponding accommodating chamber 113 to form stop collar 12.Stop collar 12 For limiting the installation site for the input and output mould group 20 being mounted in accommodating chamber 113.

Occlusion part 13 is extended to form from side wall 11 towards far from 1132 side of the second accommodating chamber, and occlusion part 13 is located at and mounting groove On 116 corresponding side walls 11.Occlusion part 13 is offered through the dispensing hole 131 of occlusion part 13.The quantity in dispensing hole 131 can be One, two or any number of.

Flange 14 is extended to form from side wall 11 towards far from 113 side of accommodating chamber, and flange 14 is located at close the first of side wall 11 The one end in face 111 is simultaneously arranged around accommodating chamber 113.Bracket 10 can be threaded through the formation in mobile device 200 (as shown in Figure 8) Have in the circuit board (not shown) of mounting hole, and flange 14 and circuit board are inconsistent.

It please refers to Fig.1 to Fig.3, input and output mould group 20 includes at least imaging modules 21 and flight time mould group 22.Imaging Mould group 21 and flight time mould group 22 are mounted in multiple accommodating chambers 113 and are located on same straight line L.

Imaging modules 21 include imaging ontology 201 and imaging electronics board 202.It includes the first imaging ontology that ontology 201, which is imaged, 2111 and second are imaged at least one of ontology 2121.Imaging electronics board 202 is corresponding with imaging ontology 201 and including the first electricity At least one of road plate 2112 and second circuit board 2122, specifically, when imaging ontology 201 includes the first imaging ontology 2111 When, imaging electronics board 202 includes first circuit board 2112；When it includes the second imaging ontology 2121 that ontology 201, which is imaged, imaging electricity Road plate 202 includes second circuit board 2122.Imaging ontology 201 is mounted in accommodating chamber 113 (for example, second accommodating chamber 1132) simultaneously Exposed by through-hole 114 (for example, second through-hole 1142) from the first face 111.Imaging electronics board 202 is threaded through 115 (example of limiting slot Such as, the second limiting slot 1152) in.Imaging modules 21 are taken the photograph including visible image capturing head, infrared camera, black and white camera, focal length As any one in head and wide-angle camera.The quantity of imaging modules 21 can be one, two, three or any number of. The imaging modules 21 of present embodiment include main camera 211 and secondary camera 212.

Main camera 211 is mounted in the second accommodating chamber 1132 and is exposed by the second through-hole 1142 from the first face 111.Tool Body, main camera 211 includes the first imaging ontology 2111 and first circuit board 2112.First imaging ontology 2111 is mounted on the Expose in two accommodating chambers 1132 and from the second through-hole 1142.First circuit board 2112 is threaded through in the second limiting slot 1152 and installation In slot 116.Main camera 211 can be wide-angle camera, colour imagery shot (i.e. RGB camera) or infrared camera.

Secondary camera 212 is mounted in third accommodating chamber 1133 and is exposed by third through-hole 1143 from the first face 111.It is secondary Camera 212 includes the second imaging ontology 2121 and second circuit board 2122.Second imaging ontology 2121 is mounted on third receiving Expose in chamber 1133 and from third through-hole 1143.Second circuit board 2122 is threaded through in third limiting slot 1153.Secondary camera 212 It can be focal length camera, black and white camera (i.e. Mono camera), colour imagery shot or infrared camera.

Specifically, when main camera 211 is wide-angle camera, secondary camera 212 can be focal length camera；When master takes the photograph When picture head 211 is colour imagery shot, secondary camera 212 can be black and white camera；When main camera 211 be colour imagery shot, Secondary camera 212 can be colour imagery shot；When main camera 211 is colour imagery shot, secondary camera 212 can be infrared Camera；When main camera 211 is infrared camera, secondary camera 212 can be black and white camera.

It may be noted that being, in contrast " wide-angle " and " focal length " is.Wide-angle camera has relative to focal length camera Bigger field angle, focal length camera is longer relative to wide-angle camera focal length, shooting distance is farther.Black and white camera relative to Colour imagery shot is able to ascend half-light/night scene filming image quality.

Fig. 6 and Fig. 7 is please referred to, flight time mould group 22 includes first substrate component 223, cushion block 224, optical transmitting set 221 And optical receiver 222.Incorporated by reference to Fig. 3, flight time mould group 22 is fixedly mounted in the first accommodating chamber 1131 and logical by first Hole 1141 is exposed from the first face 111, specifically, first substrate component 223, cushion block 224, optical transmitting set 221 and optical receiver 222 It is housed in the first accommodating chamber 1131, optical transmitting set 221 and optical receiver 222 pass through first through hole 1141 from the first face 111 Expose.

First substrate component 223 is stretched out out of first limiting slot 1151.First substrate component 223 includes the interconnected One substrate 2231 and flexible circuit board 2232.First substrate 2231 can be printed wiring board or flexible circuit board, first substrate The control route etc. of flight time mould group 22 can be equipped on 2231.One end of flexible circuit board 2232 can connect first On substrate 2231, the other end of flexible circuit board 2232 is connected on the circuit board 2211 of optical transmitting set 221.Flexible circuit board 2232 can occur the bending of certain angle, allow 2232 both ends of flexible circuit board connect device relative position have compared with More options.

Cushion block 224 is arranged on first substrate 2231.In one example, cushion block 224 contacted with first substrate 2231 and It is carried on first substrate 2231, specifically, cushion block 224 can be combined by modes such as gluings with first substrate 2231.Cushion block 224 material can be metal, plastics etc..In embodiments of the present invention, the face that cushion block 224 is combined with first substrate 2231 can be with It is plane, the opposite face in face of the cushion block 224 in conjunction with this is also possible to plane, so that optical transmitting set 221 is arranged on cushion block 224 When have preferable stationarity.

Optical transmitting set 221 is mounted in the second sub- accommodating chamber 1135 and exposes from the second sub-through hole 1145.Optical transmitting set 221 It is arranged on cushion block 224.One end of the bending of flexible circuit board 2232 and flexible circuit board 2232 connects first substrate 2231, another End connection optical transmitting set 221.Optical transmitting set 221 is for launching outward optical signal.

Optical receiver 222 is mounted in the first sub- accommodating chamber 1134 and exposes from the first sub-through hole 1144.Optical receiver 222 It is arranged on first substrate 2231, and the contact surface of optical receiver 222 and first substrate 2231 and cushion block 224 and first substrate 2231 contact surface is substantially flush setting (that is, the start of installation of the two is in the same plane).Specifically, optical receiver 222 Including shell 2221 and optical element 2222.Shell 2221 is arranged on first substrate 2231, and optical element 2222 is arranged outside On shell 2221, shell 2221 can be the microscope base and lens barrel of optical receiver 222, and optical element 2222, which can be, to be arranged in shell The elements such as the lens in 2221.Optical receiver 222 is used to receive the optical signal that the optical transmitting set 221 being reflected back toward emits.

Further, optical receiver 222 can also include sensitive chip (not shown), be believed by the light that measured target is reflected back Number by optical element 2222 act on after be irradiated in sensitive chip, sensitive chip to the optical signal generate response.Flight time Mould group 22 calculates the sending optical signal of optical transmitting set 221 and sensitive chip receives the time reflected between the optical signal through testee Difference, and the depth information of testee is further obtained, which can be used for ranging, for generating depth image or use In three-dimensional modeling etc..

In the embodiment of the present invention, shell 2221 links into an integrated entity with cushion block 224.Specifically, shell 2221 and cushion block 224 can To be to be integrally formed, such as shell 2221 is identical as the material of cushion block 224 and is integrally formed by the modes such as being molded, cutting；Or Person's shell 2221 is different from the material of cushion block 224, and the two the modes such as forms by double-shot moulding and is integrally formed.Shell 2221 and pad Block 224 is also possible to be separately formed, and the two forms fit structure can be first by shell when assembling flight time mould group 22 2221 link into an integrated entity with cushion block 224, then are co-located on first substrate 2231；It can also be first by shell 2221 and cushion block One in 224 is arranged on first substrate 2231, then another is arranged on first substrate 2231 and is linked into an integrated entity.

Incorporated by reference to Fig. 3, in present embodiment, the center of optical receiver 222, the center of optical transmitting set 221, main camera 211 center and the center of secondary camera 212 are located on same straight line L1.

The setting of electric component group 30 is on first circuit board 2112 and corresponding with occlusion part 13.Specifically, electric component group 30 are arranged in the side identical with the second face 112 of occlusion part 13.User can by dispensing hole 131 electric component group 30 with Dispensing between occlusion part 13, electric component group 30 is fixed on occlusion part 13.Electric component group 30 can be capacitor, electricity The elements such as sense, transistor, resistance, optical device (including light compensating lamp, eyeglass etc.), sensor (stabilization use).Electric component group 30 It can be with a part of imaging modules 21, for example, imaging modules 21 further include optical anti-vibration (Optical image Stabilization, OIS) component when, electric component group 30 can be at least part electronics member in optical anti-vibration component Part.In other embodiments, electric component group 30 can be used for that imaging modules 21 is cooperated to use, for example, electric component group 30 It can also be light compensating lamp, light compensating lamp is for giving imaging modules 21 light filling, at this point, occlusion part 13 offers light hole, electronic component Group 30 can be exposed by light hole from the first face 111.

Bracket 10 in the in-out box 100 of embodiment of the present invention is non-magnetic material integral structure, works as imaging When mould group 21 and flight time mould group 22 are mounted in accommodating chamber 113, the opposite position of imaging modules 21 and flight time mould group 22 It sets and is not susceptible to change, to enable multiple input and output mould groups 20 preferably cooperating.Specifically, multiple accommodating chambers 113 position will not change, as long as input and output mould group 20 is fixed in accommodating chamber 113, input and output mould group 20 it Between relative position will not change, to improve the intensity of entire in-out box 100, increase each functional unit it Between the stability that cooperates, bracket 10 uses non-magnetic material, it is possible to prevente effectively from bracket 10 and input and output mould group 20 for example The magnetic disturbance between optical anti-vibration component in imaging modules 21.

Further, in flight time mould group 22, since optical transmitting set 221 is arranged on cushion block 224, cushion block 224 can be with The height of padded optical transmitting set 221, and then the height of the exit facet of optical transmitting set 221 is improved, the light letter that optical transmitting set 221 emits It number is not easy to be blocked by optical receiver 222, optical signal is irradiated on testee completely；Bracket 10 is by forming limit Ring 12, when input and output mould group 20 is mounted in accommodating chamber 113, input and output mould group 20 and stop collar 12 to conflict, thus Convenient for the location and installation of input and output mould group 20；Bracket 10 is being blocked by setting occlusion part 13 and by the setting of electric component group 30 112 same side of portion 13 and the second face, to can be protected when that will install in-out box 100 and be installed in mobile device 200 Shield electric component group 30 will not be collided；Bracket 10 is by setting flange 14 consequently facilitating the location and installation of bracket 10.

In some embodiments, when the quantity of accommodating chamber 113 is two, two accommodating chambers 113 are respectively the first receipts Cavity 1131 and the second accommodating chamber 1132, wherein the first accommodating chamber 1131 includes the first sub- accommodating chamber 1134 for being connected and the Two sub- accommodating chambers 1135.At this point, through-hole 114 includes and the first accommodating chamber 1131 and the second accommodating chamber 1132 corresponding first Through-hole 1141 and the second through-hole 1142, wherein first through hole 114 includes and the first sub- accommodating chamber 1134 and the second sub- accommodating chamber 1135 corresponding first sub-through holes 1144 and the second sub-through hole 1145.First sub-through hole 1144, the second sub-through hole 1145 and The center of second through-hole 1142 is located along the same line.At this point, the quantity of imaging modules 21 is one, imaging modules 21 are visible Any one in light video camera head, infrared camera, black and white camera, focal length camera and wide-angle camera.Optical receiver 222, optical transmitting set 221, imaging modules 21 are successively separately mounted to the first sub- accommodating chamber 1134, the second sub- accommodating chamber 1135 and In two accommodating chambers 1132.At this point, the center of optical receiver 222, the center of optical transmitting set 221, the centre bit with imaging modules 21 In on same straight line.In other embodiments, imaging modules 21 are located at optical transmitting set 221 and the center of optical receiver 222 connects On the middle line (perpendicular bisector) of line, specifically, the center of the first sub-through hole 1144 and the line at the center of the second sub-through hole 1145 are First line segment, the line at the center at the center and first through hole 1141 of the second through-hole 1142 are second line segment, the first line segment and the Two line segments are mutually perpendicular to, and second line segment is located on the perpendicular bisector of the first line segment.In this way, being mounted on the first sub- accommodating chamber 1134 The line at the center of interior optical receiver 222 and the center of optical transmitting set 221 being mounted in the second sub- accommodating chamber 1135 is the Three line segments, imaging modules 21 are located on the middle line (perpendicular bisector) of third line segment.

In some embodiments, the quantity of accommodating chamber 113 is three, and three accommodating chambers 113 include successively interval setting The first accommodating chamber 1131, the second accommodating chamber 1132 and third accommodating chamber 1133.Through-hole 114 include with the first accommodating chamber 1131, Second accommodating chamber 1132 and the corresponding first through hole 1141 of third accommodating chamber 1133, the second through-hole 1142 and third through-hole 1143.At this point, the quantity of imaging modules 21 is two, it is respectively main camera 211 and secondary camera 212.Wherein, main camera 211 be wide-angle camera, and secondary camera 212 is focal length camera；Alternatively, main camera 211 is colour imagery shot, secondary camera 212 be black and white camera；Alternatively, main camera 211 is colour imagery shot, secondary camera 212 is colour imagery shot；Alternatively, main Camera 211 is colour imagery shot, and secondary camera 212 is infrared camera；Alternatively, main camera 211 is infrared camera, it is secondary Camera 212 is black and white camera.Wherein, the center of optical transmitting set 221, optical receiver 222 center, with main camera 211 And at least one of secondary camera 212 is located along the same line.For example, the center of optical transmitting set 221, optical receiver 222 Center and the center of main camera 211 are located along the same line, at this point, in the center of main camera 211 and secondary camera 212 The line of the heart can be vertical with the straight line；Alternatively, the center of optical transmitting set 221, the center of optical receiver 222 and secondary camera 212 center is located along the same line, at this point, the line at the center of main camera 211 and the center of secondary camera 212 is straight with this Line can be vertical.

In other embodiments, flight time mould group 22 is located at the line of centres of main camera 211 and secondary camera 212 Middle line on, specifically, the line at the center of the center of main camera 211 and secondary camera 212 is perpendicular to optical transmitting set 221 The line at center and the center of optical receiver 222, also, optical transmitting set 221 and optical receiver 222 are located at main camera 211 On the middle line (perpendicular bisector) of the line at center and the center of secondary camera 212.

In other embodiments, the line at the center of main camera 211 and the center of secondary camera 212 is parallel to light hair The line at the center at the center and optical receiver 222 of emitter 221.The center of main camera 211 and the middle line of optical transmitting set 221 connect Line of the line perpendicular to the center of main camera 211 and the center of secondary camera 212；Alternatively, center and the light of main camera 211 Line of the middle line line of receiver 222 perpendicular to the center of main camera 211 and the center of secondary camera 212；Alternatively, pair is taken the photograph As first 212 center and optical receiver 222 middle line line perpendicular in the center and secondary camera 212 of main camera 211 The line of the heart；The center and pair of the center of secondary camera 212 and the middle line line of optical transmitting set 221 perpendicular to main camera 211 The line at the center of camera 212.

Fig. 6 and Fig. 7 is please referred to, in some embodiments, the side that cushion block 224 is combined with first substrate 2231 offers Accommodating cavity 2241.Flight time mould group 22 further includes the electronic component 227 being arranged on first substrate 2231, electronic component 227 It is housed in accommodating cavity 2241.Electronic component 227 can be the elements such as capacitor, inductance, transistor, resistance, and electronic component 227 can To be electrically connected with the control route being laid on first substrate 2231, and for driving or controlling optical transmitting set 221 or light-receiving Device 222 works.Electronic component 227 is housed in accommodating cavity 2241, and the space in cushion block 224 is reasonably utilized, and does not need to increase Add the width of first substrate 2231 electronic component 227 is arranged, conducive to the overall dimensions for reducing flight time mould group 22.Accommodating cavity 2241 quantity can be one or more, multiple accommodating cavities 2241 can be apart from one another by, can when installing cushion block 224 To be arranged on first substrate 2231 by the position alignment of accommodating cavity 2241 and electronic component 227 and by cushion block 224.

Fig. 6 and Fig. 7 is please referred to, in some embodiments, cushion block 224 is offered to be connected to at least one accommodating cavity 2241 Evacuation perforation 225, at least one electronic component 227 protrude into evacuation perforation 225 in.It is appreciated that needing electronic component 227 When being housed in accommodating cavity 2241, it is desirable that the height of electronic component 227 is not higher than the height of accommodating cavity 2241.And for height height In the electronic component 227 of accommodating cavity 2241, evacuation perforation 225 corresponding with accommodating cavity 2241 can be opened up, electronic component 227 can To partially protrude into evacuation perforation 225, with the arranging electronic element 227 under the premise of not improving 224 height of cushion block.

Fig. 6 and Fig. 7 is please referred to, in some embodiments, first substrate component 223 further includes stiffening plate 2233, is reinforced Plate 2233 is incorporated in the side opposite with cushion block 224 of first substrate 2231.Stiffening plate 2233 can cover first substrate 2231 A side, stiffening plate 2233 can be used for increasing the intensity of first substrate 2231, and avoiding first substrate 2231, deformation occurs. In addition, stiffening plate 2233 can be made of conductive material, such as metal or alloy etc., when flight time mould group 22 is mounted on shifting When in dynamic equipment 200 (shown in Fig. 8), stiffening plate 2233 can be electrically connected with shell 40 (shown in Fig. 8), so that stiffening plate 2233 Ground connection, and efficiently reduce interference of the electrostatic of outer member to flight time mould group 22.

Fig. 6 and Fig. 7 is please referred to, in other embodiments, flight time mould group 22 further includes connector 226, connector 226 are connected on first substrate component 223 and for being electrically connected with the electronic component outside flight time mould group 22.

Fig. 8 and Fig. 9 please be participate in, the mobile device 200 of embodiment of the present invention includes shell 40 and any of the above-described embodiment party The in-out box 100 of formula, in-out box 100 are mounted on shell 40.

Specifically, mobile device 200 is including in mobile phone, tablet computer, laptop, Intelligent bracelet, intelligent helmet Any one.

Shell 40 can provide the protection such as dust-proof, waterproof, shatter-resistant to in-out box 100, offer on shell 40 with The corresponding hole of input and output mould group 20, the light that input and output mould group 20 (for example, optical transmitting set 221) issues can be pierced by from hole Shell 40；Light outside shell 40 can penetrate shell 40 from hole and be transmitted to input and output mould group 20 (for example, light-receiving Device 222, imaging modules 21).In other embodiments, referring to Fig. 9, in-out box 100 is housed in shell 40 simultaneously It can be stretched out out of shell 40, at this point, not needing to open up on shell 40 corresponding with the disengaging light direction of in-out box 100 Hole, for example, shell 40 includes main body 41 and movable part 42, in-out box 100 is mounted on movable part 42, and movable part 42 exists It can be moved relative to main body 41 under the driving of driving device, movable part 42 can be slided relative to main body 41, to slide into main body 41 inside (as shown in Figure 8) skid off (as shown in Figure 9) from main body 41.When needing using in-out box 100, movably Portion 42 drives in-out box 100 to be reached outside shell 40 out of shell 40；When not needing using in-out box 100 When, movable part 42 drives in-out box 100 to accommodate outside shell 40 to shell 40.In yet another embodiment, please join Fig. 8 is read, mobile device 200 further includes display screen 50, and in-out box 100 is housed in shell 40 and is located at display screen 50 Lower section, at this point, also not needing to open up hole corresponding with the disengaging light direction of in-out box 100 on shell 40.

Bracket 10 in the mobile device 200 of embodiment of the present invention is that integral structure is made in non-magnetic material, works as imaging When mould group 21 and flight time mould group 22 are mounted in accommodating chamber 113, the opposite position of imaging modules 21 and flight time mould group 22 It sets and is not susceptible to change, to enable multiple input and output mould groups 20 preferably cooperating.Specifically, multiple accommodating chambers 113 position will not change, as long as input and output mould group 20 is fixed in accommodating chamber 113, input and output mould group 20 it Between relative position will not change.

In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.

While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that: These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become Type, scope of the present application are defined by the claims and their equivalents.

Claims

1. A bracket, characterized in that the bracket comprises a first surface and a second surface opposite to each other, the second surface is provided with a plurality of accommodating cavities, and the first surface is provided with corresponding to the plurality of accommodating cavities A plurality of through holes are formed, and the bracket adopts an integrated structure of non-magnetic material.

2 . The stent according to claim 1 , wherein the stent adopts an aluminum-titanium alloy integrally formed structure, the surface of the stent adopts a sandblasting and spot nickel plating process, and the nickel layer formed by the nickel electroplating process is used. 3 . The thickness of the stent is 3 microns to 8 microns, and the resistance of the stent is less than 1 ohm.

3 . The bracket of claim 1 , wherein the plurality of accommodating cavities comprise a first accommodating cavity and a second accommodating cavity, and the plurality of the through holes comprise a first accommodating cavity corresponding to the first accommodating cavity. 4 . A through hole and a second through hole corresponding to the second receiving cavity.

4 . The bracket of claim 1 , wherein the bracket comprises a side wall connecting the first surface and the second surface, the side wall encloses a plurality of the accommodating cavities, and the The second surface is provided with a plurality of limiting grooves penetrating the side wall and correspondingly communicating with the plurality of the accommodating cavities.

5 . The bracket according to claim 1 , wherein the opening size of the through hole is smaller than the opening size of the corresponding accommodating cavity to form a limit ring, and the accommodating cavity is surrounded by the limit ring and the surrounding. 6 . The inner wall of the limiting ring is formed.

6 . The bracket of claim 1 , wherein the bracket comprises a side wall and a flange, the side wall is connected to the first surface and the second surface and encloses a plurality of the receiving cavities 6 . The flange is formed extending from the side wall toward the side away from the receiving cavity, the flange is located at one end of the side wall close to the first surface and is arranged around the receiving cavity.

7. An input and output assembly, characterized in that, comprising:

The stent of any one of claims 1-6; and

Input-output module, the input-output module includes an imaging module and a time-of-flight module, and the imaging module and the time-of-flight module are respectively fixedly installed in a plurality of the accommodating cavities and pass through the corresponding cavities. The through hole is exposed from the first surface.

8 . The input-output assembly according to claim 7 , wherein the plurality of accommodating cavities comprise a first accommodating cavity and a second accommodating cavity, and the plurality of through holes comprise corresponding to the first accommodating cavity. 9 . a first through hole and a second through hole corresponding to the second accommodating cavity, the time-of-flight module is fixedly installed in the first accommodating cavity and exposed from the first surface through the first through hole , the imaging module is installed in the second accommodating cavity and exposed from the first surface through the second through hole.

9 . The input-output assembly of claim 7 , wherein the imaging module comprises any one of a visible light camera, an infrared camera, a black-and-white camera, a telephoto camera, and a wide-angle camera. 10 .

10. The input-output module of claim 9, wherein the time-of-flight module comprises an optical transmitter and an optical receiver, the center of the optical transmitter, the center of the optical receiver, and the The centers of the imaging modules are located on the same straight line; or

The imaging module is located on the center line of the center line connecting the center of the light transmitter and the light receiver.

11. The input-output assembly of claim 7, wherein the imaging module comprises a main camera and a sub-camera, and the plurality of accommodating cavities comprise a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity The plurality of through holes include a first through hole corresponding to the first receiving cavity, a second through hole corresponding to the second receiving cavity, and a third through hole corresponding to the third receiving cavity The time-of-flight module is fixedly installed in the first accommodating cavity and exposed from the first surface through the first through hole, and the main camera is installed in the second accommodating cavity and passes through the first through hole. The second through hole is exposed from the first surface, and the sub-camera is installed in the third receiving cavity and exposed from the first surface through the third through hole.

12. The input-output assembly of claim 11, wherein the main camera is located between the secondary camera and the time-of-flight module, the time-of-flight module and the main camera and the At least one of the secondary cameras is on the same line; or

The time-of-flight module is located on the center line of the center line connecting the main camera and the sub-camera.

13. The input-output assembly of claim 11, wherein the main camera is a wide-angle camera, and the sub-camera is a telephoto camera; or

The main camera is a color camera, and the secondary camera is a black and white camera; or

The main camera is a color camera, and the secondary camera is a color camera; or

The main camera is a color camera, and the secondary camera is an infrared camera; or

The main camera is an infrared camera, and the sub-camera is a black and white camera.

14. The input-output assembly of claim 7, wherein the bracket comprises a side wall connecting the first surface and the second surface, and the side wall encloses a plurality of the accommodating cavities, The second surface is provided with a plurality of limit slots that penetrate through the side walls and are correspondingly communicated with the plurality of the accommodating cavities; the time-of-flight module includes a first substrate assembly, and the imaging module includes an imaging circuit board , the first substrate assembly and the imaging circuit board are both penetrated in the limiting groove.

15 . The input-output assembly of claim 14 , wherein a plurality of the accommodating cavities include imaging accommodating cavities for installing the imaging module, and a plurality of the limiting grooves include communicating with the imaging accommodating cavities. 16 . The imaging limiting groove of the cavity, the second surface is further provided with a mounting groove that penetrates through the side wall and communicates with the imaging receiving cavity, and the mounting groove and the imaging limiting groove are located in the imaging receiving cavity. opposite sides; the bracket further includes a shielding portion extending from the side wall toward the side away from the imaging accommodating cavity, the shielding portion is located on the side wall corresponding to the bottom of the installation groove; the The imaging circuit board passes through the installation slot, and the input/output module further includes electronic components, which are arranged on the imaging circuit board and correspond to the shielding portion.

16. The input-output assembly of claim 7, wherein the time-of-flight module comprises:

a first substrate assembly, the first substrate assembly including a first substrate and a flexible circuit board connected to each other;

a spacer, the spacer is arranged on the first substrate;

a light emitter, the light emitter is disposed on the spacer, the flexible circuit board is bent, and one end of the flexible circuit board is connected to the first substrate, and the other end is connected to the light emitter; and

An optical receiver, the optical receiver is arranged on the first substrate, the optical receiver includes a housing and an optical element arranged on the housing, and the housing is connected to the spacer as a whole.

17. The input-output assembly of claim 16, wherein the plurality of accommodating cavities comprise first accommodating cavities, and the plurality of through holes comprise first through holes corresponding to the first accommodating cavities, The time-of-flight module is fixedly installed in the first receiving cavity and exposed from the first surface through the first through hole.

18 . The input-output assembly of claim 17 , wherein the first receiving cavity comprises a first sub-accommodating cavity and a second sub-accommodating cavity that communicate with each other, and the first through hole includes a second sub-accommodating cavity that communicates. 19 . A sub-through hole and a second sub-through hole, the first sub-through hole corresponds to the first sub-accommodating cavity, the second sub-through hole corresponds to the second sub-accommodating cavity, and the light receiver The light emitter is installed in the first sub-accommodating cavity and exposed from the first sub-through hole, and the light emitter is installed in the second sub-accommodating cavity and exposed from the second sub-through hole.

19. A mobile device, comprising:

the shell; and

The input-output assembly according to any one of claims 7-18, wherein the input-output assembly is mounted on the housing.