CN109136636A - A kind of copper alloy wire and preparation method thereof - Google Patents
A kind of copper alloy wire and preparation method thereof Download PDFInfo
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- CN109136636A CN109136636A CN201811148462.2A CN201811148462A CN109136636A CN 109136636 A CN109136636 A CN 109136636A CN 201811148462 A CN201811148462 A CN 201811148462A CN 109136636 A CN109136636 A CN 109136636A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
The invention belongs to technical field of alloy, and in particular to a kind of copper alloy wire and preparation method thereof, the copper alloy wire, using copper as matrix, addition element includes tin or tin and at least one following element: titanium, magnesium, silicon or boron.Preparation method is copper alloy liquid through drawing the copper alloy bar of bar preparation, and after necking down is processed and carries out dynamic recrystallization treatment, successively through excessive drawing, middle drawing and small drawing, copper alloy wire is prepared.The copper alloy wire is easy to refine, and tensile strength is high, and electric conductivity is strong, can meet the requirements the application in the fields such as harsh coaxial line, automotive light weight technology line and Microspeaker coil line, application prospect expectability is high, and at low cost.
Description
Technical field
The invention belongs to technical field of alloy, and in particular to a kind of copper alloy wire and preparation method thereof, the copper alloy wire
Material can be used for coaxial line, micro-coil line and automotive light weight technology line.
Background technique
With electrical equipment, electronic equipment, using mobile phone as universal and miniaturization the development of the smart machine of representative, automobile
Demand increasingly increases, and line footpath is also increasing in the demand of 0.1mm thin wire below, miniature loudspeaking in smart phone
Device coil and automobile twisted wire are exactly the relatively common application of such conducting wire.
In recent years, the type of superfine copper alloy wire mainly has high-intensitive low conductivity: Cu-Fe system;It is highly conductive in high intensity
Rate: Cu-Cr system, Cu-Co-P system, Cu-Ni system, Cu-Sn system, Cu-Mg system;High-strength high-conductivity: Cu-Ag system, Cu-Cr-Zr
System.There is biggish cost advantage relative to Cu-Ag system using preferably at most Cu-Ag system and Cu-Sn system, Cu-Sn system in production, because
This makes it meet demand instantly it is necessary to make further Investigation on intensification to Cu-Sn system alloy.Existing disclosed Cu-Sn series is closed
Gold thread has:
(1) copper alloy ingredient disclosed in copper alloy wire and its manufacturing method (CN104169447B) are as follows: copper, silver and tin,
At least one of magnesium, zinc, indium, nickel, cobalt, zirconium and chromium, the preparation method comprises the following steps: the melting in the graphite crucible of inert atmosphere, horizontal company
Continuous casting casts rod of metal alloy, is cold worked twice and carries out intermediate annealing between cold working twice, it is left to obtain diameter 0.1mm
Right thin footpath line, then carry out purification annealing and purification cold working.
(2) copper alloy ingredient disclosed in copper alloy wire and its manufacturing method (CN106164306A) are as follows: copper, silver and tin,
At least one of magnesium, zinc, indium, nickel, cobalt, zirconium and chromium, the preparation method comprises the following steps: inert atmosphere melting and continuously casting wire drawing, successively weigh
Multiple at least each 1 cold working and intermediate annealing are successively finally being cold worked and final annealing.
(3) Cu alloy material, copper alloy conductor and its manufacturing method, cable and Electric supply lines
(CN100491555C) alloying component disclosed in are as follows: the Sn of 0.1~0.4% weight percent, 0.001~0.1% O and
0.01~0.7% at least one kind of additional elements for being greater than Sn with the affinity of oxygen, the preparation method comprises the following steps: continuously casting, casting temperature
500 DEG C~600 DEG C multistage hot rollings are carried out lower than 15 DEG C of aluminium alloy fusing point or more, after casting and are rolled, at 100 DEG C after rolling
~200 DEG C carry out cold working of the deflection greater than 50% and form alloy conductor.
The copper alloy wire of above-mentioned (1)~(3) method preparation, when below line footpath 0.1mm, conductivity loss is larger, can draw
Performance is not also up to standard, disconnection problem occurs, it is difficult to obtain the superfine copper alloy wire of up-to-standard high-strength highly-conductive.
When the existing single alloy of Cu-Sn is below line footpath 0.1mm, also results in conductivity and be significantly lost, drawability energy
It is poor, the superfine copper alloy wire of up-to-standard high-strength highly-conductive can not be obtained.
Therefore, it is necessary to improve Cu-Sn system alloy on the basis of existing technology, guaranteed using it as the alloy wire of material preparation
While refining quality, high tensile and high conduction performance are kept, meets existing wire rod and applies (coaxial line, micro-coil line
And automotive light weight technology line) rigors.
Summary of the invention
The object of the present invention is to provide a kind of copper alloy wires, and the wire rod tensile strength is high, and electric conductivity is strong, line footpath refinement,
Meet the requirements the application in the fields such as harsh automotive light weight technology line and Microspeaker coil line, application prospect expectability
Height, and it is at low cost.
The present invention also provides the preparation method of copper alloy wire, the preparation method is easy to be easily-controllable easy to operate, is suitable for industrialization
Production.
The technical solution of the present invention is as follows: a kind of copper alloy wire, using copper as matrix, addition element includes tin or tin and extremely
Few a kind of following element: titanium, magnesium, silicon or boron.Addition element is preferably tin and two or more following elements: titanium, magnesium, silicon or
Boron, addition element is more preferably tin, titanium and more than one following element: magnesium, silicon or boron, such as tin, titanium and magnesium, Huo Zhexi, titanium
And boron, Huo Zhexi, titanium, magnesium and silicon.
In copper alloy wire, the mass content of tin is 0.1%~0.7%, preferably 0.15%~0.5%, more preferably
0.15%~0.3%;If addition element further includes the element in addition to tin, the gross mass of addition element and tin in addition to tin
Mass ratio is 1:2~10, preferably 1:2~5;Surplus is copper.
Also introducing in copper alloy wire prepared by the present invention has inevitable impurity, but its content is extremely low, to copper alloy wire
The quality and performance of material influence little.Such as comprising protium and oxygen element, the content of protium is in 10ppm hereinafter, oxygen element
Content in 20ppm hereinafter, protium and oxygen element content are extremely low, the quality of copper alloy wire and performance are influenced little.
Copper alloy wire prepared by the present invention is line footpath 0.15mm copper alloy wire below, preferably 0.1 mm or less of line footpath
Superfine copper alloy wire, especially line footpath 0.05mm superfine copper alloy wire below.
For the tensile strength of copper alloy wire prepared by the present invention in 700MPa or more, conductivity is 78%IACS or more.Especially
It is copper alloy wire in 0.1mm line footpath hereinafter, when especially below 0.05mm line footpath, still high tensile and height can be kept to lead
Electrical property is a kind of superfine copper alloy wire of high-strength highly-conductive, meets the high-end products such as automobile and Microspeaker to conducting wire
Rigors.
The preparation method of copper alloy wire of the present invention, step include:
(1) aluminium alloy after copper base metal and addition element melt is drawn bar and prepares copper alloy bar;
(2) copper alloy bar carries out necking down processing, prepares copper alloy wire base;
(3) copper alloy wire base is successively through excessive drawing, middle drawing and small drawing, and carries out bright annealing before small drawing after middle drawing, makes
Standby copper alloy wire.
Melting prepares aluminium alloy in an inert atmosphere for step (1), copper base metal and addition element, specifically, copper base metal and adds
Added elements melting in the smelting furnace of inert atmosphere prepares aluminium alloy, and inert atmosphere includes vacuum or filling nitrogen and/or argon
The atmosphere of the non-active gas such as gas.
Step (1) adds addition element, obtains aluminium alloy after melting after copper base metal fusing.
Step (1), the existence form of addition element include the intermediate alloy of addition element elemental body or addition element, addition
The intermediate alloy of element is the binary intermediate alloy comprising addition element and copper.Such as, the existence form of tin element is tin elemental gold
Belong to, the existence form of titanium elements is copper titanium intermediate alloy, and the existence form of magnesium elements is copper magnesium intermediate alloy, the presence of element silicon
Form is copper silicon intermediate alloy, and the existence form of boron element is copper boron intermediate alloy.
Step (1), aluminium alloy surface are laid with antioxidation coating, and anti-oxidation materials used in antioxidation coating includes powdered carbon or graphite squama
Piece, antioxidation coating with a thickness of 5~20mm, preferably 10~15mm, more preferably 15mm.Aluminium alloy surface is laid with anti-oxidation
Layer effectively prevents aluminium alloy from contacting with its surrounding air, avoids the introducing of the nonmetalloids such as oxygen in aluminium alloy, hydrogen, avoid closing
The oxidation and scaling loss of golden liquid, to reduce the content of impurity in alloy.
Step (1), at least heat preservation is placed one hour before aluminium alloy draws bar processing.Specifically, aluminium alloy is being higher than aluminium alloy
At least heat preservation is placed one hour under the conditions of 50 DEG C~80 DEG C of freezing point, and the time for keeping the temperature placement is preferably one hour.
Step (1), the temperature for drawing bar processing are higher than 50 DEG C~80 DEG C of aluminium alloy freezing point, preferably higher than aluminium alloy freezing point
50℃.The speed for drawing bar processing is 300~500mm/min, preferably 400~500mm/min.
Aluminium alloy after copper base metal and addition element melting is drawn bar and is prepared copper conjunction by step (1) using continuous casting process
Golden bar.Draw bar processing mode include Horizontal Bridgman Method draw bar casting or up-drawing method draw bar casting.
The diameter of step (1), copper alloy bar of the aluminium alloy through drawing bar preparation is 10~25mm.
Step (2), necking down processing include that extrusion process and/or cold rolling are processed, and need to carry out at heat after cold rolling processing
Reason.Specifically, necking down processing, which can be, carries out cold rolling after individual extrusion process, individual cold rolling processing, extrusion process again and adds
Extrusion process is carried out again after work or cold rolling processing.Preferably, dynamic recrystallization treatment is also carried out after extrusion process.
Under inert atmosphere, the dynamic recrystallization treatment of 400 DEG C~800 DEG C progress 2~8 hours.Inert atmosphere includes argon gas, nitrogen
It is one or more in gas, helium or neon, preferably argon gas;The temperature of dynamic recrystallization treatment is preferably 600 DEG C~800 DEG C, then
The time of crystallization heat treatment is preferably 2~5 hours, and more preferably 3 hours.
By dynamic recrystallization treatment, copper alloy recrystallization refines crystal grain, improves copper alloy tissue, improve alloy wire
Processing performance improves its elongation percentage.By dynamic recrystallization treatment, the elongation percentage of copper alloy wire base is maintained at 30% or more.
Copper alloy bar is processed through necking down, and necking down working modulus reaches 60%~99.9%, preferably reaches 80%~90%.
Step (3), under room temperature, copper alloy bar successively drawn greatly, middle drawing and small drawing;
It is drawn greatly under 5~12m/s tensile speed, tensile speed is preferably 8~11m/s;The big line line footpath that pulls out is 2.5
~3.5mm.
It is drawn in being carried out under 10~15m/s tensile speed, tensile speed is preferably 10~13m/s;Middle pull-out line line footpath is
0.5~1mm.
Small drawing is carried out under 18~26m/s tensile speed, tensile speed is preferably 18~22m/s;Small pull-out line line footpath is
0.08~0.3mm.
Step (3), under inert atmosphere, 200 DEG C~400 DEG C carry out 1~6 hour bright annealing.Inert atmosphere includes argon
It is one or more in gas, nitrogen, helium or neon, preferably argon gas.
Step (3), the elongation percentage of alloy wire is 25% or more after bright annealing.
Step (3) further includes that micro- drawing is carried out after small drawing.Micro- pulling rate degree be 400m/min, outlet line footpath be 0.05mm with
Under.Ensure to obtain line footpath smaller (0.1mm is hereinafter, be more suitable for 0.08mm hereinafter, being particularly suited for 0.05mm or less) by micro- drawing
Superfine copper alloy wire, and guarantee the homogeneity of copper alloy wire line footpath.
The preparation method of copper alloy wire material further includes carrying out plating to copper alloy wire, and the protective layer of plating includes
Silvering or tin coating.
Compared with the existing technology, the invention has the following advantages that
(1) copper alloy wire being made of alloying element of the present invention is suitable for preparation line footpath 0.1mm superfine copper alloy below
Line is more suitable for line footpath 0.08mm superfine copper alloy wire below, is particularly suited for line footpath 0.05mm superfine copper alloy wire below;
While preparation refinement copper alloy wire, guarantee that the tensile strength of copper alloy wire is maintained at 700MPa or more, conductivity is maintained at
78%IACS or more so that copper alloy wire refine while still keep high-strength highly-conductive performance, meet the requirements harsher coaxial line,
The application in the fields such as automotive light weight technology line and Microspeaker coil.
(2) copper alloy wire being made of alloying element of the present invention uses the preparation method system of copper alloy wire of the present invention
Standby copper alloy wire, especially prepares superfine copper alloy wire (line footpath 0.1mm or less), still can guarantee copper alloy wire high-strength highly-conductive
Can, and the preparation method simplicity of copper alloy wire of the present invention is easily-controllable, and it is at low cost, it is suitable for industrial applications.
(3) for copper alloy wire of the present invention using copper as matrix, addition metal includes tin or tin and at least one following metal:
Titanium, magnesium, silicon or boron, addition metal includes solution strengthening type metal (tin, magnesium, silicon) and precipitation strength type metal (titanium, boron), is passed through
These metals are added, while improving alloy strength as far as possible, the influence to conductivity is reduced to the greatest extent, guarantees copper alloy of the present invention
The excellent tensile strength of line, electric conductivity and processability.
Detailed description of the invention
Fig. 1 is the preparation flow figure of copper alloy wire of the present invention.
Specific embodiment
Combined with specific embodiments below, the invention will be further described.Following embodiment is only used for clearly saying
Bright technical solution of the present invention is not defined its content.Basic preparation process such as Fig. 1 institute of copper alloy wire of the present invention
Show.
Embodiment 1
Copper alloy wire, the following element comprising mass percent: 0.2%Sn, 0.05%Ti, 0.05%B, surplus are
Mass ratio=2:1 of Cu, Sn/ (Ti+B).
(1) according to the mass percent of Sn, Ti, B and Cu element in copper alloy wire weigh block tin, copper titanium intermediate alloy,
Copper boron intermediate alloy and copper base metal (Cu containing ratio is 99.999%).
(2) weighed copper base metal is placed in the graphite crucible of inert atmosphere (inert atmospheres such as vacuum or nitrogen, argon gas)
Induction heating fusing is carried out, after copper base metal fusing, weighed block tin, copper titanium intermediate alloy and copper boron intermediate alloy, shape is added
At the copper alloy liquid of melting;
It is laid with the carbon dust layer that a layer thickness is 15mm on copper alloy liquid surface, carbon dust layer can effectively avoid in surrounding air
The introducing of the impurity elements such as hydrogen, oxygen, under the conditions of being higher than 50 DEG C~80 DEG C of copper alloy liquid freezing point of temperature (1250 DEG C~
1270 DEG C) after placement one hour, using continuous casting equipment, copper alloy liquid is being higher than 50 DEG C~80 DEG C of copper alloy liquid freezing point
Temperature under the conditions of, the copper alloy bar that bar prepares diameter as 14mm is drawn with the speed of 500mm/min.
(3) copper alloy bar cold rolling under the mill speed of 30m/s is processed, until the contraction percentage of area of copper alloy bar reaches
85%;Again under an argon atmosphere, 600 DEG C of heat preservations, 6 hours progress dynamic recrystallization treatments are heated to, copper alloy wire base is made.
(4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, it is last it is micro- draw line footpath is the superfine of 0.05mm
Copper alloy wire, technical process are as follows: being pulled to line footpath under 10m/s tensile speed greatly is 3mm or so, under 12m/s tensile speed in
Being stretched to line footpath is 1mm or so;After middle drawing before small drawing, under an argon atmosphere, it is heated to 300 DEG C of heat preservations, 4 hours progress lights and moves back
Fire, the elongation percentage of alloy wire is 26% after annealing;Again with the small line footpath that is stretched to of 20m/s tensile speed for 0.08mm, finally with
400m/min speed is micro- to pull into the copper alloy wire that line footpath is 0.05mm.
The content of protium is 10ppm in copper alloy wire manufactured in the present embodiment, and the content of oxygen element is 20ppm, hydrogen
The content of the impurity such as element and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment preparation
Tensile strength, conductivity and the elongation percentage of copper alloy wire are as shown in table 1.
Embodiment 2
Copper alloy wire, the following element comprising mass percent: 0.2%Sn, 0.05%Ti, 0.05%B, surplus are
Mass ratio=2:1 of Cu, Sn/ (Ti+B).
The preparation method is the same as that of Example 1 for the present embodiment, the difference is that:
Step (4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, and the copper alloy wire that line footpath is 0.15mm is made
Material, technical process are as follows: being pulled to line footpath under 10m/s tensile speed greatly is 3mm or so, under 10m/s tensile speed in be pulled to line footpath
For 1mm or so;After middle drawing before small drawing, under an argon atmosphere, 300 DEG C of heat preservations, 4 hours progress bright annealings is heated to, are closed after annealing
The elongation percentage of gold thread is 28%;Finally with the small line footpath that pulls into of the speed of 19m/s for the copper alloy wire of 0.15mm.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
Embodiment 3
Copper alloy wire, the following element comprising mass percent: 0.15%Sn, 0.02%Mg, 0.01%Si,
3~4:1 of mass ratio ≈ of 0.01%Ti, surplus Cu, Sn/ (Mg+Si+Ti).
(1) block tin is weighed according to the mass percent of Sn, Mg, Si, Ti and Cu element in copper alloy wire, copper magnesium centre is closed
Gold, copper silicon intermediate alloy, copper titanium intermediate alloy and copper base metal (Cu containing ratio is 99.999%).
(2) weighed copper base metal is placed in the graphite crucible of inert atmosphere (inert atmospheres such as vacuum or nitrogen, argon gas)
Induction heating fusing is carried out, after copper base metal fusing, weighed block tin, copper magnesium intermediate alloy, copper silicon intermediate alloy and copper is added
Titanium intermediate alloy forms the copper alloy liquid of melting;
It is laid with the carbon dust layer that a layer thickness is 15mm on copper alloy liquid surface, carbon dust layer can effectively avoid in surrounding air
The introducing of the impurity elements such as hydrogen, oxygen, under the conditions of being higher than 50 DEG C~80 DEG C of copper alloy liquid freezing point of temperature (such as 1250 DEG C
~1270 DEG C) after placement one hour, using continuous casting equipment, copper alloy liquid is being higher than copper alloy liquid freezing point 50 DEG C~80
DEG C temperature under the conditions of, the copper alloy bar that bar prepares diameter as 14mm is drawn with the speed of 400mm/min.
(3) contraction percentage of area of the extrusion process of copper alloy bar to copper alloy bar reaches 80%;Again under an argon atmosphere, it heats
To 700 DEG C of heat preservations, 2 hours progress dynamic recrystallization treatments, copper alloy wire base is made.
(4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, it is last it is micro- draw line footpath is the superfine of 0.05mm
Copper alloy wire, technical process are as follows: being pulled to line footpath under 9m/s tensile speed greatly is 3mm or so, under 12m/s tensile speed in
Being pulled to line footpath is 1mm or so;After middle drawing before small drawing, under an argon atmosphere, 300 DEG C of heat preservations, 4 hours progress bright annealings are heated to,
Alloy wire elongation percentage is 26% after annealing;Again with the line footpath that is pulled to small under 22m/s tensile speed for 0.08mm, finally with 400m/s speed
Spend micro- superfine alloy wire for pulling into 0.05mm.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
Embodiment 4
Copper alloy wire, the following element comprising mass percent: 0.15%Sn, 0.02%Mg, 0.01%Si,
3~4:1 of mass ratio ≈ of 0.01%Ti, surplus Cu, Sn/ (Mg+Si+Ti).
The present embodiment preparation method with embodiment 3, the difference is that:
Step (4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, and the copper alloy wire that line footpath is 0.15mm is made
Material, technical process is as follows, and being pulled to line footpath under 9m/s tensile speed greatly is 3mm or so, under 11m/s tensile speed in be stretched to line
Diameter is 1mm or so;After middle drawing before small drawing, under an argon atmosphere, 300 DEG C of heat preservations, 4 hours progress bright annealings are heated to, after annealing
The elongation percentage of alloy wire is 26%;Finally with the small line footpath that pulls into of the speed of 19m/s for the alloy wire of 0.15mm.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
Embodiment 5
Copper alloy wire, the following element comprising mass percent: 0.2%Sn, 0.06%Ti, 0.02%Mg, surplus are
2~3:1 of mass ratio ≈ of Cu, Sn/ (Ti+Mg).
(1) according to the mass percent of Sn, Ti, Mg and Cu element in copper alloy wire weigh block tin, copper titanium intermediate alloy,
Copper magnesium intermediate alloy and copper base metal (Cu containing ratio is 99.999%).
(2) weighed copper base metal is placed in the graphite crucible of inert atmosphere (inert atmospheres such as vacuum or nitrogen, argon gas)
Induction heating fusing is carried out, after copper base metal fusing, weighed block tin, copper titanium intermediate alloy and copper magnesium intermediate alloy, shape is added
At the copper alloy liquid of melting;
It is laid with the carbon dust layer that a layer thickness is 15mm on copper alloy liquid surface, carbon dust layer can effectively avoid in surrounding air
The introducing of the impurity elements such as hydrogen, oxygen, under the conditions of being higher than 50 DEG C~80 DEG C of copper alloy liquid freezing point of temperature (1250 DEG C~
1270 DEG C) after placement one hour, using continuous casting equipment, copper alloy liquid is being higher than 50 DEG C~80 DEG C of copper alloy liquid freezing point
Temperature under the conditions of, the copper alloy bar that bar prepares diameter as 14mm is drawn with the speed of 400mm/min.
(3) copper alloy bar cold rolling under the mill speed of 30m/s is processed, until the contraction percentage of area of copper alloy bar reaches
85%;Again under an argon atmosphere, 650 DEG C of heat preservations, 6 hours progress dynamic recrystallization treatments are heated to, copper alloy wire base is made.
(4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, it is last it is micro- draw line footpath is the superfine of 0.05mm
Copper alloy wire, technical process are as follows: being pulled to line footpath under 11m/s tensile speed greatly is 3mm or so, under 11m/s tensile speed in
Being pulled to line footpath is 1mm or so;After middle drawing before small drawing, under an argon atmosphere, 300 DEG C of heat preservations, 4 hours progress bright annealings are heated to,
The elongation percentage of alloy wire is 30% after annealing;Again with the small line footpath that is pulled to of 20m/s tensile speed for 0.08mm, finally with 400m/
The micro- superfine copper alloy wire for pulling into 0.05mm of min speed.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
Embodiment 6
Copper alloy wire, the following element comprising mass percent: 0.2%Sn, 0.06%Ti, 0.02%Mg, surplus are
2~3:1 of mass ratio ≈ of Cu, Sn/ (Ti+Mg).
The present embodiment preparation method with embodiment 3, the difference is that:
Step (4) copper alloy wire base successively drawn greatly, middle drawing and small drawing, and the copper alloy wire that line footpath is 0.15mm is made
Material, technical process are as follows: being pulled to line footpath under 8m/s tensile speed greatly is 3mm or so, under 13m/s tensile speed in be pulled to line footpath
For 1mm or so;After middle drawing before small drawing, under an argon atmosphere, it is heated to 300 DEG C of heat preservations, 4 hours progress bright annealings, line after annealing
The elongation percentage of material is 27%;Finally with the small line footpath that pulls into of the speed of 18m/s for the copper alloy wire of 0.15mm.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
Embodiment 7
Copper alloy wire, the following element comprising mass percent: 0.3%Sn, surplus Cu.
The preparation method is the same as that of Example 1 for the present embodiment, and the superfine copper alloy wire material that line footpath is 0.05mm is prepared.Difference
Be in:
Step (1) according to the mass percent of Sn and Cu element in copper alloy wire weighs block tin and copper base metal, and (Cu contains
99.999%) rate is.
The present embodiment prepare the content of protium in copper alloy wire in 10ppm hereinafter, the content of oxygen element 20ppm with
Under, the content of the impurity such as protium and oxygen element is extremely low, and the influence to the quality and performance of copper alloy wire is little.The present embodiment
The tensile strength, conductivity and elongation percentage for preparing copper alloy wire are as shown in table 1.
As shown in Table 1, solid solution element Sn is added in Copper substrate, alloying element disperse is uniformly precipitated, and improves the same of intensity
When, it reduces conductivity and minimizes, guarantee the high-strength highly-conductive performance of superfine Cu-Sn alloy wire;Add in the single alloy of Cu-Sn
Enter Mg, Ti, B or Si and carry out multiphase reinforcing, uniformly refine matrix, overcomes single alloy strength relatively low or high-temperature brittleness etc. is asked
Topic improves copper alloy intensity and conductivity.
Mg, Ti, B and Si are respectively common solution strengthening type or precipitation strength type element, by the single conjunction of Cu-Sn
These trace alloying elements are introduced in gold, a variety of hardening constituents are precipitated in reciprocation between alloying element, refine crystal grain, alloying element
Performance complement while improving alloy strength, weakens conductivity and minimizes, guarantee the high-strength highly-conductive performance of alloy wire.
Table 1
Claims (10)
1. a kind of copper alloy wire, which is characterized in that using copper as matrix, addition element include tin or tin and it is at least one with
Lower element: titanium, magnesium, silicon or boron.
2. copper alloy wire according to claim 1, which is characterized in that addition element is tin and two or more following members
Element: titanium, magnesium, silicon or boron.
3. copper alloy wire according to claim 1, which is characterized in that the mass content of tin is 0.1%~0.7%, if
When addition element further includes the element in addition to tin, the mass ratio of the gross mass of addition element and tin is 1:2~10 in addition to tin,
Surplus is copper.
4. the preparation method of any one of claims 1 to 3 copper alloy wire, which is characterized in that step includes:
(1) aluminium alloy after copper base metal and addition element melt is drawn bar and prepares copper alloy bar;
(2) copper alloy bar carries out necking down processing, prepares copper alloy wire base;
(3) copper alloy wire base is successively through excessive drawing, middle drawing and small drawing, and carries out bright annealing before small drawing after middle drawing, prepares copper
Alloy wire.
5. the preparation method according to claim 4, which is characterized in that step (1), the temperature for drawing bar processing are higher than aluminium alloy
50 DEG C~80 DEG C of freezing point, the speed for drawing bar processing is 300~500mm/min.
6. the preparation method according to claim 4, which is characterized in that step (2), necking down processing include extrusion process and/
Or cold rolling processing, dynamic recrystallization treatment is carried out after cold rolling processing.
7. preparation method according to claim 6, which is characterized in that step (2), under inert atmosphere, 400 DEG C~800 DEG C
Carry out 2~8 hours dynamic recrystallization treatments.
8. the preparation method according to claim 4, which is characterized in that step (3) carries out under 5~12m/s tensile speed
Big to draw, the big line line footpath that pulls out is 2.5~3.5mm;
It is drawn in being carried out under 10~15m/s tensile speed, middle pull-out line line footpath is 0.5~1mm;
Small drawing is carried out under 18~26m/s tensile speed, small pull-out line line footpath is 0.08~0.3mm.
9. the preparation method according to claim 4, which is characterized in that step (3), under inert atmosphere, 200 DEG C~400 DEG C
Carry out 1~6 hour bright annealing.
10. the preparation method according to claim 4, which is characterized in that step (3) further includes carrying out micro- drawing after small drawing.
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| CN115478185A (en) * | 2022-09-26 | 2022-12-16 | 江苏亨通电力智网科技有限公司 | Copper-tin alloy superfine wire and preparation method thereof |
| CN116411202A (en) * | 2021-12-29 | 2023-07-11 | 无锡市蓝格林金属材料科技有限公司 | A kind of copper-tin alloy wire rod and preparation method thereof |
| CN120464903A (en) * | 2025-06-04 | 2025-08-12 | 河北战豪新材料有限公司 | A high-conductivity copper alloy material for cables and its preparation process and application |
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