CN109100043A - A kind of test specimen thermometry in thermo-electrically-power coupling testing system - Google Patents
A kind of test specimen thermometry in thermo-electrically-power coupling testing system Download PDFInfo
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- CN109100043A CN109100043A CN201810950936.9A CN201810950936A CN109100043A CN 109100043 A CN109100043 A CN 109100043A CN 201810950936 A CN201810950936 A CN 201810950936A CN 109100043 A CN109100043 A CN 109100043A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/30—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermal noise of resistances or conductors
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Abstract
本发明公开了一种用于热‑电‑力耦合测试系统中的试件温度测量方法，涉及电子封装材料力学性能测试技术。试件由两根铜棒焊接而成，试件被装夹于拉伸机上，同时在试件上加载一定强度的电流，由于试件本身通过较强度的电流，导致热电偶温度计和热电阻温度计不能直接接触试件表面。在测试开始前，使用游标卡尺对试件进行标距，将电压测量仪器两触点接于标距段两端点，以测量标距内的电压降；该段包括焊点在内，以准确测量电压降；试件温度‑电压关系式，根据铜和SAC305焊料的电阻率‑温度曲线，结合试件截面形状、标距长度，通过计算得到试件的温度与电压降的对应关系。该试件温度测量方法简单，具有测量精度高，且便于测试记录特点。
The invention discloses a method for measuring the temperature of a test piece used in a thermo-electric-force coupling test system, and relates to the technology for testing the mechanical properties of electronic packaging materials. The test piece is welded by two copper rods. The test piece is clamped on the stretching machine, and a certain intensity of current is applied to the test piece at the same time. Because the test piece itself passes through a relatively strong current, the thermocouple thermometer and the thermal resistance thermometer Do not directly contact the surface of the test piece. Before the test starts, use a vernier caliper to gauge the test piece, and connect the two contacts of the voltage measuring instrument to the two ends of the gauge section to measure the voltage drop within the gauge section; this section includes solder joints to accurately measure the voltage drop; the temperature-voltage relationship of the test piece, according to the resistivity-temperature curve of copper and SAC305 solder, combined with the cross-sectional shape and gauge length of the test piece, the corresponding relationship between the temperature of the test piece and the voltage drop is obtained through calculation. The temperature measurement method of the test piece is simple, has the characteristics of high measurement accuracy and convenient test record.
Description
Technical field
The present invention relates to electronic package material mechanics performance testing technologies, specifically, being related to a kind of for thermo-electrically-power
Test specimen thermometry in coupling testing system.
Background technique
Electronic Encapsulating Technology plays a crucial role in electronic product.Interconnection solder joint in electron package structure is
The key position of microelectronic chip, only chip and substrate do not provide mechanical support, are even more electrically connected and radiate important
Approach.High performance electronics typically contain thousands of a solder joints, the single solder joint failure of key position, it is possible to cause whole
The function of a electronic chip is lost.In some sense, interconnection solder joint mechanical property reliability determines entire electronic product
Use reliability.Therefore, in order to test welding spot reliability and analyze its broken also mechanism, occur for novel lead-free solder joint
Thermo-electrically-power multi- scenarios method measuring technology.
In existing multi- scenarios method measuring technology, test specimen temperature generally is controlled using high and low temperature environment case, due to environment
Case inner space is larger, and there are air flowings, cause the sensor of environmental cabinet itself that can not accurately reflect test specimen temperature, in order to
Accurately reflect temperature locating for test specimen, it is necessary to increase the temperature measuring device for being directed to test specimen.Existing technology is usually to use thermoelectricity
It couples touching surface of test piece and carries out direct detection, since thermocouple probe size is larger, when sample dimensions are smaller, temperature measures meeting
Now very big error, simultaneously as test specimen itself is by there is an electric current of larger intensity, directly with thermocouple thermometer or
Thermal resistance thermometer contact test specimen may all cause the error that can not be measured；Another method is sensed using infrared temperature
Device, this is a kind of non-contact type temperature measurement instrument, and prices are rather stiff for the enough infrared temperature sensors of precision, and by
It in the requirement of itself local environment, must be placed on outside environmental cabinet, by the quartz glass observation window of environmental cabinet to examination
Part measures, and certainly will will increase measurement error in this way, reduces the confidence level of data.So lacking in a kind of pair of environmental cabinet now
The measurement method of the efficiently and accurately of energization test specimen temperature.It is surveyed existing for test specimen temperature in thermo-electrically-power multi- scenarios method test
In amount method, measurement error is generally bigger than normal, and measuring instrument is with high costs and the inconvenient problem of data record,
Summary of the invention
In order to avoid the shortcomings of the prior art, the present invention proposes a kind of in thermo-electrically-power coupling testing system
Test specimen thermometry.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of test specimen thermometry in thermo-electrically-power coupling testing system, it is characterised in that including following step
It is rapid:
Step 1. test specimen to be measured carries out gauge length to test specimen using vernier caliper, by voltage-measuring equipment before the test begins
Two contacts are connected to gauge length section two-end-point, and to measure the voltage drop in gauge length, the gauge length section is including solder joint, accurately to measure electricity
Pressure drop；
Test specimen to be measured is welded by two copper rods, length 80mm, and solder joint average length 3.15mm makes before experiment
Make gauge length section, length 30.00mm on test specimen with vernier caliper；
Step 2. clamping test specimen；Test specimen is clamped on stretching-machine, while the electric current of some strength is loaded on test specimen；
Step 3. test specimen temperature-voltage relationship formula, according to resistivity-temperature curve of copper and SAC305 solder, in conjunction with examination
Part cross sectional shape and gauge length segment length obtain the temperature of test specimen and the corresponding relationship of voltage drop by calculating.
Beneficial effect
A kind of test specimen thermometry in thermo-electrically-power coupling testing system proposed by the present invention, test specimen is by two
Root copper rod is welded, and test specimen is clamped on stretching-machine, while the electric current of some strength is loaded on test specimen, due to test specimen sheet
Body causes thermocouple thermometer and thermal resistance thermometer that cannot directly contact surface of test piece by the electric current compared with intensity.It is testing
Before beginning, gauge length is carried out to test specimen using vernier caliper, two contact of voltage-measuring equipment is connected to gauge length section two-end-point, with measurement
Voltage drop in gauge length；The section is including solder joint, accurately to measure voltage drop；Test specimen temperature-voltage relationship formula, according to copper and
The temperature of test specimen is obtained by calculation in conjunction with test specimen cross sectional shape, gauge length in resistivity-temperature curve of SAC305 solder
With the corresponding relationship of voltage drop.
Test specimen thermometry proposed by the present invention in thermo-electrically-power coupling testing system, be related to -50 DEG C~
By the lead-free solder being widely used thermo-electrically-power multi- scenarios method measuring technology in electronic package material under the conditions of 300 DEG C of temperature,
The test specimen thermometry pushes away test specimen temperature by the way that the resistance of test specimen is counter, has the following effects:
1. simple in measurement system structure, relative to infrared temperature sensor, voltage signal sensor price is lower, precision
It is higher, and be more convenient for recording.
2. due to the resistance for directly measuring entire test specimen in gauge length, so measurement result is able to reflect the temperature of test specimen entirety
Degree more obviously has higher precision compared with other test methods that can only measure surface temperature.
3. the voltage signal of output can be directly translated into accurately directly by measuring instrument records by phasing meter
Temperature-time curve can record temperature variations in whole experiment process in further detail.
Detailed description of the invention
With reference to the accompanying drawing with embodiment to a kind of test specimen temperature in thermo-electrically-power coupling testing system of the present invention
Spend measurement method.
Fig. 1 Specimen Shape, dielectric holder and charging portion details are as shown in figure -1.
Fig. 2 carries out gauge length to test specimen before the test begins, with vernier caliper, as shown in figure -2,
Voltage-measuring equipment two is got an electric shock before starting and is accurately connected to gauge length section two-end-point by Fig. 3 experiment, as shown in figure -3,
Specific embodiment
The present embodiment is a kind of test specimen thermometry in thermo-electrically-power coupling testing system.
A kind of test specimen thermometry in thermo-electrically-power coupling testing system proposed by the present invention, basic principle
It is that curve is varied with temperature according to conductor resistance, it is counter to push away temperature locating for test specimen by resistance of measurement conductor at a temperature of certain.By
In test specimen be welded by two non-oxygen copper bars, the resistance of copper vary with temperature it is obvious that also used in manufacturing industry copper as
The probe of thermal resistance thermometer, and have accurate empirical equation for calibration, so the voltage drop of direct detection test specimen is simultaneously
Resistance and then the anti-test method precision with higher for pushing away test specimen temperature are calculated accordingly.
Refering to fig. 1, Fig. 2, Fig. 3, a kind of test specimen temperature measurement in thermo-electrically-power coupling testing system of the present embodiment
Method, it is characterised in that the following steps are included:
A) test specimen to be measured carries out gauge length to test specimen using vernier caliper, voltage-measuring equipment two is touched before the test begins
Point is connected to gauge length section two-end-point, and to measure the voltage drop in gauge length, the gauge length section is including solder joint, accurately to measure voltage
Drop；
Test specimen to be measured is welded by two copper rods, length 80mm, and solder joint average length 3.15mm makes before experiment
Make gauge length section, length 30.00mm on test specimen with vernier caliper；
B) clamping test specimen；Test specimen is clamped on stretching-machine, while the electric current of some strength is loaded on test specimen；
C) test specimen temperature-voltage relationship formula is cut according to resistivity-temperature curve of copper and SAC305 solder in conjunction with test specimen
Face shape and gauge length obtain the temperature of test specimen and the corresponding relationship of voltage drop by calculating.
In this example, test specimen is used in testing for mechanical property of solder joint under the conditions of thermo-electrically-power multi- scenarios method.Test specimen
It is centered in copper rod on same central axes by two to be welded, welding filler metal is SAC305 lead-free solder, two copper rod length point
Not Wei 40mm, diameter 1mm, solder joint length average out to 3.15mm, spot size is identical as copper rod diameter.
Due to the Mechanics Performance Testing under the conditions of thermo-electrically to be carried out-power multi- scenarios method, test specimen is clamped on stretching-machine,
The electric current for loading some strength on test specimen simultaneously leads to thermocouple temperature since test specimen itself has passed through the electric current of larger intensity
Degree meter and thermal resistance thermometer cannot directly contact surface of test piece, simultaneously as sample dimensions are smaller, the temp measuring method of contact
It is difficult to accurately reflect test specimen bulk temperature, pushes away test specimen temperature by the way that voltage drop is counter in test specimen equidistance line marking so need to use in the present invention
The method of degree.
Before the test begins, gauge length is carried out to test specimen with vernier caliper, gauge length section must include solder joint, and gauge length segment length is
20.00mm；It tests and two contact of voltage-measuring equipment is accurately connected to gauge length section two-end-point before starting, to measure the voltage in gauge length
Drop.
When temperature is higher than 250K, by being fitted to experimental data, the temperature and conductivity of SAC305 solder just like
Lower relationship:
σ=12.241 × 109T-1.2677
Wherein, σ is conductivity, unit Ω-1m-1, T is temperature, unit K.
Substitute into welding spot size data, according to correlation formula, calculate solder joint resistance value and temperature relation it is as follows:
Rs=3.27645 × 10-9T1.2677
About the temperature resistance curve of copper rod, curve is fitted using cubic polynomial, available following pass
System:
Rc=R0(1+a(T-273.15)+b(T-273.15)2+c(T-273.1)3)
Wherein, RcThe resistance value for being test specimen when temperature is T, R0For resistance value of the copper rod in 273.15K,
T is temperature locating for copper rod, unit K；
A, b, c are respectively fitting constant, wherein a=4.28899 × 10-3, b=-2.133 × 10-7, c=1.233 × 10-9。
When temperature is 273.15K, the conductivity of copper is 0.645, and the length of copper rod is 26.85mm in gauge length, and diameter is
1mm, calculate resistance of the copper rod in 273.15K be 0.53 × 10-3Ω, i.e. 0.53m Ω.
When test specimen temperature Ω degree is T (K), the resistance R in gauge length can be expressed from the next:
R=Rs+Rc
=327.645T1.2677+R0(1+a(T-273.15)+b(T-273.15)2+c(T-273.13)),
Wherein, a=4.28899 × 10-3B=-2.133 × 10-7C=1.233 × 10-9,
R0=0.53 × 10-3Ω,
So far, the resistance in specimen equidistance line marking and the corresponding relationship of temperature are determined by above formula；When measurement, test specimen need to be only measured
Voltage drop in gauge length can solve temperature locating for test specimen in conjunction with the electric current that test specimen itself passes through by above formula.
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Cited By (2)
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| CN110186583A (en) * | 2019-06-13 | 2019-08-30 | 南京航空航天大学 | Ceramic matric composite high-temperature component thermometry based on electrical impedance imaging |
| CN120314040A (en) * | 2025-06-16 | 2025-07-15 | 吉林大学 | Solid propellant resistivity test device and test method using mechanical and thermal coupling loading |
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| CN120314040A (en) * | 2025-06-16 | 2025-07-15 | 吉林大学 | Solid propellant resistivity test device and test method using mechanical and thermal coupling loading |
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Application publication date: 20181228 |