CN108901149A - It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord - Google Patents
It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord Download PDFInfo
- Publication number
- CN108901149A CN108901149A CN201810985268.3A CN201810985268A CN108901149A CN 108901149 A CN108901149 A CN 108901149A CN 201810985268 A CN201810985268 A CN 201810985268A CN 108901149 A CN108901149 A CN 108901149A
- Authority
- CN
- China
- Prior art keywords
- line
- imaging
- dielectric material
- type
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000013461 design Methods 0.000 claims abstract description 6
- 238000004381 surface treatment Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 238000011946 reduction process Methods 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 4
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord, include the following steps：A) a detachable core plate is first provided, surface sets carrier copper foil and auxiliary copper foil；B) first line figure is made in auxiliary copper foil surface；C) first line graphic design pressure can imaging-type dielectric material, formed the first embedded type circuit；D) it is positioned with first line figure, produces the counterbore of sunk type line slot and certain depth；E) it is positioned with first line figure, counterbore is reprocessed with laser, makes complete through-hole；F) can copper facing on imaging-type dielectric material, sunk type line slot and through-hole are filled up into copper；G) removal can imaging-type dielectric material surface electro-coppering, formed the second embedded type circuit；H) detachable core plate is removed, the auxiliary copper foil of first line patterned surface is removed；I) solder mask and surface treatment are made in circuit board surface, obtains two-sided printed circuit board of sunkening cord.
Description
Technical field
The present invention relates to the manufacturing technologies of printed circuit board or semiconductor integrated circuit package substrate, in particular to one kind can
The method that imaging-type dielectric material makes two-sided printed circuit board of sunkening cord.
Background technique
With the continuous progress of science and technology, electronic industry is developed rapidly, electronic product entered function, intelligence already
The developing stage of change, to better meet electronic product high integration, demand miniaturization, printed circuit board or semiconductor are integrated
Circuit package substrate, under the premise of guaranteeing electronic product good electrical properties, hot property, also towards light, thin, short, small direction
Development.
Because printed circuit board or semiconductor integrated circuit package substrate are more and more frivolous in design, route is more and more thinner
Close, general route is because only route bottom is contacted with substrate, and contact area is small, and binding force is poor, has been easy route drifting problem,
It is unfavorable for the production of fine rule road, and sunkens cord because of route insertion in a insulating layer, three sides of route contacts substrate, are embedded in insulating layer
In, it is good with the binding force of substrate, conducive to the production of fine rule road, single side may be implemented using traditional dielectric material at present and sunken cord
The production of printed circuit board, and to realize the production of two-sided printed circuit board of sunkening cord, since two sides layer of sunkening cord is located at two differences
Copper-clad base plate on, two open that different copper-clad base plate Aligning degree control is difficult, and interlayer intercommunication is also affected when lamination.The present invention
Provide it is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord, this method can be with.
Summary of the invention
The purpose of the present invention is to provide it is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord,
The level to level alignment degree that solves the problems, such as to sunken cord is poor, while breaking problem caused by avoiding subtracting copper excessively, can better ensure that two-sided
It sunkens cord the quality of printed circuit board.
In order to achieve the above objectives, the technical scheme is that：
The present invention using can imaging-type dielectric material developing property, sunk type is produced in conjunction with radium-shine laser by development
Line slot and through-hole, then the production that sunk type line slot and through-hole realize embedded type circuit is filled and led up by filling out line plating, it avoids
The problem of level to level alignment degree difference improves Aligning degree and interconnection and interflow function between two-sided gas producing formation of sunkening cord, improves product quality.
Specifically, one kind of the present invention can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord,
Include the following steps：
A) a detachable core plate is first provided, surface sets carrier copper foil and forms the auxiliary copper of first line figure
Foil, carrier copper foil and auxiliary copper foil are detachable；
B) first line figure and positioning datum figure are produced by pattern transfer, graphic plating on auxiliary copper foil surface
Shape；
C) first line graphic design press one layer can imaging-type dielectric material, formed the first embedded type circuit；
D) it is positioned using the reference pattern on first line figure, it can be on imaging-type dielectric material by exposing, being developed in
It makes forming the sunk type line slot of the second embedded type circuit and the counterbore of certain depth, being made with UV light and baking later can be at
As type dielectric cure；
E) it is positioned using the positioning datum figure on first line figure, counterbore is reprocessed by laser, makes through-hole；
F) can copper facing on imaging-type dielectric material, while copper will be filled up in sunk type line slot and through-hole；
G) using chemically and physically reduction process, removal can imaging-type dielectric material surface electro-coppering, while being retained in down
Copper in heavy formula line slot forms the second embedded type circuit；
H) detachable core plate is removed, then removes the auxiliary copper foil of first line patterned surface by fast-etching；
I) using welding resistance printing, process of surface treatment, solder mask and surface-treated layer is formed in printed circuit plate surface, is obtained
To two-sided printed circuit board of sunkening cord.
Further, the Aligning degree between the first line layer and sunk type line slot and through-hole, characterized in that under
Heavy formula line slot and through-hole use the positioning datum figure of first line layer to position when processing, and guarantee sunk type line slot, lead to
The Aligning degree consistency in hole and first line layer pattern.
The fast-etching is used to remove the auxiliary copper foil of first line patterned surface.
The surface treatment protective layer includes that organic guarantor welds film (OSP), chemical deposition (or plating) nickel gold, chemical deposition
(or plating) NiPdAu, chemistry (or plating) tin, chemistry silver, chemistry (or plating) Xi Yin, chemistry (or plating) tin silver copper.
Beneficial effects of the present invention：
1. tradition is sunken cord, printed circuit board can only generally realize that single side is sunken cord, and the second embedded type circuit is by interlayer conduction side
The factors such as formula, Aligning degree control difficulty influence, and cannot achieve two-sided sunken cord.
The second embedded type circuit is first by the way of exposure, development using the characteristic that dielectric material can be imaged in the present invention
Processing line slot combines laser technology to make through-hole later, fills and leads up route by filling perforation plating, recycles and process for copper is thinned table
Face electro-coppering and auxiliary copper foil removal, form embedded type circuit by the electro-coppering in line slot, solve printed circuit board of sunkening cord
Can only realize that single layer is sunken cord, the technical barrier that two-sided can not be sunken cord has novelty.
2. traditional method printed circuit board is generally positioned using mechanical hole to figure, and mechanical hole is by drilling machine precision
It influences, borehole accuracy is poor, easily brings adverse effect to different interlayer Aligning degrees.
It makes forming the as positioning datum point using first layer line pattern when the present invention makes the second embedded type circuit
The line slot and through-hole of two embedded type circuits are eliminated in traditional method and are positioned to different interlayer Aligning degrees not using mechanical hole
Benefit influences, and solves the problems, such as that printed circuit board difference interlayer Aligning degree is poor, improves the Aligning degree of product difference interlayer.
3. the present invention sunkens cord, printed circuit board orifice ring design comparison is small, 50um is generally not above, using traditional machinery
The orifice ring that hole positioning way is made is generally higher than 75um, holes problem easily occurs, and then influence the conduction in encapsulation quality and hole.
Present invention optimizes positioning system system, through-hole and orifice ring use identical anchor point, solve traditional printed circuit board through-hole
Incident holes problem can control orifice ring in 50um hereinafter, preferable guarantee that encapsulation quality and interlayer interconnect.
Detailed description of the invention
Fig. 1 to 9 is the present invention using two-sided printed circuit board of sunkening cord as the production flow diagram of example.Wherein：
Fig. 1 first provides a detachable core plate, and surface sets carrier copper foil and forms the auxiliary copper of first line figure
Foil, carrier copper foil and auxiliary copper foil are detachable；
Fig. 2 produces first line figure and positioning datum by pattern transfer, graphic plating on auxiliary copper foil surface
Figure；
Fig. 3 first line graphic design press one layer can imaging-type dielectric material, formed the first embedded type circuit；
Fig. 4 is positioned using the reference pattern on first line figure, can be on imaging-type dielectric material by exposing, being developed in
It makes forming the sunk type line slot of the second embedded type circuit and the counterbore of certain depth, being made with UV light and baking later can be at
As type dielectric cure；
Fig. 5 is positioned using the positioning datum figure on first line figure, is reprocessed, is made logical to counterbore by laser
Hole；
Fig. 6 can copper facing on imaging-type dielectric material, while copper will be filled up in sunk type line slot and through-hole；
Fig. 7 using chemically and physically reduction process, removal can imaging-type dielectric material surface electro-coppering, while being retained in down
Copper in heavy formula line slot forms the second embedded type circuit；
Fig. 8 removes detachable core plate, then the auxiliary copper foil of first line patterned surface is removed by fast-etching；
Fig. 9 forms solder mask and surface-treated layer using welding resistance printing, process of surface treatment, in printed circuit plate surface,
Obtain two-sided printed circuit board of sunkening cord.
Specific embodiment
Referring to FIG. 1 to FIG. 9, it is of the present invention can imaging-type dielectric material make the production of two-sided printed circuit board of sunkening cord
Method comprising following steps：
A) core plate 100,101 for first providing a detachable structure is detachable carrier copper foil, and 102 be to form First Line
The auxiliary copper foil of road figure, as shown in Figure 1；
B) the first line figure of printed board is made by pattern transfer, the method for graphic plating on auxiliary 102 surface of copper foil
Shape 1021, while positioning datum figure 1022 is made, as shown in Figure 2；
C) pressed on first line figure 1021 it is upper can imaging-type dielectric material 103, the first embedded type circuit of formation, 1021
That is the first embedded type circuit, 1031 for can imaging-type dielectric material protective layer, as shown in Figure 3；
D) it is positioned using positioning datum figure 1022, using exposing, be developed in and can develop out on imaging-type dielectric material 103
The line slot 104 of the second embedded type circuit and the counterbore 105 of certain depth are formed, as shown in Figure 4；
E) it is positioned using positioning datum figure 1022, through-hole 1051 is made on the basis of counterbore 105 using radium-shine laser,
As shown in Figure 5；
F) using fill out line plating can copper facing 108 on imaging-type dielectric material, while being electroplated and filling out in line slot and through-hole
Upper copper forms the route 106 and through-hole 107 of conducting, as shown in Figure 6；
G) by the removal of chemically and physically reduction process can imaging-type dielectric material surface electro-coppering 108, be retained in route
Route 106 is the second embedded type circuit in slot, as shown in Figure 7；
H) core plate 100 of detachable structure is removed, then removes the auxiliary copper of first line patterned surface by fast-etching
Foil 102 forms two-sided buried cable architecture printed circuit board, as shown in Figure 8；
I) by aftertreatment technology, solder mask 109 is coated in circuit board surface, and to the pad and line part revealed
Divide and carries out protection processing, protective layer 110；So far, two-sided printed circuit board of sunkening cord is obtained, as shown in Figure 9.
Example of the present invention is the explanation to basic principle, understands that the present invention is not by above-mentioned implementation convenient for tradesman
The limitation of example, under the premise of not departing from the principle of the invention and spirit, the present invention also has further improvement and various change,
Any method based on spirit of that invention and principle is in protection scope of the present invention.
Claims (2)
1. one kind can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord, include the following steps：
A) a detachable core plate is first provided, surface sets carrier copper foil and forms the auxiliary copper foil of first line figure, carries
Body copper foil and auxiliary copper foil are detachable；
B) first line figure and positioning datum figure are produced by pattern transfer, graphic plating on auxiliary copper foil surface；
C) first line graphic design press one layer can imaging-type dielectric material, formed the first embedded type circuit；
D) it is positioned using the reference pattern on first line figure, can be made on imaging-type dielectric material by exposing, being developed in
The sunk type line slot of the second embedded type circuit and the counterbore of certain depth are formed, being made later with UV light and baking can imaging-type
Dielectric cure；
E) it is positioned using the positioning datum figure on first line figure, counterbore is reprocessed by laser, makes through-hole；
F) can copper facing on imaging-type dielectric material, while copper will be filled up in sunk type line slot and through-hole；
G) using chemically and physically reduction process, removal can imaging-type dielectric material surface electro-coppering, while being retained in sunk type
Copper in line slot forms the second embedded type circuit；
H) detachable core plate is removed, then removes the auxiliary copper foil of first line patterned surface by fast-etching；
I) using welding resistance printing, process of surface treatment, solder mask and surface-treated layer is formed in printed circuit plate surface, is obtained double
Face is sunken cord printed circuit board.
2. as described in claim 1 can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord, characterized in that
Surface treatment described in step i) includes that organic guarantor welds film, chemical deposited nickel gold or electronickelling gold, chemical deposition NiPdAu or electricity
Plate NiPdAu, chemical tin or electrotinning, chemistry silver, chemical tin silver or electrotinning silver, chemical tin silver copper or plating tin silver copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810985268.3A CN108901149A (en) | 2018-08-28 | 2018-08-28 | It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810985268.3A CN108901149A (en) | 2018-08-28 | 2018-08-28 | It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108901149A true CN108901149A (en) | 2018-11-27 |
Family
ID=64358550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810985268.3A Pending CN108901149A (en) | 2018-08-28 | 2018-08-28 | It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108901149A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI703903B (en) * | 2019-12-19 | 2020-09-01 | 頎邦科技股份有限公司 | Flexible circuit board |
| CN118338548A (en) * | 2024-04-22 | 2024-07-12 | 江苏博敏电子有限公司 | A process for manufacturing ultra-fine pitch gold fingers of circuit boards based on buried wire structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581325A (en) * | 2003-08-01 | 2005-02-16 | 精碟科技股份有限公司 | template forming method |
| CN101197308A (en) * | 2006-12-04 | 2008-06-11 | 中芯国际集成电路制造(上海)有限公司 | Production method of metal wiring structure in semiconductor element |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | A printed circuit board manufacturing method based on laser groove processing technology |
| CN105960103A (en) * | 2016-07-14 | 2016-09-21 | 安捷利电子科技（苏州）有限公司 | Manufacturing method for embedded type circuit of PCB (Printed Circuit Board) |
| CN108207082A (en) * | 2017-12-29 | 2018-06-26 | 上海美维科技有限公司 | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord |
-
2018
- 2018-08-28 CN CN201810985268.3A patent/CN108901149A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581325A (en) * | 2003-08-01 | 2005-02-16 | 精碟科技股份有限公司 | template forming method |
| CN101197308A (en) * | 2006-12-04 | 2008-06-11 | 中芯国际集成电路制造(上海)有限公司 | Production method of metal wiring structure in semiconductor element |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | A printed circuit board manufacturing method based on laser groove processing technology |
| CN105960103A (en) * | 2016-07-14 | 2016-09-21 | 安捷利电子科技（苏州）有限公司 | Manufacturing method for embedded type circuit of PCB (Printed Circuit Board) |
| CN108207082A (en) * | 2017-12-29 | 2018-06-26 | 上海美维科技有限公司 | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI703903B (en) * | 2019-12-19 | 2020-09-01 | 頎邦科技股份有限公司 | Flexible circuit board |
| CN118338548A (en) * | 2024-04-22 | 2024-07-12 | 江苏博敏电子有限公司 | A process for manufacturing ultra-fine pitch gold fingers of circuit boards based on buried wire structure |
| CN118338548B (en) * | 2024-04-22 | 2024-10-25 | 江苏博敏电子有限公司 | Circuit board ultra-small space golden finger manufacturing process based on buried line structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100761706B1 (en) | Printed Circuit Board Manufacturing Method | |
| CN103474361B (en) | A kind of embedded active packaging process and encapsulation structure imbedding function substrate | |
| CN101616549B (en) | Method for making one-sided thick copper step plate by electroplating additive method | |
| CN101351088B (en) | Embedded circuit structure and process thereof | |
| CN108207082A (en) | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| TW200829104A (en) | Circuit board and method for manufaturing thereof | |
| CN105934084B (en) | A kind of printed circuit board and its full addition production method | |
| CN102821553A (en) | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) | |
| CN103874346B (en) | Manufacturing method of circuit board | |
| CN101282622B (en) | Circuit board and method for manufacturing the same | |
| CN103985695A (en) | Fan-out type packaging structure and manufacturing process thereof | |
| US20110089138A1 (en) | Method of manufacturing printed circuit board | |
| CN108366492A (en) | It is a kind of pre- big without lead electro-plating method based on finger connection position | |
| CN108901149A (en) | It is a kind of can the imaging-type dielectric material method that makes two-sided printed circuit board of sunkening cord | |
| TWI581697B (en) | Method for manufacturing heat dissipation structure of ceramic substrate | |
| CN103702509A (en) | Step-shaped circuit board and manufacturing method thereof | |
| CN104093272A (en) | Improved semiconductor packaging substrate structure and manufacturing method thereof | |
| CN104091790A (en) | Semiconductor packaging substrate structure and manufacturing method of semiconductor packaging substrate structure | |
| CN108901137A (en) | A kind of method that temperature control dissociation film auxiliary makes ultra-thin printed circuit board | |
| JP5176643B2 (en) | Multilayer circuit board manufacturing method | |
| TWI275332B (en) | Method for fabricating interlayer conducting structure of circuit board | |
| CN103906354B (en) | Circuit board and method for manufacturing the same | |
| CN104105340A (en) | Package substrate via hole structure and manufacture method | |
| CN104425431B (en) | Substrate structure, packaging structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181127 |
|
| RJ01 | Rejection of invention patent application after publication |